A gas purification device applied to semiconductor packaging

Abstract

The utility model relates to tail gas treatment technical field, concretely points to a kind of gas purification equipment applied to semiconductor packaging;Including host computer, the host computer is equipped with purification tank, fan, air inlet pipe and exhaust pipe, the air inlet pipe, purification tank, exhaust pipe and fan are connected in proper order, ionization component is equipped in purification tank, air inlet pipe and purification tank are equipped with electric heater, air inlet pipe is equipped with wind speed sensor;First recovery tank is equipped on the purification tank, second recovery tank is equipped on exhaust pipe, and the discharge port of fan is connected with end processor;It further includes controller, and the controller is connected ionization component, electric heater, fan and wind speed sensor respectively by circuit;The utility model structure is reasonable, and electric heating device makes the temperature in air inlet pipe and purification tank maintain above rosin melting point, and ionization device can effectively remove rosin component in waste gas;Controller maintains flow balance according to the wind speed in air inlet pipe and purification tank, and with packaging equipment, packaging quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of exhaust gas treatment technology, specifically to a gas purification device applied to semiconductor packaging. Background Technology

[0002] Currently, common oil mist purifiers on the market mainly include centrifugal, electrostatic, and mechanical types. These purifiers effectively remove large-particle, low-viscosity, and highly fluid oil mist generated during machining processes. In the electronic packaging industry, rosin is often used as a flux for soldering semiconductor chips. Rosin-containing exhaust gases are highly viscous and adhere to the inside of equipment and filter components, leading to a decrease in the purifier's airflow and purification efficiency. In particular, nitrogen is required during packaging to protect electronic components. Unstable airflow from the purifier makes it difficult to control the nitrogen content within the packaging equipment, resulting in substrate oxidation and batch defects. Therefore, existing technologies require further improvement and development. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings and deficiencies of existing technologies by providing a gas purification device for semiconductor packaging that is structurally sound, stable, reliable, and has a good purification effect.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] This utility model discloses a gas purification device for semiconductor packaging, comprising a main unit, which is equipped with a purification tank, a fan, an inlet pipe, and an exhaust pipe. The inlet pipe, purification tank, exhaust pipe, and fan are connected in sequence. An ionization component is installed inside the purification tank. Electric heaters are installed on both the inlet pipe and the purification tank. A wind speed sensor is installed on the inlet pipe. A first recovery tank is installed on the purification tank, and a second recovery tank is installed on the exhaust pipe. An end-of-line processor is connected to the exhaust port of the fan. The device also includes a controller, which is connected to the ionization component, electric heater, fan, and wind speed sensor via wiring.

[0006] According to the above scheme, the ionization component includes a base rod and spikes. The base rod is vertically inserted into the purification tank, and a number of spikes are provided on the base rod. The spikes constitute the positive electrode, and the discharge ends of the spikes are spaced apart from the inner sidewall of the purification tank. The inner sidewall of the purification tank constitutes the negative electrode.

[0007] According to the above scheme, the distance between the discharge end of the spike and the inner wall of the purification tank is H, and the value of H is between 15MM and 50MM.

[0008] According to the above scheme, the operating voltage of the ionization component is between 10KV and 40KV.

[0009] According to the above scheme, the purification tank is equipped with two air inlet pipes, which are respectively connected to the lower part of the purification tank. Both air inlet pipes are equipped with wind speed sensors, and both the air inlet pipes and the purification tank are equipped with electric heaters. The first recovery tank is located at the bottom of the purification tank.

[0010] According to the above scheme, the electric heater can control the temperature in the purification tank and the air inlet pipe between 30℃ and 80℃, and the air velocity in the purification tank is between 0.05M / S and 0.5M / S.

[0011] According to the above scheme, the exhaust pipe is vertically installed on one side of the purification tank. The upper end of the exhaust pipe is connected to the upper part of the purification tank, and the lower end of the exhaust pipe is connected to the second recovery tank. The exhaust pipe is provided with an exhaust port, and the exhaust port is connected to the fan through a pipeline.

[0012] According to the above scheme, the end processor includes a filter, the exhaust port of the fan is connected to the filter, and the filter is provided with physical filter media, including glass fiber cotton and HEPA filter element.

[0013] The beneficial effects of this utility model are as follows: This utility model has a reasonable structure. The electric heating device keeps the temperature in the air inlet pipe and the purification tank above the melting point of rosin. The ionization device can effectively remove rosin components in the exhaust gas and recover them using the recovery tank. The controller adjusts the fan according to the wind speed in the air inlet pipe and the purification tank to control the wind speed and maintain flow balance with the packaging equipment to improve the packaging quality. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the internal structure of the host of this utility model;

[0016] Figure 3 yes Figure 2 A schematic diagram of the vertical cross-sectional structure.

