Atomizer and electronic atomization device

Abstract

This application discloses an atomizer and an electronic atomizing device. The atomizer includes a first housing, an atomizing core, and an electrode plate installed within the first housing. The first housing has an atomization channel and a liquid storage chamber. The atomizing core is located in the atomization channel and communicates with the liquid storage chamber. The first housing has a first connecting portion with spaced-apart first and second through holes. The atomizing core has spaced-apart first and second leads. The surface of the electrode plate is covered with spaced-apart first electrode layers, second electrode layers, third electrode layers, and fourth electrode layers, all made of metal. The first electrode layer is positioned corresponding to the first through hole and electrically connected to the third electrode layer. The second electrode layer is positioned corresponding to the second through hole and electrically connected to the fourth electrode layer. The third electrode layer is welded to the first lead, and the fourth electrode layer is welded to the second lead. This atomizer has the advantage of low cost.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, and in particular to an atomizer and electronic atomization device. Background Technology

[0002] An electronic atomizing device is an electronic device that can vaporize stored e-liquid, medicinal liquid, or other atomizing liquid into vapor through electric heating or other methods. An electronic atomizing device typically includes an atomizing component and a power supply component. The atomizing component generally includes a reservoir for storing the atomizing liquid and an atomizing core for drawing in the atomizing liquid and vaporizing it. The power supply component generally includes a battery for powering the atomizing core and a control circuit board for controlling the working state of the atomizing core. Based on whether the atomizing component and the power supply component are detachable, electronic atomizing devices are mainly divided into disposable electronic atomizing devices where the two components are not detachable, and refillable electronic atomizing devices where the two components are detachable.

[0003] For cartridge-based electronic atomizing devices, to facilitate electrical connection between the atomizing component and the power supply component, both components typically have corresponding electrode structures. Specifically, the electrode structure of the atomizing component usually includes an electrode mounting base made of insulating material and a first conductive pin and a second conductive pin spaced apart within the mounting base. The positive terminal of the atomizing core is electrically connected to the first conductive pin via crimping (specifically, after one end of the positive terminal of the atomizing core extends into the electrode mounting base, the first conductive pin presses against that end to achieve reliable electrical contact) or welding. The negative terminal of the atomizing core is electrically connected to the second conductive pin via crimping (specifically, after one end of the negative terminal of the atomizing core extends into the electrode mounting base, the second conductive pin presses against that end to achieve reliable electrical contact) or welding. The electrode structure of the power supply component typically includes a first electrode spring and a second electrode spring spaced apart, both of which are electrically connected to the battery via a control circuit board. When the atomizing component and the power supply component are assembled into a complete electronic atomizing device, the first conductive pin makes electrical contact with the first electrode spring, and the second conductive pin makes electrical contact with the second electrode spring, thereby realizing the electrical connection between the atomizing component and the power supply component, so that the atomizing core can obtain electrical energy from the battery to perform atomization.

[0004] However, in the above-mentioned cartridge-type electronic atomizing device, the electrode structure of the atomizing component involves a large number of parts (including at least the first conductive pin, the second conductive pin, and the electrode mounting base), which increases the component cost and assembly cost of the atomizing component, thereby increasing the production cost of the electronic atomizing device. Utility Model Content

[0005] The main purpose of this application is to provide an atomizer and an electronic atomizing device, which aims to reduce the production cost of electronic atomizing devices.

[0006] To achieve the above objectives, in a first aspect, this application provides an electronic atomizing device, which includes:

[0007] An atomizing assembly includes a first housing, an atomizing core, and an electrode plate installed within the first housing. The first housing has an atomizing channel and a reservoir for storing atomizing liquid. The atomizing core is located on the airflow path of the atomizing channel and communicates with the reservoir. The first housing has a first connecting portion with a first through hole and a second through hole spaced apart. The atomizing core has a first pin and a second pin spaced apart. The surface of the electrode plate is covered with a first electrode layer, a second electrode layer, a third electrode layer, and a fourth electrode layer spaced apart. The first electrode layer, the second electrode layer, the third electrode layer, and the fourth electrode layer are all made of metal. The first electrode layer is positioned corresponding to the first through hole and electrically connected to the third electrode layer. The second electrode layer is positioned corresponding to the second through hole and electrically connected to the fourth electrode layer. The third electrode layer is welded to the first pin, and the fourth electrode layer is welded to the second pin.

[0008] A power supply assembly includes a second housing, a control circuit board, a battery electrically connected to the control circuit board, and a first electrode spring and a second electrode spring spaced apart. The control circuit board and the battery are both installed inside the second housing. The second housing has a second connecting portion, which is disposed opposite to and detachably connected to the first connecting portion. One end of the first electrode spring is located inside the second housing and electrically connected to the control circuit board. The other end of the first electrode spring protrudes from the second connecting portion, passes through the first through hole, and contacts the first electrode layer. One end of the second electrode spring is located inside the second housing and electrically connected to the control circuit board. The other end of the second electrode spring protrudes from the second connecting portion, passes through the second through hole, and contacts the second electrode layer.

[0009] In some embodiments, the electrode plate is a printed circuit board, and the electrode plate has a first conductive line and a second conductive line arranged at intervals. The first electrode layer is electrically connected to the third electrode layer through the first conductive line, and the second electrode layer is electrically connected to the fourth electrode layer through the second conductive line.

[0010] In some embodiments, the first electrode layer, the second electrode layer, the first conductive line, and the second conductive line are all located on the side surface of the electrode plate facing the first connection portion; the edge of the electrode plate is provided with a first notch and a second notch spaced apart, a portion of the third electrode layer covers the inner wall of the first notch, and another portion of the third electrode layer covers at least the side surface of the electrode plate facing the first connection portion; a portion of the fourth electrode layer covers the inner wall of the second notch, and another portion of the fourth electrode layer covers at least the side surface of the electrode plate facing the first connection portion; one end of the first pin extends into the first notch and is welded to the third electrode layer, and one end of the second pin extends into the second notch and is welded to the fourth electrode layer.

