Aging test fixtures and aging test systems

Abstract

This application relates to an aging test fixture and an aging test system. The aging test fixture includes: a substrate with at least one test groove on its upper surface, the test groove penetrating both the upper and lower surfaces of the substrate; a test circuit board located on one side of the test groove in a first direction X; heat-conducting blocks disposed on one side of the lower surface of the substrate and extending into the test groove, with each heat-conducting block floatingly connected to the substrate; and an elastic member disposed between the heat-conducting blocks and the substrate, the elastic member being configured to apply a pushing force to the heat-conducting blocks. Using the aging test fixture of this application, the product to be tested can be placed on the aging test fixture first, and then the aging test fixture can be placed on a heating device to establish heat conduction between the product to be tested and the heating device. In this process, using the aging test fixture to transfer the product to be tested avoids the risk of product handling and saves time, improving testing efficiency.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to an aging test fixture and an aging test system. Background Technology

[0002] In existing technologies, aging tests are conducted by placing products onto a heating device. This method involves placing each product directly onto the heating device and keeping it in contact with the heating zone. This results in low product handling efficiency, leading to low testing efficiency, and also poses a risk of product damage during handling. Utility Model Content

[0003] Therefore, it is necessary to propose an aging test fixture to address the problem of low efficiency in product aging tests. An aging test system is also proposed.

[0004] One aspect of this application provides an aging test fixture, comprising: a substrate, wherein at least one test groove is provided on the upper surface of the substrate, the test groove penetrating the upper and lower surfaces of the substrate; a test circuit board located on one side of the test groove in a first direction; a heat-conducting block disposed on one side of the lower surface of the substrate and extending into the test groove, and each of the heat-conducting blocks being floatingly connected to the substrate; and an elastic member disposed between the heat-conducting block and the substrate, the elastic member being configured to apply a pushing force to the heat-conducting block.

[0005] In some embodiments, the heat-conducting block is provided with a vacuum adsorption hole and a connecting channel communicating with the vacuum adsorption hole, the vacuum adsorption hole being used to adsorb the product to be tested.

[0006] In some embodiments, the position of the test circuit board in the first direction is adjustable.

[0007] In some embodiments, a scale with graduations arranged along a first direction is also included, the scale being located on one side of the test circuit board in a second direction, the second direction being perpendicular to the first direction.

[0008] In some embodiments, the lower surface of the substrate is provided with a first groove, and the bottom of the first groove is provided with a second groove; the heat-conducting block is located in the first groove, and the elastic element is provided in the second groove.

[0009] In some embodiments, the top of the heat-conducting block is provided with a third groove, and one end of the elastic element is accommodated in the third groove.

[0010] In some embodiments, the substrate is provided with a connection hole, the bottom of the heat-conducting block is provided with a fourth groove, and the bottom of the fourth groove is provided with a through hole penetrating the heat-conducting block; the aging test fixture further includes a connector, the connector including a mating part, a transition part and a head connected in sequence, the mating part is connected to the connection hole, the transition part passes through the through hole and its length is greater than the length of the through hole, the head of the connector is located in the fourth groove, and the head is configured not to pass through the through hole.

[0011] In some embodiments, the mating part is a threaded hole, and the mating part has a threaded structure.

[0012] In some embodiments, the edge of the substrate is provided with a snap fastener.

[0013] Another aspect of this application proposes an aging test system, comprising: a heating device; the aging test fixture, wherein a heat-conducting block of the aging test fixture is in contact with the heating zone of the heating device.

[0014] Using the aging test fixture provided in this application, the product to be tested can be placed on the aging test fixture first, and then the aging test fixture can be placed on the heating equipment to establish heat transfer between the product to be tested and the heating equipment. In the above process, the product to be tested is transferred using the aging test fixture, avoiding the risk of product handling and saving time, thereby improving testing efficiency. At the same time, the elastic element can keep the heat-conducting block in close contact with the heating area, thereby ensuring the stability of the aging test. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the aging test fixture according to an embodiment of this application.

[0016] Figure 2 This is an exploded view of the aging test fixture according to an embodiment of this application.

[0017] Figure 3 for Figure 1 A top view of the aging test fixture according to an embodiment of this application.

[0018] Figure 4 for Figure 3 Sectional view along the AA direction.

[0019] Figure 5 for Figure 3 Sectional view along the BB direction.

