An LED epitaxial cleaving device

Abstract

This application provides an LED epitaxial scribing device, comprising: a scribing control unit, a ranging unit, an objective lens, a laser path, and a laser; the scribing control unit is connected to both the ranging unit and the laser; the ranging unit is mounted on the objective lens and is used to measure the thickness of the area to be scribed on the LED epitaxial layer; the laser, upon receiving the thickness value fed back from the ranging unit by the scribing control unit, emits a laser with a power matching the thickness value to the laser path; the laser path transmits the laser to the objective lens, so as to scrib the area to be scribed on the LED epitaxial layer through the objective lens. This application improves product cutting yield and scribing process stability by dynamically adjusting the laser power through thickness measurement of different areas of the epitaxial layer.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to an LED epitaxial cleaving device. Background Technology

[0002] Currently, in the development of the semiconductor and LED industries, with the shrinking size of LED chips (from millimeters to micrometers) and the diversification of materials (sapphire, SiC, GaN, silicon-based, etc.), the scribing technology has evolved from mechanical cutting to laser precision processing. Currently, the mainstream scribing equipment in the MINI LED industry uses laser hidden cutting technology. However, as chip size and cutting paths become smaller, and the grinding thickness becomes thinner, the stability of the cutting process becomes more challenging. This is because the thickness of the chip processed in the grinding process can fluctuate by 5µm. For example, for products requiring a 60µm specification, the size of the product after grinding will fluctuate between 55µm and 65µm, making it difficult to set a suitable laser power for laser cutting in the scribing process, resulting in a low cutting yield. Utility Model Content

[0003] In view of the shortcomings of the prior art, the purpose of this application is to provide an LED epitaxial dicing device to improve the LED epitaxial cutting yield.

[0004] In a first aspect, this application provides an LED epitaxial scrubbing device, comprising: a scrubbing control unit, a ranging unit, an objective lens, a laser path, and a laser;

[0005] The slicing control unit is connected to the ranging unit and the laser, respectively.

[0006] The ranging unit is mounted on the objective lens and is used to measure the thickness of the LED epitaxial region to be scratched.

[0007] The laser is used to emit a laser with a power matching the thickness value to the laser path after receiving the thickness value fed back by the ranging unit forwarded by the dicing control unit.

[0008] The laser path is used to transmit the laser to the objective lens, so as to scratch the area to be scratched on the LED epitaxial layer through the objective lens.

[0009] In one possible embodiment, the ranging unit is a rangefinder.

[0010] In one possible embodiment, the laser path includes: a conduit, a first reflector, a second reflector, a lens, and a third reflector;

[0011] The first reflector, the second reflector, the lens, and the third reflector are all disposed in the pipeline;

[0012] The laser emitted by the laser is reflected by the first reflector to the second reflector, and then reflected by the second reflector into the lens. It passes through the lens and enters the third reflector, and exits the tube through the third reflector to the objective lens.

[0013] In one possible embodiment, the objective lens has a magnification of 50x.

[0014] In one possible embodiment, the first reflector, the second reflector, and the third reflector are total reflection mirrors.

[0015] In one possible embodiment, the lens is a full lens.

[0016] This embodiment provides an LED epitaxial scrubbing device that uses a ranging unit to measure the thickness of the area to be scrubbed on the LED epitaxial layer. This thickness is then transmitted to the laser by the scrubbing control unit, allowing the laser to adjust its output power based on the thickness. This enables the laser to output the required scrubbing power according to different thickness values ​​of the LED epitaxial layer, thereby reducing the probability of scrubbing abnormalities caused by uneven product thickness, improving product cutting yield, and enhancing the stability of the scrubbing process. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the planar structure of an LED epitaxial scrubbing device provided in one embodiment of this application;

[0018] Figure 2 for Figure 1 A schematic diagram of the laser path structure in the image.

[0019] Reference numerals: 110-Scibing control unit; 120-Range measuring unit; 130-Objective lens; 140-Laser path; 141-Pipeline; 143-First reflecting mirror; 145-Second reflecting mirror; 147-Lens; 149-Third reflecting mirror; 150-Laser. Detailed Implementation

[0020] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0021] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. The component designations used herein, such as "first," "second," etc., are merely for distinguishing the described objects and have no sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages). Directional terms used in this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," "side," etc., are merely for reference to the accompanying illustrations. Therefore, the use of directional terms is for better and clearer explanation and understanding of this application, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising," "may include," "include," or "may include" used in this application indicate the presence of the corresponding disclosed function, operation, element, etc., and do not limit one or more other functions, operations, elements, etc. Moreover, the terms "comprising" or "include" indicate the presence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusion.