[0011] In some embodiments, the metallic material includes any one of gold, silver, and copper.

[0012] In some embodiments, the material of the first conductive line includes any one of gold, silver, and copper, and the material of the second conductive line includes any one of gold, silver, and copper.

[0013] In some embodiments, the first connecting portion is located between the top and bottom of the first housing, and the second connecting portion is located between the top and bottom of the second housing. The atomizing assembly further includes a liquid storage cup installed in the first housing. The liquid storage cup includes a cup body, a top cover having a first mounting through hole, an air duct having at least a portion of the atomizing channel, and a base having a second mounting through hole. The top cover is connected to the top of the cup body, and the base is connected to the bottom of the cup body. One end of the air duct is sealed and communicated with the first mounting through hole, and the other end is sealed and communicated with the second mounting through hole. The cup body, the top cover, the air duct, and the base together define the liquid storage cavity. At least one liquid inlet hole communicating with the liquid storage cavity is provided on the side wall of the air duct. The atomizing core is installed in the air duct, and the outer wall of the atomizing core covers the at least one liquid inlet hole. The base is made of an elastic sealing material, and the side wall of the base is provided with a mounting groove facing the first through hole and the second through hole. The electrode plate is snapped into the mounting groove.

[0014] In some embodiments, a positioning protrusion is provided on the groove wall facing the first through hole and the second through hole, and the electrode plate has a positioning hole adapted to the positioning protrusion. The positioning hole is disposed through the circuit board along the thickness direction of the circuit board, and the positioning protrusion is interference-fitted with the positioning hole.

[0015] In some embodiments, the top of the first housing is provided with a mouthpiece communicating with the atomizing channel, the bottom of the first housing is provided with an air inlet communicating with the atomizing channel, the first connecting portion is also provided with a third through hole corresponding to the positioning protrusion, the base is provided with a first microphone air passage communicating with the atomizing channel, one end of the first microphone air passage is located inside the positioning protrusion, the end of the positioning protrusion facing away from the mounting groove passes through the positioning hole and contacts the inner wall of the first connecting portion, and one end of the first microphone air passage is correspondingly connected to the third through hole; the power supply assembly also includes a sealed housing with a second microphone air passage. The sealing element includes a mounting portion and a connector portion protruding from one side of the mounting portion. The second microphone air passage is disposed through both the mounting portion and the connector portion. One end of the first electrode spring and one end of the second electrode spring both pass through the mounting portion and are soldered to the control circuit board. The end of the connector portion facing away from the mounting portion passes through the second connecting portion and contacts the first connecting portion. One end port of the second microphone air passage is connected to the third through hole. A microphone sensor is soldered on the control circuit board. The microphone sensor is disposed corresponding to the end port of the second microphone air passage facing away from the third through hole.

[0016] In some embodiments, the control circuit board is provided with a microphone through hole, which is connected to the end of the second microphone air passage opposite to the third through hole. The microphone sensor is soldered to the side of the control circuit board opposite to the seal and covers the microphone through hole.

[0017] In some embodiments, the base is made of any one of silicone, rubber, or silicone rubber.

[0018] In some embodiments, the material of the seal includes any one of silicone, rubber, and silicone rubber.

[0019] In some embodiments, the first microphone airway and the atomizing channel are arranged perpendicular to each other.

[0020] In some embodiments, a protrusion is provided on the bottom inner wall of the first housing, the protrusion height of the protrusion is 0.5 to 4 mm, the air inlet is provided through the protrusion, and the end port of the first microphone air passage opposite to the third through hole is located above the protrusion.

[0021] In some embodiments, the atomizing assembly further includes a liquid absorber made of a porous material, the liquid absorber being installed on the base at one end away from the cup body and in contact with the bottom inner wall of the first housing, the liquid absorber having a through hole, the through hole being located below the second mounting through hole and correspondingly communicating with the second mounting through hole and the air inlet, and the end port of the first microphone air passage away from the third through hole being located inside the through hole.

[0022] In some embodiments, the bottom wall of the base is provided with a first wire guide groove and a second wire guide groove spaced apart. One end of the first pin passes through the first wire guide groove and is welded to the third electrode layer. One end of the second pin passes through the second wire guide groove and is welded to the fourth electrode layer.

[0023] Secondly, this application also provides an atomizer for detachable combination with a power supply component in the electronic atomizing device described in any of the above embodiments, wherein the atomizer is an atomizing component in the electronic atomizing device described in any of the above embodiments.

[0024] Compared with the prior art, this application has at least the following beneficial effects:

[0025] In the technical solution provided in this application embodiment, the surface of the electrode plate is covered with a first electrode layer, a second electrode layer, a third electrode layer, and a fourth electrode layer, all made of metal and spaced apart from each other. The first electrode layer is electrically connected to the third electrode layer, and the second electrode layer is electrically connected to the fourth electrode layer. The first electrode layer is used for electrical contact with the first electrode spring of the power supply component, the second electrode layer is used for electrical contact with the second electrode spring of the power supply component, the third electrode layer is used for welding to the first pin of the atomizing core, and the fourth electrode layer is used for welding to the second pin of the atomizing core. Thus, by using an electrode plate integrating multiple metal layers as the electrode structure of the atomizing component, the atomizing core and the power supply component only need to be electrically connected through this single electrode plate component. Therefore, compared to the traditional technical solution that uses an electrode mounting base with multiple conductive pins as the electrode structure of the atomizing component, the electrode plate not only reduces the number of parts in the atomizing component's electrode structure but also eliminates the installation process of inserting multiple conductive pins into the electrode mounting base. This reduces the component cost and assembly cost of the atomizing component, thereby helping to reduce the production cost of the electronic atomizing device. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0027] Figure 1 This is a three-dimensional structural diagram of an electronic atomizing device in one embodiment of this application;

[0028] Figure 2 This is an exploded view of the electronic atomizing device in one embodiment of this application;

[0029] Figure 3 This is a top view of an electronic atomizing device according to an embodiment of this application;

