A system for semiconductor electronic components

Abstract

This utility model relates to the field of semiconductor manufacturing technology. The technical problems it addresses are large size, large space occupation, low space utilization, high labor costs, and low efficiency. To solve these problems, this utility model provides a system for semiconductor electronic components. The utility model includes: a conveying assembly comprising two conveying tracks, a driving component, and two conveying elements; the two conveying tracks are arranged in parallel; the two conveying elements are symmetrically arranged on the two conveying tracks; the driving component is connected to the two conveying elements; a detection position is located on the conveying assembly; a detection module is located above the detection position; the detection module includes a projector, a camera, and a reflection component; the projector is located to the side of the camera and perpendicular to the electronic component; the camera is perpendicular to the electronic component; the reflection component is located at the bottom of the projector. This utility model reduces size, increases space utilization, lowers labor costs, and improves efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a system for semiconductor electronic components. Background Technology

[0002] Inspection is required during the fabrication of semiconductor electronic components. Existing inspection systems typically include a camera and a projector. When performing triangulation on the object under test using a projector and camera, the camera and the projector, positioned to the side of the object, need to be at a certain angle. Usually, to ensure the camera is perpendicular to the object, the projector is tilted to one side of the camera. This results in a large inspection module, occupying a significant amount of space and having low space utilization. Furthermore, current technology involves manual loading and measurement, which is costly and inefficient. Utility Model Content

[0003] Therefore, the technical problem to be solved by this utility model is to overcome the above-mentioned problems existing in the prior art.

[0004] To solve the above-mentioned technical problems, this utility model provides a system for semiconductor electronic components, comprising:

[0005] The conveying assembly includes two conveying tracks, a drive unit, and two conveying components; the two conveying tracks are arranged in parallel; the two conveying components are symmetrically arranged on the two conveying tracks; the drive unit is connected to the two conveying components to drive the two conveying components to move synchronously.

[0006] The detection point is located on the conveying assembly;

[0007] The detection module is located above the detection position and moves relative to the conveying assembly on the X, Y, and Z axes. The detection module includes a projector, a camera, and a reflective assembly. The projector is positioned to the side of the camera and perpendicular to the electronic component to generate structured light stripes on the surface of the electronic component. The camera is positioned perpendicular to the electronic component to capture images of the structured light stripes on the surface of the electronic component. The reflective assembly is located at the bottom of the projector. The beam of light from the projector is projected onto the surface of the electronic component after passing through the reflective assembly.

[0008] In one embodiment of this utility model, the projector's beam, after passing through the reflective component, is projected onto the surface of the electronic component at an angle of 20-30° to the vertical direction of the electronic component's surface.

[0009] In one embodiment of this utility model, the reflective component includes a first reflector and a second reflector; the beam of light from the projector is projected onto the surface of the electronic component after passing through the first reflector and the second reflector in sequence.

[0010] In one embodiment of this utility model, there are multiple projectors, which are arranged at equal intervals around the camera along the circumference.

[0011] In one embodiment of this utility model, the application further includes a leveling assembly disposed at the detection position; the leveling assembly includes a top plate and a lifting side plate; the top plate is connected to the top of the conveying track and is located above the carrier loaded with multiple electronic components; the lifting side plate is located on one side of the conveying component and below the carrier; the lifting side plate is slidably connected to the conveying track; the lifting side plate moves up and up to lift the carrier, so that the lifting side plate and the top plate clamp the carrier.

[0012] In one embodiment of this utility model, multiple conveying components are arranged side by side.

[0013] In one embodiment of this utility model, the distance between the two conveying tracks is adjustable.

[0014] In one embodiment of this utility model, the conveying assembly further includes an adjusting component; the adjusting component includes an adjusting power component, a lead screw, and a lead screw nut; the adjusting power component is connected to one end of the lead screw, the lead screw nut cooperates with the lead screw, and the lead screw nut is connected to the conveying track.

[0015] In one embodiment of this utility model, the conveying component is a belt; the conveying assembly further includes two transmission components, each corresponding to one of the conveying components; the transmission components include a driving pulley and a driven pulley; the belt is wound around the driving pulley and the driven pulley; the driving component is connected to the driving pulleys of the two transmission components through a connecting shaft.

