MOS tube and transformer integrated heat dissipation structure
By integrating the MOSFET and transformer into a single heat dissipation structure, the problems of large space occupation and poor heat dissipation in power supply design are solved, achieving efficient heat dissipation and insulation protection, and making it suitable for power supply modules with limited space.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GOSPELL DIGITAL TECHNOLOGY CO LTD
- Filing Date
- 2025-06-04
- Publication Date
- 2026-07-10
AI Technical Summary
In conventional power supply designs, the independent layout of MOSFETs and transformers occupies a large space, has poor heat dissipation, and the exposed transformer on the PCB board is prone to scratching the insulation layer, affecting its lifespan and overall performance.
The system adopts an integrated heat dissipation structure for MOSFETs and transformers. Thermal conductive adhesive is used to fill the gap between the transformer and the transformer tank. Thermal conductive sheets are attached to the sides of the MOSFETs and the transformer tank. Multiple MOSFETs and transformers are integrated inside the transformer tank, and the lead wire body is encapsulated in the cavity.
It improves heat dissipation area and efficiency, reduces space occupation, and lowers the risk of scratching the lead wire insulation layer, making it suitable for power modules with limited space.
Smart Images
Figure CN224480855U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power supply heat dissipation technology, specifically to an integrated heat dissipation structure for a MOSFET and a transformer. Background Technology
[0002] Conventional power supply designs feature separate MOSFETs and transformers, which take up a lot of space and result in large power supply products. They also rely mainly on cooling fans for heat dissipation, which has a small heat dissipation area and poor heat dissipation effect. Long-term excessively high temperatures can affect the lifespan of MOSFETs and transformers and the overall performance of the system. In addition, the transformer is exposed on the PCB board, and its outer surface insulation layer is easily scratched during assembly, causing short circuits. Therefore, there is an urgent need for an integrated heat dissipation structure for MOSFETs and transformers to solve the above problems. Utility Model Content
[0003] In view of this, an integrated heat dissipation structure for MOSFETs and transformers that is highly efficient in heat dissipation, compact in structure and occupies little space, and has insulation protection is provided.
[0004] An integrated heat dissipation structure for MOSFETs and transformers is disclosed, which integrates and dissipates heat from multiple MOSFETs and multiple transformers. The structure includes a transformer tank for accommodating the transformers, multiple positioning covers on top of the transformer tank, thermally conductive adhesive, and multiple thermally conductive pads. The transformer tank is internally divided into multiple chambers by multiple partitions, with each transformer housed in a corresponding chamber. Gaps exist between the inner walls of the chambers and the outer periphery of the transformers. The thermally conductive adhesive is injected into the transformer tank, filling the gaps to integrate the transformer tank and each transformer. Each MOSFET and a corresponding thermally conductive pad are fastened to the side of the transformer tank using fasteners. One side of the thermally conductive pad is in contact with the MOSFET, and the other side is in contact with the side of the transformer tank.
[0005] Furthermore, the positioning cover plate has a transformer positioning port in the middle, the transformer slot has a top opening, the upper part of the transformer protrudes from the top opening and is positioned by the transformer positioning port, the left and right sides of the positioning cover plate have recesses, and the recesses of two adjacent positioning cover plates form a glue venting port, and the thermally conductive adhesive is injected from the glue venting port.
[0006] Furthermore, the plurality of the positioning cover plates are arranged above the transformer tank along the length of the transformer tank.
[0007] Furthermore, the width of the positioning cover plate is greater than the distance between the two inner walls of the transformer tank in the width direction and less than the distance between the two outer walls, and the sum of the lengths of each positioning cover plate is less than or equal to the length of the transformer tank.
[0008] Furthermore, a connecting strip is provided on the outer edge of the opening at the top of the transformer tank, and a buckle is provided on the positioning cover plate corresponding to the position of the connecting strip. The transformer tank and the positioning cover plate are engaged and connected by the connecting strip and the buckle.