[0017] In the diagram: 1. Main unit; 2. Purification tank; 3. Base rod; 4. Controller; 11. Fan; 12. Exhaust port; 13. Filter; 21. Inlet pipe; 22. Exhaust pipe; 23. Electric heater; 24. Wind speed sensor; 25. First recovery tank; 26. Second recovery tank; 31. Spikes. Detailed Implementation

[0018] The technical solution of this utility model will be described below with reference to the accompanying drawings and embodiments.

[0019] like Figures 1-3As shown, the present invention discloses a gas purification device for semiconductor packaging, comprising a main unit 1, wherein the main unit 1 is provided with a purification tank 2, a fan 11, an air inlet pipe 21, and an exhaust pipe 22, wherein the air inlet pipe 21, the purification tank 2, the exhaust pipe 22, and the fan 11 are connected in sequence; the purification tank 2 is provided with an ionization component; both the air inlet pipe 21 and the purification tank 2 are provided with electric heaters 23; and the air inlet pipe 21 is provided with a wind speed sensor 24; the purification tank 2 is provided with a first recovery tank 25; the exhaust pipe 22 is provided with a second recovery tank 26; and an end processor is connected to the exhaust port of the fan 11; the device also includes a controller 4, which is connected to the ionization component, the electric heater 23, the fan 11, and the wind speed sensor 24 via wiring.

[0020] The fan 11 can generate negative pressure, causing the exhaust gas to flow along the inlet pipe 21, purification tank 2, exhaust pipe 22, fan 11, and end processor. Specifically, the ionization component generates a high-voltage electric field inside the purification tank 2, causing the rosin component in the exhaust gas to be adsorbed onto the inner wall of the purification tank 2. Both the inlet pipe 21 and the purification tank 2 are equipped with electric heaters 23. The electric heater 23 on the inlet pipe 21 is used to preheat the exhaust gas, preventing rosin from solidifying on the inner wall of the inlet pipe 21 and affecting the flow rate. Furthermore, the electric heater 23 on the purification tank 2 is used to maintain the internal temperature, keeping the exhaust gas above the melting point temperature of rosin.

[0021] Understandably, the rosin components inside purification tank 2 are adsorbed and become liquid. Under the influence of gravity, the rosin liquid on the inner wall of purification tank 2 will drip into the first recovery tank 25. The gas discharged from purification tank 2 into exhaust pipe 22 may contain residual rosin liquid carried by the airflow, which will fall into the second recovery tank 26 as it passes through exhaust pipe 22.

[0022] Furthermore, the exhaust gas after the above treatment enters the terminal processor through the fan 11. The terminal processor includes a filter 13. The exhaust port of the fan 11 is connected to the filter 13. The filter 13 can be equipped with filter media according to the emission requirements. The filter 13 is equipped with physical filter media, including but not limited to glass fiber cotton and HEPA filter element.

[0023] like Figure 2As shown, the ionization component includes a base rod 3 and spikes 31. The base rod 3 is vertically inserted into the purification tank 2, and a plurality of spikes 31 are provided on the base rod 3. The spikes 31 constitute the positive electrode, and the discharge ends of the spikes 31 are spaced apart from the inner sidewall of the purification tank 2, which constitutes the negative electrode. Specifically, the upper end of the base rod 3 is fixedly mounted on the upper end cover of the purification tank 2. The spikes 31 are arranged vertically along the base rod 3 at intervals, and the spikes 31 are arranged circumferentially around the base rod 3 at equal angles. Of course, the spikes 31 at different heights can be staggered to form a high-voltage electric field inside the purification tank 2, which fully adsorbs flux components such as rosin in the exhaust gas passing through the purification tank 2.

[0024] like Figure 3 As shown, the preferred distance between the discharge end of the spike 31 and the inner wall of the purification tank 2 is H, where H is between 15MM and 50MM, and the operating voltage of the ionization component is between 10KV and 40KV.

[0025] The purification tank 2 is equipped with two air inlet pipes 21, which are respectively connected to the lower part of the purification tank 2. Each air inlet pipe 21 is equipped with a wind speed sensor 24. Both the air inlet pipes 21 and the purification tank 2 are equipped with electric heaters 23. The first recovery tank 25 is located at the bottom of the purification tank 2. The two air inlet pipes 21 ensure the flow rate within the purification tank 2. Alternatively, the two air inlet pipes 21 can be connected to two sets of encapsulation equipment to treat waste gas, reducing equipment investment.

