Laser welding device

Abstract

The application relates to the chip processing technical field, in particular to a laser welding device. The device comprises a bearing table used for bearing a substrate and a chip on the substrate; a laser generator which is oppositely arranged with the bearing table and is movable along a direction perpendicular to the bearing table; a pressing assembly which is connected with the laser generator and comprises a moving module and a pressing piece connected with the moving module; the moving module drives the pressing piece to move to the lower side of the laser generator along a first direction, a second direction and a third direction, the first direction, the second direction and the third direction are perpendicular to each other, and the pressing piece can penetrate the laser beam or the pressing piece is arranged to be staggered with the laser beam. The pressing piece does not affect the welding of the chip by the laser beam, the laser beam can act on the bearing substrate which needs to be welded vertically, the chip pad is uniformly heated, the problem of virtual welding is effectively solved, and the welding quality of the chip is improved.

Description

Technical Field

[0001] This application relates to the field of chip processing technology, and in particular to a laser welding apparatus. Background Technology

[0002] With the development of the display industry, small-pitch micro-LED chips are increasingly used in the market. Due to the small spacing between adjacent micro-LED chips, the manufacturing process becomes more complex, leading to issues such as chip damage, misalignment, missing chips, or chip detachment during transport. This can result in abnormal LED displays after lighting up, including dead LEDs, dim LEDs, bright LEDs, LED stringing, and color distortion. Furthermore, these defects require rework during panel production. The rework process uses lasers or halogen lamps to heat and solder solder paste to weld the LED chips. However, during the solder paste melting process, the chip essentially floats above the paste, causing a positional shift and chip misalignment. This is especially problematic in MIP (Micro Light Emitting Diode Display) displays, where a single chip has multiple pads; poor contact at even one pad can lead to a cold solder joint or no light at all.

[0003] To address the issue of chip misalignment, related technologies employ a pick-up nozzle to extract new chips and fix their position during panel rework. However, due to the nozzle's obstruction, the laser generator or halogen lamp needs to be installed at an angle, resulting in an skewed beam relative to the substrate. Since the laser's focal length and focus are relatively small, tilted heating can lead to three states for the same chip: positive defocus, positive focus, and negative defocus. This results in poor heating uniformity of the solder pads, causing cold solder joints and affecting the chip's soldering quality. Utility Model Content

[0004] In order to solve the above-mentioned technical problems, or at least partially solve the above-mentioned technical problems, this application provides a laser welding apparatus.

[0005] The first aspect of this application provides a laser welding apparatus, comprising:

[0006] A support platform for supporting a substrate and the chips on the substrate;

[0007] A laser generator is movably disposed opposite to the support platform in a direction perpendicular to the support platform;

[0008] A pressing assembly is connected to the laser generator, and the pressing assembly includes a moving module and a pressing member connected to the moving module. The moving module drives the pressing member to move along a first direction, a second direction and a third direction to below the laser generator. The first direction, the second direction and the third direction are perpendicular to each other. The pressing member can transmit the laser beam or the pressing member is offset from the laser beam.

[0009] In some embodiments, the pressing element includes a pressing sheet made of a light-transmitting material.

[0010] In some embodiments, the pressing element includes a pressing needle or a pressing nozzle, which is offset from the laser beam.

[0011] In some embodiments, the moving module includes a first-direction moving module, a second-direction moving module, and a third-direction moving module; the first-direction moving module includes a first fixing member, a first moving member, and a first driving mechanism disposed between the first fixing member and the first moving member, the first fixing member being connected to the sidewall of the laser generator, and the first driving mechanism having a first moving shaft, the first moving shaft being disposed along the first direction and connected to the first moving member;

[0012] The second direction moving module includes a second driving mechanism and a second moving member. The second driving mechanism is disposed on the first moving member, and the second driving mechanism has a second moving shaft. The second moving shaft is disposed along the second direction and connected to the second moving member.

[0013] The third-direction moving module includes a third driving mechanism and a third moving component. The third driving mechanism is disposed on the second moving component and has a third moving shaft. The third moving shaft is disposed along the third direction and connected to the third moving component. The pressing component is connected to the third moving component.

[0014] In some embodiments, the second direction is a direction perpendicular to the first sidewall, and the first sidewall is configured as the sidewall connecting the laser generator and the first fixing member; the third direction is a direction parallel to the axis of the laser beam emitted by the laser generator.

