A vulcanizing mold for processing a semiconductor seal ring

Abstract

This utility model provides a vulcanizing mold for processing semiconductor sealing rings, relating to the field of sealing ring production technology. It includes an upper mold and a lower mold, with their rear sides and adjacent ends connected by a hinge. Each of the upper and lower molds has a placement groove on its adjacent side, and a mold core is respectively engaged and installed inside the placement groove. This utility model eliminates the need for a completely replaced mold, unlike traditional fluororubber sealing ring vulcanizing molds which require replacing the entire mold to meet different semiconductor sealing ring production needs. When changing molds, a suitable mold core can be quickly removed and replaced using the cooperation of a sliding groove and slider, and then fixed by a limiting mechanism. This significantly reduces downtime for mold changes and avoids the high equipment investment costs associated with replacing the entire mold, effectively improving the production efficiency and economy of semiconductor sealing rings.

Description

Technical Field

[0001] This utility model relates to the field of sealing ring production technology, and more specifically, to a vulcanizing mold for processing semiconductor sealing rings. Background Technology

[0002] Semiconductor sealing rings are an indispensable key component in semiconductor manufacturing equipment and packaging processes. They are mainly used to ensure a high vacuum and high cleanliness process environment and prevent gas and liquid leakage and contaminant intrusion. When producing semiconductor sealing rings, it is often necessary to use a vulcanization mold. For example, the vulcanization mold for fluororubber sealing rings proposed in application number "CN202322254798.X" includes a lower mold, an upper mold rotatably connected to one side of the outer wall of the lower mold, and several mutually adaptable mold grooves are opened on one side of the inner cavity of the lower mold and one side of the inner cavity of the upper mold.

[0003] However, in the above technical solutions, the mold groove is directly opened in the inner cavity of the upper and lower molds, and no mold core structure that can be replaced independently is set. Semiconductor sealing rings have extremely high requirements for dimensional accuracy and cleanliness. The production of semiconductor sealing rings of different specifications requires the entire mold to be replaced, which not only increases the equipment investment cost, but also prolongs the downtime of mold replacement and reduces production efficiency. Therefore, we propose a vulcanization mold for semiconductor sealing ring processing to solve the above problems. Utility Model Content

[0004] The main purpose of this utility model is to provide a vulcanizing mold for processing semiconductor sealing rings. It solves the problem that the mold groove is directly opened in the inner cavity of the upper and lower molds in the mold structure, and there is no mold core structure that can be replaced independently. Semiconductor sealing rings have extremely high requirements for dimensional accuracy and cleanliness. The production of semiconductor sealing rings of different specifications requires the entire mold to be replaced, which not only increases the equipment investment cost, but also prolongs the downtime of mold replacement and reduces production efficiency.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A vulcanizing mold for processing semiconductor sealing rings includes an upper mold and a lower mold. The rear sides of the upper and lower molds, which are close to each other, are connected by a hinge. Placement grooves are provided on the close sides of the upper and lower molds, and mold cores are respectively engaged inside the placement grooves. Limiting mechanisms are installed at the front end of the placement grooves, each limiting mechanism including a movable groove. The movable grooves pass through the front end of the placement grooves and are engaged with the mold cores. L-shaped baffles are movably installed inside the movable grooves and are engaged with the mold cores. Fixed rods are installed at the far ends of the movable grooves, and the rods are movably installed through the L-shaped baffles. Several clamping rods are installed on the side of the L-shaped baffles closest to the mold cores and are clamped to the mold cores.

[0007] Preferably, the placement groove is provided with a sliding groove on the side opposite to each other, the front end of the sliding groove is connected to the movable groove, and the mold core is provided with a slider on the side opposite to each other, and the slider is respectively engaged and installed inside the sliding groove.

[0008] Preferably, a connecting block is installed in the middle of the front surface of the L-shaped baffle at the upper end, and an outer frame is installed in the middle of the front surface of the L-shaped baffle at the lower end, with the lower end of the connecting block engaging inside the outer frame.

[0009] Preferably, the upper mold and the lower mold are provided with guide grooves at both ends of their front surfaces. Movable blocks are movably installed inside the guide grooves. Positioning rods are installed on the side of each movable block near the L-shaped baffle. The rods of the positioning rods movably pass through the guide grooves and the movable grooves and are engaged inside the L-shaped baffle.

[0010] Preferably, the L-shaped baffle has positioning holes on both sides, and the positioning rods are respectively engaged and installed inside the positioning holes.