[0020] Figure 6 This is a schematic diagram of an aging test system according to an embodiment of this application.

[0021] The corresponding numbers of the relevant components in the diagram are as follows:

[0022] 1. Aging test fixture; 10. Substrate; 101. Upper surface; 102. Lower surface; 110. Test groove; 111. Small hole; 120. Handle; 130. First groove; 140. Second groove; 150. Connecting hole; 160. Buckle; 20. Test circuit board; 30. Heat-conducting block; 301. Base; 302. Embedded part; 310. Vacuum adsorption hole; 320. Connecting channel; 330. Third groove; 340. Fourth groove; 350. Through hole; 40. Elastic element; 50. Scale; 60. Connector; 610. Mating part; 620. Transition part; 630. Head; 2. Product to be tested; 3. Heating equipment; 31. Heating zone. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0029] One aspect of this application provides an aging test fixture for performing aging tests on products to be tested. The product to be tested as described in this application may specifically be a micro organic light-emitting diode (Micro OLED), but the aging test fixture of this application is not limited to testing Micro OLEDs.

[0030] refer to Figures 1 to 5 An embodiment of this application provides an aging test fixture 1 including a substrate 10, a test circuit board 20, a heat-conducting block 30, and an elastic member 40. The upper surface 101 of the substrate 10 is provided with at least one test groove 110, which extends through the upper surface 101 and the lower surface 102 of the substrate 10. The test circuit board 20 is located on one side of the test groove 110 in a first direction X. The heat-conducting block 30 is disposed on one side of the lower surface 102 of the substrate 10 and extends into the test groove 110, and each heat-conducting block 30 is floatingly connected to the substrate 10. The elastic member 40 is disposed between the heat-conducting block 30 and the substrate 10, and the elastic member 40 is configured to apply a pushing force to the heat-conducting block 30.

[0031] The substrate 10 is specifically rectangular, with its width direction being the first direction X, and its length direction being the second direction Y, which is perpendicular to the first direction X. The substrate 10 has a handle 120 at each end in the first direction X for easy handling of the aging test fixture 1.

[0032] The heat-conducting block 30 is floatingly connected to the substrate 10, meaning that the heat-conducting block 30 is movably connected to the substrate 10 in the thickness direction of the substrate 10, and the heat-conducting block 30 can move up and down relative to the substrate 10. The elastic member 40 is configured to apply a pushing force to the heat-conducting block 30, meaning that the elastic member 40 is in a compressed state, and it applies an elastic force to the heat-conducting block 30 in the direction opposite to the lower surface 102 of the substrate 10. The elastic member 40 is specifically a spring, but is not limited to this.

[0033] The top of the heat-conducting block 30 is embedded within the test slot 110, thereby enabling it to contact the product. The heat-conducting block 30 is made of a material with excellent thermal conductivity, such as copper. Specifically, refer to... Figure 2 The test slot 110 is a stepped hole. The heat-conducting block 30 includes a base 301 and an insert 302, which extends into the small hole 111 of the stepped hole.

[0034] refer to Figure 6 In one embodiment of this application, the aging test fixture 1 provides that, during application, one end of the product 2 to be tested is placed in the test tank 110 and in contact with the heat-conducting block 30, while the other end is placed on the test circuit board 20 to contact the test contacts on the test circuit board 20. When the aging test fixture 1 carrying the product 2 to be tested is placed on the heating device 3, the bottom of the heat-conducting block 30 contacts the heating area 31 on the heating device 3. Under the elastic force of the elastic member 40, the heat-conducting block 30 and the heating area 31 maintain close contact, ensuring uniform heat conduction of the product and better test results.

[0035] In this application, the upper surface 101 of the substrate 10 is specifically provided with four test slots 110, which can simultaneously test four products 2 to be tested. The four test slots 110 are arranged at intervals along the second direction Y. Four heat-conducting blocks 30 are provided accordingly. Optionally, the four heat-conducting blocks 30 can also be connected as one unit. It can be understood that the length of the test circuit board 20 in the first direction X is set to meet the testing requirements of the four test slots 110. That is, it ensures that the other ends of the four products 2 to be tested can be attached to the test circuit board 20.