[0015] In some embodiments, an adjustment module is further included, which is connected between the moving module and the pressing member. The adjustment module drives the pressing member to move along a fourth direction, which is set at an angle to both the second direction and the third direction.

[0016] In some embodiments, the adjustment module includes a fourth fixing member, a fourth moving member, and a fourth driving mechanism disposed between the fourth fixing member and the fourth moving member. The fourth fixing member is connected to the moving module, the fourth moving member is connected to the pressing member, and the fourth driving mechanism has a fourth moving shaft, which is disposed along the fourth direction and connected to the fourth fixing member or the fourth moving member.

[0017] In some embodiments, the fourth fixing member includes a connecting portion and a mounting portion. One end of the connecting portion is connected to the movable module, and the other end extends along the second direction toward the laser generator and is connected to the mounting portion. The mounting portion extends along the fourth direction toward the laser generator. The fourth movable member is arranged parallel to the mounting portion, and the fourth driving mechanism is disposed between the fourth movable member and the mounting portion.

[0018] In some embodiments, the laser generator is equipped with a laser rangefinder, the laser rangefinder's light emission direction is oriented towards the support platform, and the laser generator adjusts the distance between itself and the corresponding chip based on the data detected by the laser rangefinder.

[0019] In some embodiments, a pressure sensor is also included, which is disposed on the pressing member and is used to detect the pressure exerted by the pressing member on the chip.

[0020] The technical solution provided in this application has the following advantages compared with the prior art:

[0021] The laser welding apparatus provided in this application uses a pressing component to fix the chip to be welded, preventing the chip from tilting or shifting during the welding process. The pressing component can be transmitted through the laser beam or set off from the laser beam. In this way, the laser generator can be set perpendicular to the carrier stage. The setting of the pressing component not only fixes the chip to be welded, but also prevents the chip from tilting even after the solder paste is heated due to surface tension. Moreover, the pressing component does not affect the laser beam's welding of the chip. The laser beam can act perpendicularly on the carrier substrate to be welded, so that the chip pads are heated evenly, effectively solving the problem of cold solder joints and improving the welding quality of the chip. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the laser welding apparatus described in the embodiments of this application;

[0025] Figure 2 This is a schematic diagram of the pressing assembly described in the embodiments of this application;

[0026] Figure 3 This is a flowchart of the chip welding method described in the embodiments of this application.

[0027] Among them, 1. Laser generator;

[0028] 2. Pressing assembly;

[0029] 21. First direction moving module; 22. Second direction moving module; 23. Third direction moving module; 24. Pressing component; 251. Fourth fixing component; 252. Fourth moving component; 253. Fourth drive mechanism; 2511. Connecting part; 2512. Mounting part; 26. Pressure sensor; 27. First mounting component. Detailed Implementation

[0030] To better understand the above-mentioned objectives, features, and advantages of this application, the solution of this application will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0031] Many specific details are set forth in the following description in order to provide a full understanding of this application, but this application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of this application, and not all embodiments.

[0032] MIP (Micro LED in Package) is a technology that directly packages micro LED chips (Micro Light Emitting Diode Displays) onto a substrate, belonging to the advanced display and lighting fields. During panel production, defective LED chips need to be reworked. The overall rework process includes four steps: rejection, soldering, surface mounting, and soldering, each requiring a certain amount of time. The current rework process uses a pick-up nozzle to grab new LED chips and place them at the defective location. The nozzle is then used to press the chip down for soldering, meaning the soldering and pick-up processes cannot be synchronized. The nozzle cannot move on to the next step of picking up LED chips in advance, reducing efficiency to some extent. Furthermore, because the nozzle obstructs the LED chip, the laser needs to be installed at an angle to avoid obstruction. This angled installation and adjustment is difficult. The laser's heating effect on the panel is not perpendicular, and since lasers have a focal length and relatively small focus, tilting the heat can result in three states for the same chip: positive defocus, positive focus, and negative defocus. This leads to poor heat uniformity on the solder pads, potentially causing cold solder joints.

[0033] To address the technical problem of cold solder joints, embodiments of this application provide a laser welding apparatus and a chip welding method implemented using the apparatus.

