A wafer inspection device

Abstract

This invention belongs to the field of wafer inspection technology and discloses a wafer inspection device. The wafer inspection device includes a rotating mechanism and a detection mechanism. The rotating mechanism is used to clamp and rotate the wafer; the detection mechanism includes a base, a lever, a spraying assembly, and a detection element. The lever is rotatably connected to the base. The spraying end of the spraying assembly is aligned with a detection point on the wafer edge to spray fluid to the detection point. When there is a gap at the wafer edge, the fluid sprayed from the spraying end of the spraying assembly can pass through the gap and reach the first end of the lever, causing the lever to swing. The detection element is used to detect the swing state of the lever. This invention detects the swing state of the lever by spraying fluid onto the wafer edge, thereby determining whether there is a gap at the wafer edge. It can accurately and reliably detect gaps at the edges of transparent or semi-transparent wafers, has strong applicability, can improve the wafer alignment rate and avoid wafer damage, has a relatively simple structure, and low cost.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and in particular to a wafer inspection device. Background Technology

[0002] In semiconductor manufacturing processes, defects at the wafer edge have an increasingly significant impact on the process and product yield. Therefore, it is necessary to set up wafer inspection devices to detect defects at the wafer edge, so as to avoid affecting the wafer alignment rate and prevent wafer chipping and damage during subsequent clamping and processing.

[0003] Existing wafer inspection devices directly detect notches at the wafer edge using optical components. However, for transparent or semi-transparent wafers, such as glass wafers, light refraction occurs, affecting the accuracy of the measurement results. Furthermore, existing optical components for detecting notches at wafer edges are relatively complex and expensive. Utility Model Content

[0004] The purpose of this invention is to provide a wafer inspection device that can accurately and reliably detect notches on the edges of transparent or semi-transparent wafers. It has strong applicability, can improve the alignment rate of wafers and avoid wafer damage, and has a relatively simple structure and low cost.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A wafer inspection apparatus, comprising:

[0007] A rotating mechanism for clamping and rotating a wafer;

[0008] The detection mechanism includes a base, a lever, a spraying assembly, and a detection element. The lever is rotatably connected to the base. The spraying end of the spraying assembly is aligned with a detection point on the edge of the wafer and is used to spray fluid to the detection point on the wafer. When there is a gap on the edge of the wafer, the fluid sprayed from the spraying end of the spraying assembly can pass through the gap and spray to the first end of the lever, causing the lever to swing. The detection element is used to detect the swing state of the lever.

[0009] In some possible implementations, the jetting assembly includes a nozzle located on the side of the lever closer to the wafer, the nozzle being capable of jetting fluid onto the top surface of a first end of the lever.

[0010] In some possible implementations, the detection element is located on the side of the lever away from the wafer.

[0011] In some possible implementations, at the first and second ends of the lever, the detection element is used to detect the distance between one end of the lever and the detection element.

[0012] In some possible implementations, the base includes a first base body, and the wafer inspection device further includes a conveying mechanism disposed on the first base body for conveying the wafer along the length direction of the first base body.

[0013] In some possible implementations, the first seat body is provided with a through hole, the lever is disposed in the through hole, and there are rotating shafts on both sides of the lever. The hole wall of the through hole is provided with two connecting holes, and the two connecting holes are provided in a one-to-one correspondence with the two rotating shafts. The rotating shafts are rotatably connected to the connecting holes.

[0014] In some possible implementations, the conveying mechanism includes a drive member and two first belts, which are respectively located on opposite sides of the first base and extend along the length of the first base. The drive member is used to drive the two first belts to move, thereby moving the wafer.

[0015] In some possible implementations, the spraying assembly includes a nozzle and a third seat, the nozzle being adjustablely positioned on the third seat.

[0016] In some possible implementations, when the ejection end of the jetting assembly is aligned with a detection point on the edge of the wafer, the first end of the lever is close to the wafer and the second end of the lever is away from the wafer.

[0017] In some possible implementations, the first end of the lever is provided with a clearance groove for avoiding the wafer.

