Touch pressure detection module and electronic device

Abstract

The embodiment of the present application provides a touch pressure detection module and an electronic device, the touch pressure detection module comprises: a touch detection unit, a pressure detection unit and a first circuit board; the second surface of the touch detection unit is electrically connected with the first surface of the first circuit board, the pressure detection unit comprises a first component and a second component, the first component is arranged on the touch detection unit, and the first component and the second component are oppositely arranged; the touch detection unit can generate a touch signal when a detection object touches an identification area, the touch signal is used for touch detection, one of the first component and the second component generates a pressure detection signal as a transmitting end, the other of the first component and the second component generates an identification signal as a receiving end according to the pressure detection signal, the pressure detection unit converts the identification signal into a pressure signal, and the pressure signal is used for pressure detection. The module can detect the pressing degree while detecting the touch.

Description

Technical Field

[0001] This application relates to the field of pressure detection technology, and more particularly to a touch pressure detection module and an electronic device. Background Technology

[0002] Touch technology is a human-computer interaction method. Users interact with electronic devices by touching or gesturing on the touch area of ​​the device. With the development of smart devices, touch technology has become the mainstream operating method for mobile phones and other electronic devices. Mobile phones and other electronic devices receive touch commands input by users on the touch area and recognize the corresponding touch operations based on the touch commands.

[0003] Currently, touch detection technology is integrated into various devices such as mobile phones and other terminal devices, in-vehicle touch buttons, and sensing devices such as headphones.

[0004] However, existing touch detection modules are limited in function, only able to detect user touch operations and unable to expand functionality based on different pressure levels applied by the user. Utility Model Content

[0005] In view of this, embodiments of this application provide a touch pressure detection module and an electronic device to at least partially solve the above-mentioned problems.

[0006] According to a first aspect of the present application, a touch pressure detection module is provided, applied to an electronic device. The touch pressure detection module includes: a touch detection unit, a pressure detection unit, and a first circuit board; a second surface of the touch detection unit is electrically connected to a first surface of the first circuit board; the pressure detection unit includes a first component and a second component; the first component is disposed on the touch detection unit, and the first component and the second component are disposed opposite to each other; the first circuit board is electrically connected to a processing unit of the electronic device; the touch detection unit is used to generate a sensing signal when a detected object touches a recognition area, and convert the sensing signal into a touch signal, the touch signal being used for... Touch detection is performed; one of the first component and the second component serves as a transmitter, and the other of the first component and the second component serves as a receiver. The transmitter is used to generate a pressure detection signal, and the receiver is used to generate an identification signal based on the pressure detection signal. The pressure detection unit converts the identification signal into a pressure signal, which is used for pressure detection. The identification signal is related to the distance between the first component and the second component, and the distance between the first component and the second component is related to the pressure applied by the detected object. The first circuit board is used to send the touch signal and / or the pressure signal to the processing unit.

[0007] In one possible implementation, the first circuit board has a first through-hole on the signal transmission path of the pressure detection signal; the second component is disposed on the second surface of the first circuit board, and the first circuit board is partially bent so that the first component and the second component are opposite to each other; or, the first circuit board includes a first sub-circuit board and a second sub-circuit board, the first sub-circuit board and the second sub-circuit board are respectively electrically connected to the processing unit, the second surface of the touch detection unit is electrically connected to the first surface of the first sub-circuit board, the second component is disposed on the first surface of the second sub-circuit board, the first surface of the second sub-circuit board is disposed opposite to the second surface of the first sub-circuit board so that the first component and the second component are opposite to each other, and the first through-hole is disposed on the first sub-circuit board.

[0008] In one possible implementation, the touch pressure detection module further includes a first reinforcing plate; the first reinforcing plate is attached to the second surface of the first circuit board and is located between the touch detection unit and the second component; the first reinforcing plate has a second through hole in the signal transmission path of the pressure detection signal, and the second through hole is at least partially connected to the first through hole; the first reinforcing plate is at least used to reinforce the first circuit board.

[0009] In one possible implementation, the touch pressure detection module further includes at least one support member; the at least one support member is disposed between the first reinforcing plate and the surface on the first circuit board where the second component is disposed; the first reinforcing plate and / or the at least one support member are used to deform when the detection object touches the recognition area, so that the distance between the first component and the second component changes.

[0010] In one possible implementation, the at least one support member is made of a rigid material; the first reinforcing plate is configured to deform when the detected object touches the recognition area, causing a change in the distance between the first component and the second component; or, the at least one support member is made of a soft material; the at least one support member is configured to deform when the detected object touches the recognition area, causing a change in the distance between the first component and the second component.

[0011] In one possible implementation, the touch pressure detection module further includes at least one elastic device; a first end of the elastic device is housed within the first reinforcing plate, and a first surface of the elastic device near the first end abuts against the support structure of the electronic device; the elastic device is partially bent so that the first surface of the elastic device near the second end abuts against the surface on the first circuit board where the second component is disposed; the first reinforcing plate is used to cause the elastic device to deform when the detected object touches the recognition area, thereby changing the distance between the first component and the second component.

[0012] In one possible implementation, the touch pressure detection module further includes a protective plate; the protective plate is disposed between the first reinforcing plate and the second component, and the protective plate covers the second through hole.

[0013] In one possible implementation, the pressure detection signal includes an optical signal.

[0014] In one possible implementation, the transmitting end includes a light-emitting diode (LED) and the receiving end includes a photodiode (PDD).

[0015] In one possible implementation, the touch pressure detection module further includes: a physical button; the physical button is disposed on the first circuit board and abuts against the protective plate; the protective plate is used to trigger the physical button when the distance between the first component and the second component changes; the physical button is at least used to generate button feedback when the detected object touches the recognition area.

[0016] In one possible implementation, the second component is a transmitter; the second component includes a first transmitter sub-component and a second transmitter sub-component; the first transmitter sub-component and the second transmitter sub-component are disposed on both sides of the physical button.

[0017] In one possible implementation, the touch pressure detection module further includes: a second reinforcing plate; the second reinforcing plate is disposed between the first circuit board and the electronic device; the second reinforcing plate is used to provide rigid support for the first circuit board.

[0018] In one possible implementation, the second component is disposed between the touch detection unit and the electronic device; the second component is the transmitter used to generate a magnetic field, and the first component is the receiver used to generate the identification signal based on the magnetic field strength, the magnetic field strength being related to the distance between the first component and the second component.

[0019] In one possible implementation, the second component is disposed between the second surface of the touch detection unit and the electronic device, or the second component is disposed between the third surface of the touch detection unit and the electronic device, wherein the third surface of the touch detection unit is used to connect the first surface of the touch detection unit and the second surface of the touch detection unit, and the first surface of the touch detection unit and the second surface of the touch detection unit are opposite to each other.

[0020] In one possible implementation, the first component includes a magnetic induction chip, and the second component includes a magnet.

[0021] In one possible implementation, the touch detection unit includes: a second circuit board, a substrate, and a touch chip; the pressure detection unit further includes: a pressure chip; a first surface of the second circuit board has multiple electrodes distributed thereon, a second surface of the second circuit board is electrically connected to the first surface of the substrate, the touch chip is electrically connected to the substrate or the second circuit board, the pressure chip is electrically connected to the substrate or the second circuit board, the first component is disposed on the second surface of the second circuit board, and the substrate has a third through hole disposed on the signal transmission path of the pressure detection signal; the touch chip is used to receive the sensing signal generated by the electrodes when the detected object touches the recognition area, and convert the sensing signal into the touch signal; the pressure chip is used to receive the recognition signal generated by the receiving end, and convert the recognition signal into the pressure signal.

[0022] In one possible implementation, the touch detection unit further includes: a first encapsulation layer; the second circuit board is located within the first encapsulation layer, and at least a portion of the substrate is located within the first encapsulation layer, wherein the first encapsulation layer has a fourth through hole on the signal transmission path of the pressure detection signal, and the fourth through hole is at least partially connected to the third through hole.

[0023] In one possible implementation, the touch detection unit further includes a protective layer; the protective layer is at least partially located in the fourth through-hole, and the first component is located between the second circuit board and the protective layer.

[0024] In one possible implementation, the touch pressure detection module further includes: a second encapsulation layer; the second surface of the touch detection unit is soldered to the first surface of the first circuit board, the second encapsulation layer is disposed between the second surface of the touch detection unit and the first surface of the first circuit board, and the second encapsulation layer is in contact with the second surface of the touch detection unit and the first surface of the first circuit board.

[0025] According to a second aspect of the present application, an electronic device is provided, comprising: a processing unit as described in the first aspect of the present application for a touch pressure detection module; the processing unit being configured to receive the touch signal and / or the pressure signal.

[0026] In one possible implementation, the touch pressure detection module is disposed in an opening in the mid-frame of the electronic device.

