Sn ball separation closed loop supply device and multi-channel sn ball laser welding machine

Abstract

The utility model is a tin ball separation closed loop supply device and a multi-channel tin ball laser welding machine, the supply of tin balls from the bin body to the blanking hole is realized through the transverse movement of the first moving plate and the second moving plate in the tin ball separation closed loop supply device, compared with the traditional rotary table supply device, the device reduces the floor space, and solves the problems of jamming, deformation due to impact and difficulty in taking materials during the tin ball feeding process; the multi-channel tin ball laser welding machine is connected with the conveying member through two symmetrical tin ball separation closed loop supply devices, realizes the supply of different specifications of tin balls, and is convenient for subsequent welding.

Description

Technical Field

[0001] This utility model relates to the field of laser soldering technology, and in particular to a closed-loop supply device for separating solder balls and a multi-channel laser soldering machine for solder balls. Background Technology

[0002] Solder ball welding machines achieve high-precision welding during chip packaging and wafer packaging processes, ensuring good electrical connection and mechanical stability between the chip and the substrate. Solder ball welding machines typically include a closed-loop solder ball separation and supply device, a laser melting device, and nitrogen assistance.

[0003] Solder ball separation closed-loop supply device orderly transports tiny solder balls to the feeding position through a solder ball storage and supply system, and then places the solder balls near the nozzle of the soldering head through a positioning and transmission mechanism; such as the patent with publication number: CN114473265B, entitled "Rapid Solder Ball Separation Mechanism". Conventional solder ball separation closed-loop supply devices often achieve feeding through a rotating turntable. However, the above-mentioned mechanism has an excessively large footprint due to the rotation of the turntable. In addition, during the operation of the above device, because the dispensing cylinder and the storage cylinder are fixedly connected, the internal diameter of the dispensing cylinder is larger than the diameter of the solder ball but less than twice the diameter of the solder ball. As a result, the solder balls will get stuck at the connection between the dispensing cylinder and the storage cylinder during the feeding process, resulting in poor solder ball discharge.

[0004] For example, in the patent with publication number CN211102023U entitled "Solder Ball Conveying Mechanism and Laser Solder Ball Welding Device", the solder balls are conveyed from the top of the substrate to the bottom of the substrate by a vertically rotating feed trough cover. However, in the above mechanism, multiple solder balls entering the conveying pipe collide with the solder balls already located in the feed trough, causing the solder balls to deform. The deformation of the solder balls will prevent them from entering the feed trough of the feed trough cover. Furthermore, because multiple solder balls in the conveying pipe collide with the solder balls in the feed trough, the solder balls in the feed trough are in a state of collision and agitation, making it difficult for the solder balls to enter the feed trough cover.

[0005] In summary, how to design a new closed-loop solder ball separation and supply device to solve the problems of jamming, deformation due to impact, and difficulty in retrieving solder balls during the feeding process has become an urgent problem for researchers in this field. Summary of the Invention

[0006] The technical problem to be solved by this utility model is: how to design a new closed-loop solder ball separation and supply device to solve the problems of jamming, deformation due to impact, and difficulty in picking up solder balls during the feeding process.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: This utility model is a closed-loop solder ball separation and supply device, comprising: a transfer section having a downward-facing transfer cavity; a hopper assembly disposed on the top of the transfer section and communicating with the transfer cavity; a fixed plate fixed to the bottom of the transfer section and having a transfer hole thereon; a first moving plate, which is laterally disposed between the transfer section and the fixed plate under the drive of a linear module, and having a transfer hole thereon; a dropping plate fixed to the bottom of the fixed plate and having a dropping hole thereon; and a second moving plate, which is laterally disposed between the fixed plate and the dropping plate under the drive of a linear module, and having a through hole thereon; when solder balls are supplied, multiple solder balls fall from the hopper assembly into the transfer cavity, and a single solder ball located in the transfer hole falls into the transfer hole under the lateral movement of the first moving plate, and the second moving plate laterally moves, causing the single solder ball in the transfer hole to pass through the through hole and then fall out from the dropping hole for supply.

[0008] Furthermore, the hopper assembly includes: a feeding section having a feeding chamber with an opening facing downwards, the bottom of which is connected to the transfer section; and a hopper body disposed on top of the feeding section and communicating with the feeding chamber, which stores multiple solder balls.