[0036] Using the aging test fixture 1 provided in one embodiment of this application, the product 2 to be tested can be placed on the aging test fixture 1 first, and then the aging test fixture 1 can be placed on the heating device 3 to establish heat conduction between the product 2 to be tested and the heating device 3. In the above process, the product to be tested is transferred using the aging test fixture, avoiding the risk of product handling and saving time, thereby improving testing efficiency; at the same time, the elastic element 40 can keep the heat-conducting block 30 in close contact with the heating zone 31, thereby ensuring the stability of the aging test.

[0037] refer to Figures 2 to 4 To ensure stable contact between the heat-conducting block 30 and the product 2 to be tested, in some embodiments, the heat-conducting block 30 is provided with a vacuum adsorption hole 310 and a connecting channel 320 communicating with the vacuum adsorption hole 310. The vacuum adsorption hole 310 is used to adsorb the product 2 to be tested. The connecting channel 320 is used to connect to an external vacuum adsorption pipeline, so that the heat-conducting block 30 can adsorb the product 2 to be tested, and make the heat-conducting block 30 contact the product 2 to be tested.

[0038] The vacuum adsorption hole 310 extends in a direction perpendicular to the top of the heat-conducting block 30 and opens at the top of the heat-conducting block 30. Specifically... Figure 4 In this configuration, the direction perpendicular to the top of the heat-conducting block 30 is the vertical direction. The connecting channel 320 is arranged parallel to the top of the heat-conducting block 30, and the opening of the connecting channel 320 is located at the bottom of the heat-conducting block 30. Specifically... Figure 4 In the middle, the direction parallel to the top of the heat-conducting block 30 is the left-right direction.

[0039] refer to Figure 1 In some embodiments, the position of the test circuit board 20 in the first direction X is adjustable.

[0040] Optionally, the upper surface 101 of the substrate 10 may be provided with a groove and a locking device extending along the first direction X, allowing the test circuit board 20 to slide in the groove and be locked in place by the locking device. Optionally, the upper surface 101 of the substrate 10 may be provided with a plurality of positioning holes along the first direction X, and the test circuit board 20 may be provided with positioning posts. By having the positioning posts engage with different positioning holes, the position of the test circuit board 20 in the first direction X can be changed.

[0041] By making the position of the test circuit board 20 adjustable in the first direction X, the position of the test circuit board 20 can be adjusted according to the length of the product 2 to be tested, thereby adapting to aging tests of products of different specifications.

[0042] Further, refer to Figure 1 The aging test fixture 1 of this application also includes a scale 50 with scale values ​​arranged along the first direction X, and the scale 50 is located on one side of the test circuit board 20 in the second direction Y.

[0043] A scale 50 is fixed to the upper surface 101 of the substrate 10. The scale values ​​of the scale 50 are arranged along the first direction X. The position of the test circuit board 20 in the first direction X can be precisely adjusted according to the indication of the scale 50.

[0044] refer to Figure 4 and Figure 5 The lower surface 102 of the substrate 10 is provided with a first groove 130, and the bottom of the first groove 130 is provided with a second groove 140; the heat-conducting block 30 is located in the first groove 130, and the elastic member 40 is provided in the second groove 140.

[0045] The first groove 130 is a recessed area formed on the lower surface 102 of the substrate 10, and the second groove 140 is a recessed area formed at the bottom of the first groove 130. When the heat-conducting block 30 is assembled in the first groove 130, the elastic member 40 is at least partially accommodated in the second groove 140 and held between the substrate 10 and the heat-conducting block 30.

[0046] Further, refer to Figure 5 The top of the heat-conducting block 30 is provided with a third groove 330, and one end of the elastic member 40 is accommodated in the third groove 330. In this way, both ends of the elastic member 40 are respectively accommodated in the second groove 140 and the third groove 330, thereby being held between the substrate 10 and the heat-conducting block 30.

[0047] In this application, the heat-conducting block 30 is specifically floatingly connected to the substrate 10 in the following manner.

[0048] refer to Figure 5 The substrate 10 has a connection hole 150, and the bottom of the heat-conducting block 30 has a fourth groove 340. The bottom of the fourth groove 340 has a through hole 350 that penetrates the heat-conducting block 30. The aging test fixture 1 also includes a connector 60, which includes a mating part 610, a transition part 620 and a head 630 connected in sequence. The mating part 610 is connected to the connection hole 150. The transition part 620 passes through the through hole 350 and its length is greater than the length of the through hole 350. The head 630 of the connector 60 is located in the fourth groove 340 and is configured so that it cannot pass through the through hole 350.

