A needle bed leveling device

CN224438208UActive Publication Date: 2026-06-30GUANGDONG LIXING INTELLIGENT EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG LIXING INTELLIGENT EQUIP CO LTD
Filing Date
2025-06-12
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

During the electronic component processing, the implanted electronic components are not at the same height on the thick silicone plate, resulting in uneven silver coating thickness. Some components cannot be coated with the paste, which affects product quality.

Method used

A needle bed leveling device is adopted, which uses a servo motor to drive the lead screw and cylinder to clamp and position the structure. The electronic components are uniformly aligned to the same height by pushing with long needles. Combined with the cooperation of positioning pins and compression springs, precise calibration is achieved.

Benefits of technology

Ensuring that each electronic component is immersed to a consistent depth in the liquid slurry avoids variations in silver thickness, significantly reduces product defect rates, improves finished product quality stability, and shortens processing cycles.

✦ Generated by Eureka AI based on patent content.

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Abstract

A needle bed leveling device, relating to the technical field of needle bed leveling devices, includes a support frame. A servo motor is mounted on the upper end of the support frame. A lead screw is mounted on the output shaft of the servo motor via a coupling. An upper needle bed pressure plate is fixedly mounted on the bottom of the lead screw. A needle bed is mounted on the bottom of the upper needle bed pressure plate. A thick silicone plate is disposed below the needle bed. Positioning components for clamping and fixing the thick silicone plate are provided on both sides of the upper needle bed pressure plate. A lower needle bed pressure plate is disposed at the lower end of the support frame. This solution ensures that electronic components fixed on the thick silicone plate protrude at the same height, thereby ensuring that the silver plating thickness at the ends is basically consistent and improving the quality of the electronic components after silver plating.
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