[0009] Furthermore, the top surface of the transfer section and the portion projected downward from the feed chamber is an inclined wall, and a feed hole is provided at the lower part of the inclined wall, which is connected to the transfer chamber.

[0010] Furthermore, the transfer section is also provided with a downward-facing buffer cavity, which is located on one side of the transfer cavity and is connected to the transfer cavity. The top of the buffer cavity is connected to the feed hole.

[0011] Furthermore, the bottom of the transfer section is inclined, the first moving plate slides against the bottom of the transfer section, and the material transfer hole is provided at the low position of the first moving plate.

[0012] Furthermore, a detection hole is provided through the transfer hole to allow the detection light to pass through.

[0013] Furthermore, the first moving plate and the second moving plate move synchronously under the drive of the same linear module, which is adapted to connect the material transfer hole with the transfer hole, or connect the through hole with the transfer hole, or connect the through hole with the discharge hole.

[0014] Furthermore, the first moving plate is driven to move laterally by the first linear module, and the second moving plate is driven to move laterally by the second linear module.

[0015] Furthermore, the transfer hole and the discharge hole are connected vertically, and the transfer part is provided with an air nozzle for blowing air toward the transfer hole.

[0016] This utility model also provides a multi-channel solder ball laser welding machine, including two symmetrically arranged solder ball separation closed-loop supply devices. The two solder ball separation closed-loop supply devices are connected by a conveyor. A nozzle is provided at the bottom of the conveyor, and a conveying channel is provided inside the conveyor to connect the nozzle with the corresponding drop hole.

[0017] The beneficial effects of this utility model are as follows: This utility model is a closed-loop solder ball separation and supply device and a multi-channel solder ball laser welding machine. In the closed-loop solder ball separation and supply device, the lateral movement of the first moving plate and the second moving plate realizes the feeding of solder balls from the hopper body to the discharge hole. Compared with the traditional rotary feeding device, this device reduces the floor space. Secondly, the solder balls entering the transfer chamber are located at the low position of the first moving plate. The movable first moving plate can realize the picking up of all solder balls in the transfer chamber. Even if the solder balls in the transfer chamber are stuck, the lateral movement of the first moving plate can disrupt the balance of multiple solder balls and smoothly enter the discharge hole. Furthermore, the solder balls are first guided into the buffer by the inclined wall. The solder balls are then fed into the transfer chamber, preventing them from colliding directly. The reduced potential energy of the solder balls entering the transfer chamber from the buffer chamber lowers their potential energy, making it easier for them to enter the transfer hole and preventing deformation. Finally, compared to traditional turntable structures, the solder balls in this invention are discharged after a short lateral movement via the first and second moving plates. This shorter lateral movement path prevents flux wear on the solder ball surface due to a longer path. Furthermore, this multi-channel solder ball laser welding machine connects to the conveyor via two symmetrical closed-loop solder ball separation supply devices, enabling the supply of solder balls of different specifications, facilitating subsequent welding.

[0018] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a structural schematic diagram of Example 1; Figure 2 This is a schematic diagram of the transfer unit in Example 1; Figure 3 This is a structural schematic diagram of the transfer unit from another perspective in Embodiment 1; Figure 4 This is a cross-sectional view of Example 1; Figure 5 This is a cross-sectional view from another perspective of Embodiment 1; Figure 6This is a cross-sectional view of the first and second movable plates in Embodiment 1 with the first and second movable plates positioned on the left. Figure 7 This is a cross-sectional view of Embodiment 1 in which the first movable plate is on the right and the second movable plate is on the left. Figure 8 This is a cross-sectional view of the first and second movable plates in Embodiment 1, with the first and second movable plates positioned on the right. Figure 9 This is a cross-sectional view of the first movable plate in the left position in Embodiment 2; Figure 10 This is a cross-sectional view of the first movable plate in the right position in Embodiment 2; Figure 11 This is a schematic diagram of a multi-channel solder ball laser welding machine.