[0009] Furthermore, the connecting strip has an angled surface facing the buckle, which guides the buckle to slide and engage with the connecting strip.
[0010] Furthermore, the positioning cover plate is provided with lead wire holes, and the transformer leads extend sequentially from the top opening and the lead wire holes.
[0011] Furthermore, the transformer tank is a thermally conductive metal or a thermally conductive non-metal, the thermally conductive adhesive is silicone AB adhesive, the thermally conductive sheet is a ceramic substrate, and the positioning cover is a plastic cover.
[0012] Furthermore, the thermal pad is coated with thermal grease on both sides.
[0013] Furthermore, the area of the heat-conducting plate covers the main body area of the MOS transistor, and the main body of the MOS transistor and the heat-conducting plate do not protrude from the side edge of the transformer tank.
[0014] Compared with the prior art, the present invention has at least the following beneficial effects:
[0015] First, this integrated heat dissipation structure of MOSFET and transformer uses thermally conductive adhesive to fill the gap between the transformer and the transformer tank to conduct the heat of the entire transformer to the transformer tank. A thermally conductive sheet is attached between the side of the transformer tank and the MOSFET, and the heat of the MOSFET is also conducted to the transformer tank through the thermally conductive sheet. Compared with traditional cooling fan heat dissipation, the heat dissipation area of MOSFET and transformer is increased, the heat dissipation effect is better, and the heat dissipation is more efficient.
[0016] Secondly, this integrated heat dissipation structure of MOSFET and transformer integrates multiple transformers in the internal cavity of the transformer tank, and multiple MOSFETs are mounted on the side of the transformer tank, realizing the integration of MOSFET and transformer. The structure is compact and occupies little space, making it especially suitable for power modules with limited space.
[0017] Third, this integrated heat dissipation structure of MOSFET and transformer encapsulates the transformer lead body in the cavity with thermally conductive adhesive, leaving only lead holes in the positioning cover for the lead ends to protrude. Compared with the traditional method of exposing the transformer on the PCB board, this avoids tools directly contacting the surface of the transformer lead body during handling or assembly, reducing the risk of scratching the lead insulation layer. Attached Figure Description
[0018] Figure 1This is a three-dimensional schematic diagram of an integrated heat dissipation structure for a MOS transistor and transformer according to an embodiment of the present invention.
[0019] Figure 2 This is an exploded view of an integrated heat dissipation structure for a MOS transistor and transformer according to an embodiment of the present invention.
[0020] In the picture,
[0021] 1. MOSFET; 2. Transformer; 3. Transformer tank; 4. Positioning cover; 5. Heat-conducting plate; 6. Partition plate; 7. Chamber; 8. Transformer positioning port; 9. Glue vent; 10. Connecting strip; 11. Buckle; 12. Lead hole; 13. Lead wire. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0023] Please see Figures 1 to 2 This illustration shows an embodiment of the present invention providing an integrated heat dissipation structure for MOSFETs and transformers, used to integrate and dissipate heat from multiple MOSFETs 1 and multiple transformers 2. It includes a transformer tank 3 for accommodating the multiple transformers 2, multiple positioning covers 4 covering the transformer tank 3, thermally conductive adhesive, and multiple thermally conductive sheets 5. The transformer tank 3 is internally divided into multiple chambers 7 by multiple partition plates 6. Each transformer 2 is installed in a corresponding chamber 7. A gap exists between the inner wall of each chamber 7 and the outer periphery of the transformer 2. The thermally conductive adhesive is injected into the transformer tank 3, filling the gaps to integrate the transformer tank 3 with each transformer 2. Each MOSFET 1 and a corresponding thermally conductive sheet 5 are fastened to the side of the transformer tank 3 using fasteners. One side of the thermally conductive sheet 5 is in contact with the MOSFET 1, and the other side is in contact with the side of the transformer tank 3.