[0018] The beneficial effects of this utility model are:

[0019] The wafer inspection device provided by this utility model includes a rotating mechanism and an inspection mechanism. The rotating mechanism is used to clamp and rotate the wafer; the inspection mechanism includes a base, a lever, a spraying assembly, and an inspection element. During inspection, the rotating mechanism rotates the wafer, and the spraying end of the spraying assembly is aligned with the inspection point on the edge of the wafer, spraying fluid to the inspection point while maintaining a stable fluid flow rate. When the edge of the wafer is intact, the fluid is blocked by the wafer, and the lever remains stationary. When there is a notch on the edge of the wafer, i.e., a flat edge, a regular or irregular opening, the fluid sprayed from the spraying end of the spraying assembly can pass through the notch and reach the first end of the lever, causing the lever to swing. At this time, the lever deflects significantly and reaches the set range of the inspection element, which sends a trigger signal to other devices or the rotating mechanism. Therefore, this utility model combines the spraying assembly, lever, and inspection element, and by spraying fluid onto the edge of the wafer and detecting the swing state of the lever, it determines whether there is a notch on the edge of the wafer. It can accurately and reliably detect notches on the edges of transparent or semi-transparent wafers, has strong applicability, can improve the wafer alignment rate and avoid wafer damage, has a relatively simple structure, and is low in cost. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the wafer inspection device provided by this utility model;

[0021] Figure 2 This is a partial structural schematic diagram of the wafer inspection device provided by this utility model (when the edge of the wafer is detected to be intact);

[0022] Figure 3 This is a partial structural diagram of the wafer inspection device provided by this utility model (when a notch is detected at the edge of the wafer).

[0023] In the picture:

[0024] 1. Base; 11. First base body; 111. Through hole; 12. Second base body; 2. Lever; 21. Clearance groove; 3. Spray assembly; 31. Nozzle; 32. Third base body; 33. Conveying pipe; 4. Conveying mechanism; 41. First belt; 42. First shaft; 43. Second shaft; 44. Second belt;

[0025] 100. Chip. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0027] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0030] like Figures 1 to 3 As shown, this utility model provides a wafer inspection device, including a rotating mechanism and an inspection mechanism. The rotating mechanism is used to clamp and rotate the wafer 100. The inspection mechanism includes a base 1, a lever 2, a spraying assembly 3, and an inspection element. The lever 2 is rotatably connected to the base 1. The spraying end of the spraying assembly 3 is aligned with the inspection point on the edge of the wafer 100, and is used to spray fluid to the inspection point on the wafer 100. When there is a gap on the edge of the wafer 100, the fluid sprayed from the spraying end of the spraying assembly 3 can pass through the gap and spray to the first end of the lever 2, causing the lever 2 to swing. The inspection element is used to detect the swing state of the lever 2. Optionally, the fluid sprayed from the spraying end of the spraying assembly 3 is water, and the water flow rate is adjustable. The water flow rate is increased during inspection, and the spraying assembly 3 can be turned off or a small water flow can be maintained when not inspecting.

[0031] During testing, the rotating mechanism rotates the wafer 100, and the ejector end of the spray assembly 3 is aligned with the detection point on the edge of the wafer 100, spraying fluid onto the detection point while maintaining a constant fluid flow rate. Figure 2As shown, when the edge of the wafer 100 is intact, the fluid is blocked by the wafer 100, and the lever 2 remains stationary. It is understandable that some fluid may fall onto the lever 2, causing it to deflect. However, since the fluid flow rate remains constant, the lever 2 can maintain its deflected position and does not reach the set range of the detection element, so the detection element will not issue a trigger signal. When there is a notch at the edge of the wafer 100, i.e., a flat edge, a regular or irregular opening, the fluid ejected from the ejector end of the jet assembly 3 can pass through the notch and reach the first end of the lever 2, causing the lever 2 to swing. At this time, the lever 2 deflects significantly and reaches the set range of the detection element, which then issues a trigger signal, feeding the signal back to other devices or the rotating mechanism. Specifically, the detection element feeds the signal back to other devices to record the notch status of the wafer 100, or feeds the signal back to the rotating mechanism, which stops operating to mark the notch location. Therefore, this invention combines the spraying assembly 3, the lever 2, and the detection element. By spraying fluid onto the edge of the wafer 100 and detecting the swing state of the lever 2, it determines whether there is a notch at the edge of the wafer 100. This allows for accurate and reliable detection of notches at the edges of transparent or semi-transparent wafers 100, as well as accurate and reliable detection of opaque wafers 100. It has strong applicability, improves the alignment rate of the wafer 100, and avoids damage to the wafer 100. The structure is relatively simple and the cost is low. Furthermore, the wafer detection device does not directly contact the wafer 100, thus avoiding damage or secondary contamination to the wafer 100.