[0021] In the diagram: 1-Hopper assembly, 11-Hopper body, 12-Feeding section, 121-Feeding chamber, 2-Transfer section, 21-Transfer chamber, 22-Groove, 23-Inclined wall, 24-Feeding hole, 25-Buffer chamber, 3-First moving plate, 31-Transfer hole, 4-Fixed plate, 41-Transfer hole, 42-Detection hole, 43-Detection beam, 5-Second moving plate, 51-Through hole, 6-Discharge plate, 61-Discharge hole, 7-Linear module, 71-First linear module, 72-Second linear module, 8-Air nozzle, 10-Solder ball separation closed-loop supply device, 100-Multi-channel solder ball laser welding machine, 110-Conveying component, 120-Nozzle, 130-Conveying channel, 140-Laser device. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention. Therefore, they only show the components, orientations, and references (e.g., up, down, left, right, etc.) relevant to the present invention and are intended only to aid in the description of the features in the drawings. Therefore, the following specific embodiments are not intended to be restrictive, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents. Example 1

[0023] See Figure 1 This embodiment is a closed-loop solder ball separation and supply device 10. From top to bottom on the right side of the figure, the device includes a hopper assembly 1, a transfer section 2, a first moving plate 3, a fixed plate 4, a second moving plate 5, and a dropping plate 6. On the left side of the figure is a linear module 7 that drives the first moving plate 3 and the second moving plate 5 to move horizontally left and right. (See also...) Figure 2 , 3 The transfer section 2 has a downward-facing transfer cavity 21; the hopper assembly 1 is disposed on the top of the transfer section 2 and is connected to the transfer cavity 21, allowing solder balls to fall from the hopper assembly 1 into the transfer cavity 21; see also Figure 4 A transfer hole 41 is provided on the fixed plate 4; the first moving plate 3 is horizontally moved left and right between the transfer part 2 and the fixed plate 4 under the drive of the linear module 7; see Figure 2 The bottom surface of the transfer section 2, extending to one side of the transfer cavity 21, is provided with a groove 22 for the first moving plate 3 to move; see also Figure 4 The first moving plate 3 has a transfer hole 31. The diameter of a single solder ball is d. The inner diameter of the transfer hole 31 is between greater than d and less than 2d. The transfer hole 31 can only accommodate a single solder ball. Thus, the single solder ball that enters the transfer cavity 21 enters the transfer hole 31. When the first moving plate 3 is moved horizontally until the transfer hole 31 and the transfer hole 41 are vertically connected, the solder ball falls from the transfer hole 31 to the transfer hole 41. The dropping plate 6 has a dropping hole 61. The second moving plate 5 is moved horizontally between the fixed plate 4 and the dropping plate 6 under the drive of the linear module 7. The second moving plate 5 has a through hole 51. The top of the through hole 51 has an flared opening to facilitate the entry of the solder ball.

[0024] To illustrate the specific structure of the silo assembly, see [link / reference]. Figure 1 , 4 The hopper assembly 1 includes a hopper body 11 and a feeding section 12 arranged vertically. The feeding section 12 has a feeding chamber 121 with an opening facing downwards, and its bottom is connected to the transfer section 2. The hopper body 11 stores multiple solder balls and is connected to the feeding chamber 121.

[0025] As can be seen from the above, the multiple solder balls stored in the hopper body 11 enter the feeding chamber 121 of the feeding section 12 under the action of gravity. The multiple solder balls entering the feeding chamber 121 also enter the transfer chamber 21 of the transfer section 2 under the action of gravity. In this way, the solder balls can enter the transfer chamber 21 through the feeding chamber 121 under the action of gravity.

[0026] To explain how the solder balls in the feed chamber enter the transfer chamber of the transfer section, see [link to relevant documentation]. Figure 2 The top surface of the transfer section 2 and the portion projected downward from the feed chamber 121 is an inclined wall 23. A feed hole 24 is provided at the lower position of the inclined wall 23, and the feed hole 24 is connected to the transfer chamber 21. As can be seen from the above, the solder balls that have entered the feeding chamber 121 are guided by the inclined wall 23 at the top of the transfer section 2 to move sequentially to the lower feeding hole 24. The solder balls fall into the transfer chamber 21 through the feeding hole 24. In this way, the solder balls are guided from the feeding chamber 121 into the transfer chamber 21 by only the gravity of the solder balls and the guidance of the inclined wall 23.

[0027] To reduce the impact on the solder balls inside the transfer chamber during their fall into the transfer chamber, see [reference needed]. Figure 3The transfer section 2 is also provided with a buffer chamber 25 with the opening facing downward. The buffer chamber 25 is located on one side of the transfer chamber 21 and is connected to the transfer chamber 21. The top of the buffer chamber 25 is connected to the feed hole 24.

