A data center cooling system

Abstract

This application discloses a data center cooling system, belonging to the field of data center cooling systems. The system includes rack units, each with interconnected rack units on its sides and back, housed within a sealed server room. A cooling airflow layer is located at the top of the sealed server room. This data center cooling system features a modular design for the rack units, but adjacent racks share a heat-conducting plate. Heat is transferred to the cooling airflow layer via heat pipe phase change principle and dissipated by variable frequency fans, forming an overall cooling capacity. Simultaneously, each rack unit has an independent cooling system with copper pipe cooling plates, a circulating pump, and a heat exchanger. Temperature changes are monitored online by temperature sensors within each rack to evaluate the effectiveness of the overall cooling architecture. Cooling compensation is then implemented through the independent cooling architecture, effectively saving energy and facilitating targeted maintenance without affecting overall operation.

Description

Technical Field

[0001] This application relates to the field of heat dissipation system technology for data centers, specifically a heat dissipation system for a data center. Background Technology

[0002] Data center cooling systems are thermal architectures that maintain the normal operating temperature environment for equipment. They can prevent hardware failures or data loss caused by overheating and are an important guarantee for the safe operation of data centers.

[0003] With the development of AI technology, data center cooling systems are constantly being improved to meet the heat dissipation needs of high-density computing scenarios such as AI and cloud computing. Traditional air-cooled systems have a single-rack heat dissipation limit of about 15kW, which is difficult to cope with high-density scenarios and has a high energy consumption ratio; immersion liquid cooling directly contacts the heat dissipation, with the server completely immersed in the coolant, resulting in high construction and maintenance costs; cold plate liquid cooling relies on a unified water supply and return pipe, and the water pipe is prone to scale buildup, requiring a complete shutdown for cleaning and maintenance, making it unreliable; spray liquid cooling may be affected by airflow and may lead to coolant waste, which reduces the system's heat dissipation efficiency and energy efficiency ratio.

[0004] Therefore, this application provides a heat dissipation system for a data center to solve the above-mentioned problems. Utility Model Content

[0005] This application provides a data center cooling system designed to address the shortcomings of existing data center cooling systems as described in the background art.

[0006] To achieve the above objectives, this application provides the following technical solution: a heat dissipation system for a data center, including a cabinet unit, wherein the cabinet unit is provided with interconnected cabinet units on both the side and the back, and is located in a sealed computer room, wherein a heat dissipation air layer is provided on the top of the sealed computer room, and a plurality of variable frequency fans are fixedly installed in a linear array at the end of the heat dissipation air layer away from the air outlet.

[0007] The cabinet unit includes a cabinet, a cabinet door, three heat-conducting plates embedded on both sides and the back of the cabinet, and several heat pipes with heat-absorbing ends embedded in the heat-conducting plates and arranged in a linear array. The heat dissipation ends of the heat pipes all extend into the heat dissipation air layer.

[0008] The cabinet is equipped with copper tube cooling plates arranged longitudinally at equal intervals to support the servers. All copper tube cooling plates are connected to a heat exchanger and a circulation pump located outside the sealed computer room through the same water inlet pipe and the same water return pipe. Each cabinet unit is equipped with an independent heat exchanger and circulation pump.

[0009] Temperature sensors are fixedly installed inside each cabinet, and the temperature sensors, variable frequency fans, and circulating pumps are all connected to an external control system. This modular design of the cabinet units allows adjacent cabinets to share a heat-conducting plate and heat pipes. Heat is transferred to the cooling air layer through the phase change principle of heat pipes and dissipated by the variable frequency fans, forming an overall cooling capacity. Simultaneously, each cabinet unit has its own independent cooling system with copper pipe cooling plates, circulating pumps, and heat exchangers. Temperature changes are monitored online by temperature sensors in each cabinet to evaluate the effectiveness of the overall cooling architecture. Heat compensation is then performed through the independent cooling architecture, effectively saving energy and facilitating targeted maintenance without affecting overall operation.

[0010] Preferably, two adjacent cabinets are assembled from the side or back using bolts and nuts, and the two adjacent cabinets share the same heat-conducting plate. A sealing strip is fixedly installed between the heat-conducting plate and the cabinet.

[0011] Preferably, both the water supply pipe and the return water pipe are connected to underground pipes. The inlet end of the water supply pipe is connected to the outlet end of the circulating pump, the inlet end of the circulating pump is connected to the outlet end of the hot water pipe of the heat exchanger, the outlet end of the return water pipe is connected to the inlet end of the hot water pipe of the heat exchanger, and the inlet and outlet of the cold water pipe of the heat exchanger are connected to an external coolant supply system.

[0012] Preferably, the heat dissipation end of the heat pipe is fixedly connected with a number of fins arranged in a linear array.

