A driving power circuit, a driving power system and a vehicle

Abstract

The application relates to a driving power circuit, a driving power system and a vehicle. The driving power circuit comprises: a motor driving circuit, which is used for receiving power direct current based on a first direct current power port and driving a motor to work; and a thermal management system driving circuit, which is used for receiving power direct current based on a second direct current power port and driving a thermal management system to work; wherein the motor driving circuit and the thermal management system driving circuit are integrated and packaged in the same power module. The application can solve the problem of low integration degree of the driving power circuit in the prior art.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a drive power circuit, a drive power system, and a vehicle. Background Technology

[0002] With the development of the electric vehicle market, the requirements for power modules are becoming increasingly stringent. Currently, the power modules used in the technology are all independently packaged, and the corresponding power circuits are also arranged separately, which makes it difficult to meet the needs of enterprises and users for circuit integration and module miniaturization in power modules. Utility Model Content

[0003] This application provides a drive power circuit, a drive power system, and a vehicle, which at least partially solves the problem of low integration of drive power circuits in related solutions.

[0004] To achieve the above objectives, according to a first aspect of this application, a driving power circuit is provided, comprising: a motor driving circuit for receiving DC power from a power source based on a first DC power port to drive a motor to operate; and a thermal management system driving circuit for receiving DC power from a power source based on a second DC power port to drive a thermal management system to operate; wherein the motor driving circuit and the thermal management system driving circuit are integrated and packaged within the same power module.

[0005] Optionally, the thermal management system drive circuit includes a compressor drive sub-circuit; wherein,

[0006] The compressor drive sub-circuit is a three-phase full-bridge structure, including multiple second power switch chips and a freewheeling diode connected in anti-parallel to each second power switch chip;

[0007] The DC positive input port and DC negative input port of the compressor drive sub-circuit are connected to the power supply, and the three-phase AC output port of the compressor drive sub-circuit is connected to the compressor.

[0008] Optionally, the thermal management system drive circuit includes a heating drive sub-circuit; wherein,

[0009] The heating drive sub-circuit includes at least one third power switch chip;

[0010] The DC positive input port and DC negative input port of the heating drive sub-circuit are connected to the power supply, and the load output terminal of the heating drive sub-circuit is connected to the heating component.

[0011] Optionally, the thermal management system drive circuit includes a compressor drive sub-circuit and a heating drive sub-circuit connected in parallel; wherein,

[0012] The compressor drive sub-circuit and the heating drive sub-circuit are connected to the power supply in parallel through a shared DC positive input port and a DC negative input port.

[0013] Optionally, the heating drive sub-circuit also includes an inductor module, which is connected in series with the third power switch chip.

[0014] Optionally, the motor drive circuit is a three-phase full-bridge structure, including multiple first power switch chips and a freewheeling diode connected in anti-parallel to each first power switch chip;

[0015] In the three-phase full-bridge structure of the motor drive circuit, each phase bridge arm includes multiple first power switch chips and a freewheeling diode connected in anti-parallel with each first power switch chip. Each phase bridge arm is connected to the power supply through an independent first DC power port, and the three-phase AC output port of the motor drive circuit is connected to the motor.

[0016] Optionally, the power switch chip in the motor drive circuit and the thermal management system drive circuit is a surface-mount chip, and the electrodes of the power switch chip are connected to the conductive layer of the substrate in the power module through a bonding process.

[0017] Optionally, the circuit may also include multiple thermistors;

[0018] Thermistors are used to monitor the temperature of power switch chips in motor drive circuits and thermal management drive circuits, respectively.

[0019] According to a second aspect of this application, a drive power system is provided, comprising:

[0020] A drive power module, which integrates any of the above-mentioned drive power circuits.

[0021] The power supply is used to supply power to the motor drive circuit and the thermal management system drive circuit in the drive power module, respectively.

[0022] The controller is used to send drive control signals to the motor drive circuit and the thermal management system drive circuit, respectively.

[0023] According to a third aspect of this application, a vehicle is also provided, including the aforementioned drive power system.