[0011] Preferably, guide rods are installed at the rear end of the guide groove, and the rods are movably installed inside the movable block. Springs are sleeved on the outer side of the rods located between the movable block and the guide groove.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] (1) In this utility model, a replaceable mold core is installed by engaging in the placement groove of the upper mold and the lower mold. Unlike the traditional fluororubber sealing ring vulcanization mold, which requires the entire mold to be replaced when changing the production needs of different specifications of semiconductor sealing rings, when changing the mold, the mold core can be quickly replaced by the cooperation of the sliding groove and the slider, and then fixed by the limiting mechanism. This greatly reduces the downtime of mold replacement and avoids the high equipment investment cost caused by replacing the entire mold, effectively improving the production efficiency and economy of semiconductor sealing rings.

[0014] (2) The limiting mechanism in this utility model can reliably fix the mold core. The fixing rod in the movable groove provides stable guidance for the L-shaped baffle. The clamping rod on one side of the L-shaped baffle can tightly abut against the mold core to prevent the mold core from shifting during the vulcanization process. Furthermore, the upper and lower mold L-shaped baffles are engaged with the outer frame through the connecting block, which further enhances the integrity of the mold after it is closed. This double limiting structure effectively avoids the problem of finished product size deviation caused by the displacement of internal components in traditional molds, ensuring the molding accuracy of semiconductor sealing rings and meeting their production requirements of high cleanliness and high precision. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a vulcanizing mold for processing semiconductor sealing rings according to this utility model;

[0016] Figure 2 This is a front view structural diagram of a vulcanizing mold for processing semiconductor sealing rings according to this utility model;

[0017] Figure 3 This is a side view of a vulcanizing mold for processing semiconductor sealing rings according to the present invention.

[0018] Figure 4 This utility model relates to a vulcanizing mold for processing semiconductor sealing rings. Figure 2 Schematic diagram of the cross-sectional structure at point AA;

[0019] Figure 5 This utility model relates to a vulcanizing mold for processing semiconductor sealing rings. Figure 2 Schematic diagram of the cross-sectional structure at point BB;

[0020] Figure 6 This utility model relates to a vulcanizing mold for processing semiconductor sealing rings. Figure 3 Schematic diagram of the cross-sectional structure at the CC section;

[0021] Figure 7 This utility model relates to a vulcanizing mold for processing semiconductor sealing rings. Figure 4 Enlarged structural diagram at point D;

[0022] Figure 8 This utility model relates to a vulcanizing mold for processing semiconductor sealing rings. Figure 5 Enlarged structural diagram at point E in the middle.

[0023] In the diagram: 1. Upper mold; 2. Lower mold; 3. Limiting mechanism; 301. Movable groove; 302. L-shaped baffle; 303. Fixed rod; 304. Clamping rod; 305. Guide groove; 306. Movable block; 307. Positioning rod; 308. Positioning hole; 309. Guide rod; 310. Spring; 4. Connecting block; 5. Outer frame; 6. Placement groove; 7. Mold core; 8. Slider; 9. Slide groove. Detailed Implementation

[0024] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0025] like Figures 1 to 8 As shown in the figure, this utility model embodiment proposes a vulcanizing mold for processing semiconductor sealing rings, including an upper mold 1 and a lower mold 2. The rear sides of the upper mold 1 and the lower mold 2, which are close to each other, are connected by a hinge. The sides of the upper mold 1 and the lower mold 2 that are close to each other are respectively provided with placement grooves 6. Mold cores 7 are respectively engaged and installed inside the placement grooves 6. Limiting mechanisms 3 are respectively installed at the front end of the interior of the placement grooves 6. The limiting mechanisms 3 include movable grooves 301. The movable grooves 301 are respectively provided through the front end of the interior of the placement grooves 6, and the mold cores 7 are engaged and connected with the movable grooves 301. L-shaped baffles 302 are respectively movably installed inside the movable grooves 301. The L-shaped baffles 302 are respectively engaged and connected with the mold cores 7. Fixed rods 303 are respectively installed at the interior of the movable grooves 301, which are far from each other. The rods of the fixed rods 303 are respectively movably installed through the interior of the L-shaped baffles 302. Several clamping rods 304 are respectively installed on the side of the L-shaped baffles 302 that are close to the mold cores 7. The clamping rods 304 are tightly connected to the mold cores 7.