[0024] In some specific embodiments, during the assembly of the integrated heat dissipation structure, multiple transformers 2 are first assembled one by one into the corresponding chambers 7 of the transformer tank 3. Then, thermally conductive silicone AB glue is poured into the chambers 7 through the glue venting port 9. After adjusting the position of the transformers 2, the positioning cover plate 4 is covered. The positioning cover plate 4 is engaged with the transformer tank 3 to form a transformer assembly. The transformer assembly is then baked to cure the thermally conductive silicone AB glue. Finally, the heat-conducting sheet 5 and the MOS tube 1 are fixed to the transformer tank 3 with screws to complete the assembly. More specifically, the gas generated during the curing process of the AB glue is discharged from the glue venting port 9. The partition plate 6 separating each chamber 7 can be an integrally formed structure with the transformer tank 3, or it can be fixed inside the transformer tank 3 by welding or other fixing methods to form an integrated structure.
[0025] Specifically, the positioning cover plate 4 has a transformer positioning port 8 in the middle, the transformer tank 3 has a top opening, the upper part of the transformer 2 protrudes from the top opening and is positioned by the transformer positioning port 8, the left and right sides of the positioning cover plate 4 have recesses, and the recesses of two adjacent positioning cover plates 4 form a glue venting port 9, and the thermally conductive adhesive is injected from the glue venting port 9.
[0026] Specifically, the plurality of positioning cover plates 4 are arranged above the transformer tank 3 along the length direction of the transformer tank 3.
[0027] Specifically, the width of the positioning cover plate 4 is greater than the distance between the two inner walls of the transformer tank 3 in the width direction and less than the distance between the two outer walls, and the sum of the lengths of each positioning cover plate 4 is less than or equal to the length of the transformer tank 3.
[0028] Specifically, a connecting strip 10 is provided on the outer edge of the opening at the top of the transformer tank 3, and a buckle 11 is provided on the positioning cover plate 4 corresponding to the position of the connecting strip 10. The transformer tank 3 and the positioning cover plate 4 are engaged and connected by the connecting strip 10 and the buckle 11.
[0029] More specifically, the connecting strip 10 has an angled surface facing the buckle 11, which is used to guide the buckle 11 to slide and engage with the connecting strip 10.
[0030] More specifically, the positioning cover plate 4 is provided with lead wire hole 12, and the lead wire 13 of the transformer 2 extends out from the top opening and the lead wire hole 12 in sequence.
[0031] Specifically, the transformer tank 3 is a thermally conductive metal or a thermally conductive non-metal, the thermally conductive adhesive is silicone AB adhesive, the thermally conductive sheet 5 is a ceramic substrate, and the positioning cover plate 4 is a plastic cover plate.
[0032] Specifically, the heat-conducting sheet 5 is coated with thermal grease on both sides.
[0033] Specifically, the area of the heat-conducting plate 5 covers the main body area of the MOS transistor 1, and the main body of the MOS transistor 1 and the heat-conducting plate 5 do not protrude from the side edge of the transformer tank 3 to avoid interfering with other electronic components.
[0034] In summary, this integrated heat dissipation structure of MOSFET and transformer conducts the heat of the entire transformer 2 to the transformer tank 3 by filling the gap between the transformer 2 and the transformer tank 3 with thermally conductive adhesive. Furthermore, the heat-conducting plate 5 is attached between the side of the transformer tank 3 and the MOSFET 1, allowing the heat of the MOSFET 1 to also be conducted to the transformer tank 3 through the heat-conducting plate 5. Compared with traditional cooling fans, this structure increases the heat dissipation area of the MOSFET 1 and transformer 2, resulting in better and more efficient heat dissipation. Moreover, multiple transformers 2 are integrated into the internal cavity of the transformer tank 3, and multiple MOSFETs 1 are mounted on the side of the transformer tank 3, achieving integration of the MOSFETs 1 and transformer 2. This results in a compact structure with minimal space requirements, making it particularly suitable for power modules with limited space. Additionally, this heat dissipation structure encapsulates the main body of the transformer 2's lead wire 13 within the cavity 7 with thermally conductive adhesive, leaving only lead wire holes 12 in the positioning cover plate 4 for the ends of the lead wire 13 to extend. Compared to the traditional method where the transformer 2 is exposed on the PCB board, this avoids direct contact between tools and the main body surface of the transformer 2's lead wire 13 during handling or assembly, reducing the risk of scratching the insulation layer of the lead wire 13.