[0028] As can be seen from the above, a buffer chamber 25 is provided on one side of the transfer chamber 21 in the transfer section 2. The buffer chamber 25 is connected to the transfer chamber 21. The solder balls that have entered the feeding chamber 121 first enter the buffer chamber 25 through the feeding hole 24, and then enter the transfer chamber 21 from the buffer chamber 25. This avoids the solder balls falling directly from the feeding hole 24 into the transfer chamber 21, which would impact the solder balls already in the transfer chamber 21. The solder balls would be difficult to place stably in the transfer chamber 21, making it difficult for solder balls to enter the transfer hole 31 in the first moving plate 3. In addition, by reducing the impact on the solder balls, the deformation of the solder balls due to the impact can be avoided.

[0029] For instructions on how to facilitate the entry of solder balls from the transfer cavity into the transfer hole, please refer to [link / reference]. Figure 5 The bottom of the transfer section 2 is inclined, and the first moving plate 3 slides against the bottom of the transfer section 2. A material transfer hole 31 is provided at the low position of the first moving plate 3.

[0030] As can be seen from the above, the top surface of the first moving plate 3 is inclined to fit the bottom of the transfer section 2, and a transfer hole 31 is provided at the low position of the first moving plate 3. The solder balls move from the top inclined wall 23 of the transfer section 2 to the low position of the transfer cavity 21 inside the transfer section 2, and the path is roughly a horizontal V-shaped trajectory. In this way, the solder balls entering the transfer cavity 21 will gather in the transfer cavity 21 of the transfer section 2 and the low position on the right side of the first moving plate 3. All the solder balls located in the transfer cavity 21 can enter the transfer hole 31 in sequence during the reciprocating horizontal movement of the first moving plate 3, so as to avoid any solder balls being stuck in the transfer cavity 21 and unable to be picked up by the transfer hole 31 of the first moving plate 3.

[0031] See Figure 4 A detection hole 42 is obliquely arranged through the transfer hole 41 in the front-to-back direction. The detection light 43 passes through the detection hole 42. If there is a solder ball in the detection hole, the solder ball will block the detection light 43. This means that the first moving plate 3 has completed the material picking up during one reciprocating lateral movement and put the material into the transfer hole 41. Subsequently, the second moving plate 5 is driven to move laterally. Conversely, if the detection light 43 is not blocked, it means that there is no solder ball in the transfer hole 41. The second moving plate 5 will not move laterally until the detection light 43 detects that there is a solder ball in the transfer hole 41. Then the second moving plate 5 will move. By setting the detection hole 42 and the detection light 43, it is possible to detect whether the material transfer hole 31 on the first moving plate 3 has effectively picked up the material.

[0032] See Figure 1The first moving plate 3 is driven to move laterally by the first linear module 71, the second moving plate 5 is driven to move laterally by the second linear module 72, the transfer hole 41 and the discharge hole 61 are connected vertically, and the transfer part 2 is provided with an air nozzle 8 that blows air toward the transfer hole 41. As can be seen from the above, the first moving plate 3 is controlled by the first linear module 71, and the second moving plate 5 is controlled by the second linear module 72. The first moving plate 3 and the second moving plate 5 can move horizontally independently. In this way, by moving the first moving plate 3 and the second moving plate 5 horizontally, the transfer hole 31, the transfer hole 41, the through hole 51, and the drop hole 61 can be set to be connected vertically. At this time, inert gas is sprayed through the air nozzle 8, which not only accelerates the flow of solder balls and avoids the solder balls getting stuck in the holes, but also provides inert gas for the subsequent heating and melting of the solder balls.

[0033] Working principle: See Figure 6 The solder balls inside the hopper body 11 fall into the feeding chamber 121 of the feeding section 12 under the action of gravity, and enter the transfer chamber 21 from the feeding hole 24 and the buffer chamber 25 under the guidance of the top inclined wall 23 of the transfer section 2. They gather in the transfer chamber 21 and the low position of the first moving plate 3 under the secondary guidance of the inclined top surface of the first moving plate 3 and the inclined bottom surface of the transfer section 2.