[0026] Preferably, each intake pipe 21 is equipped with an electric heater 23 to preheat the exhaust gas, preventing rosin from accumulating on the inner wall of the intake pipe 21 and affecting the flow rate. Furthermore, a wind speed sensor 24 is installed inside the intake pipe 21 to detect the flow rate of the exhaust gas in real time, and the controller 4 controls the fan 11 to change its speed to maintain balance with the packaging equipment and prevent imbalance of the protective gas (nitrogen, etc.) content in the packaging equipment.

[0027] Specifically, the electric heater 23 can control the temperature inside the purification tank 2 and the air inlet pipe 21 between 30℃ and 80℃, and the wind speed inside the purification tank 2 is between 0.05M / S and 0.5M / S.

[0028] The exhaust pipe 22 is vertically installed on one side of the purification tank 2. The upper end of the exhaust pipe 22 is connected to the upper part of the purification tank 2, and the lower end of the exhaust pipe 22 is connected to the second recovery tank 26. The exhaust pipe 22 is provided with an exhaust port 12, which is connected to the fan 11 through a pipeline.

[0029] It is understood that both the first recycling tank 25 and the second recycling tank 26 are detachable and can be removed to clean the rosin inside after a period of continuous operation. The main unit 1 is equipped with wheels at the bottom, allowing it to be moved around the production site to be paired with packaging equipment for waste gas treatment.

[0030] The above description is only a preferred embodiment of the present utility model. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the claims of the present utility model patent application are included in the scope of the present utility model patent application.

Claims

1. A gas purification device for semiconductor packaging, comprising a main unit (1), wherein the main unit (1) is provided with a purification tank (2), a fan (11), an inlet pipe (21), and an exhaust pipe (22), characterized in that: The air inlet pipe (21), purification tank (2), exhaust pipe (22) and fan (11) are connected in sequence. The purification tank (2) is equipped with an ionization component. Both the air inlet pipe (21) and the purification tank (2) are equipped with electric heaters (23). The air inlet pipe (21) is equipped with a wind speed sensor (24). The purification tank (2) is equipped with a first recovery tank (25). The exhaust pipe (22) is equipped with a second recovery tank (26). The exhaust port of the fan (11) is connected to an end processor. The system also includes a controller (4). The controller (4) is connected to the ionization component, electric heater (23), fan (11) and wind speed sensor (24) through lines.

2. The gas purification device for semiconductor packaging according to claim 1, characterized in that: The ionization component includes a base rod (3) and spikes (31). The base rod (3) is vertically inserted into the purification tank (2). The base rod (3) is provided with a plurality of spikes (31). The spikes (31) constitute the positive electrode. The discharge ends of the plurality of spikes (31) are spaced apart from the inner sidewall of the purification tank (2). The inner sidewall of the purification tank (2) constitutes the negative electrode.

3. The gas purification device for semiconductor packaging according to claim 2, characterized in that: The distance between the discharge end of the spike (31) and the inner wall of the purification tank (2) is H, and the value of H is between 15MM and 50MM.

4. The gas purification device for semiconductor packaging according to claim 2, characterized in that: The operating voltage of the ionization component is between 10KV and 40KV.

5. The gas purification device for semiconductor packaging according to claim 1, characterized in that: The purification tank (2) is provided with two air inlet pipes (21), which are respectively connected to the lower part of the purification tank (2). Both air inlet pipes (21) are provided with wind speed sensors (24). Both air inlet pipes (21) and purification tank (2) are provided with electric heaters (23). The first recovery tank (25) is located at the bottom of the purification tank (2).

6. The gas purification device for semiconductor packaging according to claim 5, characterized in that: The electric heater (23) can control the temperature in the purification tank (2) and the air inlet pipe (21) between 30°C and 80°C, and the wind speed in the purification tank (2) is between 0.05M / S and 0.5M / S.

7. The gas purification device for semiconductor packaging according to claim 1, characterized in that: The exhaust pipe (22) is vertically installed on one side of the purification tank (2). The upper end of the exhaust pipe (22) is connected to the upper part of the purification tank (2), and the lower end of the exhaust pipe (22) is connected to the second recovery tank (26). The exhaust pipe (22) is provided with an exhaust port (12), and the exhaust port (12) is connected to the fan (11) through a pipeline.

8. The gas purification device for semiconductor packaging according to claim 1, characterized in that: The end processor includes a filter (13), the outlet of the fan (11) is connected to the filter (13), and the filter (13) is provided with physical filter media, including glass fiber cotton and HEPA filter element.

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