[0016] In one embodiment of this utility model, the detection module further includes a lampshade, which is disposed at the bottom of the camera.

[0017] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0018] The system for semiconductor electronic components described in this utility model features a projector combined with a reflective component that ensures the generation of structured light stripes on the surface of the electronic components. Furthermore, the projector is positioned perpendicular to the electronic components, rather than at an angle. This vertically positioned projector, in conjunction with the reflective component, satisfies the requirements for triangulation. Compared to an angled projector, the detection module of this application is smaller, saving space, achieving higher space utilization, and providing better imaging results. Multiple electronic components 400 are mounted on a carrier, with both sides of the carrier resting on two conveyor components of a conveying assembly. Driven by a driving component, the carrier is conveyed to a detection position, where the detection module can detect the height of the electronic components on the carrier. This application achieves automated detection through the cooperation of the conveyor components and the detection module, reducing labor costs and improving efficiency. Attached Figure Description

[0019] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:

[0020] Figure 1 This is a schematic diagram of the structure of a system for semiconductor electronic components according to a preferred embodiment of the present invention;

[0021] Figure 2 yes Figure 1 A three-dimensional schematic diagram of a detection module in a system used for semiconductor electronic components;

[0022] Figure 3 yes Figure 1 A front view of the detection module in a system for semiconductor electronic components;

[0023] Figure 4 yes Figure 1 A three-dimensional schematic diagram of a transport component in a system for semiconductor electronic components;

[0024] Figure 5 yes Figure 1 A top view of a transport component in a system for semiconductor electronic components;

[0025] Explanation of reference numerals in the accompanying drawings: 100, conveying assembly; 110, conveying track; 120, drive component; 130, conveying element; 140, adjusting component; 141, adjusting power component; 142, lead screw; 143, lead screw nut; 150, driving pulley; 160, driven pulley; 170, connecting shaft;

[0026] 200, detection position;

[0027] 300. Detection module; 310. Projector; 320. Camera; 330. Reflective component; 331. First reflector; 332. Second reflector; 340. Lampshade;

[0028] 400. Electronic components;

[0029] 500. Leveling assembly; 510. Top plate; 520. Lifting side plate;

[0030] 600. Frame;

[0031] 700, Three-axis moving module. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0033] Reference Figures 1-5 As shown, this embodiment of the present invention provides a system for semiconductor electronic components, comprising:

[0034] The conveying assembly 100 includes two conveying tracks 110, a driving component 120, and two conveying elements 130; the two conveying tracks 110 are arranged in parallel; the two conveying elements 130 are symmetrically arranged on the two conveying tracks 110; the driving component 120 is connected to the two conveying elements 130 to drive the two conveying elements 130 to move synchronously.

[0035] Detection position 200 is located on the conveying assembly 100;

[0036] The detection module 300 is located above the detection position 200 and moves relative to the conveying assembly 100 along the X, Y, and Z axes. The detection module 300 includes a projector 310, a camera 320, and a reflective assembly 330. The projector 310 is positioned to the side of the camera 320 and perpendicular to the electronic component 400, used to generate structured light stripes on the surface of the electronic component 400. The camera 320 is perpendicular to the electronic component 400 to capture images of the structured light stripes on the surface of the electronic component 400. The reflective assembly 330 is located at the bottom of the projector 310. The light beam from the projector 310 is projected onto the surface of the electronic component 400 after passing through the reflective assembly 330. During detection, the projector 310 projects structured light stripes onto the surface of the electronic component 400. If the surface of the electronic component 400 has uneven heights, it will cause stripe distortion. The height value of the object being measured is calculated based on the stripe distortion.

[0037] Specifically, in this embodiment, the projector 310, combined with the reflective component 330, ensures the generation of structured light stripes on the surface of the electronic component 400. Furthermore, the projector 310 is positioned perpendicular to the electronic component 400 rather than at an angle. This vertically positioned projector 310, in conjunction with the reflective component 330, satisfies the requirements of triangulation. Compared to an angled projector 310, the detection module 300 of this application has a smaller volume, saves space, has high space utilization, and provides better imaging results. In this embodiment, multiple electronic components 400 are mounted on a carrier, with both sides of the carrier resting on two conveyor members 130 of the conveying component 100. Driven by the driving component 120, the carrier is conveyed to the detection position 200, where the detection module 300 can detect the height of the electronic components 400 on the carrier. This embodiment, through the cooperation of the conveyor member 130 and the detection module 300, achieves automated detection, reduces labor costs, and improves efficiency.