[0034] When solder balls need to be fed, the first moving plate 3 is moved to the left until the transfer hole 31 is located in the transfer cavity 21, and a single solder ball in the transfer cavity 21 enters the transfer hole 31; see also Figure 7 When the first moving plate 3 moves to the right until the transfer hole 31 and the transfer hole 41 are vertically connected, the solder ball in the transfer hole 31 falls into the transfer hole 41 for detection. At this time, the second moving plate 5 is in the left position and closes the bottom of the transfer hole 41; see also Figure 8 Then, the second moving plate 5 moves horizontally to the right, connecting the transfer hole 41, the through hole 51, and the drop hole 61. Solder balls are supplied through the through hole 51 and the drop hole 61. During the falling of the solder balls, the air nozzle 8 moves downward to accelerate the supply of solder balls. Example 2

[0035] See Figure 9This embodiment is a closed-loop solder ball separation and supply device. The structure of this embodiment is largely the same as that of Embodiment 1, except that the first moving plate 3 and the second moving plate 5 are connected to the same linear module 7, and the top of the transfer section 2 does not have an air nozzle 8. The linear module 7 can drive the first moving plate 3 and the second moving plate 5 to move horizontally left and right synchronously. When the first moving plate 3 is in the left position for material handling (solder ball enters the transfer hole 31), the transfer hole 41, the through hole 51, and the drop hole 61 are connected to facilitate the drop of the previous solder ball. When the first moving plate 3 moves to the right until the transfer hole 31 and the transfer hole 41 are connected... Solder balls fall from transfer hole 31 into transfer hole 41. At this time, the bottom of transfer hole 41 is closed by second moving plate 5. First moving plate 3 moves to the left position for the second time. At this time, transfer hole 41, through hole 51 and drop hole 61 are connected. Solder balls are dropped. In embodiment 2, because transfer hole 31, transfer hole 41, through hole 51 and drop hole 61 cannot be set coaxially, air nozzle 8 cannot be set in transfer part 2. Compared with the linkage of two linear modules in embodiment 1, this embodiment only needs to control one linear module in one reciprocating motion to realize the clever discharge of solder balls, reducing manufacturing costs.

[0036] Working principle: See Figure 9 The solder balls inside the hopper body 11 fall into the feeding chamber 121 of the feeding section 12 under the action of gravity, and enter the transfer chamber 21 from the feeding hole 24 and the buffer chamber 25 under the guidance of the top inclined wall 23 of the transfer section 2. They gather in the transfer chamber 21 and the low position of the first moving plate 3 under the secondary guidance of the inclined top surface of the first moving plate 3 and the inclined bottom surface of the transfer section 2.

[0037] When solder balls need to be fed, the first moving plate 3 is moved to the left until the transfer hole 31 is located in the transfer cavity 21, and a single solder ball in the transfer cavity 21 enters the transfer hole 31; see also Figure 10 At this time, the second moving plate 5 moves to the left to connect the transfer hole 41, the through hole 51, and the drop hole 61. When the first moving plate 3 moves to the right to connect the transfer hole 31 and the transfer hole 41 vertically, the solder ball in the transfer hole 31 falls into the transfer hole 41 for detection. At this time, the second moving plate 5 is in the right position and closes the bottom of the transfer hole 41. Then the second moving plate 5 moves to the left horizontally. At this time, the first moving plate 3 moves to the left to pick up the material and connects the transfer hole 41, the through hole 51, and the drop hole 61. The solder ball is supplied through the through hole 51 and the drop hole 61.

[0038] It should be noted that the first linear module 71 and the second linear module 72 in Embodiment 1, as well as the linear module 7 in Embodiment 2, can be components such as electric cylinders, pneumatic cylinders, and lead screw pairs. Example 3

[0039] See Figure 11 This embodiment provides a multi-channel solder ball laser welding machine 100, including a solder ball separation closed-loop supply device 10 as in embodiment 1 or embodiment 2. Two solder ball separation closed-loop supply devices 10 are symmetrically arranged, and the two solder ball separation closed-loop supply devices 10 are connected by a conveying member 110. A nozzle 120 is provided at the bottom of the conveying member 110, and a conveying channel 130 is provided inside the conveying member 110 to connect the nozzle 120 with the corresponding drop hole 61. This enables the feeding and soldering of two different sizes of solder balls. For example, the solder ball separation closed-loop supply device 10 on the left can provide solder balls with a diameter of 1mm, while the solder ball separation closed-loop supply device 10 on the right can provide solder balls with a diameter of 0.75mm. The solder balls are fed into the nozzle 120 through the conveying channel 130, and then the laser device 140 heats and melts the solder balls for soldering. Compared with traditional soldering machines that can only melt and solder single-size solder balls, the multi-channel solder ball laser soldering machine 100 can reduce the number of nozzles 120 and the number of laser devices used to melt solder balls, thereby reducing production costs.