[0035] It should be noted that this utility model is not limited to the above-described embodiments. Based on the inventive spirit of this utility model, those skilled in the art can make other changes, and these changes made based on the inventive spirit of this utility model should be included within the scope of protection claimed by this utility model.
Claims
1. An integrated heat dissipation structure for MOSFETs and transformers, used to integrate and dissipate heat from multiple MOSFETs and multiple transformers, characterized in that, The device includes a transformer tank for accommodating multiple transformers, multiple positioning covers on top of the transformer tank, thermally conductive adhesive, and multiple thermally conductive sheets. The interior of the transformer tank is divided into multiple chambers by multiple partition plates. Each transformer is installed in a corresponding chamber. There is a gap between the inner wall of the chamber and the outer periphery of the transformer. The thermally conductive adhesive is poured into the transformer tank and fills the gaps to integrate the transformer tank with each transformer. Each MOS transistor and a corresponding thermally conductive sheet are fastened to the side of the transformer tank by fasteners. One side of the thermally conductive sheet is in contact with the MOS transistor, and the other side is in contact with the side of the transformer tank.
2. The integrated heat dissipation structure for MOSFET and transformer as described in claim 1, characterized in that, The positioning cover plate has a transformer positioning port in the middle, the transformer tank has a top opening, the upper part of the transformer protrudes from the top opening and is positioned by the transformer positioning port, the left and right sides of the positioning cover plate have recesses, and the recesses of two adjacent positioning cover plates form a glue venting port, and the thermally conductive adhesive is injected from the glue venting port.
3. The integrated heat dissipation structure for a MOSFET and transformer as described in claim 1, characterized in that, The plurality of the positioning covers are arranged above the transformer tank along the length of the transformer tank.
4. The integrated heat dissipation structure for MOSFET and transformer as described in claim 1, characterized in that, The width of the positioning cover plate is greater than the distance between the two inner walls of the transformer tank in the width direction and less than the distance between the two outer walls. The sum of the lengths of each positioning cover plate is less than or equal to the length of the transformer tank.
5. The integrated heat dissipation structure for a MOS transistor and transformer as described in claim 1, characterized in that, A connecting strip is provided along the outer edge of the opening at the top of the transformer tank, and a buckle is provided on the positioning cover plate corresponding to the position of the connecting strip. The transformer tank and the positioning cover plate are connected by the connecting strip and the buckle.
6. The integrated heat dissipation structure for a MOSFET and transformer as described in claim 5, characterized in that, The connecting strip has an angled surface facing the buckle, which guides the buckle to slide and engage with the connecting strip.
7. The integrated heat dissipation structure for MOSFET and transformer as described in claim 2, characterized in that, The positioning cover plate is provided with lead wire holes, and the transformer leads extend from the top opening and the lead wire holes in sequence.
8. The integrated heat dissipation structure for MOSFET and transformer as described in claim 1, characterized in that, The transformer tank is a thermally conductive metal or a thermally conductive non-metal, the thermally conductive adhesive is silicone AB glue, the thermally conductive sheet is a ceramic substrate, and the positioning cover is a plastic cover.
9. The integrated heat dissipation structure for a MOSFET and transformer as described in claim 1, characterized in that, The thermal pad is coated with thermal grease on both sides.
10. The integrated heat dissipation structure for a MOSFET and transformer as described in claim 1, characterized in that, The area of the heat-conducting plate covers the main body area of the MOS transistor, and the main body of the MOS transistor and the heat-conducting plate do not protrude from the side edge of the transformer tank.