[0049] The head 630 of the connector 60 is configured to be unable to pass through the through hole 350 and cannot enter the through hole 350, but is limited in the fourth groove 340 by the bottom of the groove 340. After the connector 60 is engaged with the connecting hole 150, since the length of the transition portion 620 is greater than the length of the through hole 350, there is a relatively movable space between the bottom of the fourth groove 340 and the head 630, thereby enabling the heat-conducting block 30 to float and connect to the substrate 10.

[0050] In this embodiment, the connecting hole 150 is a threaded hole, and the mating part 610 of the connector 60 has a threaded structure, with the mating part 610 threadedly engaging with the connecting hole 150. In other embodiments, the connecting hole 150 and the mating part 610 are interference fits.

[0051] refer to Figure 1 The substrate 10 has a snap fastener 160 on its edge. The snap fastener 160 can be used to fix the substrate 10 into the slot on the heating device 3, thereby improving the stability during aging tests.

[0052] like Figure 6 As shown, in a second aspect of this application, an aging test system is provided, including a heating device 3 and an aging test fixture 1 according to any of the above embodiments, wherein the heat-conducting block 30 of the aging test fixture 1 is in contact with the heating zone 31 of the heating device 3.

[0053] like Figure 6 As shown, the heating zone 31 has four sections that correspond one-to-one with the four heat-conducting blocks 30 of the aging test fixture 1.

[0054] The aging test system of this application can first place the product to be tested 2 on the aging test fixture 1, and the heat conduction between the product to be tested 2 and the heating device 3 can be established by picking up and putting down the aging test fixture 1, thereby improving the test efficiency; at the same time, the elastic element 40 can keep the heat conduction block 30 and the heating area 31 in close contact, thereby ensuring the stability of the aging test.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An aging test fixture, characterized in that, include: A substrate, wherein at least one test groove is provided on the upper surface of the substrate, the test groove penetrating the upper surface and the lower surface of the substrate; The test circuit board is located on one side of the test slot in the first direction; A heat-conducting block is disposed on one side of the lower surface of the substrate and extends into the test groove, and each heat-conducting block is floatingly connected to the substrate; and An elastic element is disposed between the heat-conducting block and the substrate, and the elastic element is configured to apply a thrust to the heat-conducting block.

2. The aging test fixture according to claim 1, characterized in that, The heat-conducting block is provided with vacuum adsorption holes and a connecting channel communicating with the vacuum adsorption holes. The vacuum adsorption holes are used to adsorb the product to be tested.

3. The aging test fixture according to claim 1, characterized in that, The position of the test circuit board in the first direction is adjustable.

4. The aging test fixture according to claim 3, characterized in that, It also includes a scale with graduations arranged along a first direction, the scale being located on one side of the test circuit board in a second direction, the second direction being perpendicular to the first direction.

5. The aging test fixture according to claim 1, characterized in that, The lower surface of the substrate is provided with a first groove, and the bottom of the first groove is provided with a second groove; the heat-conducting block is located in the first groove, and the elastic element is provided in the second groove.

6. The aging test fixture according to claim 5, characterized in that, The top of the heat-conducting block is provided with a third groove, and one end of the elastic element is accommodated in the third groove.

7. The aging test fixture according to claim 1, characterized in that, The substrate is provided with a connection hole, and the bottom of the heat-conducting block is provided with a fourth groove. The bottom of the fourth groove is provided with a through hole penetrating the heat-conducting block. The aging test fixture also includes a connector. The connector includes a mating part, a transition part and a head connected in sequence. The mating part is connected to the connection hole. The transition part passes through the through hole and its length is greater than the length of the through hole. The head of the connector is located in the fourth groove and the head is configured not to pass through the through hole.

8. The aging test fixture according to claim 7, characterized in that, The mating part is a threaded hole, and the mating part has a threaded structure.

9. The aging test fixture according to claim 1, characterized in that, The substrate has snap-fit ​​fasteners on its edges.

10. An aging test system, characterized in that, include: Heating equipment; The aging test fixture as described in any one of claims 1-9, wherein the heat-conducting block of the aging test fixture is in contact with the heating zone of the heating device.

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