[0034] Specifically, an embodiment of this application provides a laser welding apparatus, comprising:

[0035] A support platform (not shown in the figure) is movable. When reworking the panel, the panel is fixed to the support platform and moved horizontally to a preset position. The panel includes a support substrate and chips mounted on the substrate. Several micro-LED chips are mounted on the support substrate according to functional requirements. During panel reworking, defective micro-LED chips need to be removed, solder is applied to the defective areas, and new micro-LED chips are placed on the solder paste and soldered. All of these operations are performed on the support platform. The support platform can move horizontally.

[0036] like Figure 1 As shown, the laser welding apparatus also includes a laser generator 1, which is movably disposed opposite to the support platform in a direction perpendicular to the support platform. In some embodiments of this application, the support platform is horizontally disposed, and the laser welding apparatus is vertically disposed above the support platform and is capable of lifting and lowering above the support platform.

[0037] The laser welding apparatus also includes a pressing assembly 2, which is connected to the laser generator 1. The pressing assembly 2 includes a moving module and a pressing component 24 connected to the moving module. The moving module drives the pressing component 24 to move along a first direction, a second direction, and a third direction. The first direction, the second direction, and the third direction are perpendicular to each other, allowing the laser beam to penetrate the pressing component 24 and act on the chip's pads. Alternatively, the pressing component 24 can be offset from the laser beam, allowing the laser beam to act perpendicularly on the chip's pads. In other words, the pressing position of the pressing component 24 on the chip is offset from the position of the pads to be welded, thus preventing the pressing component 24 from interfering with the laser beam. A vertically positioned laser generator 1 can be used in this way.

[0038] The laser welding apparatus provided in this application uses a pressing component 24 to fix the chip to be welded, preventing the chip from tilting or shifting during the welding process. The pressing component 24 can be arranged to allow the laser beam to pass through or be offset from the laser beam. In this way, the laser generator 1 can be set perpendicular to the carrier platform. The setting of the pressing component 24 not only fixes the chip to be welded, but also prevents the chip from tilting even after the solder paste is heated and under the action of surface tension. Moreover, the pressing component 24 does not affect the laser beam's welding of the chip. The laser beam can act perpendicularly on the carrier substrate to be welded, so that the chip pads are heated evenly, effectively solving the problem of cold solder joints and improving the welding quality of the chip.

[0039] It should be noted that the laser welding device in this embodiment only performs the welding process during the rework of the panel on the carrier platform. Rejection, soldering, and chip mounting processes require other devices to complete. For example, chip mounting can be performed using a pick-up nozzle. The nozzle picks up a new chip, places it on the carrier substrate where welding is required, and then the clamping component 24 presses the chip to fix it. Finally, the laser generator 1 welds the chip. Throughout the process, the pick-up nozzle and the clamping component 24 can work independently. When welding the chip, the clamping component 24 fixes the chip, while the pick-up nozzle can pick up other chips, greatly improving the efficiency of the rework process.

[0040] like Figure 2 As shown, in some embodiments of this application, the pressing component 24 is a pressing sheet made of a light-transmitting material, such as high-transmittance glass. During chip soldering, the pressing sheet moves to a position coaxial with the laser beam. The laser beam passes through the pressing sheet to heat the solder paste, thereby achieving soldering of the pads on the chip. Using a pressing sheet for the pressing component 24 increases the contact area between the pressing component 24 and the chip, improves the stability of the chip fixation effect, avoids chip misalignment and skewing during soldering, and thus improves soldering quality.

[0041] In other embodiments of this application, the pressing component 24 may also employ a smaller structure such as a pressing pin or a pressing nozzle, which is offset from the laser beam. When pressing the chip, the pressing pin or nozzle must avoid the areas on the chip that need to be soldered, such as solder pads. This ensures that the pressing component 24 does not interfere with the laser beam, allowing the laser beam to strike the chip perpendicularly to the panel. The perpendicular action of the laser beam on the panel results in better uniform heating of the solder pads, thereby improving the soldering quality.

[0042] In some embodiments of this application, the moving module includes a first-direction moving module 21, a second-direction moving module 22, and a third-direction moving module 23. The first-direction moving module 21 includes a first fixing member, a first moving member, and a first driving mechanism disposed between the first fixing member and the first moving member. The first fixing member is connected to the side wall of the laser generator 1. The first driving mechanism has a first moving shaft, which is arranged along a first direction (Y direction) and connected to the first moving member. Specifically, in some embodiments of this application, the moving module includes a first mounting member 27, which has a first mounting plate and a second mounting plate. The first and second mounting plates are vertically arranged, and the first mounting plate has a first mounting hole. The side wall of the laser generator 1 has a second mounting hole, and screws pass through the first and second mounting holes to fix the first mounting member 27 to the side wall of the laser generator 1. The second mounting plate is arranged horizontally, and the first-direction moving module 21, the second-direction moving module 22, and the third-direction moving module 23 are all mounted on the second mounting plate.