[0040] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A closed-loop supply device for separating solder balls (10), characterized in that, include: The transfer section (2) has a transfer cavity (21) with its opening facing downwards. A hopper assembly (1) is disposed on top of the transfer section (2) and communicates with the transfer chamber (21); A fixing plate (4) is fixed to the bottom of the transfer part (2), and a transfer hole (41) is provided on it. The first moving plate (3) is moved laterally between the transfer part (2) and the fixed plate (4) under the drive of the linear module (7). The first moving plate (3) has a material transfer hole (31). The material discharge plate (6) is fixed to the bottom of the fixed plate (4) and has a material discharge hole (61) on it. The second moving plate (5) is moved laterally between the fixed plate (4) and the blanking plate (6) under the drive of the linear module (7). The second moving plate (5) is provided with a through hole (51). When solder balls are supplied, multiple solder balls fall from the hopper assembly (1) into the transfer chamber (21). A single solder ball located in the transfer hole (31) falls into the transfer hole (41) under the lateral movement of the first moving plate (3). The second moving plate (5) moves laterally, and the single solder ball in the transfer hole (41) passes through the through hole (51) and falls out from the drop hole (61) for supply.

2. The solder ball separation closed-loop supply device (10) according to claim 1, characterized in that, The hopper assembly (1) includes: The feeding section (12) has a feeding chamber (121) with an opening facing downwards, and its bottom is connected to the transfer section (2). The hopper body (11) is located on top of the feed section (12) and communicates with the feed chamber (121), and stores multiple solder balls therein.

3. The solder ball separation closed-loop supply device (10) according to claim 2, characterized in that, The top surface of the transfer section (2) and the portion projected downward from the feed chamber (121) is an inclined wall (23). A feed hole (24) is provided at the lower part of the inclined wall (23), and the feed hole (24) is connected to the transfer chamber (21).

4. The solder ball separation closed-loop supply device (10) according to claim 3, characterized in that, The transfer section (2) is also provided with a buffer cavity (25) with the opening facing downward. The buffer cavity (25) is located on one side of the transfer cavity (21) and is connected to the transfer cavity (21). The top of the buffer cavity (25) is connected to the feed hole (24).

5. The solder ball separation closed-loop supply device (10) according to claim 1, characterized in that, The bottom of the transfer section (2) is inclined, and the first moving plate (3) slides against the bottom of the transfer section (2). The material transfer hole (31) is provided at the low position of the first moving plate (3).

6. The solder ball separation closed-loop supply device (10) according to claim 1, characterized in that, A detection hole (42) is provided through the transfer hole (41) to allow the detection light (43) to pass through.

7. The solder ball separation closed-loop supply device (10) according to claim 1, characterized in that, The first moving plate (3) and the second moving plate (5) move synchronously under the drive of the same linear module (7). The linear module (7) is adapted to connect the material transfer hole (31) with the transfer hole (41), or connect the through hole (51) with the transfer hole (41), or connect the through hole (51) with the drop hole (61).

8. The solder ball separation closed-loop supply device (10) according to claim 1, characterized in that, The first moving plate (3) is driven to move laterally by the first linear module (71) in the linear module (7), and the second moving plate (5) is driven to move laterally by the second linear module (72) in the linear module (7).

9. The solder ball separation closed-loop supply device (10) according to claim 7, characterized in that, The transfer hole (41) is connected vertically to the discharge hole (61), and the transfer part (2) is provided with an air nozzle (8) for blowing air toward the transfer hole (41).

10. A multi-channel solder ball laser welding machine (100), comprising the solder ball separation closed-loop supply device (10) as described in any one of claims 1-9, characterized in that, The two solder ball separation closed-loop supply devices (10) are symmetrically arranged and connected by a conveyor (110). The bottom of the conveyor (110) is provided with a nozzle (120) and the conveyor (110) is provided with a conveying channel (130) that connects the nozzle (120) to the corresponding drop hole (61).

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