[0030] Figure 4 for Figure 3 A cross-sectional view along the AA direction;

[0031] Figure 5 for Figure 3 A cross-sectional view along the BB direction;

[0032] Figure 6 for Figure 4 A magnified view of a portion of point C in the middle;

[0033] Figure 7 This is a schematic diagram showing the connection relationship between the control circuit board, the first electrode spring, the second electrode spring, the electrode plate, and the atomizing core in one embodiment of this application;

[0034] Figure 8 This is a three-dimensional structural diagram of the electrode plate in one embodiment of this application;

[0035] Figure 9 for Figure 8 The left view;

[0036] Figure 10 for Figure 9 Cross-sectional view along the DD direction;

[0037] Figure 11 for Figure 9 Cross-sectional view along the EE direction;

[0038] Figure 12 This is a three-dimensional structural diagram of the atomizing component in one embodiment of this application;

[0039] Figure 13 This is a schematic diagram of the internal structure of the atomizing component in one embodiment of this application;

[0040] Figure 14 This is an exploded view of the atomizing component in one embodiment of this application;

[0041] Figure 15 for Figure 14 Exploded view of the component indicated by the middle arrow F;

[0042] Figure 16 This is a three-dimensional structural diagram of the base in one embodiment of this application;

[0043] Figure 17 This is a three-dimensional structural diagram of a power supply component in one embodiment of this application;

[0044] Figure 18 This is an exploded view of the power supply component in one embodiment of this application;

[0045] Figure 19 This is a schematic diagram of the internal structure of a power supply component in one embodiment of this application.

[0046] Explanation of icon numbers:

[0047] 1-Atomizing assembly; 11-First housing; 110-First connecting part; 1101-First through hole; 1102-Second through hole; 1103-Third through hole; 111-First shell section; 1110-Liquid replenishment chamber; 112-Second shell section; 1120-Air inlet; 1121-Protrusion; 113-Nose; 12-Atomizing core; 121-First pin; 122-Second pin; 13-Electrode plate; 130-Positioning hole; 131-First electrode layer; 132-Second electrode layer; 133-Third electrode layer; 134-Fourth electrode layer; 135-First conductive line. 136-Second conductive line, 137-First notch, 138-Second notch; 14-Liquid reservoir, 140-Liquid reservoir, 141-Cup body, 142-Top cover, 1421-First mounting through hole, 143-Air passage tube, 1430-Atomization channel, 1431-Liquid inlet, 144-Base, 1440-Mounting groove, 1441-First microphone air passage, 1442-Second mounting through hole, 1443-Positioning protrusion, 1444-First wire passage groove, 1445-Second wire passage groove, 145-Liquid guide tube; 15-Liquid suction, 150-Through hole; 16-Connecting sleeve;

[0048] 2-Power supply assembly; 21-Second housing; 210-Second connection part; 22-Control circuit board; 220-Mic through hole; 23-Battery; 241-First electrode spring; 242-Second electrode spring; 25-Seal; 250-Second microphone air passage; 251-Mounting part; 252-Connector part; 26-Mic sensor.

[0049] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0051] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, top, bottom, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0052] Furthermore, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "setting," "installing," "connecting," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0053] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0054] Furthermore, if the terms "and / or," "and / or," or "and / or" appear throughout the text, their meaning includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Additionally, the specification of this application describes numerous technical features distributed across various technical solutions. Listing all possible combinations of technical features (i.e., technical solutions) would make the specification excessively lengthy. To avoid this problem, the various technical features disclosed in the above-described invention, the various technical features disclosed in the following embodiments and examples, and the various technical features disclosed in the accompanying drawings can be freely combined to form various new technical solutions (all of which are considered to have been described in this specification), unless such a combination of technical features is technically infeasible. For example, feature A+B+C is disclosed in one example, and feature A+B+D+E is disclosed in another example. Features C and D are equivalent technical means that serve the same purpose. Technically, only one of them needs to be used, and it is impossible to use them simultaneously. Feature E can be combined with feature C technically. Therefore, the solution A+B+C+D should not be considered as having been recorded because it is technically infeasible, while the solution A+B+C+E should be considered as having been recorded.

[0055] Please refer to Figure 1-9 One embodiment of this application provides an electronic atomizing device, which includes a detachably connected atomizing component 1 and a power supply component 2, wherein:

[0056] The atomizing assembly 1 includes a first housing 11, an atomizing core 12, and an electrode plate 13 installed within the first housing 11. The first housing 11 contains an atomizing channel 1430 and a storage chamber 140 for storing atomizing liquid. The atomizing core 12 is connected to the storage chamber 140, allowing it to draw atomizing liquid from the storage chamber 140 for heating and atomization. Furthermore, the atomizing core 12 is installed in the airflow path of the atomizing channel 1430, so that the vapor generated by the atomizing core 12 can be carried away by the suction airflow formed in the atomizing channel 1430 for inhalation by the user. The first housing 11 has a first connecting portion 110, which has a first through hole 1101 and a second through hole 1102 spaced apart. The atomizing core 12... The electrode plate 13 has a first pin 121 and a second pin 122 spaced apart. The surface of the electrode plate 13 is covered with a first electrode layer 131, a second electrode layer 132, a third electrode layer 133 and a fourth electrode layer 134 spaced apart from each other. The first electrode layer 131, the second electrode layer 132, the third electrode layer 133 and the fourth electrode layer 134 are all made of metal. The first electrode layer 131 is disposed corresponding to the first through hole 1101 and is electrically connected to the third electrode layer 133. The second electrode layer 132 is disposed corresponding to the second through hole 1102 and is electrically connected to the fourth electrode layer 134. The third electrode layer 133 is soldered to the first pin 121 and the fourth electrode layer 134 is soldered to the second pin 122.