[0027] In one possible implementation, the electronic device further includes: a cover layer; a second surface of the cover layer is attached to the touch pressure detection module, and a first surface of the cover layer is used to provide a recognition area, wherein the first surface of the cover layer is opposite to the second surface of the cover layer.

[0028] In one possible implementation, the electronic device further includes: a cover plate; a second surface of the cover plate is attached to the touch pressure detection module, and a first surface of the cover plate is used to provide a recognition area, wherein the first surface of the cover plate is opposite to the second surface of the cover plate.

[0029] According to the touch pressure detection module provided in the embodiments of this application, the touch pressure detection module includes a touch detection unit, a pressure detection unit, and a first circuit board. The touch detection unit is electrically connected to the first circuit board. A first component of the pressure detection unit is disposed on the touch detection unit, and the first component and the second component are opposite to each other. The touch detection unit can generate a touch signal when the detection object touches the recognition area, and the pressure detection unit can generate a pressure signal. It can identify the touch operation of the detection object based on the touch signal, and detect the pressure intensity of the detection object based on the pressure signal. This touch pressure detection module can detect the pressure intensity of the detection object while realizing the touch detection function. Therefore, different functions can be realized according to different pressure intensities of the detection object. Compared with the touch detection scheme in the prior art, multiple custom functions can be set for different pressure intensities, which has high functional scalability and improves user experience. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0031] Figure 1 This is a cross-sectional schematic diagram of a touch pressure detection module provided in an embodiment of this application;

[0032] Figure 2This is a cross-sectional schematic diagram of another touch pressure detection module provided in the embodiments of this application;

[0033] Figure 3 This is a cross-sectional schematic diagram of a touch pressure detection module including a reinforcing plate provided in an embodiment of this application;

[0034] Figure 4 This is a cross-sectional schematic diagram of another touch pressure detection module including a reinforcing plate provided in an embodiment of this application;

[0035] Figure 5 This is a cross-sectional schematic diagram of a touch pressure detection module including a support member provided in an embodiment of this application;

[0036] Figure 6 This is a cross-sectional schematic diagram of another touch pressure detection module including a support member provided in an embodiment of this application;

[0037] Figure 7 This is a cross-sectional schematic diagram of a touch pressure detection module including an elastic device provided in an embodiment of this application;

[0038] Figure 8 This is a cross-sectional schematic diagram of another touch pressure detection module including an elastic device provided in an embodiment of this application;

[0039] Figure 9 This is a cross-sectional schematic diagram of a touch pressure detection module including a protective plate provided in an embodiment of this application;

[0040] Figure 10 This is a cross-sectional schematic diagram of another touch pressure detection module including a protective plate provided in an embodiment of this application;

[0041] Figure 11 This is a cross-sectional schematic diagram of a touch pressure detection module including buttons provided in an embodiment of this application;

[0042] Figure 12 This is a cross-sectional schematic diagram of another touch pressure detection module including buttons provided in an embodiment of this application;

[0043] Figure 13 This is a schematic diagram of another touch pressure detection module including a reinforcing plate provided in the embodiments of this application;

[0044] Figure 14 This is a schematic diagram of another touch pressure detection module including a reinforcing plate provided in the embodiments of this application;

[0045] Figure 15 This is a schematic diagram illustrating the location of a second component according to an embodiment of this application;

[0046] Figure 16This is a schematic diagram illustrating another location of the second component provided in an embodiment of this application;

[0047] Figure 17 This is a schematic diagram illustrating yet another possible location of the second component provided in an embodiment of this application;

[0048] Figure 18 This is a cross-sectional schematic diagram of a touch detection unit provided in an embodiment of this application;

[0049] Figure 19 This is a cross-sectional schematic diagram of a touch detection unit including a first encapsulation layer provided in an embodiment of this application;

[0050] Figure 20 This is a cross-sectional schematic diagram of a touch detection unit including a protective layer provided in an embodiment of this application;

[0051] Figure 21 This is a cross-sectional schematic diagram of a touch detection unit including a second encapsulation layer provided in an embodiment of this application;

[0052] Figure 22 This is a schematic diagram of an electronic device provided in an embodiment of this application;

[0053] Figure 23 This is a schematic diagram of a mid-frame provided in an embodiment of this application;

[0054] Figure 24 This is a schematic diagram of another middle frame provided in an embodiment of this application;

[0055] Figure 25 This is a cross-sectional schematic diagram of a touch pressure detection module including a cover layer provided in an embodiment of this application;

[0056] Figure 26 This is a cross-sectional schematic diagram of a touch pressure detection module including a cover plate provided in an embodiment of this application. Detailed Implementation

[0057] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0058] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0059] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0060] The touch pressure detection module and electronic device provided in this application are illustrated below through examples.

[0061] Figure 1 This is a cross-sectional schematic diagram of a touch pressure detection module 100 provided in an embodiment of this application. The touch pressure detection module 100 is applied to electronic devices, such as... Figure 1 As shown, the touch pressure detection module 100 includes: a touch detection unit 101, a pressure detection unit, and a first circuit board 103.

[0062] The second surface of the touch detection unit 101 is electrically connected to the first surface of the first circuit board 103. The pressure detection unit includes a first component 1021 and a second component 1022. The first component 1021 is disposed on the touch detection unit 101. The first component 1021 and the second component 1022 are disposed opposite to each other. The first circuit board 103 is electrically connected to the processing unit of the electronic device.

[0063] The touch detection unit 101 can generate a sensing signal when the object touches the recognition area and convert the sensing signal into a touch signal. The touch signal is used for touch detection. One of the first component 1021 and the second component 1022 serves as a transmitter, and the other of the first component 1021 and the second component 1022 serves as a receiver. The transmitter can generate a pressure detection signal, and the receiver can generate an identification signal based on the pressure detection signal. The pressure detection unit converts the identification signal into a pressure signal, which is used for pressure detection. The identification signal is related to the distance between the first component 1021 and the second component 1022, and the distance between the first component 1021 and the second component 1022 is related to the pressure applied by the object. The first circuit board 103 can send the touch signal and / or the pressure signal to the processing unit.

[0064] The touch detection unit 101 is disposed on the first surface of the first circuit board 103. Optionally, the first circuit board 103 can be a printed circuit board (PCB) or a flexible printed circuit board (FPC). Optionally, the first circuit board 103 can be partially a PCB and partially an FPC. The pressure detection unit includes a first component 1021 and a second component 1022. The first component 1021 is disposed on the lower surface of the touch detection unit 101, and the second component 1022 can be disposed between the touch detection unit 101 and the electronic device. In one example, the second component 1022 can be disposed on the first circuit board 103, and the first component 1021 and the second component 1022 are disposed opposite to each other. Optionally, as... Figure 1 As shown, the first circuit board 103 is partially bent so that the first component 1021 and the second component 1022 are positioned opposite each other.

[0065] When the object being detected touches the recognition area, the touch detection unit 101 can generate a sensing signal and convert the sensing signal into a touch signal. In one example, the sensing signal can be a voltage signal (analog signal), and the touch signal can be a digital signal. The touch signal is used to perform touch detection to identify the touch operation of the object being detected in the recognition area, such as: recognizing finger click operation, swipe operation, etc.

[0066] When the object is touched in the recognition area, one of the first component 1021 and the second component 1022 acts as a transmitter to generate a pressure detection signal. This pressure detection signal can be an optical signal (e.g., infrared signal), an acoustic signal (e.g., ultrasonic signal), a magnetic signal, etc. The other component acts as a receiver to receive the pressure detection signal. After receiving the pressure detection signal, the receiver converts it (optical, acoustic, or magnetic signal) into a recognition signal (electrical signal). The pressure detection unit can then convert the recognition signal into a pressure signal. Since the pressure signal is a digital signal, the pressure intensity can be detected based on it. Using an optical signal as an example, the detection principle is explained. The first component 1021 and the second component 1022 are relatively... The system is configured such that when the object being detected touches the recognition area, the touch detection unit 101 moves in the pressure direction, changing the distance between the first component 1021 and the second component 1022. This changes the time it takes for the receiving end to receive the pressure detection signal. Therefore, the pressure detection unit can determine the distance between the first component 1021 and the second component 1022 based on the time the pressure detection signal is emitted and the time the recognition signal is generated. It should be understood that when the pressure applied by the object is greater, the distance between the first component 1021 and the second component 1022 changes more significantly; when the pressure applied by the object is less, the distance changes less. The pressure applied by the object can be determined based on the distance between the first component 1021 and the second component 1022, thus achieving pressure detection.

