Chip pre-shrinking deformation prevention structure of intelligent card laminator before chip lamination

Abstract

The utility model relates to a chip pre -laminating preheating anti -shrinkage deformation structure of intelligent card laminating machine, including heat insulating plate, heating plate and spring, the spring is installed in heat insulating plate, heat insulating plate is located between heating plate and laminating machine's upper crossbeam, and the both ends of spring are respectively rested on heating plate and laminating machine's upper crossbeam. The utility model can prevent the too big pressure that heating plate ascends and laminating machine upper crossbeam produce and lead to chip breakage or damage, also can prevent the material shrinkage deformation with chip together laminating and produce defective product.

Description

Technical Field

[0001] This utility model relates to the field of smart card laminators, and more specifically, to a chip preheating and anti-shrinkage deformation structure for a smart card laminator. Background Technology

[0002] In existing technology, after the chip and material to be laminated are placed between the heating plates of the smart card laminator, pressure is applied and the laminator rises. The top heating plate pushes the heat insulation plate upwards, making close contact with the upper crossbeam. During preheating before chip lamination, excessive pressure generated by the rising heating plates and the upper crossbeam of the laminator can easily cause the chip to crack or be damaged. Simultaneously, the top layer of laminating material is only subjected to the weight of the top heating plate, resulting in insufficient pressure and causing the material laminated with the chip to shrink and deform, producing defective products. Summary of the Invention

[0003] The technical problem to be solved by this utility model is to provide a preheating and anti-shrinkage deformation structure for chip lamination in a smart card laminator. This structure can prevent the heating plate from rising and generating too much pressure on the crossbeam of the laminator, which could cause the chip to crack or be damaged. It can also prevent the materials laminated together with the chip from shrinking and deforming, resulting in defective products.

[0004] The technical solution adopted by this utility model to solve its technical problem is: to construct a preheating and anti-shrinkage deformation structure for chip lamination of a smart card laminator, including a heat insulation plate, a heating plate and a spring. The spring is installed in the heat insulation plate, and the heat insulation plate is located between the heating plate and the upper crossbeam of the laminator. The two ends of the spring abut against the heating plate and the upper crossbeam of the laminator, respectively.

[0005] In the above scheme, the heat insulation plate is provided with a mounting groove for installing springs.

[0006] In the above scheme, the spring is fixed in the mounting groove by bolts.

[0007] In the above scheme, the spring is a compression spring.

[0008] The chip preheating and anti-shrinkage deformation structure of the smart card laminator implementing this utility model has the following beneficial effects:

[0009] By incorporating a preheating and anti-shrinkage deformation structure before chip lamination in the smart card laminator of this invention, excessive pressure between the rising heating plate and the upper crossbeam of the laminator during chip preheating can be prevented, thus avoiding chip cracking or damage. Simultaneously, preheating prevents shrinkage and deformation of the material being laminated with the chip due to insufficient pressure between the rising heating plate and the upper crossbeam, resulting in defective products. During the preheating process, temperature dissipation from the heating plate surface is prevented, thus avoiding temperature differences between each layer of heating plate; the heating plate and the upper crossbeam are insulated by a heat-insulating plate. Attached Figure Description

[0010] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0011] Figure 1 This is a schematic diagram of the installation position of the chip preheating and anti-shrinkage deformation structure of the smart card laminator of this utility model;

[0012] Figure 2 This is a schematic diagram of the chip preheating and anti-shrinkage deformation structure of the smart card laminator of this utility model. Detailed Implementation

[0013] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0014] like Figure 1-2 As shown, the chip preheating and anti-shrinkage deformation structure of the smart card laminator of this utility model includes a heat insulation plate 2, a heating plate 3, and a spring 4.

[0015] Spring 4 is installed in heat insulation plate 2, which is located between heating plate 3 and upper crossbeam 1 of laminator. The two ends of spring 4 abut against heating plate 3 and upper crossbeam 1 of laminator respectively, and can apply pressure to heating plate 3 and upper crossbeam 1.

[0016] Preferably, the heat insulation plate 2 is provided with a mounting groove for installing the spring 4, and the spring 4 is placed in the groove.

[0017] Preferably, the spring 4 is fixed in the mounting groove by bolts. In this embodiment, the spring 4 is a high-temperature resistant compression spring.

[0018] The working principle of this utility model is as follows:

[0019] When the chip to be laminated and the material are placed between the heating plates of the smart card laminator, pressure is applied and the laminator rises.

[0020] When the heating plate 3 rises to the top layer and pushes the heat insulation plate 2 upward, it almost contacts the upper crossbeam 1 but does not make contact. At this time, the hydraulic motor of the smart card laminator stops. At this time, all the chips only bear the pressure generated by the weight of the heating plate itself. The laminating material enters the preheating process to prevent the heating plate and the upper crossbeam 1 of the laminator from generating too much pressure, which could cause the chips to crack or be damaged. At the same time, the high-temperature resistant compression spring 4 of the chip preheating and anti-shrinkage deformation structure of the smart card laminator generates downward thrust to prevent the uppermost laminating material from being subjected to too little pressure from the weight of the top heating plate 3, which could cause the material laminated with the chips to shrink and deform, resulting in defective products.

[0021] After the laminating material is fully preheated, the hydraulic motor of the smart card laminator starts again. When the heating plate rises and makes full contact with the upper crossbeam 1 to the pressure value required for normal chip lamination, the hydraulic motor of the smart card laminator stops again, and chip lamination officially begins.

[0022] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the protection scope of the present invention.

Claims

1. A preheating and anti-shrinkage deformation structure before chip lamination in a smart card laminator, characterized in that, It includes a heat insulation plate (2), a heating plate (3) and a spring (4). The spring (4) is installed in the heat insulation plate (2). The heat insulation plate (2) is located between the heating plate (3) and the upper crossbeam (1) of the laminator. The two ends of the spring (4) abut against the heating plate (3) and the upper crossbeam (1) of the laminator, respectively.

2. The chip preheating and anti-shrinkage deformation structure of the smart card laminator according to claim 1, characterized in that, The heat insulation plate (2) is provided with a mounting groove for installing the spring (4).

3. The chip preheating and anti-shrinkage deformation structure of the smart card laminator according to claim 2, characterized in that, The spring (4) is fixed in the mounting groove by bolts.

4. The chip preheating and anti-shrinkage deformation structure of the smart card laminator according to claim 1 or 2, characterized in that, The spring (4) is a compression spring.

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