[0023] like Figures 1 to 2 As shown in the figure, this application provides an LED epitaxial scrubbing device, which includes: scrubbing control unit 110, ranging unit 120, objective lens 130, laser path 140 and laser 150.

[0024] In this embodiment, the scribbling control unit 110 is connected to both the ranging unit 120 and the laser 150. For example, the scribbling control unit 110 is electrically connected to the ranging unit 120 and the laser 150 via control / signal lines to facilitate signal transmission and control.

[0025] Alternatively, the dicing control unit 110 may be a device with processing capabilities, such as a PC.

[0026] It should be understood that the dicing control unit 110 is pre-configured with data processing software to control the ranging unit 120 to perform distance measurement, receive the thickness value fed back by the ranging unit 120, and send the thickness value to the laser 150. This application does not limit the type of data processing software; those skilled in the art can select different software according to actual needs, and no specific limitation is made here.

[0027] In this embodiment, the ranging unit 120 is disposed on the objective lens 130 and is used to measure the thickness of the LED epitaxial region to be scratched.

[0028] Optionally, the ranging unit 120 is a rangefinder. For example, it can be an electro-optical rangefinder or a pulse rangefinder; no specific limitation is made here.

[0029] It should be noted that the LED epitaxial layer to be scratched is placed on a fixed platform. Therefore, the ranging unit 120 is able to measure the thickness of the LED epitaxial layer.

[0030] Of course, in one embodiment, the dicing control unit 110 can be connected to the stage to control the movement of the LED extension on the stage.

[0031] Optionally, the objective lens 130 has a magnification of 50x.

[0032] In one possible embodiment, the laser path 140 includes: a conduit 141, a first reflector 143, a second reflector 145, a lens 147, and a third reflector 149.

[0033] The first reflector 143, the second reflector 145, the lens 147 and the third reflector 149 are all disposed in the pipeline 141;

[0034] The laser emitted by the laser 150 is reflected by the first reflector 143 to the second reflector 145, and then reflected by the second reflector 145 into the lens 147. The laser passes through the lens 147 and enters the third reflector 149, and then exits the pipe 141 through the third reflector 149 to the objective lens 130.

[0035] Optionally, the first reflector 143, the second reflector 145 and the third reflector 149 are total reflection mirrors.

[0036] Optionally, the lens 147 is a full lens.

[0037] Understandably, in this embodiment, after the objective lens 130 focuses the LED epitaxial wafer, the ranging unit 120 measures the thickness of the area to be scratched on the LED epitaxial wafer and sends the measured thickness value to the scribing control unit 110. The scribing control unit 110 then transmits the thickness value to the laser 150. After receiving the thickness value, the laser 150 uses its preset thickness-power relationship to output a laser with a laser power matching the thickness value to the laser path 140. The laser path 130 is then used to input the laser into the objective lens 130, and the objective lens 130 is used to scrib the area to be scratched on the LED epitaxial wafer. This overcomes the abnormal probability of scratching caused by uneven product thickness, thereby improving the product cutting yield and the stability of the scratching process.

[0038] It should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0039] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments, and equivalent changes made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. An LED epitaxial dicing apparatus, characterized by, include: The scoping control unit, ranging unit, objective lens, laser path, and laser; The slicing control unit is connected to the ranging unit and the laser, respectively. The ranging unit is mounted on the objective lens and is used to measure the thickness of the LED epitaxial region to be scratched. The laser is used to emit a laser with a power matching the thickness value to the laser path after receiving the thickness value fed back by the ranging unit forwarded by the dicing control unit. The laser path is used to transmit the laser to the objective lens, so as to scratch the area to be scratched on the LED epitaxial layer through the objective lens.

2. The LED epitaxial cleaving device according to claim 1, characterized in that, The ranging unit is a rangefinder.

3. The LED epitaxial cleaving device according to claim 2, characterized in that, The laser path includes: a conduit, a first reflecting mirror, a second reflecting mirror, a lens, and a third reflecting mirror; The first reflector, the second reflector, the lens, and the third reflector are all disposed in the pipeline; The laser emitted by the laser is reflected by the first reflector to the second reflector, and then reflected by the second reflector into the lens. It passes through the lens and enters the third reflector, and exits the tube through the third reflector to the objective lens.

4. The LED epitaxial cleaving device according to any one of claims 1-3, characterized in that, The objective lens has a magnification of 50x.

5. The LED epitaxial cleaving device according to claim 3, characterized in that, The first reflector, the second reflector, and the third reflector are total reflection mirrors.

6. The LED epitaxial cleaving device according to claim 3, characterized in that, The lens is a full lens.

Images