[0024] The driving power circuit provided in this application includes: a motor drive circuit for receiving DC power from a first DC power port to drive a motor; and a thermal management system drive circuit for receiving DC power from a second DC power port to drive the thermal management system. The motor drive circuit and the thermal management system drive circuit are integrated and packaged within the same power module. By integrating the motor drive circuit and the thermal management system drive circuit, which are respectively powered by independent DC power ports, into the same power module, the integration of the driving power circuit is improved, and the miniaturization of the driving power module that packages the driving power circuit is achieved.

[0025] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0028] Figure 1 This is a schematic diagram of the drive power circuit provided in an exemplary embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the circuit topology of the drive power circuit of the integrated motor drive circuit and compressor drive sub-circuit provided in the exemplary embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the circuit topology of the drive power circuit of the integrated motor drive circuit and the heating drive sub-circuit provided in the exemplary embodiment of this application.

[0031] Figure 4 This is a schematic diagram of the circuit topology of the drive power circuit of the integrated motor drive circuit, compressor drive sub-circuit, and heating drive sub-circuit provided in the exemplary embodiments of this application.

[0032] Figure 5 yes Figure 4 A schematic diagram of the drive power module corresponding to the drive power circuit shown;

[0033] Figure 6 This is a schematic diagram of the vehicle architecture provided in an exemplary embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10 -- Motor drive circuit; 20 -- Thermal management system drive circuit;

[0036] Q1, Q2, Q3, Q4, Q5, Q6 -- First power switch chips (first IGBTs) in the motor drive circuit; C1, C2, C3, C4, C5, C6 -- Collectors of each first IGBT; G1, G2, G3, G4, G5, G6 -- Gates of each first IGBT; E1, E2, E3, E4, E5, E6 -- Emitters of each first IGBT; F1, F2, F3, F4, F5, F6 -- Interconnected with each The fast recovery diodes of the first IGBT are connected in anti-parallel; U1, V1, W1 -- the three-phase AC output terminals of the motor drive circuit; DC1-, DC1+ -- the first DC power ports corresponding to the U-phase bridge arm; DC2-, DC2+ -- the first DC power ports corresponding to the V-phase bridge arm; DC3-, DC3+ -- the first DC power ports corresponding to the W-phase bridge arm; T1, T2, T3, T4, T5, T6 -- thermistors in the motor drive circuit;

[0037] Q7, Q8, Q9, Q10, Q11, Q12 -- Second power switch chips (second IGBTs) in the compressor drive sub-circuit; C7, C8, C9, C10, C11, C12 -- Collectors of each second IGBT; G7, G8, G9, G10, G11, G12 -- Gates of each second IGBT; E7, E8, E9, E10, E11, E12 -- Emitters of each second IGBT; F7, F8, F9, F10, F11, F12 -- Fast recovery diodes connected in anti-parallel to each second IGBT; U2, V2, W2 -- Three-phase AC output terminals of the compressor drive sub-circuit; DC4-, DC4+ -- Second DC power ports of the thermal management system drive circuit; T7, T8 -- Thermistors in the compressor drive sub-circuit;

[0038] Q13 -- The third power switch chip (third IGBT) in the heating drive sub-circuit; C13 -- The collector of each third IGBT; G13 -- The gate of each third IGBT; E13 -- The emitter of each third IGBT; T9, T10 -- Thermistors in the heating drive sub-circuit; P1+ -- The load output terminal in the heating drive sub-circuit. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0040] This application provides a drive power circuit; please refer to [link / reference]. Figure 1 , Figure 1 This is a schematic diagram of the drive power circuit provided in an embodiment of this application.

[0041] The driving power circuit includes: a motor drive circuit 10, which receives DC power from a first DC power port to drive the motor to work; and a thermal management system drive circuit 20, which receives DC power from a second DC power port to drive the thermal management system to work; wherein the motor drive circuit 10 and the thermal management system drive circuit 20 are integrated and packaged in the same power module.