[0057] The power supply assembly 2 includes a second housing 21, a control circuit board 22, a battery 23 electrically connected to the control circuit board 22, and a first electrode spring 241 and a second electrode spring 242 spaced apart. The control circuit board 22 and the battery 23 are both installed inside the second housing 21. The second housing 21 has a second connecting portion 210, which is opposite to the first connecting portion 110 and is detachably connected to the first connecting portion 110. One end of the first electrode spring 241 is located inside the second housing 21 and is electrically connected to the control circuit board 22. The other end of the first electrode spring 241 protrudes from the second connecting portion 210 and passes through the first through hole 1101 to contact the first electrode layer 131. One end of the second electrode spring 242 is located inside the second housing 21 and is electrically connected to the control circuit board 22. The other end of the second electrode spring 242 protrudes from the second connecting portion 210 and passes through the second through hole 1102 to contact the second electrode layer 132.

[0058] In this embodiment, it should be noted that, in specific implementation, the structure of the electronic atomizing device can be a top-bottom structure where "the atomizing component 1 is located above the power supply component 2," or a left-right structure where "the atomizing component 1 is located to the side of the power supply component 2." The specific structure of the electronic atomizing device can be determined according to actual usage needs, and this embodiment does not impose specific limitations on it. It can be understood that when the structure of the electronic atomizing device is a top-bottom structure where "the atomizing component 1 is located above the power supply component 2," the first connecting part 110 is located at the bottom of the first housing 11, and the second connecting part 210 is located at the top of the second housing 21; while when the structure of the electronic atomizing device is a left-right structure where "the atomizing component 1 is located to the side of the power supply component 2," the first connecting part 110 is located on the side of the first housing 11, and the second connecting part 210 is located on the side of the second housing 21. For example, as shown... Figure 1-2 , Figure 12 and Figure 17 As shown, the first connecting part 110 is the left side of the first housing 11, and the second connecting part 210 is the right side of the second housing 21. Furthermore, in specific implementations, the detachable connection between the first connecting part 110 and the second connecting part 210 can be a magnetic connection, a snap-fit ​​connection, a plug-in connection, etc., and this embodiment does not impose specific limitations on this.

[0059] In this embodiment, it should also be noted that, in specific implementation, the first housing 11 can be a one-piece structure or a separate structure assembled from different housing structures. Its specific structural form can be determined according to actual usage needs, and this embodiment does not impose specific limitations on it. Similarly, the second housing 21 can be a one-piece structure or a separate structure assembled from different housing structures. Its specific structural form can be determined according to actual usage needs, and this embodiment also does not impose specific limitations on it.

[0060] In this embodiment, based on the above structural design, by using an electrode plate 13 with multiple metal layers as the electrode structure of the atomizing component 1, the atomizing core 12 and the power supply component 2 can be electrically connected through only one component, the electrode plate 13. Therefore, compared with the traditional technical solution of using an electrode mounting base with multiple conductive pins as the electrode structure of the atomizing component 1, the setting of the electrode plate 13 not only reduces the number of parts of the electrode structure of the atomizing component 1, but also eliminates the installation process of inserting multiple conductive pins into the electrode mounting base, thereby reducing the part cost and assembly cost of the atomizing component 1, and thus helping to reduce the production cost of the electronic atomizing device.

[0061] Furthermore, please refer to the following: Figure 4 and Figure 6-11In some optional embodiments of this application, the electrode plate 13 is a printed circuit board. The electrode plate 13 has a first conductive line 135 and a second conductive line 136 spaced apart. The first electrode layer 131 is electrically connected to the third electrode layer 133 through the first conductive line 135, and the second electrode layer 132 is electrically connected to the fourth electrode layer 134 through the second conductive line 136.

[0062] In this embodiment, based on the above structural design, since printed circuit boards have the advantages of mature manufacturing process and low production cost, this embodiment uses a printed circuit board with conductive lines as the electrode plate 13, which not only facilitates the electrical connection between the first electrode layer 131 and the third electrode layer 133 and the electrical connection between the second electrode layer 132 and the fourth electrode layer 134, but also helps to reduce the production cost of the electrode plate 13.

[0063] In this embodiment, it should be noted that, in specific implementation, the third electrode layer 133 and the first electrode layer 131 can be located on the same side surface of the electrode plate 13, or on different surfaces of the electrode plate 13 (for example, the third electrode layer 133 is located on the side surface of the electrode plate 13 facing away from the first electrode layer 131); similarly, the fourth electrode layer 134 and the second electrode layer 132 can be located on the same side surface of the electrode plate 13, or on different surfaces of the electrode plate 13 (for example, the fourth electrode layer 134 is located on the side surface of the electrode plate 13 facing away from the second electrode layer 132). When the first electrode layer 131, the second electrode layer 132, the third electrode layer 133, and the fourth electrode layer 134 are all located on the same side surface of the electrode plate 13 along its own thickness direction (i.e., all located on the side surface of the electrode plate 13 facing the first connecting portion 110), the specific structural form of the electrode plate 13 can be a single-sided printed circuit board with conductive lines arranged on only one side surface. When the first electrode layer 131 and the second electrode layer 132 are both located on the side surface of the electrode plate 13 facing the first connecting portion 110, and the third electrode layer 133 and the fourth electrode layer 134 are both located on the side surface of the electrode plate 13 facing away from the first connecting portion 110, the specific structural form of the electrode plate 13 can be a double-sided printed circuit board with conductive lines arranged on both sides of the mutually back-to-back arrangement. Since the production cost of a double-sided printed circuit board is lower than that of a single-sided printed circuit board, in specific implementations, the structural form of the electrode plate 13 is preferably a single-sided printed circuit board.

[0064] In this embodiment, it should also be noted that, in specific implementation, the materials used for each electrode layer (i.e., the first electrode layer 131, the second electrode layer 132, the third electrode layer 133, and the fourth electrode layer 134) and each conductive line (i.e., the first conductive line 135 and the second conductive line 136) can be metals with good conductivity, such as gold, silver, and copper. Furthermore, the materials used for each electrode layer can be the same or different, and the materials used for each conductive line can also be the same or different. In addition, each electrode layer can be formed on the surface of the electrode plate 13 by electroplating, spraying, or other methods. In some optional embodiments, the metal material used for each electrode layer is gold, and the material used for each conductive line is copper.

