A circuit board

Abstract

The application discloses a circuit board, which comprises a circuit board body and a chip welded on the circuit board body, wherein the chip comprises a chip body and pins, the chip body is in a plate structure and comprises a plurality of pins, the pins are fixedly connected to the circumferential surface of the chip body and are sequentially and spacedly distributed along one direction of the chip body; the chip body is located on the first surface of the circuit board body, the pins pass through the through holes of the circuit board body and are welded on the second surface of the circuit board body, the pins comprise first parts fixedly connected to the chip body and second parts inserted into the through holes, the second parts have arc segments, the arc segments are at least partially located on the second surface of the circuit board body, and the included angle alpha between the recess directions of adjacent arc segments is 90 DEG <= alpha <= 180 DEG; the arc segments are welded on the circuit board body, the distance between adjacent pins and the welding positions of the circuit board body is increased, the phenomenon of tin connection between the pins of the chip is reduced, and the yield of the chip is improved.

Description

Technical Field

[0001] This application relates to the field of frequency converter drive technology, and more specifically, to a circuit board. Background Technology

[0002] In related technologies, during the process of soldering a chip onto a circuit board, the small spacing between the chip's pins can cause solder bridging between the pins due to the flow and diffusion of solder during the soldering process, leading to short circuits and chip failure.

[0003] In summary, how to reduce solder bridging between chip pins and improve chip yield is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a circuit board that reduces solder bridging between chip pins and improves chip yield.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A circuit board includes: a circuit board body and a chip soldered onto the circuit board body; the chip includes a chip body and pins, the chip body has a plate-like structure, and there are several pins, all of which are fixedly connected to the peripheral side surface of the chip body and sequentially distributed along one direction of the chip body, with gaps between adjacent pins; the circuit board body has a through hole, the circuit board body has a first surface and a second surface, the chip body is located on the first surface of the circuit board body, and the pins pass through the through hole and are soldered to the second surface of the circuit board body; the pins include a first portion and a second portion, a first end of the first portion is fixedly connected to the chip body, a second end of the first portion is connected to the first end of the second portion, and a second end of the second portion is inserted into the through hole; the second portion has an arc segment, the arc segment at least partially passes through the through hole and is located on the second surface of the circuit board body, and the concave directions of adjacent arc segments have an included angle α, where 90°≤α≤180°.

[0007] The circuit board provided in this application includes a circuit board body and a chip soldered onto the circuit board body. The chip includes a chip body and pins. The chip body has a plate-like structure and includes a plurality of pins, which are fixedly connected to the peripheral side of the chip body and distributed sequentially at intervals along one direction of the chip body. The circuit board body has through holes and has a first side and a second side. The chip body is located on the first side of the circuit board body. The pins pass through the through holes and are soldered to the second side of the circuit board body. Each pin includes a first part and a second part. The first part is fixedly connected to the chip body, and the second part is inserted into the through hole. The second part has an arc segment, which is at least partially located on the second side of the circuit board body. The concave directions of adjacent arc segments have an included angle α, and 90°≤α≤180°. In this way, by soldering the arc segment to the circuit board body, the distance between two adjacent pins during soldering is increased, the solder bridging phenomenon between the chip pins is reduced, and the yield of the chip is improved. Attached Figure Description

[0008] The accompanying drawings used in the embodiments of this application will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings. Figure 1 A schematic diagram of a circuit board structure provided in an embodiment of this application;

[0009] Figure 2 for Figure 1 A partial enlarged view of the circuit board shown;

[0010] Figure 3 This is a schematic diagram of another pin structure provided in an embodiment of this application;

[0011] Figure 4 for Figure 3 A top view of another pin structure shown.

[0012] Explanation of reference numerals in the attached figures:

[0013] 100 - Circuit board body;

[0014] 200 - Chip, 210 - Chip body, 220 - Pin, 221 - First straight line segment, 222 - Second straight line segment, 223 - Arc segment, 224 - Third straight line segment. Detailed Implementation

[0015] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. The following embodiments are examples used to illustrate the technical solutions of this application, and should not be used to limit the scope of protection of this application. Those skilled in the art will understand that, without conflict, the following embodiments and features can be combined with each other.