[0067] The first circuit board 103 can send touch signals and / or pressure signals to the processing unit of the electronic device. The touch signal can be a recognition result, or it can be an intermediate signal in the touch recognition process. In one example, when the touch detection unit 101 includes a touch detection chip, if the touch detection chip includes a processing module, the touch signal can be a touch recognition result. The touch recognition result can indicate the touch position of the detected object, the sliding direction of the detected object, etc. The processing unit of the electronic device can perform related touch operations according to the touch signal. In another example, if the touch detection unit 101 includes a touch detection chip, but the touch detection chip does not include a processing module, or if the touch detection unit 101 does not include a touch detection chip, the first circuit board 103 transmits the touch signal to the processing unit. The processing unit can perform touch detection according to the touch signal and perform related touch operations according to the detection result. The pressure signal can be a pressure detection result, or it can be an intermediate signal in the pressure recognition process. The specific principle is similar to that of the touch signal and will not be described in detail here.

[0068] The processing unit is a chip with processing capabilities in an electronic device, such as a processor, pressure detection chip, or touch detection chip. The processing unit can perform corresponding functions based on touch signals. For example, when a click is detected, a click operation is performed; when a swipe is detected, volume adjustment is implemented. Furthermore, the processing unit can perform corresponding functions based on the detected pressure level. For example, in the camera function, a light pressure activates focusing, while a heavier pressure activates the shutter. Similarly, in the menu function, a light pressure activates the first-level menu, while a heavier pressure activates the second-level menu.

[0069] In this embodiment, the touch pressure detection module 100 includes a touch detection unit 101, a pressure detection unit, and a first circuit board 103. The touch detection unit 101 is electrically connected to the first circuit board 103. A first component 1021 of the pressure detection unit is disposed on the touch detection unit 101, and the first component 1021 and the second component 1022 are opposite to each other. The touch detection unit 101 can generate a touch signal when the object touches the recognition area. The pressure detection unit can generate a pressure signal, identify the touch operation of the object based on the touch signal, and detect the pressure intensity of the object based on the pressure signal. This touch pressure detection module 100 can detect the pressure intensity of the object while realizing the touch detection function. Thus, different functions can be realized according to different pressure intensities of the object. Compared with the touch detection scheme in the prior art, multiple custom functions can be set for different pressure intensities, which has high functional scalability and improves user experience.

[0070] In one possible implementation, the first circuit board 103 has a first through hole 1031 on the signal transmission path of the pressure detection signal.

[0071] The second component 1022 is disposed on the second surface of the first circuit board 103, and the first circuit board 103 is partially bent so that the first component 1021 and the second component 1022 are opposite to each other; or, the first circuit board 103 includes a first sub-circuit board 1032 and a second sub-circuit board 1033, the first sub-circuit board 1032 and the second sub-circuit board 1033 are respectively electrically connected to the processing unit, the second surface of the touch detection unit 101 is electrically connected to the first surface of the first sub-circuit board 1032, the second component 1022 is disposed on the first surface of the second sub-circuit board 1033, the first surface of the second sub-circuit board 1033 is disposed opposite to the second surface of the first sub-circuit board 1032 so that the first component 1021 and the second component 1022 are opposite to each other, and the first through hole 1031 is disposed on the first sub-circuit board 1032.

[0072] The first circuit board 103 includes a first through hole 1031, which is located on the signal transmission path of the pressure detection signal. After the transmitter transmits the pressure detection signal, the pressure detection signal passes through the first circuit board 103 through the first through hole 1031. The receiver receives the pressure detection signal passing through the first circuit board 103, thereby realizing the detection of the distance between the first component 1021 and the second component 1022 and realizing the pressure detection function.

[0073] The first component 1021 and the second component 1022 are arranged relative to each other, based on which, as Figure 1 As shown, the first circuit board 103 can be a flexible circuit board, and the second component 1022 is disposed on the second surface of the first circuit board 103. The first circuit board 103 is partially bent so that the first component 1021 and the second component 1022 are opposite each other. Optionally, the first circuit board 103 can be partially a flexible circuit board. For example, the first circuit board 103 can be an FPC only in the bent part, and the rest can be a PCB.

[0074] Figure 2 This is a cross-sectional schematic diagram of another touch pressure detection module provided in an embodiment of this application, as shown below. Figure 2 As shown, the first circuit board 103 includes a first sub-circuit board 1032 and a second sub-circuit board 1033. The touch detection unit 101 is disposed on the first surface of the first sub-circuit board 1032, and the second component 1022 is disposed on the first surface of the second sub-circuit board 1033. The second surface of the first sub-circuit board 1032 is opposite to the first surface of the second sub-circuit board 1033, and the first through hole 1031 is located on the first sub-circuit board 1032, so that the pressure detection signal can pass through the first sub-circuit board 1032. It should be understood that the first sub-circuit board 1032 and the second sub-circuit board 1033 can both be FPCs, or both be PCBs, or both FPCs and PCBs. Optionally, the first sub-circuit board 1032 and the second sub-circuit board 1033 can be electrically connected to the processing unit of the electronic device. Taking the second component 1022 disposed on the second sub-circuit board 1033 as the transmitting end as an example, when the detected object touches the recognition area, the processing unit controls the second component 1022 to emit a pressure detection signal through the second circuit board. The processing unit receives the touch signal and / or pressure signal transmitted by the first circuit board 103 to realize touch detection and pressure detection.

[0075] Optionally, the second component 1022 can be electrically connected to the first circuit board 103 via conductive adhesive, electrical connecting wire, or solder, which can be configured as needed.

[0076] In this embodiment, the first circuit board 103 has a first through hole 1031 on the signal transmission path of the pressure detection signal, so that the pressure detection signal can pass through the first circuit board 103 and the receiving end can receive the pressure detection signal. The second component 1022 is disposed on the second surface of the first circuit board 103. The first circuit board 103 is partially bent so that the first component 1021 and the second component 1022 are opposite to each other. Alternatively, the first circuit board 103 includes a first sub-circuit board 1032 and a second sub-circuit board 1033. The second surface of the touch detection unit 101 is electrically connected to the first surface of the first sub-circuit board 1032, and the second component 1022 is disposed on the first surface of the second sub-circuit board 1033. This allows the first component 1021 and the second component 1022 of the pressure detection unit to be disposed opposite to each other. When the object touches the recognition area, the pressure of the object can be identified based on the distance between the first component 1021 and the second component 1022, thus realizing the detection of pressure at the same time as touch detection.

[0077] Figure 3 This is a cross-sectional schematic diagram of a touch pressure detection module including a reinforcing plate, provided in an embodiment of this application. Figure 4 This is a cross-sectional schematic diagram of another touch pressure detection module including a reinforcing plate provided in an embodiment of this application, as shown below. Figure 3 and Figure 4 As shown, the touch pressure detection module 100 also includes a first reinforcing plate 104. The first reinforcing plate 104 is attached to the second surface of the first circuit board 103, and the first reinforcing plate 104 is located between the touch detection unit 101 and the second component 1022. The first reinforcing plate 104 has a second through hole 1041 on the signal transmission path of the pressure detection signal. The second through hole 1041 is at least partially connected to the first through hole 1031. The first reinforcing plate 104 is at least used to reinforce the first circuit board 103.

[0078] Figure 3 The structure of the first circuit board 103 is shown in the figure. Figure 1 In the structure shown, the first reinforcing plate 104 is positioned as follows: Figure 4 The first circuit board 103 is shown in the figure. Figure 2 In the structure shown, the first reinforcing plate 104 is positioned as an integral structure. A second through hole 1041 is provided on the first reinforcing plate 104, located on the signal transmission path. The second through hole 1041 is at least partially connected to the first through hole 1031. In one example, the first reinforcing plate 104 can be a steel plate.

[0079] Optionally, the first reinforcing plate 104 can also be a split structure. For example, the first reinforcing plate 104 may include a first sub-reinforcing plate and a second sub-reinforcing plate, and the first sub-reinforcing plate and the second sub-reinforcing plate can be formed as follows: Figure 3 and Figure 4 The structure of the first reinforcing plate 104 shown has a gap between the first sub-reinforcing plate and the second sub-reinforcing plate that connects with the first through hole 1031, allowing the pressure detection signal to pass through.

[0080] In this embodiment, the touch pressure detection module 100 further includes a first reinforcing plate 104, which is attached to the second surface of the first circuit board 103 and is located between the touch detection unit 101 and the second component 1022. Thus, the first reinforcing plate 104 can provide rigid support for the first circuit board 103, preventing the first circuit board 103 from bending under pressure and improving the reliability of the touch pressure detection module 100.

[0081] Figure 5 This is a cross-sectional schematic diagram of a touch pressure detection module including a support member, provided in an embodiment of this application. Figure 6 This is a cross-sectional schematic diagram of another touch pressure detection module including a support member provided in an embodiment of this application, as shown below. Figure 5 and Figure 6 As shown, the touch pressure detection module 100 also includes at least one support member 105. The at least one support member 105 is disposed between the first reinforcing plate 104 and the surface on the first circuit board 103 on which the second component 1022 is disposed. The first reinforcing plate 104 and / or at least one support member 105 can deform when the detection object touches the recognition area, so that the distance between the first component 1021 and the second component 1022 changes.