[0065] Further, please refer to Figure 7-11 In some optional embodiments of this application, the first electrode layer 131, the second electrode layer 132, the first conductive line 135, and the second conductive line 136 are all located on the side surface of the electrode plate 13 facing the first connection portion 110; the edge of the electrode plate 13 is provided with a first notch 137 and a second notch 138 spaced apart (exemplarily, the first notch 137 and the second notch 138 are both provided on the lower edge of the electrode plate 13); a portion of the third electrode layer 133 covers the inner wall of the first notch 137, and another portion of the third electrode layer 133 covers at least the side surface of the electrode plate 13 facing the first connection portion 110; a portion of the fourth electrode layer 134 covers the inner wall of the second notch 138, and another portion of the fourth electrode layer 134 covers at least the side surface of the electrode plate 13 facing the first connection portion 110; one end of the first pin 121 extends into the first notch 137 and is welded to the third electrode layer 133, and one end of the second pin 122 extends into the second notch 138 and is welded to the fourth electrode layer 134.

[0066] In this embodiment, based on the above structural design, since the first notch 137 can limit one end of the first pin 121 to a certain extent, it is beneficial to improve the convenience and stability of welding between the third electrode layer 133 and the first pin 121. Similarly, since the second notch 138 can limit one end of the second pin 122 to a certain extent, it is beneficial to improve the convenience and stability of welding between the fourth electrode layer 134 and the second pin 122.

[0067] In this embodiment, it should be noted that in some specific application scenarios, when each electrode layer is made of gold foil and the metal material used for each conductive circuit is copper, the cost of the electrode plate 13 provided in this embodiment is only three cents RMB, while the cost of a traditional single conductive pin (the specific structure of the conductive pin is usually gold-plated on the entire outer surface of a copper alloy substrate) is five cents RMB. Therefore, using the electrode plate 13 provided in this embodiment as the electrode structure of the atomizing component 1 can effectively reduce the cost of the components used in the atomizing component 1. It is understood that, in specific implementation, the coverage area of ​​each electrode layer can be determined according to actual usage needs. For example, the coverage area of ​​the first electrode layer 131 only needs to meet the requirement of "covering one end of the first conductive line 135 and ensuring electrical contact with the first electrode spring 241," the coverage area of ​​the second electrode layer 132 only needs to meet the requirement of "covering one end of the second conductive line 136 and ensuring electrical contact with the second electrode spring 242," the coverage area of ​​the third electrode layer 133 only needs to meet the requirement of "covering the other end of the first conductive line 135 and ensuring soldering with the first pin 121," and the coverage area of ​​the fourth electrode layer 134 only needs to meet the requirement of "covering the other end of the second conductive line 136 and ensuring soldering with the second pin 122." This embodiment does not impose specific limitations on the specific coverage area of ​​each electrode layer. Theoretically, under the premise of meeting usage requirements, the smaller the coverage area of ​​each electrode layer, the more beneficial it is to reduce the usage cost of the electrode plate 13.

[0068] Furthermore, in some optional embodiments of this application, the structure of the electronic atomizing device can be a left-right structure in which "the atomizing component 1 is located to the side of the power supply component 2", and the structural composition of the atomizing component 1 can be as follows:

[0069] Specifically, please refer to the following: Figure 4-5 , Figure 12-15 and Figure 17The first connecting portion 110 is located between the top and bottom of the first housing 11 (i.e., the first connecting portion 110 is a side portion of the first housing 11), and the second connecting portion 210 is located between the top and bottom of the second housing 21 (i.e., the second connecting portion 210 is a side portion of the second housing 21). The atomizing assembly 1 also includes a liquid storage cup 14 installed inside the first housing 11. The liquid storage cup 14 includes a cup body 141, a top cover 142 having a first mounting through hole 1421, and a liquid storage cup 14 having at least partial atomization function. The airway tube 143 of channel 1430 and the base 144 having a second mounting through hole 1442 are connected to the top of the cup body 141 (optionally, the top cover 142 can be integrally connected to the top of the cup body 141 by injection molding), the base 144 is connected to the bottom of the cup body 141 (exemplarily, the upper end of the base 144 is interference-fitted into the bottom of the cup body 141), and the upper end of the airway tube 143 is sealed and connected to the first mounting through hole 1421 of the top cover 142 (exemplarily, the upper end of the airway tube 143 is sealed and connected to the first mounting through hole 1421 of the top cover 142). The end of the airway tube 143 can be sealed and connected to the first mounting through hole 1421 of the top cover 142 through a connecting sleeve 16 (the connecting sleeve 16 can be made of silicone, rubber, or silicone rubber). The lower end of the airway tube 143 is sealed and connected to the second mounting through hole 1442 of the base 144 (exemplarily, the lower end of the airway tube 143 is press-fitted to the second mounting through hole 1442 of the base 144). The cup body 141, the top cover 142, the airway tube 143, and the base 144 together define the liquid storage chamber 140. The side wall of the airway tube 143 is provided with a connection to the liquid storage chamber. At least one liquid inlet 1431 is connected to the air passage 140. The atomizing core 12 is installed in the air passage 143, and the outer wall of the atomizing core 12 covers at least one liquid inlet 1431 (that is, the atomizing core 12 is connected to the liquid storage chamber 140 through the liquid inlet 1431). The base 144 is made of an elastic sealing material (such as silicone, rubber or silicone rubber), and the side wall of the base 144 is provided with a mounting groove 1440 facing the first through hole 1101 and the second through hole 1102. The electrode plate 13 is snapped in the mounting groove 1440.

[0070] In this embodiment, the mounting groove 1440 facilitates the installation of the electrode plate 13 into the first housing 11. Specifically, when installing the electrode plate 13, it is only necessary to embed the electrode plate 13 into the mounting groove 1440, which is very convenient to operate.