[0016] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0017] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more unless otherwise expressly defined; the terms "comprising" and "having," and any variations thereof, in the specification and claims are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0019] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the appendix. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0020] The terms "parallel" and "perpendicular" used in this application refer to "basically parallel" and "basically perpendicular" in practical operation. "Basically parallel" can be understood as parallelism with a certain degree of error, and similarly, "basically perpendicular" can be understood as perpendicularity with a certain degree of error.

[0021] The “plane” referred to in this application is a “plane that is substantially parallel to the horizontal plane” in actual operation.

[0022] like Figure 1 As shown, the circuit board provided in this application embodiment includes: a circuit board body 100 and a chip 200 soldered on the circuit board body 100. The chip 200 includes a chip body 210 and pins 220. The chip body 210 has a plurality of pins 220, which are fixedly connected to the peripheral side surface of the chip body 210 and distributed sequentially along one direction of the chip body 210, with gaps between adjacent pins 220. The circuit board body 100 has through holes and has a first surface and a second surface. The chip body 210 is located on the first surface of the circuit board body 100. The pins 220 pass through the through holes and are soldered to the second surface of the circuit board body 100 to connect the chip 200 and the circuit board body 100 so that the chip 200 can operate. The pins 220 include a first part and a second part that are integrally formed. The first part is fixedly connected to the chip body 210, and the second part is inserted into the through hole. The second part has an arc segment 223, which is at least partially located on the second surface of the circuit board body 100. The concave directions of adjacent arc segments 223 have an included angle α, and 90°≤α≤180°. In this way, by soldering the arc segment 223 to the circuit board body, the soldering positions of adjacent pins 220 are spaced apart in both the length and width directions of the chip body 210, which increases the distance between the soldering positions of pins 220 and the circuit board body 100, reduces the solder bridging phenomenon between the pins of chip 200, and improves the yield of chip 200.

[0023] It should be noted that all pins 220 are made of copper. A copper foil layer is formed on the surface of the circuit board body 100. The pins 220 are soldered to the copper foil layer, and the copper foil layer carries the current to realize the current transmission between the chip 200 on the circuit board body 100 and the corresponding device, so as to realize the operation of the circuit board.

[0024] It should be noted that the chip body 210 has relatively distributed length and width directions, such as Figures 1-3 The width direction of the chip body 210 is shown. It can be understood that the direction extending perpendicular to the inside and outside of the figure is the length direction. The length direction and width direction of the chip body 210 are perpendicular to each other. The thickness direction of the chip body 210 is consistent with the thickness direction of the circuit board body 100.

[0025] In some embodiments, the arc segment 223 is entirely located on the second side of the circuit board body 100, which improves the convenience of the soldering process.

[0026] like Figure 2 As shown, the first part of pin 220 includes a first straight line segment 221; the second part also includes a second straight line segment 222 and a third straight line segment 224, and the second straight line segment 222, the arc segment 223 and the third straight line segment 224 are distributed sequentially.

[0027] like Figure 2 As shown, the first end of the first straight segment 221 is fixedly connected to the peripheral side of the chip body 210, and the first straight segment 221 extends along the width direction of the chip body 210; the second end of the first straight segment 221 is fixedly connected to the first end of the second straight segment 222, and the second straight segment 222 extends along the thickness direction of the chip body 210 and is inserted into the through hole of the circuit board body 100 through the second straight segment 222, and there is an angle between the second straight segment 222 and the first straight segment 221; the second end of the second straight segment 222 is fixedly connected to the first end of the arc segment 223; the second end of the arc segment 223 is fixedly connected to the third straight segment 224.

[0028] It should be noted that the included angle between the first straight line segment 221 and the second straight line segment 222 can be an acute angle, a right angle, or an obtuse angle; in this application, in order to facilitate the insertion of the pin 220 into the circuit board body 100, the first straight line segment 221 and the second straight line segment 222 are set perpendicularly.

[0029] In some embodiments, such as Figure 2As shown, the included angle α between the concave directions of the arc segments 223 of adjacent pins 220 is 180°, which makes the concave directions of adjacent arc segments 223 opposite, and the soldering position of the pin 220 to the circuit board body 100 is located in the arc segment 223, so that the soldering positions of adjacent pins 220 have a spacing distance along the width direction of the chip body 210, which increases the space that can accommodate solder flow and reduces the solder bridging phenomenon of adjacent pins 220.