[0043] The first fixing member is fitted to the second mounting plate, the first movable plate is located above the first fixing plate, and the first drive mechanism is located between the first fixing plate and the first movable plate, with the first moving shaft arranged along a first direction. The first movable plate is connected to the first moving shaft, thereby driving the first movable plate to move linearly along the first direction. The first drive mechanism can be a linear cylinder, specifically a rodless cylinder. A rodless cylinder is a cylinder that uses a piston to directly or indirectly connect to an external actuator, causing it to reciprocate following the piston. The biggest advantage of this type of cylinder is that it saves installation space. The number of first drive mechanisms can be one or more. When there are multiple first drive mechanisms, they are spaced apart and operate synchronously.

[0044] The second-direction moving module 22 includes a second driving mechanism and a second moving member. The second driving mechanism is disposed on the first moving member and has a second moving shaft, which is arranged along a second direction (X-direction) and connected to the second moving member. Specifically, in some embodiments of this application, the second moving member is located above the first moving member and is arranged parallel to the first moving member. The second driving mechanism is fixed to the first moving member, and the second moving shaft is arranged along the second direction to drive the second moving member to move linearly along the second direction. The second driving mechanism may also adopt the same structure as the first driving mechanism, such as a rodless cylinder.

[0045] The third-direction moving module 23 includes a third driving mechanism and a third moving member. The third driving mechanism is disposed on the second moving member and has a third moving axis. The third moving axis is disposed along the third direction (Z direction) and connected to the third moving member. Specifically, in some embodiments of this application, the third moving axis is vertically disposed, and the pressing member 24 is located at the lower end of the third moving axis, driving the pressing member 24 to move up and down relative to the laser generator 1.

[0046] By setting up the first direction moving module 21, the second direction moving module 22 and the third direction moving module 23, the pressing component 24 can be moved relative to the laser generator 1 in the first direction, the second direction and the third direction, thereby adjusting the position of the pressing component 24 with high adjustment accuracy and flexibility.

[0047] Furthermore, in some embodiments of this application, the second direction is a direction perpendicular to the first sidewall, the first sidewall is configured as the sidewall connecting the laser generator 1 and the first fixing member, and the third direction is a direction parallel to the axis of the laser beam emitted by the laser generator 1.

[0048] like Figure 2 As shown, the third direction (Z direction) is vertical, and the first direction (Y direction) and the second direction (X direction) are both horizontal. When the second direction moving module 22 moves, it drives the pressing component 24 to move in the direction of approaching and moving away from the laser generator 1. When the third direction moving module 23 moves, it drives the pressing component 24 to move in the direction parallel to the laser generator 1. When the third direction moving module 23 moves, it drives the pressing component 24 to move in the vertical direction.

[0049] In some embodiments of this application, the laser welding apparatus further includes an adjustment module connected between the moving module and the pressing member 24. The adjustment module drives the pressing member 24 to move along the fourth direction (XZ direction), which is set at an angle to the second and third directions.

[0050] When the adjustment module moves, the pressing part 24 moves along the fourth direction, having displacement along the second direction and displacement in the third direction.

[0051] In some embodiments of this application, the angle between the fourth direction and the second direction is 45°, and the angle between the fourth direction and the third direction is 45°. Of course, the angle between the fourth direction and the second direction can also be 40°, and the angle with the third direction can be 50°. Specifically, the angles between the fourth direction and the second and third directions can be set according to actual conditions.

[0052] In some embodiments of this application, the adjustment module includes a fourth fixing member 251, a fourth moving member 252, and a fourth driving member disposed between the fourth fixing member 251 and the fourth moving member 252. The fourth fixing member 251 is connected to the third moving member, the fourth moving member 252 is connected to the pressing member 24, and the fourth driving mechanism 253 has a fourth moving shaft, which is disposed along a fourth direction and connected to the fourth fixing member 251 or the fourth moving member 252.

