A new structure of glue-filling power module

Abstract

The utility model discloses a novel glue filling power module structure, and signal terminal installation arrangement is in the middle part of power module and extends upward, and power terminal arrangement is in the both sides of power module and extends outward, the root of signal terminal is connected on the insulating substrate of power module and drive board through pressure equipment and interference fit, the arrangement of signal terminal in the middle part of power module corresponds with drive board, and the arrangement of signal terminal is according to: there is shortening circuit loop between drive board and corresponding signal terminal, and the arrangement position of power terminal is flexibly laid out according to application demand. Through the application, built-in integrated drive board is at signal terminal, shortens circuit loop, reduces loop inductance, solves the cooperation problem of product and terminal drive board, and improves production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuits, and in particular to a novel potting power module structure. Background Technology

[0002] Currently common power modules, such as the EconoPIM™3 product, have a structure commonly referred to as a 'housing', which consists of a housing filled with silicone gel and terminal pins arranged around the perimeter of the housing. However, this structure has high parasitic inductance and poor compatibility with subsequent driver boards. Utility Model Content

[0003] The purpose of this invention is to provide a novel potting power module structure that addresses and compensates for the shortcomings of current technologies, improves parasitic inductance, and solves the problem of product compatibility with terminal driver boards.

[0004] To achieve the above technical objectives, this utility model provides a novel potting power module structure, which includes signal terminals and power terminals. The signal terminals are mounted in the middle of the power module and extend upwards, while the power terminals are arranged on both sides of the power module and extend outwards. The roots of the signal terminals are press-fitted and interference-fitted onto the insulating substrate and drive board of the power module. The arrangement of the signal terminals in the middle of the power module corresponds to the drive board. The arrangement of the signal terminals is based on the fact that there is a shortened circuit loop between the drive board and the corresponding signal terminal. The arrangement of the power terminals can be flexibly configured according to application requirements.

[0005] This utility model provides a novel potting power module structure, which integrates a driver board at the signal terminal, shortens the circuit loop, reduces the loop inductance, and solves the problem of product compatibility with the terminal driver board.

[0006] As a further improvement, the signal terminal is a split type, and mounting posts are arranged on the insulating substrate. The root of the signal terminal is interference-fitted with the mounting posts.

[0007] As a further improvement, the power module includes chips connected by sintering or welding, the insulating substrate, the copper base plate, or a needle-fin shape.

[0008] As a further improvement, the insulating substrate adopts either direct copper plating (DBC) or active metal brazing (AMB).

[0009] As a further improvement, the front-side connection of the chip adopts aluminum-copper strip bonding, clip welding, DTS, or aluminum-copper wire bonding.

[0010] As a further improvement, the chip is arranged on the insulating substrate and the driving board.

[0011] As a further improvement, the power terminal is Z-shaped and its bottom is press-fitted and ultrasonically welded or solid-state welded to the drive plate. The upper part of the power terminal extends laterally outward from the drive plate, and the upper part of the power terminal has a connection hole.

[0012] As a further improvement, the root of the signal terminal also has a flange, and potting medium is arranged below the flange.

[0013] As a further improvement, mounting holes are arranged at the four corners of the power module.

[0014] This invention has a higher degree of integration and saves on terminal assembly costs. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the present invention;

[0016] Figure 2 This is a cross-sectional schematic diagram of the present invention;

[0017] Figure 3 This is a schematic diagram of the installation and assembly of the signal terminals.

[0018] Reference numerals: 1. Power module; 2. Signal terminal; 3. Power terminal; 4. Insulating substrate; 5. Chip; 6. Driver board; 7. Mounting post; 8. Mounting hole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] like Figures 1 to 3 As shown, this utility model provides a novel potting power module 1 structure, which includes signal terminals 2 and power terminals 3. The signal terminals 2 are installed in the middle of the power module 1 and extend upward. The power terminals 3 are arranged on both sides of the power module 1 and extend outward. The root of the signal terminals 2 is press-fitted and interference-fitted to the insulating substrate 4 and the drive plate 6 of the power module 1. The arrangement of the signal terminals 2 in the middle of the power module 1 corresponds to the drive plate 6. The arrangement of the signal terminals 2 is based on the fact that there is a shortened circuit loop between the drive plate 6 and the corresponding signal terminals 2. The arrangement of the power terminals 3 can be flexibly laid out according to application requirements.