[0071] Further, please refer to Figure 13-16In some optional embodiments of this application, a positioning protrusion 1443 is provided on the groove wall of the mounting groove 1440 facing the first through hole 1101 and the second through hole 1102. The electrode plate 13 has a positioning hole 130 that matches the positioning protrusion 1443. The positioning hole 130 is disposed through the circuit board along the thickness direction of the circuit board, and the positioning protrusion 1443 and the positioning hole 130 are interference-fitted. With this configuration, the positioning effect of the positioning protrusion 1443 can make the electrode plate 13 more stably fixed in the mounting groove 1440 and less likely to fall off.

[0072] Furthermore, please refer to the following: Figure 4-6 , Figure 12-13 as well as Figure 17-19 In some optional embodiments of this application, the top of the first housing 11 is provided with a mouthpiece 113 communicating with the atomizing channel 1430, the bottom of the first housing 11 is provided with an air inlet 1120 communicating with the atomizing channel 1430, the first connecting part 110 is also provided with a third through hole 1103 corresponding to the positioning protrusion 1443, the base 144 is provided with a first microphone air passage 1441 communicating with the atomizing channel 1430, one end of the first microphone air passage 1441 is located in the positioning protrusion 1443, the end of the positioning protrusion 1443 facing away from the mounting groove 1440 passes through the positioning hole 130 and contacts the inner wall of the first connecting part 110, and one end of the first microphone air passage 1441 is correspondingly connected with the third through hole 1103; the power assembly 2 also includes a sealing member 2 having a second microphone air passage 250. 5. The material of the sealing element 25 can be a sealing material such as silicone, rubber, or silicone rubber. The sealing element 25 includes a mounting part 251 and a connector part 252 protruding from one side of the mounting part 251. The second microphone air passage 250 is provided to pass through both the mounting part 251 and the connector part 252. One end of the first electrode spring 241 and one end of the second electrode spring 242 pass through the mounting part 251 and are welded to the control circuit board 22. The end of the connector part 252 facing away from the mounting part 251 passes through the second connecting part 210 and contacts the first connecting part 110. One end of the second microphone air passage 250 is connected to the third through hole 1103. A microphone sensor 26 is welded on the control circuit board 22. The microphone sensor 26 is provided to correspond to the end of the second microphone air passage 250 facing away from the third through hole 1103.

[0073] In this embodiment, based on the above structural design, the level of intelligence in the operation of the electronic atomization device can be improved, thereby enhancing the user experience. Specifically, when a user bites the mouthpiece 113 to inhale, a suction airflow is formed along the path connecting the air inlet 1120, the atomization channel 1430, and the mouthpiece 113. This creates a negative pressure along the path connecting the first microphone airway 1441, the third through-hole 1103, and the second microphone airway 250. This negative pressure triggers the microphone sensor 26 to send a suction signal to the control circuit board 22, indicating that the user is inhaling. When the control circuit board 22 receives this suction signal, it connects the battery 23 to the first electrode spring 241 and the second electrode spring 242, thereby energizing the atomizing core 12 and heating and atomizing the atomized liquid it adsorbs into vapor. When the suction airflow passes through the atomizing core 12, the vapor produced by the atomizing core 12 is carried away by the suction airflow and eventually discharged to the mouthpiece 113 for the user to inhale. When the user stops inhaling, the airflow and negative pressure disappear, causing the microphone sensor 26 to send a stop signal to the control circuit board 22, indicating that the user has stopped inhaling. When the control circuit board 22 receives this stop signal, it disconnects the electrical connection between the battery 23 and the first electrode spring 241 and the second electrode spring 242, thereby de-energizing the atomizing coil 12 and stopping its operation. In other words, the user can control the working state of the atomizing coil 12 simply by inhaling through their mouth, making it very convenient to use.

[0074] In this embodiment, it should be noted that the specific installation position of the microphone sensor 26 on the control circuit board 22 can be determined according to the actual situation. For example, in some optional embodiments, when there is sufficient installation space between the control circuit board 22 and the second connecting part 210, the microphone sensor 26 can be disposed on the side surface of the control circuit board 22 facing the second connecting part 210 and interference-fitted into the end port of the second microphone air passage 250 away from the third through hole 1103. As another example, in some optional embodiments, when the installation space between the control circuit board 22 and the second connecting part 210 is relatively narrow and insufficient to simultaneously install the seal 25 and the microphone sensor 26, the microphone sensor 26 can be disposed on the side surface of the control circuit board 22 away from the seal 25. Specifically, such as... Figure 4 , Figure 6 and Figure 19 As shown, the control circuit board 22 is provided with a microphone through hole 220, which is connected to the end port of the second microphone air passage 250 opposite to the third through hole 1103. The microphone sensor 26 is soldered to the side of the control circuit board 22 opposite to the seal 25 and covers the microphone through hole 220.

[0075] Further, please refer to Figure 4 and Figure 13 In some optional embodiments of this application, the first microphone airway 1441 and the atomizing channel 1430 are arranged perpendicular to each other. Exemplarily, the first microphone airway 1441 is arranged along... Figure 13 The atomizing channel 1430 is set horizontally in the left and right direction. Figure 13 The atomizer is vertically arranged in the vertical direction. With this arrangement, when the atomizing liquid leaks from the atomizing core 12, the atomizing liquid falling from the atomizing channel 1430 is unlikely to enter the first microphone channel, thus effectively preventing the microphone sensor 26 from being damaged due to the atomizing liquid flowing into the first microphone channel and eventually soaking into it.