[0053] The fourth moving axis drives the fourth moving part 252 to move linearly in the fourth direction. The pressing part 24 is fixedly connected to the fourth moving part 252, which in turn drives the pressing part 24 to move linearly in the fourth direction. When the fourth driving mechanism 253 moves, it drives the pressing part 24 to move obliquely to directly below the laser generator 1. The moving path is short and the moving speed is fast.

[0054] In some embodiments of this application, the fourth fixing member 251 includes a connecting portion 2511 and a mounting portion 2512. One end of the connecting portion 2511 is connected to the lower end of the third moving member, and the other end extends along the second direction toward the laser generator 1 and is connected to the mounting portion 2512. The mounting portion 2512 extends along the fourth direction toward the laser generator 1. The fourth moving member 252 is arranged parallel to the mounting portion, and the fourth driving mechanism 253 is disposed between the fourth moving member 252 and the mounting portion 2512. It should be noted that in some other embodiments of this application, the fourth fixing member 251 may only include the inclined mounting portion 2512, excluding the connecting portion 2511. The specific structure can be determined according to the model and structure of the fourth driving mechanism 253, and the specific structure and size of the first direction moving module 21, the second direction moving module 22, and the third direction moving module 23.

[0055] In some embodiments of this application, the laser generator 1 is equipped with a laser rangefinder, the laser rangefinder’s light emission direction is set toward the support platform, and the laser generator 1 is raised and lowered according to the data detected by the laser rangefinder until the number detected by the laser rangefinder meets the preset value.

[0056] In some embodiments of this application, the laser welding apparatus further includes a pressure sensor 26, which is disposed on the pressing member 24 and is used to detect the pressure exerted by the pressing member 24 on the chip. When the pressure exerted by the pressing member 24 on the chip is too large, it may damage the chip. When the pressure exerted by the pressing member 24 on the chip is too small, the fixing effect is not good, and the chip may still be at risk of being crooked or skewed, affecting the fixing effect of the chip.

[0057] The controller of the rework equipment adjusts the position of the pressing component 24 based on the pressure value detected by the pressure sensor 26, so that the pressure value of the chip under the action of the pressing component 24 meets the preset pressure value requirement.

[0058] When the above-mentioned laser welding device is used to weld the chip, the laser beam passes through the pressure plate and acts on the chip. During the welding process, the pressure plate will keep the chip under downward pressure. During the welding process, the solder paste melts and the chip floats. At the same time, the welding heating will melt the original solder paste. Under the pressure, the chip descends to the electrodes to complete the contact with the pads, thereby realizing the chip welding.

[0059] like Figure 3 As shown, the laser welding apparatus of this application mainly includes the following steps when welding chips:

[0060] S1, the support platform moves the panel to be repaired so that the chip to be soldered is moved to the position corresponding to the laser generator 1, that is, directly below the laser generator 1.

[0061] S2, the moving module drives the pressing component 24 to move to the position corresponding to the laser generator 1; specifically, in some embodiments of this application, the fourth moving module drives the pressing component 24 to move along the fourth direction to directly below the laser generator 1, that is, to move between the laser generator 1 and the chip.

[0062] S3, the laser generator 1 moves to a preset height. During this process, the pressing component 24 moves with the laser generator 1 and presses the chip.

[0063] S4, adjust the position of the pressing component 24 according to the actual pressure exerted on the chip by the pressing component 24, so that the pressure exerted on the chip by the pressing component 24 meets the preset pressure value;

[0064] S5, laser generator 1 emits a laser beam to weld the chip.

[0065] After welding is completed, laser generator 1 rises, and pressing component 24 retracts to its original position along with the fourth moving module.

[0066] Specifically, in step S2, if the pressing component 24 fails to move to the direct under the laser generator 1 during the process of the fourth moving module moving the pressing component 24, the position of the pressing component 24 can be adjusted by the movement of the first direction moving module 21, the second direction moving module 22 and the third direction moving module 23, so that the pressing component 24 eventually moves to the direct under the laser generator 1.

[0067] In step S3, the laser rangefinder detects the actual distance between the laser generator 1 and the panel, and adjusts the actual position of the laser generator 1 according to the preset height to meet the preset height value.

[0068] In step S4, the pressure sensor 26 on the pressing member 24 can detect the actual pressure exerted by the pressing member 24 on the chip in real time, and adjust the position of the pressing member 24 according to the detected actual pressure, so that the pressure exerted by the pressing member 24 on the chip meets the preset pressure value.