[0032] Optionally, in this embodiment, the spraying assembly 3 includes a nozzle 31 located on the side of the lever 2 near the wafer 100. The nozzle 31 can spray fluid onto the top surface of the first end of the lever 2. Specifically, the fluid sprayed from the nozzle 31 falls vertically to the top surface of the first end of the lever 2. With this configuration, the sprayed fluid falls onto the lever 2 from top to bottom, requiring a lower flow rate, and the fluid falls reliably due to gravity. In other embodiments, the nozzle 31 can spray fluid onto the bottom surface of the first end of the lever 2, that is, the sprayed fluid is sprayed onto the lever 2 from bottom to top. This allows the fluid sprayed from the nozzle 31 to pass through the gap at the edge of the wafer 100 and reach the first end of the lever 2, causing the lever 2 to swing.

[0033] Optionally, the detection element is located on the side of the lever 2 away from the wafer 100. This arrangement optimizes the spatial layout and avoids interference between the detection element and the spraying assembly 3. Further, in the first and second ends of the lever 2, the detection element is used to detect the distance between one end of the lever 2 and the detection element. During the swinging process of the lever 2, since the distances between both the first and second ends of the lever 2 and the detection element change, the distance of one end can be detected. In this embodiment, the detection element is used to detect the distance between the first end of the lever 2 and the detection element. Specifically, the detection element is a magnetic proximity switch. Furthermore, the base 1 includes a second base 12, and the magnetic proximity switch is waterproofly encapsulated within the second base 12. In other embodiments, the detection element is located on the side of the lever 2 closer to the wafer 100, used to detect the distance between the second end of the lever 2 and the detection element. In other embodiments, the detection element is an angle sensor used to measure the swing angle of the lever 2.

[0034] Optionally, in this embodiment, the base 1 includes a first base body 11, and the wafer inspection device further includes a conveying mechanism 4. The conveying mechanism 4 is disposed on the first base body 11 and is used to convey the wafer 100 along the length direction of the first base body 11. By providing the conveying mechanism 4, it is convenient to convey the wafer 100 to the inspection mechanism and the rotation mechanism. After the previous wafer 100 is inspected, the next wafer 100 can be inspected, improving inspection efficiency. In addition, the position of the wafer 100 can be adjusted by the conveying mechanism 4 to perform multiple inspections, avoiding the problem of the nozzle 31 being aligned with the point closest to the center of the notch line of the wafer 100, which would result in the notch not being detected and causing inaccurate inspection. Of course, the position of the wafer 100 can also be adjusted by the rotation mechanism to avoid the problem of inaccurate inspection.

[0035] Optionally, in this embodiment, the first base 11 has a through hole 111, the lever 2 is disposed within the through hole 111, and rotating shafts are provided on both opposite sides of the lever 2. The wall of the through hole 111 has two connecting holes, each corresponding to one of the two rotating shafts, which are rotatably connected to the connecting holes. Disposing the lever 2 within the through hole 111 saves space and makes the structure more compact. In this embodiment, rotating shafts on both opposite sides of the lever 2 enable rotation, ensuring smooth rotation. In other embodiments, a rotating shaft is provided on one side of the lever 2, and a connecting hole is provided on the wall of the through hole 111, with the rotating shaft rotatably connected to the connecting hole.

[0036] Optionally, the conveying mechanism 4 includes a drive unit and two first belts 41. The two first belts 41 are located on opposite sides of the first base 11 and extend along the length of the first base 11. The drive unit drives the two first belts 41 to move, thereby moving the wafer 100. This configuration enables stable conveying of the wafer 100 without affecting the detection of the wafer 100's edges. In this embodiment, the conveying mechanism 4 also includes a first shaft 42, a second shaft 43, a third shaft, and two second belts 44. The first shaft 42, the second shaft 43, and the third shaft are all rotatably connected to the first base 11. Each end of the first shaft 42, the second shaft 43, and the third shaft has a pulley. The two ends of the second belts 44 are connected to one of the pulleys of the first shaft 42 and the second shaft 43, respectively. The two ends of the first belts 41 are connected to the other pulley of the second shaft 43 and the pulley of the third shaft, respectively. The drive unit drives the first shaft 42 to rotate. This configuration is simple in structure and enables synchronous movement of the two first belts 41.