[0082] Taking infrared pressure detection as an example, when the object is not touched in the recognition area, the distance between the first component 1021 and the second component 1022 is fixed. When the object is touched in the recognition area, due to pressure, at least one of the first reinforcing plate 104 and at least one support member 105 deforms, causing the touch detection unit 101 to move towards the second component 1022. The distance between the first component 1021 and the second component 1022 changes. The transmitting end emits an infrared signal (pressure detection signal) to the receiving end, and the receiving end receives the infrared signal (reflected signal). Based on the infrared signal, an identification signal is generated. The pressure detection unit can convert the identification signal into a pressure signal, thereby determining the distance between the first component 1021 and the second component 1022 based on the pressure signal. Thus, the pressure applied by the object can be determined based on the distance. In one example, a correspondence between distance and pressure can be set, with different distances corresponding to different pressure applied by the object, thereby determining the pressure applied by the object based on the distance.

[0083] It should be noted that the above examples are merely illustrative examples and should not be construed as limiting the present application. For example, the pressure detection signal emitted by the transmitter can also be an ultrasonic signal. Another example is that a distance detection signal can be emitted when the object is not touched in the recognition area, and a pressure detection signal can be emitted when the object is touched in the recognition area. Based on the change in signal amount before and after the object is touched in the recognition area, the distance change of the first component 1021 and the second component 1022 is determined, and the pressure of the object is determined according to the pre-set correspondence function between the distance change and the pressure intensity.

[0084] In this embodiment, the touch pressure detection module 100 further includes at least one support member 105. The at least one support member 105 is disposed between the first reinforcing plate 104 and the surface on the first circuit board 103 where the second component 1022 is disposed. When the object being detected touches the recognition area, at least one of the first reinforcing plate 104 and the at least one support member 105 can deform, causing the distance between the first component 1021 and the second component 1022 to change. Thus, the pressure applied by the object can be determined based on the distance between the first component 1021 and the second component 1022, thereby realizing the pressure detection function.

[0085] In one possible implementation, at least one support member 105 is made of a rigid material, and the first reinforcing plate 104 can deform when the detected object touches the recognition area, causing a change in the distance between the first component 1021 and the second component 1022. Alternatively, at least one support member 105 is made of a soft material, and at least one support member 105 can deform when the detected object touches the recognition area, causing a change in the distance between the first component 1021 and the second component 1022.

[0086] The first reinforcing plate 104 can be a steel plate. When at least one support member 105 is made of a rigid material, the at least one support member 105 can be a rigid plastic, metal, or the like. When the object being detected touches the recognition area, the first reinforcing plate 104 undergoes plastic deformation, causing a change in the distance between the first component 1021 and the second component 1022. When at least one support member 105 is made of a soft material, the support member 105 can be foam or the like. When the object being detected touches the recognition area, at least one support member 105 undergoes plastic deformation, causing a change in the distance between the first component 1021 and the second component 1022.

[0087] It should be noted that when at least one support member 105 is made of soft material, if the pressure of the object being tested is large, the first reinforcing plate 104 and at least one support member 105 can deform simultaneously, causing the distance between the first component 1021 and the second component 1022 to change.

[0088] In this embodiment, at least one support member 105 is made of a rigid material, and the first reinforcing plate 104 can deform when the detection object touches the recognition area. Alternatively, at least one support member 105 is made of a soft material, and at least one support member 105 can deform when the detection object touches the recognition area. Thus, by deforming at least one of the first reinforcing plate 104 and at least one support member 105, the distance between the first component 1021 and the second component 1022 changes. Therefore, the pressure applied by the detection object can be determined based on the distance between the first component 1021 and the second component 1022, thereby realizing the pressure detection function.

[0089] Figure 7 This is a cross-sectional schematic diagram of a touch pressure detection module including an elastic device, provided in an embodiment of this application. Figure 8 This is a cross-sectional schematic diagram of another touch pressure detection module including an elastic device provided in an embodiment of this application, as shown below. Figure 7 and Figure 8 As shown, the touch pressure detection module 100 also includes at least one elastic device 106. The first end of the elastic device 106 is housed in the first reinforcing plate 104, and the first surface of the elastic device 106 near the first end abuts against the support structure 2021 of the electronic device. The elastic device 106 is partially bent so that the first surface of the elastic device 106 near the second end abuts against the surface of the first circuit board 103 on which the second component 1022 is disposed. The first reinforcing plate 104 can cause the elastic device 106 to deform when the detection object touches the recognition area, so that the distance between the first component 1021 and the second component 1022 changes.

[0090] The first reinforcing plate 104 can be an irregularly shaped reinforcing plate, specifically, such as... Figure 7 and Figure 8 As shown, the first reinforcing plate 104 may include a receiving hole that can accommodate the first end of the elastic device 106. The first surface of the elastic device 106 near the first end abuts against the support structure 2021 of the electronic device. Optionally, for... Figure 7 As shown in the structure, the support structure 2021 can be the mid-frame of the electronic device, and through holes can be provided in the mid-frame of the electronic device. The first circuit board 103 can pass through the through holes to form a structure as shown in the diagram. Figure 7 The structure shown is such that the elastic device 106 is partially bent, forming a U-shaped structure, so that the first surface of the elastic device 106 near the first end abuts against the support structure 2021, and the first surface near the second end abuts against the first circuit board 103. Figure 8 In the structure shown, the first surface of the elastic device 106 near the second end abuts against the second sub-circuit board 1033 in the first circuit board 103.

[0091] When the object touches the recognition area, under pressure, the touch detection unit 101 moves in the pressure direction, causing the first reinforcing plate 104 to move in the pressure direction. The first reinforcing plate 104 causes the elastic device 106 to deform, and the distance between the first component 1021 and the second component 1022 changes. When the object stops touching, the elastic device 106 rebounds, causing the first reinforcing plate 104 and the touch detection unit 101 to return to the state when they were not touched.

[0092] In this embodiment, the touch pressure detection module 100 further includes at least one elastic device 106. The elastic device 106 can deform when the detection object touches the recognition area, causing the distance between the first component 1021 and the second component 1022 to change. This allows the pressure of the detection object to be determined based on the distance between the first component 1021 and the second component 1022, thus realizing the pressure detection function. When the detection object stops touching, the device rebounds, causing the first reinforcing plate 104 and the touch detection unit 101 to return to their untouched state, thereby stopping the pressure detection.

[0093] Figure 9 This is a cross-sectional schematic diagram of a touch pressure detection module including a protective plate, provided in an embodiment of this application. Figure 10 This is a cross-sectional schematic diagram of another touch pressure detection module including a protective plate provided in an embodiment of this application, as shown below. Figure 9 and Figure 10 As shown, the touch pressure detection module 100 also includes a protection plate 107, which is disposed between the first reinforcing plate 104 and the second component 1022, and the protection plate 107 covers the second through hole 1041.

[0094] Since the second component 1022 is disposed on the first circuit board 103, and the first circuit board 103 includes a second through hole 1041 in the signal transmission path, a protective plate 107 can be provided to prevent the external environment from affecting the second component 1022 through the second through hole 1041. Optionally, when the pressure detection signal emitted by the transmitting end is an optical signal, the protective plate 107 can be made of a light-transmitting material. Optionally, when the pressure detection signal emitted by the transmitting end is an optical signal, the protective plate 107 can be a light-diffusing plate, which can make the pressure detection signal emitted by the transmitting end more uniform when it exits the protective plate 107, making the signal received by the receiving end more stable and making the pressure intensity detection more accurate.

[0095] In this embodiment of the application, the touch pressure detection module 100 further includes a protection plate 107, which is disposed between the first reinforcing plate 104 and the second component 1022, and the protection plate 107 covers the second through hole 1041, which can prevent the external environment from affecting the second component 1022 and improve the reliability of the touch pressure detection module 100.

[0096] In one possible implementation, the pressure detection signal includes an optical signal.

[0097] Optionally, the pressure detection signal can be an infrared signal.

[0098] Optionally, when the pressure detection signal is an optical signal, the transmitting end can be a light-emitting diode (LED), which can emit an infrared signal (pressure detection signal), and the receiving end can be a photodiode (PD), which is used to receive the infrared signal (pressure detection signal) and generate an identification signal based on the infrared signal. The identification signal can be a current signal.

[0099] In this embodiment, the pressure detection signal includes an optical signal. Since the transmission and reception structures of optical signals are relatively simple, using optical signals as pressure detection signals can simplify the pressure detection structure and reduce costs.