[0042] Based on the above configuration, by integrating the motor drive circuit 10 and the thermal management system drive circuit 20 into the same power module, the integration level of the drive power circuit is improved, and the miniaturization design of the drive power module is realized.

[0043] Meanwhile, the motor drive circuit 10 and the thermal management system drive circuit 20 adopt independent DC power ports. On the one hand, this achieves differentiated electrical design, allowing for on-demand configuration of the power supply architecture. For example, high dynamic response can be adapted for the motor port, and steady-state current carrying can be optimized for the thermal management system port, reducing electrical losses. On the other hand, it achieves physical isolation between the two DC ports, blocking the transmission path of high-frequency switching noise from the motor to the thermal management system drive circuit. This avoids the electromagnetic interference (EMI) superposition effect in the common bus scheme of traditional integrated solutions. At the same time, low-frequency load fluctuations in the thermal management system drive circuit 20 will not affect the bus voltage of the motor drive, helping to ensure the torque output accuracy of the drive motor.

[0044] It is understood that the integrated motor drive circuit 10 and thermal management system drive circuit 20 of this application can simultaneously achieve multi-functional integration, space sharing, and a more refined design balance and cross-border fusion, which is of great significance for improving the usable space inside the vehicle and enhancing energy efficiency. When encountering situations such as a short circuit in the motor drive circuit, the thermal management system drive circuit is unaffected due to its independent power supply port, and vice versa.

[0045] The motor drive circuit 10 and the thermal management system drive circuit 20 are integrated and packaged in the same power module. The two circuits share the internal space of the module (such as the heat sink base plate and the outer frame), eliminating the need for separate shells for each drive circuit in traditional solutions, and realizing the miniaturization design of the drive power module.

[0046] This application creatively integrates multiple motor drive circuits, and overcomes the mutual exclusion problem between integration and interference suppression in traditional solutions by using an "independent power supply and same module packaging" approach.

[0047] Furthermore, the drive power module corresponding to the drive power circuit avoids the need for independent housings, brackets, and wiring harnesses required by traditional solutions due to the use of discrete components, thus eliminating redundant space occupation. It is understandable that vehicles using this type of drive power module can improve the utilization rate of interior space.

[0048] In some embodiments, the thermal management system drive circuit 20 includes a compressor drive sub-circuit; wherein the compressor drive sub-circuit is a three-phase full-bridge structure, including a plurality of second power switch chips and a freewheeling diode connected in anti-parallel to each of the second power switch chips; the DC positive input port and the DC negative input port of the compressor drive sub-circuit are connected to a power supply, and the three-phase AC output port of the compressor drive sub-circuit is connected to the compressor.

[0049] The second power switch chip provided in this application embodiment can be an IGBT (Insulated Gate Bipolar Transistor) or a SiC MOSFET (Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistor). The freewheeling diode provided in this application embodiment can be an FRD (Silicon-based Fast Recovery Diode) or a SiC SBD (Silicon Carbide Schottky Barrier Diode). The specific selection can be comprehensively evaluated based on voltage / current stress, heat dissipation capacity, EMC requirements, and cost requirements.

[0050] The three-phase full-bridge structure can be directly adapted to the compressor's permanent magnet synchronous motor to generate sinusoidal current, eliminating torque ripple caused by square wave drive, reducing compressor vibration and noise, and extending mechanical life. Fast recovery diodes (FRDs) connected in anti-parallel achieve nanosecond-level freewheeling, significantly reducing switching losses and supporting high-frequency PWM modulation.

[0051] In some cases, the gate signal ports corresponding to the second power switch chips of the upper / lower bridge arms in the compressor drive sub-circuit can be arranged separately (such as the upper bridge on the left and the lower bridge on the right). This can reduce electromagnetic disturbances on the drive board side, cut off the coupling path of the high and low voltage drive circuits, and avoid the risk of shoot-through short circuits.