[0037] Optionally, the spray assembly 3 includes a nozzle 31 and a third seat 32, with the nozzle 31 positioned adjustablely on the third seat 32. This configuration allows for easy adjustment of the fluid's position on the lever 2 while maintaining a constant flow rate, thereby adjusting the lever 2's swing amplitude to ensure that the detector sends a trigger signal when the lever 2's deflection reaches the set range. Specifically, the third seat 32 has a waist-shaped hole along its length, and the nozzle 31 has a round hole. A bolt passes through the round hole and the waist-shaped hole and is threadedly connected to a nut. This configuration is simple and easy to adjust. Furthermore, the spray assembly 3 also includes a delivery pipe 33 for delivering fluid to the nozzle 31.

[0038] Optionally, in this embodiment, when the ejection end of the ejection assembly 3 is aligned with the detection point on the edge of the wafer 100, the first end of the lever 2 is positioned close to the wafer 100, and the second end of the lever 2 is positioned away from the wafer 100. This configuration increases the swing range of the lever 2 and prevents the second end of the lever 2 from contacting the bottom surface of the wafer 100 during swing, which would restrict the swing of the lever 2 and thus affect the detection results.

[0039] Optionally, the first end of the lever 2 is provided with a relief groove 21 to avoid the chip 100 and prevent the lever 2 from interfering with the chip 100 during the swinging process.

[0040] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer inspection device, characterized in that, include: A rotating mechanism for clamping and rotating the wafer (100); The detection mechanism includes a base (1), a lever (2), a spray assembly (3), and a detection element. The lever (2) is rotatably connected to the base (1). The spraying end of the spray assembly (3) is aligned with the detection point on the edge of the wafer (100) and is used to spray fluid to the detection point on the wafer (100). When there is a gap on the edge of the wafer (100), the fluid sprayed from the spraying end of the spray assembly (3) can pass through the gap and spray to the first end of the lever (2) and make the lever (2) swing. The detection element is used to detect the swing state of the lever (2).

2. The wafer inspection apparatus according to claim 1, wherein The spraying assembly (3) includes a nozzle (31) located on the side of the lever (2) near the wafer (100), and the nozzle (31) is capable of spraying fluid onto the top surface of the first end of the lever (2).

3. The wafer inspection apparatus according to claim 2, wherein The detection element is located on the side of the lever (2) away from the wafer (100).

4. The wafer inspection apparatus according to claim 3, wherein In the first and second ends of the lever (2), the detection element is used to detect the distance between one end of the lever (2) and the detection element.

5. The wafer inspection apparatus of claim 1, wherein The base (1) includes a first base body (11), and the wafer inspection device further includes a conveying mechanism (4), which is disposed on the first base body (11) and is used to convey the wafer (100) along the length direction of the first base body (11).

6. The wafer inspection apparatus according to claim 5, wherein The first seat (11) is provided with a through hole (111), the lever (2) is disposed in the through hole (111), and the lever (2) is provided with a rotating shaft on both sides. The hole wall of the through hole (111) is provided with two connecting holes, and the two connecting holes are provided in correspondence with the two rotating shafts. The rotating shafts are rotatably connected to the connecting holes.

7. The wafer inspection apparatus according to claim 5, wherein The conveying mechanism (4) includes a drive member and two first belts (41). The two first belts (41) are located on opposite sides of the first base (11) and both extend along the length direction of the first base (11). The drive member is used to drive the two first belts (41) to move, so as to move the wafer (100).

8. The wafer inspection apparatus of claim 1, wherein The spraying assembly (3) includes a nozzle (31) and a third seat (32), wherein the nozzle (31) is tunably positioned on the third seat (32).

9. The wafer inspection apparatus according to any one of claims 1 to 8, wherein When the ejection end of the ejection assembly (3) is aligned with the detection point on the edge of the wafer (100), the first end of the lever (2) is positioned close to the wafer (100), and the second end of the lever (2) is positioned away from the wafer (100).

10. The wafer inspection apparatus according to any one of claims 1 to 8, wherein The lever (2) has a clearance groove (21) at its first end to avoid the wafer (100).

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