[0100] Figure 11 This is a cross-sectional schematic diagram of a touch pressure detection module including buttons, provided in an embodiment of this application. Figure 12 This is a cross-sectional schematic diagram of another touch pressure detection module including buttons provided in an embodiment of this application, as shown below. Figure 11 and Figure 12 As shown, the touch pressure detection module 100 also includes a physical button 108, which is disposed on the first circuit board 103 and abuts against the protection plate 107. The protection plate 107 can trigger the physical button 108 when the distance between the first component 1021 and the second component 1022 changes. The physical button 108 is at least used to generate button feedback when the detected object touches the recognition area.

[0101] The touch pressure detection module 100 may further include a physical button 108, which is disposed on and electrically connected to the first circuit board 103. When the first circuit board 103 is in a certain state, the physical button 108 is electrically connected to the first circuit board 103. Figure 2 In the structure shown, the physical button 108 is disposed on the second sub-circuit board 1033 on the first circuit board 103.

[0102] The physical button 108 can provide button feedback at least when the detected object touches the recognition area. Specifically, when the detected object touches the recognition area, the touch detection unit 101 drives the first reinforcing plate 104 to move in the pressure direction. Since the protective plate 107 is disposed between the first reinforcing plate 104 and the second component 1022, and the protective plate 107 abuts against the physical button 108, the first reinforcing plate 104 drives the protective plate 107 to move in the direction of the physical button 108, triggering the physical button 108 and providing button feedback to the detected object, allowing the detected object to feel the pressure. Regarding the tactile feedback of the physical button 108, optionally, the physical button 108 can also realize multi-level pressing functions. Specifically, taking the photo function as an example, when the touch pressure detection module 100 detects the touch of the detection object in the recognition area, it realizes the focusing function; when the physical button 108 is triggered, it realizes the shutter function. Taking the menu function as an example, when the touch pressure detection module 100 detects the touch of the detection object in the recognition area, it realizes the pop-up of the first-level menu; when the physical button 108 is triggered, it realizes the pop-up of the second-level menu, and so on. Specific functions can be set as needed. Optionally, the physical button 108 can realize multi-level pressing functions by electrically connecting it to the first circuit board 103 through conductive adhesive, electrical connecting wire, or solder.

[0103] In this embodiment, the touch pressure detection module 100 further includes a physical button 108. The physical button 108 is disposed on the first circuit board 103 and abuts against the protective plate 107. The protective plate 107 can trigger the physical button 108 when the distance between the first component 1021 and the second component 1022 changes. Thus, when the object touches the recognition area, button feedback can be generated, improving the user experience of using the touch pressure detection module 100. Furthermore, the physical button 108 can realize the multi-level pressing function of the touch pressure detection module 100, which has high functional expandability and can set a variety of custom functions to improve the user experience.

[0104] In one possible implementation, such as Figure 11 and Figure 12 As shown, the second component 1022 is the transmitter. The second component 1022 includes a first transmitter sub-component 10221 and a second transmitter sub-component 10222. The first transmitter sub-component 10221 and the second transmitter sub-component 10222 are disposed on both sides of the physical button 108.

[0105] like Figure 11 and Figure 12 As shown, the second component 1022 is the transmitter, and includes a first transmitting sub-component 10221 and a second transmitting sub-component 10222. When the pressure detection signal is an optical signal, the signal transmission path of the pressure detection signal can be... Figure 11 and Figure 12 As shown by the dashed line in the image.

[0106] In this embodiment, the second component 1022 is a transmitter. The second component 1022 includes a first transmitter sub-component 10221 and a second transmitter sub-component 10222. The first transmitter sub-component 10221 and the second transmitter sub-component 10222 are disposed on both sides of the physical button 108. This allows the physical button 108 to be disposed in the central area of ​​the press detection module, which can improve the button feedback experience when the detected object is touched. It can also improve the user experience without affecting the transmission of the pressure detection signal.

[0107] Figure 13 This is a schematic diagram of another touch pressure detection module including a reinforcing plate provided in the embodiments of this application. Figure 14 This is a schematic diagram of another touch pressure detection module including a reinforcing plate provided in the embodiments of this application, as shown below. Figure 13 and Figure 14 As shown, the touch pressure detection module 100 also includes a second reinforcing plate 109, which is disposed between the first circuit board 103 and the electronic device, and can provide rigid support for the first circuit board 103.

[0108] The touch pressure detection module 100 also includes a second reinforcing plate 109, when the first circuit board 103 is as follows: Figure 1 In the structure shown, the second reinforcing plate 109 is disposed on the first surface of the first circuit board 103, and the second reinforcing plate 109 is located between the first circuit board 103 and the electronic device. When the first circuit board 103 is as shown... Figure 2 In the structure shown, the second reinforcing plate 109 is located on the second surface of the second sub-circuit board 1033, and the second reinforcing plate 109 is located between the first circuit board 103 and the electronic device.

[0109] In this embodiment of the application, the touch pressure detection module 100 further includes a second reinforcing plate 109, which is disposed between the first circuit board 103 and the electronic device. The second reinforcing plate 109 can provide rigid support for the first circuit board 103, thereby preventing the first circuit board 103 from bending and ensuring the reliability of the first circuit board 103.

[0110] In one possible implementation, the second component 1022 is disposed between the touch detection unit 101 and the electronic device. The second component 1022 is a transmitter used to generate a magnetic field, and the first component 1021 is a receiver used to generate an identification signal based on the magnetic field strength. The magnetic field strength is related to the distance between the first component 1021 and the second component 1022.

[0111] The second component 1022 can generate a magnetic field, which is used as a pressure detection signal. Optionally, the second component 1022 can be a magnet, and the first component 1021 can be a magnetic induction chip. The first component 1021 can generate an identification signal based on changes in magnetic field strength. Specifically, the first component 1021 is disposed on the touch detection unit 101, and the second component 1022 is disposed between the touch detection unit 101 and the electronic device. When the object is not touched in the identification area, the relative position between the first component 1021 and the second component 1022 is fixed. When the object is touched in the identification area, the touch detection unit 101 moves along the pressure direction, making the distance between the first component 1021 and the second component 1022 smaller. It should be understood that the closer to the magnet, the higher the magnetic field strength, and the signal generated by the first component 1021 changes. The amount of signal change is the identification signal generated by the first component 1021. The distance change between the first component 1021 and the second component 1022 can be determined based on the identification signal, and the pressure applied by the object can be determined based on the distance change between the first component 1021 and the second component 1022.

[0112] In this embodiment, the second component 1022 is disposed between the touch detection unit 101 and the electronic device. The second component 1022 is a transmitter used to generate a magnetic field, and the first component 1021 is a receiver used to generate an identification signal based on the magnetic field strength. The pressure of the detected object can be determined by the change in magnetic field strength. Since the transmitter is a magnet that generates a magnetic field, there is no need to power the transmitter. Therefore, there is no need to electrically connect the second component 1022 to the first circuit board 103, which simplifies the structure of the pressure detection unit and the wiring difficulty, and reduces the cost.

[0113] Figure 15 This is a schematic diagram illustrating the location of a second component according to an embodiment of this application. Figure 16 This is a schematic diagram illustrating another location of the second component provided in an embodiment of this application, such as... Figure 15 and Figure 16 As shown, the second component 1022 is disposed between the second surface of the touch detection unit 101 and the electronic device. Figure 17 This is a schematic diagram illustrating another possible location of the second component provided in an embodiment of this application, such as... Figure 17 As shown, the second component 1022 is disposed between the third surface of the touch detection unit 101 and the electronic device. The third surface of the touch detection unit 101 is used to connect the first surface of the touch detection unit 101 and the second surface of the touch detection unit 101. The first surface of the touch detection unit 101 and the second surface of the touch detection unit 101 are opposite to each other.

[0114] Taking the touch pressure detection module 100 set in the opening 302 of the middle frame of the electronic device as an example, such as Figure 15As shown, when the touch pressure detection module 100 includes two elastic devices 106, the second component 1022 can be disposed between the two elastic devices 106, such that the second component 1022 is located between the second surface of the touch detection unit 101 and the mid-frame 302 of the electronic device. It should be understood that since the second component 1022 can be a magnet that generates a magnetic field, it does not need to be disposed on the first circuit board 103 as in the aforementioned embodiment. It should also be understood that... Figure 15 The two elastic devices 106 can be replaced with two support members 105. Optionally, as... Figure 16 As shown, when the touch pressure detection module 100 includes an elastic device 106, the second component 1022 can be disposed between the elastic device 106 and the touch detection unit 101, such that the second component 1022 is located between the second surface of the touch detection unit 101 and the mid-frame 302 of the electronic device. Optionally, Figure 15 and Figure 16 A first through hole 1031 is provided on the first circuit board 103, and a second through hole 1041 is provided on the first reinforcing plate 104. However, since a magnetic field scheme is adopted, when the first reinforcing plate 104 is made of a material that will not affect the magnetic field, it is not necessary to provide the first through hole 1031 and / or the second through hole 1041.