[0052] Figure 2 This is a schematic diagram of the circuit topology of the drive power circuit of the integrated motor drive circuit and compressor drive sub-circuit provided in the exemplary embodiment of this application; Figure 2The right side is the compressor drive sub-circuit, which includes three parallel half-bridge circuits that receive DC power from the power supply via the second DC power port (DC4+, DC4-). The compressor drive sub-circuit includes six second power switching chips (second IGBTs in the figure, Q7, Q8, Q9, Q10, Q11, Q12). Each second IGBT is connected in anti-parallel to a corresponding freewheeling diode (fast recovery diode FRD in the figure, F7, F8, F9, F10, F11, F12). The three parallel half-bridge circuits correspond to the three-phase AC output terminals U2, V2, and W2 of the drive circuit, respectively. Specifically, in the three parallel half-bridge circuits, the current flows through the collector of any one of the second IGBTs (C7, C8, C9, C10, C11, C12), to the gate of the corresponding second IGBT (G7, G8, G9, G10, G11, G12), and then to the emitter of the corresponding second IGBT (E7, E8, E9, E10, E11, E12).

[0053] In some examples, the thermal management system drive circuit 20 described above includes a heating drive sub-circuit; wherein the heating drive sub-circuit includes at least one third power switch chip; the DC positive input port and the DC negative input port of the heating drive sub-circuit are connected to a power supply, and the load output terminal of the heating drive sub-circuit is connected to a heating component.

[0054] As a purely resistive load, the heating drive sub-circuit typically requires only a single IGBT for on / off control (compared to the six-transistor full-bridge IGBT used in compressor drives), compressing the circuit area to the edge of the substrate or an unused area, with zero incremental occupation of the module's main space. Meanwhile, to meet the needs of different vehicle models, the number of third power switching chips can be increased to enhance the heating power.

[0055] Figure 3 This is a schematic diagram of the circuit topology of the drive power circuit of the integrated motor drive circuit and the heating drive sub-circuit provided in the exemplary embodiment of this application. Figure 3 The right side is the heating drive sub-circuit, which includes a third power switch chip (third IGBT, Q13). It receives DC power from the power supply via the second DC power port (DC4+, DC4-). The load output terminal (P1+) of the heating drive sub-circuit is connected to the heating component. Specifically, in the heating drive sub-circuit, current flows through the collector (C13) of the third IGBT (Q13), to the gate (G13) of the third IGBT (Q13), and then to the emitter (E13) of the third IGBT (Q13).

[0056] In some examples, the aforementioned thermal management system drive circuit 20 includes a compressor drive sub-circuit and a heating drive sub-circuit connected in parallel; wherein the compressor drive sub-circuit and the heating drive sub-circuit are connected in parallel to a power supply through a shared DC positive input port and a DC negative input port.

[0057] The compressor drive sub-circuit and the heating drive sub-circuit share a second DC power port, which directly reduces the number of power ports, simplifies the packaging process, and helps reduce the physical space occupied by external interfaces, as well as lower the material cost of the power port itself. Simultaneously, the shared port highly centralizes the current path; the DC inputs of the two drive sub-circuits are merged into the same pair of low-impedance conductive traces, shortening the total length of the current loop and reducing the additional parasitic inductance (especially self-inductance) caused by discrete traces. This helps suppress voltage spikes during switching and reduces switching losses. Furthermore, while the two drive sub-circuits are electrically connected in parallel through the shared port, they can share the same substrate heat dissipation area in terms of physical layout. The centralized design of the DC power input allows heat sources (such as IGBT chips) to be more evenly distributed within the packaged power module, avoiding localized heat accumulation caused by discrete terminals and improving overall heat dissipation efficiency.

[0058] According to the embodiments of this application, the three independent drive circuits—motor drive circuit, compressor drive sub-circuit, and heating drive sub-circuit—are integrated and packaged in the same power module, which greatly improves the high-density integration of the drive power circuit. This allows a single drive power circuit to integrate three different functional circuits. Through electrical and mechanical design, the overall parasitic parameters can be reduced, the package thermal resistance can be lowered, and the necessary mechanical support and protection can be provided, enabling the semiconductor device to withstand harsh external environments.