[0038] Furthermore, the beam from the projector 310, after passing through the reflector 330, is projected onto the surface of the electronic component 400 at an angle of 20-30° to the vertical direction of the surface. Specifically, this embodiment achieves better imaging results.

[0039] Furthermore, the reflective component 330 includes a first reflector 331 and a second reflector 332; the beam of light from the projector 310 is projected onto the surface of the electronic component 400 after passing through the first reflector 331 and the second reflector 332 in sequence. Specifically, in this embodiment, the vertical beam of light from the projector 310 is converted into an oblique beam and projected onto the surface of the electronic component 400 by using two reflectors (the first reflector 331 and the second reflector 332), thereby shortening the optical path and further reducing the size of the detection module 300.

[0040] Furthermore, there are multiple projectors 310, which are evenly spaced around the camera 320 in a circumferential direction. For example, there are two projectors 310. Or, there are four projectors 310. Or, there are six projectors 310. Specifically, having multiple projectors 310 can reduce the backlight area and is suitable for electronic components 400 with relatively complex structures.

[0041] Furthermore, this application also includes a leveling assembly 500 disposed at the detection position 200; the leveling assembly 500 includes a top plate 510 and a lifting side plate 520; the top plate 510 is connected to the top of the conveyor rail 110 and is located above the carrier; the lifting side plate 520 is located on one side of the conveyor 130 and below the carrier; the lifting side plate 520 is slidably connected to the conveyor rail 110; the lifting side plate 520 moves upward to lift the carrier, so that the lifting side plate 520 and the top plate 510 clamp the carrier. The leveling assembly 500 includes a lifting cylinder, which drives the lifting side plate 520 to move up and down. Specifically, since the conveyor 130 (e.g., a belt) is elastic, when detecting at the detection position 200, different specifications of carriers have different weights, resulting in different degrees of sag or tilt of the carrier, causing differences in the levelness of the carrier, which is not conducive to the imaging of the electronic component 400. Therefore, in order to solve this problem, in this embodiment, before the test is performed after the vehicle reaches the test position 200, the lifting side plate 520 is first moved up to lift the vehicle until the lifting side plate 520 and the top plate 510 clamp the vehicle. This ensures that the electronic components 400 on each vehicle are in the same horizontal state during the test, thereby further ensuring the accuracy of the test data.

[0042] Furthermore, multiple conveying components 100 are arranged side by side. Specifically, the synchronous arrangement of multiple conveying components 100 can improve detection efficiency. In some embodiments, multiple conveying components 100 (e.g., two conveying components 100) can share a single detection module 300.

[0043] Furthermore, the distance between the two conveyor tracks 110 is adjustable. Specifically, this embodiment can adapt to the detection of vehicles of different specifications, thus having a wider range of applications.

[0044] Furthermore, the conveying assembly 100 also includes an adjusting component 140; the adjusting component 140 includes an adjusting power component 141, a lead screw 142, and a lead screw nut 143; the adjusting power component 141 is connected to one end of the lead screw 142, the lead screw nut 143 cooperates with the lead screw 142, and the lead screw nut 143 is connected to the conveying track 110. The conveying track 110 is slidably connected to the frame 600. This application also includes a frame 600, on which the conveying track 110 is connected. Specifically, in this embodiment, the adjusting power component 141 rotates to drive the conveying track 110 to translate on the frame 600, thereby adjusting the distance between the two conveying tracks 110. In some embodiments, of the two conveying tracks 110 of each conveying assembly 100, one is fixed to the frame 600 and the other is slidably connected to the frame 600. In other embodiments, both conveying tracks 110 of each conveying assembly 100 are slidably connected to the frame 600. The adjusting component 140 of this application has a simple structure and operates more smoothly.