[0115] In addition to positioning the second component 1022 between the second surface of the touch detection unit 101 and the mid-frame 302 of the electronic device, the second component 1022 can also be positioned on the side of the touch detection unit 101, for example: Figure 17 As shown, the second component 1022 can be disposed on the middle frame 302 of the electronic device near the side (third surface) of the touch detection unit 101. Optionally, the first component 1021 can be disposed on the side near the second component 1022. The detection principle is explained below. When the second component 1022 is disposed on the side of the touch detection unit 101, when the object being detected is not touched in the recognition area, the relative position between the first component 1021 and the second component 1022 is fixed. When the object being detected touches the recognition area, the touch detection unit 101 moves along the pressure direction, causing a relative displacement between the first component 1021 and the second component 1022. The first component 1021 cuts the magnetic field lines of the magnetic field generated by the second component 1022 located in the middle frame 302. The signal generated by the first component 1021 changes, and the amount of signal change is the recognition signal generated by the first component 1021. The pressure of the object being detected can be determined based on the recognition signal.

[0116] In this embodiment, the second component 1022 is disposed between the second surface of the touch detection unit 101 and the electronic device. This allows the pressure applied by the object to be determined based on the change in distance between the first component 1021 and the second component 1022 before and after pressing. Alternatively, the second component 1022 is disposed between the third surface of the touch detection unit 101 and the electronic device. This allows the pressure applied by the object to be determined based on the change in relative position between the first component 1021 and the second component 1022 before and after pressing. The position of the second component 1022 can be set as needed. For example, when internal space is limited in the electronic device, the second component 1022 can be disposed on the side of the touch detection unit 101. When internal space is ample, the second component 1022 can be disposed between the second surface of the touch detection unit 101 and the electronic device, thus meeting different needs.

[0117] Figure 18 This is a cross-sectional schematic diagram of a touch detection unit provided in an embodiment of this application, as shown below. Figure 18 As shown, the touch detection unit 101 includes: a second circuit board 1011, a substrate 1012, and a touch chip 1013; the pressure detection unit further includes: a pressure chip 1023. The first surface of the second circuit board 1011 is provided with multiple electrodes. The second surface of the second circuit board 1011 is electrically connected to the first surface of the substrate 1012. The touch chip 1013 is electrically connected to the substrate 1012 or the second circuit board 1011. The pressure chip 1023 is electrically connected to the substrate 1012 or the second circuit board 1011. The first component 1021 is disposed on the second surface of the second circuit board 1011. The substrate 1012 is provided with a third through hole 10121 on the signal transmission path of the pressure detection signal.

[0118] The touch chip 1013 can receive the sensing signal generated by the electrode when the object touches the recognition area, and convert the sensing signal into a touch signal. The pressure chip 1023 can receive the recognition signal generated by the receiver and convert the recognition signal into a pressure signal.

[0119] The second circuit board 1011 is electrically connected to the substrate 1012. In one example, the second circuit board 1011 and the substrate 1012 can be electrically connected by soldering. In another example, the second circuit board 1011 can be electrically connected to the substrate 1012 by an electrical connection wire. The touch chip 1013 can be electrically connected to the substrate 1012 or the second circuit board 1011. The pressure chip 1023 can be electrically connected to the substrate 1012 or the second circuit board 1011.

[0120] Touch electrodes are distributed on the first surface of the second circuit board 1011. The touch chip 1013 can send driving signals to the touch electrodes. The touch electrodes can generate sensing signals in response to the driving signals through self-capacitance and / or mutual capacitance. The touch chip 1013 can receive the sensing signals and generate touch signals based on them. Optionally, the touch chip 1013 may include a transimpedance amplifier (TIA) circuit and a post-processing circuit. The TIA can convert the sensing signals into voltage signals, and the post-processing circuit can process the voltage signals and convert the processed voltage signals into touch signals. Optionally, multiple electrodes can be distributed in parallel on the first surface of the second circuit board 1011, and click or swipe operations of the detected object can be identified based on the signal changes of the multiple electrodes. It should be understood that when the touch chip 1013 is electrically connected to the second circuit board 1011, it can receive sensing signals through the second circuit board 1011. When the touch chip 1013 is electrically connected to the substrate 1012, it can receive sensing signals through both the second circuit board 1011 and the substrate 1012.

[0121] Optionally, the first component 1021 is disposed on the second surface of the second circuit board 1011, and the second component 1022 is disposed on the first circuit board 103. When the first component 1021 acts as a receiving end, if the pressure chip 1023 is electrically connected to the second circuit board 1011, the pressure chip 1023 can receive an identification signal through the second circuit board 1011; if the pressure chip 1023 is electrically connected to the substrate 1012, the pressure chip 1023 can receive a sensing signal through the second circuit board 1011 and the substrate 1012. When the second component 1022 acts as a receiving end, if the pressure chip 1023 is electrically connected to the second circuit board 1011, the pressure chip 1023 can receive an identification signal through the first circuit board 103, the substrate 1012, and the second circuit board 1011; if the pressure chip 1023 is electrically connected to the substrate 1012, the pressure chip 1023 can receive a sensing signal through the first circuit board 103 and the substrate 1012.

[0122] Optionally, the touch chip 1013 and the pressure chip 1023 can be disposed between the second circuit board 1011 and the substrate 1012, and both the touch chip 1013 and the pressure chip 1023 can be electrically connected to the second circuit board 1011 or the substrate 1012 through one of conductive adhesive, electrical connecting wires, or soldering. The first component 1021 can also be electrically connected to the second circuit board 1011 through one of conductive adhesive, electrical connecting wires, or soldering, which can be configured as needed.

[0123] Optionally, the third through hole 10121 is at least partially connected to the first through hole 1031 and the second through hole 1041 to form a transmission path for the pressure detection signal.

[0124] Optionally, when the second component 1022 is a magnet, the pressure chip 1023 can be a magnetic induction chip.

[0125] In this embodiment, the touch detection unit 101 includes a second circuit board 1011, a substrate 1012, and a touch chip 1013. Multiple electrodes distributed on the first surface of the second circuit board 1011 can identify touch operations of the detection object and generate sensing signals. The touch chip 1013 can convert the sensing signals into touch signals, thereby identifying the touch operations of the detection object. The pressure chip 1023 can convert the identified signals into pressure signals, thereby identifying the pressure applied by the detection object. Thus, touch detection and pressure degree detection can be implemented simultaneously. Different functions can be achieved based on different pressure degrees applied by the detection object. Compared with existing touch detection solutions, multiple custom functions can be set for different pressure degrees, providing higher functional expandability and improving user experience.

[0126] Figure 19 This is a cross-sectional schematic diagram of a touch detection unit including a first encapsulation layer provided in an embodiment of this application, as shown below. Figure 19 As shown, the touch detection unit 101 further includes a first encapsulation layer 1014, a second circuit board 1011 located within the first encapsulation layer 1014, and at least a portion of the substrate 1012 located within the first encapsulation layer 1014. The first encapsulation layer 1014 has a fourth through hole 10141 on the signal transmission path of the pressure detection signal, and the fourth through hole 10141 is at least partially connected to the third through hole 10121.

[0127] The touch detection unit 101 further includes a first encapsulation layer 1014, which encapsulates the touch detection unit 101. The second circuit board 1011 is located within the first encapsulation layer 1014, and at least a portion of the substrate 1012 is located within the first encapsulation layer 1014. Optionally, the first encapsulation layer 1014 can be a molding encapsulation layer. It should be understood that, since the first component 1021 is disposed on the second surface of the second circuit board 1011, to prevent the first encapsulation layer 1014 from affecting the transmission of the pressure detection signal, the first encapsulation layer 1014 includes a fourth through-hole 10141. The fourth through-hole 10141 is at least partially connected to the third through-hole 10121, i.e., the fourth through-hole 10141, the third through-hole 10121, the second through-hole 1041, and the first through-hole 1031 are connected to form a signal transmission path for the pressure detection signal. Optionally, the thickness of the first encapsulation layer 1014 is ≤200µm to prevent interference with the electrodes for touch detection.

[0128] Optionally, the touch chip 1013 and the pressure chip 1023 can be packaged between the second circuit board 1011 and the substrate 1012. Optionally, the package layer may also include external components, including at least one of resistors, capacitors and inductors.

[0129] Optionally, for example Figure 15 and Figure 16 As shown, when the second component 1022 is a magnet, it is not necessary to provide the third through hole 10121 and the fourth through hole 10141.