[0059] Furthermore, the drive power module employing this drive power circuit can significantly improve circuit integration, effectively addressing space limitations in electric vehicles and reducing hardware costs. It is understood that the highly integrated drive power circuit providing this application, which achieves multiple functions in one, is of great significance for increasing usable interior space and improving energy efficiency.

[0060] Figure 4 This is a schematic diagram of the circuit topology of the drive power circuit for the integrated motor drive circuit, compressor drive sub-circuit, and heating drive sub-circuit provided in the exemplary embodiments of this application; as shown... Figure 4 As shown, the compressor drive subunit and the heating drive subunit are connected in parallel, and the two sub-circuits are connected in parallel to the power supply through a shared second DC power port (DC4-, DC4+).

[0061] In some embodiments, the heating drive sub-circuit further includes an inductor module, which is connected in series with a third power switch chip.

[0062] In the heating drive sub-circuit, the third power switch chip (third IGBT, Q13) acts as a resistive load. During cold start-up, its resistance is extremely low, and direct power connection would cause a sudden surge of large current. The series inductor module, through its inductive reactance (current cannot change abruptly), can forcibly slow down the current rise rate, preventing damage to the IGBT due to overcurrent and significantly improving the reliability of the third IGBT. Simultaneously, the rapid switching action of the IGBT generates high-frequency harmonics, radiating noise through the power lines. The inductor, as a high-frequency impedance element, can attenuate the switching frequency harmonic currents in the heating drive circuit, suppressing conducted EMI and preventing interference with other electronic devices in the vehicle (such as the battery management system or controller).

[0063] See Figure 4 In the heating drive sub-circuit, the inductor module is connected in series between the positive port (DC4+) of the second DC power port and the collector (C13) of the third IGBT (Q13).

[0064] In some examples, the motor drive circuit 10 is a three-phase full-bridge structure, including multiple first power switch chips and freewheeling diodes connected in antiparallel to each first power switch chip; in the three-phase full-bridge structure of the motor drive circuit 10, each phase bridge arm includes multiple first power switch chips and freewheeling diodes connected in antiparallel to each first power switch chip, each phase bridge arm is connected to the power supply through an independent first DC power port, and the three-phase AC output port of the motor drive circuit 10 is connected to the motor.

[0065] Based on the above configuration, the independent first DC power port provides a dedicated low-impedance path for each phase arm, preventing the three-phase currents from being superimposed and coupled on the shared copper busbar. Especially under transient conditions (such as motor acceleration / regenerative braking), it can significantly suppress inter-phase crosstalk, ensure the symmetry of the three-phase current waveform, and reduce torque ripple and motor vibration noise at the source. Distributing the total current to three independent DC power ports significantly shortens the current loop length of each phase. At the same time, independent routing allows for efficient cancellation of the reverse current flux of adjacent phases (enhanced mutual inductance effect), significantly reducing the equivalent series parasitic inductance (especially in high-frequency switching), thereby helping to reduce voltage stress and turn-off overshoot of the switching transistors and reduce switching losses.

[0066] Furthermore, the independent DC power port design physically decouples the heat sources of each phase power device, avoiding concentrated heat generation areas caused by shared copper busbars. Combined with the heat dissipation layer on the substrate within the packaged power module, this improves temperature uniformity. Simultaneously, in the event of a single-phase fault (such as a short circuit), the independent DC power port physically isolates the fault current propagation path, reducing the risk of system-level failure.

[0067] Understandably, the independent first DC power port supplying power to each phase circuit allows for on-demand upgrades of single-phase power through external parallel battery packs or differentiated power supply configurations (such as dual-battery systems). For example, simply adding an auxiliary power supply to phase U can increase peak torque without refactoring the entire drive topology, expanding compatibility far beyond traditional solutions.