[0076] Furthermore, please refer to the following: Figure 4 , Figure 6 and Figure 13 In some optional embodiments of this application, a protrusion 1121 is provided on the bottom inner wall of the first housing 11. The protrusion height of the protrusion 1121 is 0.5mm to 4mm. An air inlet 1120 is provided through the protrusion 1121. One end of the first microphone air passage 1441 opposite to the third through hole 1103 is located above the protrusion 1121. With this configuration, when the atomizing liquid leaks from the atomizing core 12, on the one hand, the atomizing liquid falling from the atomizing channel 1430 will first accumulate on the bottom inner wall of the first housing 11. Only when the atomizing liquid accumulates to a level higher than the protrusion height of the protrusion 1121 will it leak to the outside through the air inlet 1120, thus delaying the time when the atomizing liquid leaks to the outside through the air inlet 1120 and pollutes the external environment. On the other hand, since the end of the first microphone air passage 1441 opposite to the third through hole 1103 is located above the protrusion 1121, and when the atomizing liquid accumulates to a level higher than the protrusion height of the protrusion 1121, the atomizing liquid will be discharged to the outside through the air inlet 1120. Therefore, the atomizing liquid accumulated on the bottom inner wall of the first housing 11 is also unlikely to enter the first microphone channel, thus better preventing the microphone sensor 26 from being damaged due to contact with the atomizing liquid.

[0077] Furthermore, please refer to the following: Figure 4-6 and Figure 13-16In some optional embodiments of this application, the atomizing component 1 further includes a liquid absorber 15 made of a porous material (such as fiber cotton, porous ceramic, sponge, etc.). The liquid absorber 15 is installed on the end of the base 144 away from the cup body 141 and in contact with the bottom inner wall of the first housing 11. The liquid absorber 15 has a through hole 150, which is located below the second mounting through hole 1442. The through hole 150 is connected to the second mounting through hole 1442 and the air inlet 1120 respectively. The end port of the first microphone air passage 1441 away from the third through hole 1103 is located in the through hole 150. With this configuration, when the atomizing liquid leaks from the atomizing core 12, the atomizing liquid dripping onto the bottom inner wall of the first housing 11 will be absorbed by the liquid absorber 15. This not only effectively prevents the atomizing liquid from leaking to the outside through the air inlet 1120, but also better prevents the microphone sensor 26 from being damaged by contact with the atomizing liquid.

[0078] Furthermore, please refer to the following: Figure 4 , Figure 7-11 as well as Figure 14-16 In some optional embodiments of this application, the bottom wall of the base 144 is provided with a first wire guide groove 1444 and a second wire guide groove 1445 spaced apart. One end of the first pin 121 passes through the first wire guide groove 1444 and is welded to the third electrode layer 133. One end of the second pin 122 passes through the second wire guide groove 1445 and is welded to the fourth electrode layer 134. With this configuration, after the electrode plate 13 is welded to the pins of the atomizing core 12 and the electrode plate 13 is fixed in the mounting groove 1440 of the base 144, part of the first pin 121 can be accommodated in the first wire guide groove 1444, and part of the second pin 122 can be accommodated in the second wire guide groove 1445. This effectively separates the first pin 121 and the second pin 122, thereby reducing the risk of short circuit in the atomizing core 12 due to cross contact between the first pin 121 and the second pin 122.

[0079] Further, please refer to Figure 4-5 and Figure 13-15In some optional embodiments of this application, the first housing 11 includes a first housing portion 111 and a second housing portion 112. The top of the first housing portion 111 is provided with a suction nozzle 113. The interior of the first housing portion 111 is provided with a replenishment chamber 1110 capable of pre-filling atomizing liquid. The bottom of the first housing portion 111 and the top of the second housing portion 112 are detachably connected by means of snap-fit ​​connections or other methods. A liquid storage cup 14 is disposed inside the second housing portion 112. The upper end of the top cover 142 is provided with a liquid guide tube 145. The replenishment chamber 111... The atomizing component 1 is connected to the storage chamber 140 via the liquid guide tube 145. When the atomizing liquid in the storage chamber 140 is consumed by the atomizing core 12 and becomes less, the atomizing liquid in the replenishment chamber 1110 can flow into the storage chamber 140 through the liquid guide tube 145 under the action of gravity to replenish it. The volume of the replenishment chamber 1110 can be set to 1 to 5 times the volume of the storage chamber 140. For example, assuming the volume of the storage chamber 140 is 2 ml, the volume of the replenishment chamber 1110 can be set to 2 ml to 10 ml. This setting can increase the atomizing liquid storage capacity of the atomizing component 1, thereby helping to increase the service life of the atomizing component 1.

[0080] Correspondingly, embodiments of this application also provide an atomizer, which is used in conjunction with the power supply component 2 mentioned in any of the above embodiments (such as...). Figure 1-4 and Figure 17-19 (As shown) can be detachably combined and used, and the atomizer is the atomizing component 1 mentioned in any of the above embodiments (such as... Figure 1-16 (As shown).

[0081] In this embodiment, it should be noted that other contents of the atomizer provided in this embodiment can be referred to the description of the atomizing component 1 in the above embodiment of the electronic atomizing device, and will not be repeated here.

[0082] It should be noted that other aspects of the atomizer and electronic atomizing device disclosed in this application that are not described can be found in the prior art, and will not be repeated here.

[0083] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. An electronic atomizing device, characterized in that, include: An atomizing assembly includes a first housing, an atomizing core, and an electrode plate installed within the first housing. The first housing has an atomizing channel and a reservoir for storing atomizing liquid. The atomizing core is located on the airflow path of the atomizing channel and communicates with the reservoir. The first housing has a first connecting portion with a first through hole and a second through hole spaced apart. The atomizing core has a first pin and a second pin spaced apart. The surface of the electrode plate is covered with a first electrode layer, a second electrode layer, a third electrode layer, and a fourth electrode layer spaced apart. The first electrode layer, the second electrode layer, the third electrode layer, and the fourth electrode layer are all made of metal. The first electrode layer is positioned corresponding to the first through hole and electrically connected to the third electrode layer. The second electrode layer is positioned corresponding to the second through hole and electrically connected to the fourth electrode layer. The third electrode layer is welded to the first pin, and the fourth electrode layer is welded to the second pin. A power supply assembly includes a second housing, a control circuit board, a battery electrically connected to the control circuit board, and a first electrode spring and a second electrode spring spaced apart. The control circuit board and the battery are both installed inside the second housing. The second housing has a second connecting portion, which is disposed opposite to and detachably connected to the first connecting portion. One end of the first electrode spring is located inside the second housing and electrically connected to the control circuit board. The other end of the first electrode spring protrudes from the second connecting portion, passes through the first through hole, and contacts the first electrode layer. One end of the second electrode spring is located inside the second housing and electrically connected to the control circuit board. The other end of the second electrode spring protrudes from the second connecting portion, passes through the second through hole, and contacts the second electrode layer.