[0013] Preferably, corner brackets are fixedly connected at the four corners of the cabinet, and the copper tube cooling plates are fixedly installed on the corner brackets with washers and screws.

[0014] Preferably, the bottom of the cabinet is provided with a clearance hole to allow the water inlet pipe and the water return pipe to pass through.

[0015] Preferably, the surface of the copper tube cooling plate is covered with a thermally conductive silicone pad.

[0016] The data center's cooling system features a modular design for the rack units, but adjacent racks share heat-conducting plates and heat pipes. Heat is transferred to the cooling air layer through the phase change principle of heat pipes, and then dissipated by variable frequency fans to form an overall cooling capacity. At the same time, each rack unit has an independent cooling system with copper pipe cooling plates, circulating pumps, and heat exchangers. Temperature changes are monitored online by temperature sensors installed in each rack to evaluate the effectiveness of the overall cooling architecture. Heat compensation is then carried out through the independent cooling architecture, which effectively saves energy and also facilitates targeted downtime maintenance without affecting overall operation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a heat dissipation system for a data center.

[0018] Figure 2 This is a schematic diagram of the overall structure of a cabinet unit in a data center's heat dissipation system.

[0019] In the picture:

[0020] 1. Sealed machine room; 11. Heat dissipation air layer; 12. Variable frequency fan;

[0021] 2. Cabinet unit; 21. Cabinet; 22. Cabinet door; 23. Heat plate; 231. Heat pipe; 232. Fin; 24. Corner bracket; 25. Copper pipe cooling plate; 251. Water inlet pipe; 252. Water return pipe; 26. Temperature sensor;

[0022] 3. Heat exchanger;

[0023] 4. Circulating pump. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] This embodiment provides a heat dissipation system for a data center, such as... Figures 1-2 As shown, the heat dissipation system of the data center includes a cabinet unit 2. The cabinet unit 2 has cabinet units 2 spliced ​​together on the side and back, and is set in a sealed computer room 1. A heat dissipation air layer 11 is opened on the top of the sealed computer room 1. Several variable frequency fans 12 are fixedly installed in a linear array at the end of the heat dissipation air layer 11 away from the air outlet.

[0026] The cabinet unit 2 includes a cabinet 21, a cabinet door 22, three heat-conducting plates 23 embedded on both sides and the back of the cabinet 21, and several heat pipes 231 whose heat-absorbing ends are embedded in the heat-conducting plates 23 and are distributed in a linear array. The heat dissipation ends of the heat pipes 231 all extend into the heat dissipation air layer 11.

[0027] The cabinet 21 is equipped with copper tube cooling plates 25 arranged longitudinally at equal intervals to support the servers. All copper tube cooling plates 25 are connected to the heat exchanger 3 and the circulation pump 4 located outside the sealed server room 1 through the same water inlet pipe 251 and the same water return pipe 252. Each cabinet unit 2 is equipped with an independent heat exchanger 3 and circulation pump 4.

[0028] Temperature sensors 26 are fixedly installed inside the cabinet 21. Temperature sensors 26, variable frequency fans 12 and circulating pumps 4 are all connected to the external control system.

[0029] In use, server heat is absorbed by heat-conducting plates 23 on both sides and the back of the rack, and then transferred to the heat dissipation air layer 11 via heat pipes 231 embedded in the heat-conducting plates. The heat pipes utilize the phase change principle to efficiently conduct heat, quickly dispersing local hot spots to the entire heat dissipation layer. The variable frequency fan 12 at the top of the heat dissipation air layer adjusts its speed in real time based on data from the temperature sensor 26. When the temperature in a certain area rises, the corresponding fan accelerates to force convection cooling and avoid the heat island effect. The server is directly mounted on the copper pipe cooling plate 25. Coolant enters the copper pipe through the water inlet pipe 251, absorbs heat, and then flows out to the external heat exchanger 3 through the water return pipe 252. Each rack unit 2 is equipped with an independent heat exchanger 3 and a circulation pump 4 to achieve on-demand cooling. When the load on a rack increases, its circulation pump automatically increases the flow rate to quickly remove heat, avoiding scale accumulation and downtime maintenance problems of traditional centralized liquid cooling systems. At the same time, targeted compensation of heat dissipation capacity can save energy and reduce costs.

[0030] It should be noted that adjacent racks 21 are assembled from the side or back using bolts and nuts. Adjacent racks 21 share the same heat-conducting plate 23, and sealing strips are fixedly installed between the heat-conducting plate 23 and the racks 21. The shared heat-conducting plate 23 allows heat to diffuse laterally between the racks 21, reducing the risk of local heat islands and adapting to high-density deployment scenarios. The modular design reduces the gap between racks 21, allowing more computing power to be deployed per unit area and improving the space utilization of the data center.