[0068] See Figure 2 , Figure 3 , Figure 4 The motor drive circuit on the left side of the image shows a three-phase full-bridge structure corresponding to the motor drive unit, comprising three half-bridge circuits. Each half-bridge circuit is connected to the power supply through an independent first DC power port. Each half-bridge circuit includes two first power switching chips connected in series and freewheeling diodes connected in anti-parallel to each first power chip. Specifically, the U-phase bridge arm is connected to the power supply via DC1- and DC1+, the V-phase bridge arm via DC2- and DC2+, and the W-phase bridge arm via DC3- and DC3+.

[0069] In some examples, the power switch chips in the motor drive circuit 10 and the thermal management system drive circuit 20 are surface mount chips, and the electrodes of the power switch chips are connected to the conductive layer of the substrate in the power module through a bonding process.

[0070] By directly bonding surface-mount chips to the conductive layer of the power module's substrate, the current path can be shortened, reducing the long traces caused by the pins of traditional discrete devices. Surface-mount chips are connected via bonding processes, reducing solder joints and mechanical interfaces of discrete devices, thus lowering the risk of cold solder joints and chipping. Furthermore, replacing the independent pin connections of discrete devices with bonding processes (such as copper strip connections) widens the conductive cross-sectional area. Combined with optimized current flow design, this enhances the magnetic flux cancellation effect, significantly reduces self-inductance and mutual inductance, suppresses switching voltage spikes, and reduces switching losses.

[0071] In some embodiments, the drive power circuit further includes a plurality of thermistors; the thermistors are used to monitor the temperature of the power switch chips in the motor drive circuit 10 and the thermal management drive circuit 20, respectively.

[0072] Based on thermistor components, temperature monitoring of each power switch chip in the motor drive circuit 10 and thermal management drive circuit 20 is achieved. On this basis, independent control strategies can be implemented to achieve over-temperature protection of the drive power module, further ensuring the operational safety and stability of the drive power module.

[0073] Specifically, each IGBT power switching chip is independently equipped with a dedicated thermistor, enabling near-field monitoring of "one chip, one temperature." This allows for real-time capture of chip-level micro-region temperature gradients (such as abnormal temperature rises in individual chips within a bridge arm due to parameter discrepancies), triggering over-temperature protection in advance and preventing cascading failures caused by thermal runaway. Furthermore, the monitoring results from multiple thermistors can generate chip-level temperature distribution maps (such as the six independent temperature points of the three-phase bridge arm in the motor drive circuit 10). The controller dynamically adjusts the PWM strategy for each phase accordingly, actively reducing the frequency or redistributing current for high-temperature phases, forcing temperature uniformity across multiple chips, and ensuring the operational stability and safety of the drive power circuit.

[0074] See Figure 2 , Figure 3 , Figure 4 The motor drive circuit 10 is equipped with thermistors T1, T2, T3, T4, T5, and T6 to monitor the temperature of the first power switch chips (Q1, Q2, Q3, Q4, Q5, and Q6), respectively; the compressor drive sub-circuit is equipped with thermistors (T7 and T8) to monitor the junction temperature of the chips in the compressor drive sub-circuit; and the heating drive sub-circuit is equipped with thermistors (T9 and T10) to monitor the junction temperature of the chips in the heating drive sub-circuit.

[0075] It should be noted that the number of electronic components (such as power switching chips (IGBT), fast recovery diodes (FRD), NTC (thermistors)) in the circuits shown in the accompanying drawings of the embodiments of this application is only an example and is not intended to limit this application.

[0076] According to a second aspect of this application, a drive power system is provided, comprising: a drive power module, wherein any of the aforementioned drive power circuits are integrated within the drive power module; a power supply for supplying power to the motor drive circuit 10 and the thermal management system drive circuit 20 in the drive power module; and a controller for sending drive control signals to the motor drive circuit 10 and the thermal management system drive circuit 20, respectively. Since the drive power system provided by this application includes the aforementioned drive power circuits and possesses all the beneficial effects of the aforementioned drive power circuits, further details are omitted here.