2. The electronic atomizing device as described in claim 1, characterized in that, The electrode plate is a printed circuit board. The electrode plate has a first conductive line and a second conductive line arranged at intervals. The first electrode layer is electrically connected to the third electrode layer through the first conductive line, and the second electrode layer is electrically connected to the fourth electrode layer through the second conductive line.

3. The electronic atomizing device as described in claim 2, characterized in that, The first electrode layer, the second electrode layer, the first conductive line, and the second conductive line are all located on the side surface of the electrode plate facing the first connection portion. The edge of the electrode plate is provided with a first notch and a second notch spaced apart. A portion of the third electrode layer covers the inner wall of the first notch, and another portion of the third electrode layer covers at least the side surface of the electrode plate facing the first connection portion. A portion of the fourth electrode layer covers the inner wall of the second notch, and another portion of the fourth electrode layer covers at least the side surface of the electrode plate facing the first connection portion. One end of the first pin extends into the first notch and is welded to the third electrode layer. One end of the second pin extends into the second notch and is welded to the fourth electrode layer. And / or, the metallic material includes any one of gold, silver, and copper; And / or, the material of the first conductive line includes any one of gold, silver, and copper, and the material of the second conductive line includes any one of gold, silver, and copper.

4. The electronic atomizing device as described in any one of claims 1-3, characterized in that, The first connecting portion is located between the top and bottom of the first housing, and the second connecting portion is located between the top and bottom of the second housing. The atomizing assembly further includes a liquid storage cup installed inside the first housing. The liquid storage cup includes a cup body, a top cover having a first mounting through hole, an air duct having at least a portion of the atomizing channel, and a base having a second mounting through hole. The top cover is connected to the top of the cup body, and the base is connected to the bottom of the cup body. One end of the air duct is sealed and connected to the first mounting through hole, and the other end is sealed and connected to the second mounting through hole. The cup body, the top cover, the air duct, and the base together define the liquid storage cavity. At least one liquid inlet hole communicating with the liquid storage cavity is opened on the side wall of the air duct. The atomizing core is installed inside the air duct, and the outer wall of the atomizing core covers the at least one liquid inlet hole. The base is made of an elastic sealing material, and the side wall of the base is provided with a mounting groove facing the first through hole and the second through hole. The electrode plate is snapped into the mounting groove.

5. The electronic atomizing device as described in claim 4, characterized in that, The mounting groove has a positioning protrusion on the groove wall facing the first through hole and the second through hole. The electrode plate has a positioning hole that matches the positioning protrusion. The positioning hole is set through the circuit board along the thickness direction of the circuit board. The positioning protrusion and the positioning hole are interference fit.

6. The electronic atomizing device as described in claim 5, characterized in that, The top of the first housing is provided with a mouthpiece that communicates with the atomizing channel, the bottom of the first housing is provided with an air inlet that communicates with the atomizing channel, the first connecting part is also provided with a third through hole corresponding to the positioning protrusion, the base is provided with a first microphone air passage that communicates with the atomizing channel, one end of the first microphone air passage is located inside the positioning protrusion, the end of the positioning protrusion away from the mounting groove passes through the positioning hole and contacts the inner wall of the first connecting part, and one end of the first microphone air passage is correspondingly connected to the third through hole; The power supply assembly further includes a seal with a second microphone air passage. The seal includes a mounting portion and a connector portion protruding from one side of the mounting portion. The second microphone air passage passes through both the mounting portion and the connector portion. One end of the first electrode spring and one end of the second electrode spring both pass through the mounting portion and are soldered to the control circuit board. The end of the connector portion facing away from the mounting portion passes through the second connecting portion and contacts the first connecting portion. One end port of the second microphone air passage is connected to the third through hole. A microphone sensor is soldered onto the control circuit board. The microphone sensor is positioned corresponding to the end port of the second microphone air passage facing away from the third through hole.

7. The electronic atomizing device as described in claim 6, characterized in that, The control circuit board is provided with a microphone through hole, which is connected to the end of the second microphone air passage opposite to the third through hole. The microphone sensor is welded to the side of the control circuit board opposite to the seal and covers the microphone through hole. And / or, the base is made of any one of silicone, rubber, or silicone rubber, and the seal is made of any one of silicone, rubber, or silicone rubber.

8. The electronic atomizing device as described in claim 6, characterized in that, The first microphone airway and the atomizing channel are arranged perpendicularly to each other; And / or, the bottom inner wall of the first housing is provided with a protrusion, the protrusion height of the protrusion is 0.5 to 4 mm, the air inlet is provided through the protrusion, and the end port of the first microphone air passage opposite to the third through hole is located above the protrusion; And / or, the atomizing component further includes a liquid absorber made of porous material, the liquid absorber being installed on the end of the base away from the cup body and in contact with the bottom inner wall of the first housing, the liquid absorber having a through hole, the through hole being located below the second mounting through hole and correspondingly communicating with the second mounting through hole and the air inlet, and the end port of the first microphone air passage away from the third through hole being located inside the through hole.

9. The electronic atomizing device according to any one of claims 5-8, characterized in that, The base has a first wire guide groove and a second wire guide groove spaced apart on its bottom wall. One end of the first pin passes through the first wire guide groove and is welded to the third electrode layer. One end of the second pin passes through the second wire guide groove and is welded to the fourth electrode layer.

10. An atomizer, characterized in that, For use in detachable combination with a power supply component in an electronic atomizing device as described in any one of claims 1-9, wherein the atomizer is an atomizing component in an electronic atomizing device as described in any one of claims 1-9.

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