[0030] When the included angle α is 180°, the line connecting the first end of the arc segment 223 and the second end of the arc segment 223 is collinear with the second straight line segment 222, so that the second straight line segment 222, the arc segment 223, and the third straight line segment 224 are in the same extending direction, so that the pin 220 can be inserted and mated with the through hole of the circuit board body 100, and the arc segment 223 is soldered to the circuit board body 100, so that the distance between adjacent pins 220 is increased to the maximum, and solder bridging is not easy during soldering.

[0031] In some other embodiments, such as Figures 3-4 As shown, the included angle α between the concave directions of the arc segments 223 of adjacent pins 220 is 90°, which further increases the distance between adjacent pins 220 along the length direction of the chip body 210, increases the space that can accommodate solder flow, and reduces the solder bridging phenomenon of adjacent pins 220.

[0032] like Figures 1-3 As shown, all arc segments 223 are of inferior arc structure to reduce the excessive bending of arc segments 223 away from the second straight segment 222 and the third straight segment 224, and to avoid the phenomenon that the pin 220 cannot be inserted into the through hole of the circuit board body 100 due to the arc segment 223 being too wide, so as to ensure the normal connection between the chip 200 and the circuit board body 100.

[0033] It should be noted that a minor arc is the shorter arc between any two points on a circle, and the corresponding central angle does not exceed 180°.

[0034] In the circuit board operation process provided in this application embodiment, the pins 220 of the chip 200 are inserted and connected to the through holes opened in the circuit board body 100, and the arc segment 223 on the pin 220 is soldered to the circuit board body 100. This increases the space that can accommodate the flow of solder, reduces the solder bridging phenomenon between adjacent pins 220, and improves the yield of the chip 200.

[0035] The above examples illustrate the principles and implementation methods of this application. The descriptions of the embodiments are merely for the purpose of helping to understand the methods and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A circuit board, characterized in that, include: Circuit board body (100) and chip (200) soldered on circuit board body (100); The chip (200) includes a chip body (210) and pins (220). There are several pins (220), and the several pins (220) are fixedly connected to the peripheral side of the chip body (210) and distributed sequentially along one direction of the chip body (210), and there is a gap between adjacent pins (220). The circuit board body (100) has through holes, the circuit board body (100) has a first side and a second side, the chip body (210) is located on the first side of the circuit board body (100), and the pin (220) passes through the through holes and is soldered to the second side of the circuit board body (100). The pin (220) includes a first part and a second part. The first end of the first part is fixedly connected to the chip body (210), the second end of the first part is connected to the first end of the second part, and the second end of the second part is inserted into the through hole. The second part has an arc segment (223) that at least partially passes through the through hole and is located on the second surface of the circuit board body (100). The concave directions of adjacent arc segments (223) have an included angle α, and 90°≤α≤180°.

2. The circuit board according to claim 1, characterized in that, The concave direction angle α of adjacent arc segments (223) is 180°.

3. The circuit board according to claim 1, characterized in that, The concave direction angle α of adjacent arc segments (223) is 90°.

4. The circuit board according to claim 1, characterized in that, The entire arc segment (223) is located on the second side of the circuit board body (100).

5. The circuit board according to claim 1, characterized in that, The first portion of the pin (220) includes a first straight segment (221); The second part of the pin (220) further includes a second straight segment (222) and a third straight segment (224), the second straight segment (222), the arc segment (223), and the third straight segment (224) being connected in sequence.

6. The circuit board according to claim 5, characterized in that, The first end of the first straight segment (221) is fixedly connected to the peripheral side of the chip body (210), and the first straight segment (221) extends along the width direction of the chip body (210). The second end of the first straight segment (221) is fixedly connected to the first end of the second straight segment (222), the second straight segment (222) extends along the thickness direction of the chip body (210), and there is an angle between the second straight segment (222) and the first straight segment (221); The second end of the second straight segment (222) is fixedly connected to the first end of the arc segment (223), and the arc segment (223) is soldered to the circuit board body (100); The second end of the arc segment (223) is fixedly connected to the third straight segment (224).

7. The circuit board according to claim 1, characterized in that, All of the arc segments (223) are minor arc structures.

8. The circuit board according to any one of claims 1-7, characterized in that, The pin (220) is made of copper.

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