[0077] According to a third aspect of this application, a vehicle is provided, such as Figure 6As shown, the vehicle 600 includes the aforementioned drive power system. Since the vehicle possesses this drive power system, it also enjoys all the beneficial effects of the aforementioned drive power system. It is understood that because the drive power circuit provided in this application achieves high integration and multi-functionality, the vehicle employing the drive power system including the aforementioned drive power module has the technical effect of improving the utilization rate of interior space and energy efficiency. Other effects will not be elaborated upon here. Furthermore, in the embodiments of this application, the vehicle can be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this application does not specifically limit it.

[0078] This application exemplarily describes the operation of the drive power circuit: When the vehicle starts, the motor drive circuit in the drive power circuit operates, converting the DC power from the battery terminal into three-phase AC power to drive the motor. When the vehicle's air conditioning is running, the compressor starts, and the compressor drive sub-circuit in the drive power circuit operates, converting the DC power from the battery terminal into three-phase AC power to drive the compressor. When heating is required in the vehicle, the PTC heater starts, and the heating drive sub-circuit in the drive power circuit operates, responsible for driving the PTC for heating.

[0079] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0080] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0081] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0082] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A driving power circuit, characterized in that, include: The motor drive circuit (10) is used to receive DC power from the power supply based on the first DC power port and drive the motor to work. The thermal management system drive circuit (20) is used to receive DC power from the power supply based on the second DC power port and drive the thermal management system to work. The motor drive circuit (10) and the thermal management system drive circuit (20) are integrated and packaged in the same power module.

2. The circuit according to claim 1, characterized in that, The thermal management system drive circuit (20) includes a compressor drive sub-circuit; wherein, The compressor drive sub-circuit is a three-phase full-bridge structure, including multiple second power switch chips and a freewheeling diode connected in anti-parallel to each of the second power switch chips; The DC positive input port and DC negative input port of the compressor drive sub-circuit are connected to the power supply, and the three-phase AC output port of the compressor drive sub-circuit is connected to the compressor.

3. The circuit according to claim 1, characterized in that, The thermal management system drive circuit (20) includes a heating drive sub-circuit; wherein, The heating drive sub-circuit includes at least one third power switch chip; The DC positive input port and DC negative input port of the heating drive sub-circuit are connected to the power supply, and the load output terminal of the heating drive sub-circuit is connected to the heating component.

4. The circuit according to claim 1, characterized in that, The thermal management system drive circuit (20) includes a compressor drive sub-circuit and a heating drive sub-circuit connected in parallel; wherein, The compressor drive sub-circuit and the heating drive sub-circuit are connected in parallel to the power supply through a shared DC positive input port and a DC negative input port.

5. The circuit according to claim 3 or 4, characterized in that, The heating drive sub-circuit also includes an inductor module, which is connected in series with the third power switch chip.

6. The circuit according to claim 1, characterized in that, The motor drive circuit (10) is a three-phase full-bridge structure, including multiple first power switch chips and a freewheeling diode connected in anti-parallel to each of the first power switch chips; In the three-phase full-bridge structure of the motor drive circuit (10), each phase bridge arm includes multiple first power switch chips and a freewheeling diode connected in antiparallel with each first power switch chip. Each phase bridge arm is connected to the power supply through an independent first DC power port. The three-phase AC output port of the motor drive circuit (10) is connected to the motor.

7. The circuit according to claim 1, characterized in that, The power switch chip in the motor drive circuit (10) and the thermal management system drive circuit (20) is a surface mount chip, and the electrodes of the power switch chip are connected to the conductive layer of the substrate in the power module by a bonding process.

8. The circuit according to claim 1, characterized in that, The circuit also includes multiple thermistors; The thermistor is used to monitor the temperature of the power switch chip in the motor drive circuit (10) and the thermal management drive circuit (20), respectively.

9. A driving power system, characterized in that, include: A drive power module, wherein the drive power module integrates the drive power circuit according to any one of claims 1 to 8; The power supply is used to supply power to the motor drive circuit (10) and the thermal management system drive circuit (20) in the drive power module respectively; The controller is used to send drive control signals to the motor drive circuit (10) and the thermal management system drive circuit (20), respectively.

10. A vehicle, characterized in that, Includes the drive power system as described in claim 9.

Images