[0021] This utility model provides a novel potting power module structure, which integrates a driver board at the signal terminal, shortens the circuit loop, reduces the loop inductance, and solves the problem of product compatibility with the terminal driver board.

[0022] As a further improvement, the signal terminal 2 is a split type, and a mounting post 7 is arranged on the insulating substrate 4. The root of the signal terminal 2 is interference-fitted with the mounting post 7.

[0023] As a further improvement, the power module includes a chip 5 connected by sintering or welding, the insulating substrate 4, a copper base plate, or a needle-fin shape.

[0024] As a further improvement, the insulating substrate 4 adopts either direct copper plating (DBC) or active metal brazing (AMB).

[0025] As a further improvement, the front-side connection of the chip 5 adopts aluminum-copper strip bonding, clip welding, DTS, or aluminum-copper wire bonding.

[0026] As a further improvement, the chip 5 is arranged on the insulating substrate 4 and the driving board 6.

[0027] As a further improvement, the power terminal 3 is Z-shaped and its bottom is installed with the drive plate 6 by pressure fitting and ultrasonic welding or solid-state welding. The upper part of the power terminal 4 extends laterally outward from the drive plate 6, and the upper part of the power terminal 3 has a connection hole.

[0028] As a further improvement, the root of the signal terminal 2 also has a flange 8, and a potting medium is arranged below the flange 8.

[0029] As a further improvement, mounting holes are arranged at the four corners of the power module.

[0030] In a preferred embodiment of this utility model, the potting power module 1 uses a central signal terminal pin integrated on the driver board. The structure with output power terminals on both sides allows for flexible placement of the power terminals according to customer application requirements. First, the chip, insulating substrate (not limited to DBC or AMB), copper base plate, or pinfin are connected. Soldering can be done using sintering, welding, etc. (Chip front connection can use aluminum-copper strip bonding, clip welding, DTS, or aluminum-copper wire bonding). Then, a separate pressfit pin is used to connect to the insulating substrate and the driver board. The power terminals are ultrasonically soldered using a solder / pressfit pin. This assembly structure integrates the driver board at the signal terminal using soldering, shortening the circuit loop, reducing the loop inductance by 5nH, solving the problem of product compatibility with the terminal driver board, achieving higher integration, and saving 10% of the terminal assembly cost.

[0031] It should be understood that the scope of protection sought by this utility model is not limited to the non-limiting embodiments, which are merely illustrative examples. The substantive scope of protection claimed in this application is further embodied in the scope provided by the independent claims and their dependent claims.

Claims

1. A novel potting power module structure, comprising signal terminals and power terminals, characterized in that: The signal terminals are installed in the middle of the power module and extend upwards. The power terminals are arranged on both sides of the power module and extend outwards. The roots of the signal terminals are press-fitted and interference-fitted to the insulating substrate and the drive board of the power module. The arrangement of the signal terminals in the middle of the power module corresponds to the drive board. The arrangement of the signal terminals is based on the fact that there is a shortened circuit loop between the drive board and the corresponding signal terminal. The arrangement position of the power terminals can be flexibly laid out according to application requirements.

2. The novel potting power module structure according to claim 1, characterized in that: The signal terminal is a split type, and mounting posts are arranged on the insulating substrate. The root of the signal terminal is interference-fitted with the mounting posts.

3. The novel potting power module structure according to claim 1, characterized in that: The power module includes chips connected by sintering or welding, the insulating substrate, the copper base plate, or a needle-fin shape.

4. The novel potting power module structure according to claim 3, characterized in that: The insulating substrate adopts either direct copper plating (DBC) or active metal brazing (AMB).

5. The novel potting power module structure according to claim 4, characterized in that: The chip front-side connection adopts aluminum-copper strip bonding, Clip soldering, DTS, or aluminum-copper wire bonding methods.

6. The novel potting power module structure according to claim 5, characterized in that: The chip is arranged on the insulating substrate and the driving board.

7. The novel potting power module structure according to claim 1, characterized in that: The power terminal is Z-shaped and its bottom is press-fitted and ultrasonically welded or solid-state welded to the drive plate. The upper part of the power terminal extends laterally outward from the drive plate and has a connection hole at the upper part.

8. The novel potting power module structure according to claim 7, characterized in that: The root of the signal terminal also has a flange, and potting medium is arranged below the flange.

9. The novel potting power module structure according to claim 1, characterized in that: The power module has mounting holes at its four corners.

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