[0130] In this embodiment, the touch detection unit 101 further includes a first encapsulation layer 1014, the second circuit board 1011 is located within the first encapsulation layer 1014, and at least a portion of the substrate 1012 is located within the first encapsulation layer 1014. Thus, the touch detection unit 101 can be encapsulated by the encapsulation layer, increasing the dustproof and waterproof capability of the touch detection unit 101, preventing the touch detection unit 101 from being affected by the external environment, and improving the reliability of the touch detection unit 101. Furthermore, the first encapsulation layer 1014 is provided with a fourth through hole 10141 on the signal transmission path of the pressure detection signal. The fourth through hole 10141 is at least partially connected to the third through hole 10121, thereby preventing the encapsulation layer from affecting the transmission of the pressure detection signal, and realizing the detection of pressure intensity based on the pressure detection signal while performing touch detection.

[0131] Figure 20 This is a cross-sectional schematic diagram of a touch detection unit including a protective layer provided in an embodiment of this application, as shown below. Figure 20 As shown, the touch detection unit 101 also includes a protective layer 1015, which is at least partially located in the fourth through hole 10141, and the first component 1021 is located between the second circuit board 1011 and the protective layer 1015.

[0132] The touch detection unit 101 also includes a protective layer 1015, which is at least partially disposed in the fourth through hole 10141. The protective layer 1015 is in contact with the first encapsulation layer 1014. Optionally, when the pressure detection signal is a light signal, the protective layer 1015 can be an infrared-transparent protective adhesive or an infrared-transparent glass.

[0133] In this embodiment of the application, the touch detection unit 101 further includes a protective layer 1015. The protective layer 1015 is at least partially located in the fourth through hole 10141, and the first component 1021 is located between the second circuit board 1011 and the protective layer 1015. The protective layer 1015 can protect the first component 1021, improve the dustproof and waterproof function of the first component 1021, prevent the first component 1021 from being affected by the external environment, and improve the reliability of the pressure detection unit.

[0134] Figure 21This is a cross-sectional schematic diagram of a touch detection unit including a second encapsulation layer provided in an embodiment of this application, as shown below. Figure 21 As shown, the touch pressure detection module 100 further includes: a second encapsulation layer 1016, the second surface of the touch detection unit 101 is electrically connected to the first surface of the first circuit board 103 by soldering, the second encapsulation layer 1016 is disposed between the second surface of the touch detection unit 101 and the first surface of the first circuit board 103, and the second encapsulation layer 1016 is in contact with the second surface of the touch detection unit 101 and the first surface of the first circuit board 103.

[0135] In one example, when the second encapsulation layer 1016 fills the space between the second surface of the touch detection unit 101 and the first surface of the first circuit board 103, the second encapsulation layer 1016 extends beyond the edge of the touch detection unit 101. That is, in the direction perpendicular to the second encapsulation layer 1016, the projection of the touch detection unit 101 on the second encapsulation layer 1016 is located within the edge of the second encapsulation layer 1016.

[0136] Optionally, such as Figure 21 As shown, when the second encapsulation layer 1016 is filled between the second surface of the touch detection unit 101 and the first surface of the first circuit board 103, the solder of the solder joint between the touch detection unit 101 and the first circuit board 103 is located within the second encapsulation layer 1016.

[0137] In this embodiment, the second surface of the touch detection unit 101 is electrically connected to the first surface of the first circuit board 103 by soldering, thereby realizing the electrical connection between the touch detection unit 101 and the first circuit board 103. Communication between the first circuit board 103 and the processing unit is possible. The touch pressure detection module 100 also includes a second encapsulation layer 1016, which protects the electrical connection area between the touch detection unit 101 and the first circuit board 103. This prevents the touch detection unit 101 from being affected by the external environment and also prevents the electrical connection between the touch detection unit 101 and the first circuit board 103 from being lost under the action of external force, thereby improving the reliability of the touch pressure detection module 100.

[0138] It should be understood that, for ease of explanation, Figures 18 to 21 China only adopted Figure 5 The structure of the first circuit board 103 shown is provided as an example. Figures 18 to 21 The touch detection unit 101 shown can also be applied to the structure of the first circuit board 103 in any of the foregoing embodiments, which will not be described again here.

[0139] Figure 22 This is a schematic diagram of an electronic device provided in an embodiment of this application, such as... Figure 22As shown, the electronic device 300 includes a processing unit 301 and a touch pressure detection module 100 in any of the above embodiments. The processing unit 301 can receive touch signals and / or pressure signals.

[0140] It should be noted that the touch pressure detection module 100 in this application embodiment can be the touch pressure detection module 100 in any of the above embodiments, and the processing unit can be the processing unit in any of the above embodiments. For specific structure and signal interaction, please refer to the description in the above embodiments.

[0141] Figure 23 This is a schematic diagram of a mid-frame provided in an embodiment of this application. Figure 24 This is a schematic diagram of another mid-frame provided in an embodiment of this application, such as... Figure 23 and Figure 24 As shown, the touch pressure detection module 100 is disposed in the opening of the middle frame 302 of the electronic device 300.

[0142] In this embodiment, the touch pressure detection module 100 is disposed in the opening of the mid-frame 302 of the electronic device 300, so that the touch pressure detection module 100 can be disposed in the electronic device 300, and the detection object can be pressed on the recognition area of ​​the touch pressure detection module 100. The touch pressure detection module 100 also has high functional expandability (for example, when the electronic device 300 is a mobile phone, the detection object can realize shutter or zoom function on the touch pressure detection module 100 by different pressing pressure, and can realize multi-level menu function on the mobile phone by different pressing pressure), which can improve the user experience.

[0143] It should be understood that the embodiments of this application do not limit the electronic devices or the application functions of the touch pressure detection module. For example, the electronic device can also be an earphone, and the touch pressure detection module can be used to switch songs, switch noise reduction functions, etc., according to different pressure levels of the detected object. The electronic device can also be a vehicle button, and the touch pressure detection module can be used to realize vehicle control, etc., according to different pressure levels of the detected object.

[0144] Figure 25 This is a cross-sectional schematic diagram of a touch pressure detection module including a cover layer provided in an embodiment of this application, as shown below. Figure 25 As shown, the electronic device 300 also includes a cover layer 303, the second surface of which is attached to the touch pressure detection module 100, and the first surface of which is used to provide a recognition area, wherein the first surface of the cover layer 303 is opposite to the second surface of the cover layer 303.

[0145] The touch pressure detection module 100 may be provided with a cover layer 303, which may be disposed on the outer surface of the touch pressure detection module 100. In one example, the cover layer 303 may be an ink layer. Optionally, the cover layer 303 may be set with different colors according to the color of the electronic device 300 to achieve uniformity of appearance.

[0146] In this embodiment, the electronic device 300 further includes a cover layer 303. The second surface of the cover layer 303 is attached to the touch pressure detection module 100, and the first surface of the cover layer 303 is used to provide a recognition area. Thus, the cover layer 303 can protect the touch pressure detection module 100 and provide a recognition area, thereby improving the reliability of the touch pressure detection module 100. Furthermore, the cover layer 303 can be set to different colors according to the color of the electronic device 300, ensuring the uniformity of the appearance of the electronic device 300.

[0147] In one possible implementation, the thickness of the cover layer 303 is less than or equal to 30 μm.

[0148] In this embodiment, the thickness of the cover layer 303 is less than or equal to 30 μm. This allows the touch pressure detection module 100 to be protected by the cover layer 303, while preventing the touch signal quantity generated by the touch detection unit 101 in the touch pressure detection module 100 from being too small when the object is pressed on the recognition area due to the cover layer 303. This can improve the reliability of the touch pressure detection module 100 without affecting the feature detection function of the touch pressure detection module.

[0149] Figure 26 This is a cross-sectional schematic diagram of a touch pressure detection module including a cover plate provided in an embodiment of this application, as shown below. Figure 26 As shown, the electronic device 300 also includes a cover plate 304, the second surface of which is attached to the touch pressure detection module 100, and the first surface of which is used to provide a recognition area, wherein the first surface of the cover plate 304 is opposite to the second surface of the cover plate 304.

[0150] The electronic device 300 may also include a cover plate 304, the second surface of which contacts the touch pressure detection module 100. In one example, the second surface of the cover plate 304 may be bonded to the outer surface of the touch pressure detection module 100. Optionally, the cover plate 304 may be made of materials such as plastic, glass, and sapphire, and the color of the cover plate 304 may be set as needed.

[0151] In this embodiment of the application, the electronic device 300 may further include a cover plate 304, which can protect the touch pressure detection module 100 and provide a recognition area. Thus, the touch pressure detection module 100 can be protected by the cover plate, thereby improving the reliability of the touch pressure detection module 100.

[0152] In one possible implementation, the thickness of the cover plate 304 ranges from [0.15mm, 2mm].

[0153] Preferably, when the cover plate 304 is made of plastic, the thickness of the cover plate 304 is in the range of [1mm, 2mm], and when the cover plate 304 is made of glass and sapphire, the thickness of the cover plate 304 is in the range of [0.15mm, 0.2mm].