[0069] In summary, the laser welding apparatus and chip welding method provided in this application, while maintaining the vertical mounting layout of the laser beam relative to the support platform, add a pressing component 2. The laser beam acts vertically on the panel, resulting in good heating uniformity of the solder pads. The pressing component 24 of the pressing component 2 presses down on the chip, preventing the chip from tilting due to the surface tension generated by the heated solder paste. Pressing the chip electrodes suspended on the solder paste surface into contact with the solder pads also eliminates cold solder joint defects. Simultaneously, the welding heating process melts the original solder paste pads, causing the chip to descend and contact the pads, effectively solving the problem of cold solder joints. Therefore, this solution is superior to existing technologies in terms of rework efficiency, welding effect, and manpower.

[0070] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0071] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser welding apparatus, characterized in that, include: A support platform for supporting a substrate and the chips on the substrate; A laser generator is movably disposed opposite to the support platform in a direction perpendicular to the support platform; A pressing assembly is connected to the laser generator, and the pressing assembly includes a moving module and a pressing member connected to the moving module. The moving module drives the pressing member to move along a first direction, a second direction, and a third direction. The first direction, the second direction, and the third direction are perpendicular to each other. The pressing member can transmit a laser beam or the pressing member is offset from the laser beam.

2. The laser welding apparatus according to claim 1, characterized in that, The pressing component includes a pressing sheet, which is made of a light-transmitting material.

3. The laser welding apparatus according to claim 1, characterized in that, The pressing component includes a pressing needle or a pressing nozzle, which is offset from the laser beam.

4. The laser welding apparatus according to claim 1, characterized in that, The moving module includes a first-direction moving module, a second-direction moving module, and a third-direction moving module; the first-direction moving module includes a first fixing member, a first moving member, and a first driving mechanism disposed between the first fixing member and the first moving member, the first fixing member being connected to the side wall of the laser generator, and the first driving mechanism having a first moving shaft, the first moving shaft being disposed along the first direction and connected to the first moving member; The second direction moving module includes a second driving mechanism and a second moving member. The second driving mechanism is disposed on the first moving member, and the second driving mechanism has a second moving shaft. The second moving shaft is disposed along the second direction and connected to the second moving member. The third-direction moving module includes a third driving mechanism and a third moving component. The third driving mechanism is disposed on the second moving component and has a third moving shaft. The third moving shaft is disposed along the third direction and connected to the third moving component. The pressing component is connected to the third moving component.

5. The laser welding apparatus according to claim 4, characterized in that, The second direction is perpendicular to the first sidewall, which is configured as the sidewall connecting the laser generator and the first fixing member; the third direction is parallel to the axis of the laser beam emitted by the laser generator.

6. The laser welding apparatus according to any one of claims 1-5, characterized in that, It also includes an adjustment module connected between the moving module and the pressing member. The adjustment module drives the pressing member to move along a fourth direction, which is set at an angle to both the second direction and the third direction.

7. The laser welding apparatus according to claim 6, characterized in that, The adjustment module includes a fourth fixing member, a fourth moving member, and a fourth driving mechanism disposed between the fourth fixing member and the fourth moving member. The fourth fixing member is connected to the moving module, the fourth moving member is connected to the pressing member, and the fourth driving mechanism has a fourth moving shaft, which is arranged along the fourth direction and connected to the fourth fixing member or the fourth moving member.

8. The laser welding apparatus according to claim 7, characterized in that, The fourth fixing member includes a connecting part and a mounting part. One end of the connecting part is connected to the moving module, and the other end extends along the second direction toward the laser generator and is connected to the mounting part. The mounting part extends along the fourth direction toward the laser generator. The fourth moving member is arranged parallel to the mounting part, and the fourth driving mechanism is arranged between the fourth moving member and the mounting part.

9. The laser welding apparatus according to claim 1, characterized in that, The laser generator is equipped with a laser rangefinder, and the laser rangefinder's light emission direction is set towards the support platform. The laser generator adjusts the distance between itself and the corresponding chip based on the data detected by the laser rangefinder.

10. The laser welding apparatus according to claim 1, characterized in that, It also includes a pressure sensor, which is disposed on the pressing member and is used to detect the pressure exerted by the pressing member on the chip.

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