[0045] Furthermore, the conveyor 130 is a belt; the conveyor assembly 100 also includes two transmission components, each corresponding to one of the conveyor 130; the transmission components include a driving pulley 150 and a driven pulley 160; the belt is wound around the driving pulley 150 and the driven pulley 160; the drive component 120 is connected to the driving pulleys 150 of the two transmission components via a connecting shaft 170. Specifically, this embodiment can drive the two conveyor components 130 to move synchronously through a drive component 120, thereby enabling the carrier to move stably and reliably, with a simple structure and stable and reliable operation.

[0046] Furthermore, the detection module 300 also includes a lampshade 340, which is located at the bottom of the camera 320. Specifically, in this embodiment, the lampshade 340 can better supplement the illumination of the electronic component 400, thereby improving the quality of the captured structured light stripe image.

[0047] In some embodiments, the detection module 300 is connected to the conveying assembly 100 via a three-axis motion module 700, and the three-axis motion module 700 drives the detection module 300 to move on the X, Y, and Z axes.

[0048] This application effectively solves the problems of large space occupation and structural redundancy in existing equipment. While ensuring detection accuracy, this application significantly optimizes the internal space layout of the equipment, making the detection system more compact and easier to install and maintain, making it particularly suitable for industrial detection scenarios with strict space requirements.

[0049] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A system for semiconductor electronic components, characterized in that: include: A conveying assembly includes two conveying tracks, a drive component, and two conveying components; the two conveying tracks are arranged in parallel; the two conveying components are symmetrically arranged on the two conveying tracks; the drive component is connected to the two conveying components to drive the two conveying components to move synchronously. The detection position is located on the conveying assembly; A detection module is located above the detection position and moves relative to the conveying assembly along the X, Y, and Z axes. The detection module includes a projector, a camera, and a reflective assembly. The projector is positioned to the side of the camera and perpendicular to the electronic component, and is used to generate structured light stripes on the surface of the electronic component. The camera is positioned perpendicular to the electronic component to capture an image of the structured light stripes on the surface of the electronic component. The reflective assembly is located at the bottom of the projector. The beam of light from the projector is projected onto the surface of the electronic component after passing through the reflective assembly.

2. The system for semiconductor electronic components according to claim 1, characterized in that: The projector beam, after passing through the reflective component, is projected onto the surface of the electronic component at an angle of 20-30° to the direction perpendicular to the surface of the electronic component.

3. The system for semiconductor electronic components according to claim 1, characterized in that: The reflective assembly includes a first reflector and a second reflector; the beam of light from the projector is projected onto the surface of the electronic component after passing through the first reflector and the second reflector in sequence.

4. The system for semiconductor electronic components according to claim 1, characterized in that: The projector is a plurality of projectors, which are arranged at equal intervals around the camera in a circumferential direction.

5. The system for semiconductor electronic components according to claim 1, characterized in that: It also includes a leveling assembly located at the detection position; the leveling assembly includes a top plate and a lifting side plate; the top plate is connected to the top of the conveying track and is located above the carrier loaded with multiple electronic components; the lifting side plate is located on one side of the conveying component and below the carrier; the lifting side plate is slidably connected to the conveying track; the lifting side plate moves up and up to lift the carrier, so that the lifting side plate and the top plate clamp the carrier.

6. The system for semiconductor electronic components according to claim 1, characterized in that: Multiple conveying components are arranged side by side.

7. The system for semiconductor electronic components according to claim 1, characterized in that: The spacing between the two conveyor tracks is adjustable.

8. The system for semiconductor electronic components according to claim 7, characterized in that: The conveying assembly further includes an adjusting component; the adjusting component includes an adjusting power component, a lead screw, and a lead screw nut; The adjusting power component is connected to one end of the lead screw, the lead screw nut cooperates with the lead screw, and the lead screw nut is connected to the conveying track.

9. The system for semiconductor electronic components according to claim 1, characterized in that: The conveying component is a belt; the conveying assembly also includes two transmission components, each corresponding to one of the conveying components; each transmission component includes a driving pulley and a driven pulley; the belt is wound around the driving pulley and the driven pulley; the driving component is connected to the driving pulleys of the two transmission components via a connecting shaft.

10. The system for semiconductor electronic components according to claim 1, characterized in that: The detection module also includes a lampshade, which is located at the bottom of the camera.

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