[0154] In this embodiment, the thickness of the cover plate 304 is in the range of [0.15mm, 2mm]. This can protect the touch pressure detection module 100 while preventing the signal quantity of the touch signal generated by the touch detection unit 101 of the touch pressure detection module 100 from being too small when the object being detected is pressed on the recognition area due to the presence of the cover plate 304. This can improve the reliability of the touch pressure detection module 100 without affecting the feature detection of the touch pressure detection module 100.

[0155] It should be understood that, for ease of explanation, Figures 23 to 26 The example only uses the structure of one type of touch pressure detection module 100. Figures 23 to 26 The structure of the touch pressure detection module 100 in the electronic device shown can also be applied to any of the foregoing embodiments, and will not be described in detail here.

[0156] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this application.

[0157] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A touch pressure detection module, applied to electronic devices, characterized in that, The touch pressure detection module includes: a touch detection unit, a pressure detection unit, and a first circuit board; The second surface of the touch detection unit is electrically connected to the first surface of the first circuit board. The pressure detection unit includes a first component and a second component. The first component is disposed on the touch detection unit and the first component and the second component are disposed opposite to each other. The first circuit board is electrically connected to the processing unit of the electronic device. The touch detection unit is used to generate a sensing signal when the detection object touches the recognition area, and convert the sensing signal into a touch signal, which is used for touch detection. One of the first component and the second component serves as a transmitter, and the other of the first component and the second component serves as a receiver. The transmitter is used to generate a pressure detection signal, and the receiver is used to generate an identification signal based on the pressure detection signal. The pressure detection unit converts the identification signal into a pressure signal, and the pressure signal is used for pressure detection. The identification signal is related to the distance between the first component and the second component, and the distance between the first component and the second component is related to the pressure applied by the detected object. The first circuit board is used to send the touch signal and / or the pressure signal to the processing unit.

2. The touch pressure detection module according to claim 1, characterized in that, The first circuit board has a first through hole in the signal transmission path of the pressure detection signal; The second component is disposed on the second surface of the first circuit board, and the first circuit board is partially bent so that the first component and the second component are opposite to each other; or, the first circuit board includes a first sub-circuit board and a second sub-circuit board, the first sub-circuit board and the second sub-circuit board are respectively electrically connected to the processing unit, the second surface of the touch detection unit is electrically connected to the first surface of the first sub-circuit board, the second component is disposed on the first surface of the second sub-circuit board, the first surface of the second sub-circuit board is disposed opposite to the second surface of the first sub-circuit board so that the first component and the second component are opposite to each other, and the first through hole is disposed on the first sub-circuit board.

3. The touch pressure detection module according to claim 2, characterized in that, The touch pressure detection module also includes a first reinforcing plate; The first reinforcing plate is attached to the second surface of the first circuit board, and the first reinforcing plate is located between the touch detection unit and the second component. The first reinforcing plate is provided with a second through hole on the signal transmission path of the pressure detection signal, and the second through hole is at least partially connected to the first through hole. The first reinforcing plate is used at least to reinforce the first circuit board.

4. The touch pressure detection module according to claim 3, characterized in that, The touch pressure detection module also includes at least one support component; The at least one support member is disposed between the first reinforcing plate and the surface of the first circuit board on which the second component is disposed; The first reinforcing plate and / or the at least one support member are configured to deform when the detected object touches the recognition area, thereby changing the distance between the first component and the second component.

5. The pressure detection module according to claim 4, characterized in that, The at least one support member is made of a rigid material; The first reinforcing plate is used to deform when the detected object touches the recognition area, so that the distance between the first component and the second component changes. Alternatively, the at least one support member may be made of a soft material; The at least one support member is used to deform when the detected object touches the recognition area, so that the distance between the first component and the second component changes.

6. The touch pressure detection module according to claim 3, characterized in that, The touch pressure detection module also includes at least one elastic device; The first end of the elastic device is housed within the first reinforcing plate, and the first surface of the elastic device near the first end abuts against the support structure of the electronic device. The elastic device is partially bent so that the first surface of the elastic device near the second end abuts against the surface on the first circuit board where the second component is disposed. The first reinforcing plate is used to cause the elastic device to deform when the detected object touches the recognition area, so that the distance between the first component and the second component changes.

7. The touch pressure detection module according to claim 3, characterized in that, The touch pressure detection module also includes: a protection board; The protective plate is disposed between the first reinforcing plate and the second component, and the protective plate covers the second through hole.

8. The touch pressure detection module according to claim 1, characterized in that, The pressure detection signal includes an optical signal.

9. The touch pressure detection module according to claim 8, characterized in that, The transmitting end includes a light-emitting diode, and the receiving end includes a photodiode.

10. The touch pressure detection module according to claim 7, characterized in that, The touch pressure detection module also includes: physical buttons; The physical button is disposed on the first circuit board, and the physical button abuts against the protection board; The protective plate is used to trigger the physical button when the distance between the first component and the second component changes; The physical button is used at least to generate button feedback when the detected object touches the recognition area.

11. The touch pressure detection module according to claim 10, characterized in that, The second component is the transmitter; The second component includes a first transmitting sub-component and a second transmitting sub-component; The first transmitting sub-assembly and the second transmitting sub-assembly are disposed on both sides of the physical button.

12. The touch pressure detection module according to claim 1, characterized in that, The touch pressure detection module also includes: a second reinforcing plate; The second reinforcing plate is disposed between the first circuit board and the electronic device; The second reinforcing plate is used to provide rigid support for the first circuit board.

13. The touch pressure detection module according to claim 1, characterized in that, The second component is disposed between the touch detection unit and the electronic device; The second component is the transmitter used to generate a magnetic field, and the first component is the receiver used to generate the identification signal based on the magnetic field strength, wherein the magnetic field strength is related to the distance between the first component and the second component.

14. The touch pressure detection module according to claim 13, characterized in that, The second component is disposed between the second surface of the touch detection unit and the electronic device, or the second component is disposed between the third surface of the touch detection unit and the electronic device, wherein the third surface of the touch detection unit is used to connect the first surface of the touch detection unit and the second surface of the touch detection unit, and the first surface of the touch detection unit and the second surface of the touch detection unit are opposite to each other.

15. The touch pressure detection module according to claim 13, characterized in that, The first component includes a magnetic induction chip, and the second component includes a magnet.

16. The touch pressure detection module according to any one of claims 1-15, characterized in that, The touch detection unit includes: a second circuit board, a substrate, and a touch chip; the pressure detection unit further includes: a pressure chip; The first surface of the second circuit board has a plurality of electrodes distributed thereon. The second surface of the second circuit board is electrically connected to the first surface of the substrate. The touch chip is electrically connected to the substrate or the second circuit board. The pressure chip is electrically connected to the substrate or the second circuit board. The first component is disposed on the second surface of the second circuit board. The substrate is provided with a third through hole in the signal transmission path of the pressure detection signal. The touch chip is used to receive the sensing signal generated by the electrode when the detected object touches the recognition area, and convert the sensing signal into the touch signal; The pressure chip is used to receive the identification signal generated by the receiving end and convert the identification signal into the pressure signal.

17. The touch pressure detection module according to claim 16, characterized in that, The touch detection unit further includes: a first encapsulation layer; The second circuit board is located within the first encapsulation layer, and at least a portion of the substrate is located within the first encapsulation layer. The first encapsulation layer has a fourth through hole on the signal transmission path of the pressure detection signal, and the fourth through hole is at least partially connected to the third through hole.

18. The touch pressure detection module according to claim 17, characterized in that, The touch detection unit further includes: a protective layer; The protective layer is at least partially located in the fourth through-hole, and the first component is located between the second circuit board and the protective layer.

19. The touch pressure detection module according to claim 16, characterized in that, The touch pressure detection module further includes: a second encapsulation layer; The second surface of the touch detection unit is electrically connected to the first surface of the first circuit board by soldering. The second encapsulation layer is disposed between the second surface of the touch detection unit and the first surface of the first circuit board, and the second encapsulation layer is in contact with the second surface of the touch detection unit and the first surface of the first circuit board.

20. An electronic device, characterized in that, include: The processing unit is a touch pressure detection module as described in any one of claims 1-19; The processing unit is used to receive the touch signal and / or the pressure signal.

21. The electronic device according to claim 20, characterized in that, The touch pressure detection module is disposed in the opening of the middle frame of the electronic device.

22. The electronic device according to claim 21, characterized in that, The electronic device further includes: a cover layer; The second surface of the cover layer is bonded to the touch pressure detection module, and the first surface of the cover layer is used to provide a recognition area, wherein the first surface of the cover layer is opposite to the second surface of the cover layer.

23. The electronic device according to claim 21, characterized in that, The electronic device also includes: a cover plate; The second surface of the cover plate is attached to the touch pressure detection module, and the first surface of the cover plate is used to provide a recognition area, wherein the first surface of the cover plate is opposite to the second surface of the cover plate.

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