[0031] Specifically, both the water supply pipe 251 and the return water pipe 252 are connected to the underground pipe. The inlet end of the water supply pipe 251 is connected to the outlet end of the circulating pump 4, the inlet end of the circulating pump 4 is connected to the outlet end of the hot water pipe of the heat exchanger 3, and the outlet end of the return water pipe 252 is connected to the inlet end of the hot water pipe of the heat exchanger 3. The inlet and outlet of the cold water pipe of the heat exchanger 3 are connected to the external coolant supply system. The circulating pump 4 drives the coolant from the heat exchanger 3 through the underground pipe into the cabinet 21, absorbs heat and returns to the heat exchanger 3 to exchange heat with the external coolant supply system. By utilizing the constant temperature characteristics of the soil or groundwater, the coolant is pre-cooled, reducing the load on the heat exchanger and improving the energy efficiency ratio.

[0032] Furthermore, each heat pipe 231 has a number of fins 232 fixedly connected to its heat dissipation end in a linear array; the fins 232 increase the heat dissipation area and enhance the air cooling efficiency.

[0033] Specifically, corner brackets 24 are fixedly connected to the four corners of the cabinet 21. The copper pipe cooling plates 25 are fixedly installed on the corner brackets 24 with washers and screws. The bottom of the cabinet 21 has clearance holes to allow the water inlet pipe 251 and the water return pipe 252 to pass through. The corner brackets 24 provide stable support points for the copper pipe cooling plates 25 and are fixedly installed with washers and screws for easy disassembly and assembly. The clearance holes allow the water inlet pipe 251 and the water return pipe 252 to pass through the bottom of the cabinet 21.

[0034] Furthermore, the surface of the copper tube cooling plate 25 is covered with a thermally conductive silicone pad; the thermally conductive silicone pad fills the tiny gap between the server and the copper tube, thereby reducing the contact thermal resistance.

[0035] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this application, based on the technical solution and concept of this application, should be included within the scope of protection of this application.

Claims

1. A cooling system for a data center comprising cabinet units (2), characterized in that: The cabinet unit (2) is provided with cabinet units (2) spliced ​​together on both the side and the back, and is set in a sealed computer room (1). A heat dissipation air layer (11) is provided on the top of the sealed computer room (1). Several variable frequency fans (12) are fixedly installed in a linear array at the end of the heat dissipation air layer (11) away from the air outlet. The cabinet unit (2) includes a cabinet (21), a cabinet door (22), three heat-conducting plates (23) embedded on both sides and the back of the cabinet (21), and a number of heat pipes (231) with heat-absorbing ends embedded in the heat-conducting plates (23) and arranged in a linear array. The heat dissipation ends of the heat pipes (231) all extend into the heat dissipation air layer (11). The cabinet (21) is equipped with copper tube cooling plates (25) arranged longitudinally at equal intervals to support the servers. The copper tube cooling plates (25) are all connected to the heat exchanger (3) and circulation pump (4) located outside the sealed computer room (1) through the same water inlet pipe (251) and the same water return pipe (252). Each cabinet unit (2) is equipped with an independent heat exchanger (3) and circulation pump (4). Temperature sensors (26) are fixedly installed inside each cabinet (21). The temperature sensors (26), the variable frequency fan (12), and the circulating pump (4) are all connected to an external control system.

2. The heat dissipation system of a data center of claim 1, wherein: The two adjacent cabinets (21) are assembled from the side or back by bolts and nuts. The two adjacent cabinets (21) share the same heat-conducting plate (23). A sealing strip is fixed between the heat-conducting plate (23) and the cabinet (21).

3. The heat dissipation system of a data center of claim 2, wherein: Both the water supply pipe (251) and the return water pipe (252) are connected to the underground pipe. The inlet end of the water supply pipe (251) is connected to the outlet end of the circulating pump (4). The inlet end of the circulating pump (4) is connected to the outlet end of the hot water pipe of the heat exchanger (3). The outlet end of the return water pipe (252) is connected to the inlet end of the hot water pipe of the heat exchanger (3). The inlet and outlet of the cold water pipe of the heat exchanger (3) are connected to the external coolant supply system.

4. The heat dissipation system of a data center of claim 3, wherein: The heat pipe (231) has several fins (232) that are arranged in a linear array at its heat dissipation end.

5. The heat dissipation system of a data center of claim 4, wherein: Corner brackets (24) are fixedly connected to the four corners of the cabinet (21), and the copper tube cooling plates (25) are fixedly installed on the corner brackets (24) by washers and screws.

6. The data center cooling system according to claim 5, characterized in that: The bottom of the cabinet (21) is provided with a clearance hole to allow the water inlet pipe (251) and the water return pipe (252) to pass through.

7. The data center cooling system according to claim 6, characterized in that: The surface of the copper tube cooling plate (25) is covered with a thermally conductive silicone pad.

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