[0026] like Figures 4 to 8As shown, in another embodiment of this utility model, the interior of the placement groove 6 and the sides away from each other are respectively provided with sliding grooves 9. The front end of the sliding groove 9 is connected to the movable groove 301. The mold core 7 is respectively installed with sliders 8 on the sides away from each other. The sliders 8 are respectively engaged and installed inside the sliding grooves 9. A connecting block 4 is installed in the middle of the front surface of the upper L-shaped baffle 302. An outer frame 5 is installed in the middle of the front surface of the lower L-shaped baffle 302. The lower end of the connecting block 4 is engaged and installed inside the outer frame 5. The front surfaces of the upper mold 1 and the lower mold 2 are respectively provided with guide grooves 305. Movable blocks 306 are respectively movably installed inside the guide grooves 305. Positioning rods 307 are installed on the side of the movable block 306 near the L-shaped baffle 302. The rods of the positioning rods 307 respectively movably pass through the interior of the guide groove 305 and the movable groove 301, and are engaged inside the L-shaped baffle 302. Positioning holes 308 are provided on both sides of the L-shaped baffle 302, and the positioning rods 307 are engaged inside the positioning holes 308 respectively. Guide rods 309 are installed at the rear end of the interior of the guide groove 305. The rods of the guide rods 309 are movably passed through the interior of the movable block 306. Springs 310 are sleeved on the outer side of the rods of the guide rods 309 located between the movable block 306 and the guide groove 305.

[0027] First, align the mold core 7 of the appropriate specification with the sliding groove 9 inside the upper mold 1 and lower mold 2 placement slot 6 via its installed slider 8, and push it along the sliding groove 9 into the depth of the placement slot 6 until the mold core 7 engages with the movable groove 301 at the front end of the placement slot 6, completing the initial installation of the mold core 7. Then, push the L-shaped baffle 302 to rotate it around the fixed rod 303 as the axis, so that the L-shaped baffle 302 rotates toward the mold core 7 until the L-shaped baffle 302 engages with the mold core 7. The core 7 is engaged and connected, and the L-shaped baffle 302 drives the clamping rod 304 to tightly press against the mold core 7. Then the movable block 306 in the guide groove 305 is released. Under the elastic reset action of the spring 310 on the outside of the guide rod 309, the movable block 306 drives the positioning rod 307 to pass through the guide groove 305 and the movable groove 301, and finally engages in the positioning holes 308 on both sides of the L-shaped baffle 302, thereby fixing the L-shaped baffle 302 and completing the limiting and locking of the mold core 7.

[0028] Then, when it is necessary to replace the mold core 7, the user pulls the movable block 306 to both sides, so that the movable block 306 drives the positioning rod 307 to disengage from the positioning hole 308, and then squeezes the spring 310. Then the user can control the L-shaped baffle 302 to rotate around the fixed rod 303 as the axis, so that the L-shaped baffle 302 and the mold core 7 are separated, and then the user can pull out the mold core 7 for replacement.

[0029] By cooperating with the slider 8 and the slide groove 9, the installation positions of the mold core 7 and the placement groove 6 can be quickly aligned to avoid the mold core 7 from being misaligned during installation. At the same time, the through design of the slide groove 9 and the movable groove 301 can form a preliminary limit on the mold core 7 in the front and back directions, laying the foundation for the subsequent fixation of the limit mechanism 3 and improving the accuracy and efficiency of the mold core 7 installation.

[0030] The clamping rod 304 can enhance the contact stability with the mold core 7 and prevent the mold core 7 from shifting during the vulcanization process. The locking action of the positioning rod 307 and the positioning hole 308 can lock the position of the L-shaped baffle 302 and prevent it from loosening.

[0031] The positioning rod 307 can be quickly disengaged from the positioning hole 308 by pulling the movable block 306, which conveniently releases the L-shaped baffle 302 from limiting the mold core 7; the cooperation between the slider 8 and the slide groove 9 allows the mold core 7 to be quickly pulled out and replaced without replacing the upper mold 1 and lower mold 2 as a whole, which greatly shortens downtime, reduces equipment investment costs, and improves the production switching efficiency of semiconductor sealing rings of different specifications.

[0032] The working principle of a vulcanizing mold for processing semiconductor sealing rings:

[0033] In use, first, align the mold core 7 of the appropriate specification with the sliding groove 9 inside the upper mold 1 and lower mold 2 placement slot 6 via its installed slider 8, and push it along the sliding groove 9 into the depth of the placement slot 6 until the mold core 7 engages with the movable groove 301 at the front end of the placement slot 6, completing the initial installation of the mold core 7. Then, push the L-shaped baffle 302 to rotate it around the fixed rod 303 as the axis, so that the L-shaped baffle 302 rotates toward the mold core 7 until the L-shaped baffle 302 engages with the movable groove 301 at the front end of the placement slot 6. The mold cores 7 are engaged and connected, and the L-shaped baffle 302 drives the clamping rod 304 to tightly press against the mold cores 7. Then, the movable block 306 in the guide groove 305 is released. Under the elastic reset action of the spring 310 on the outside of the guide rod 309, the movable block 306 drives the positioning rod 307 to pass through the guide groove 305 and the movable groove 301, and finally engages with the positioning holes 308 on both sides of the L-shaped baffle 302, thereby fixing the L-shaped baffle 302 and completing the limiting and locking of the mold cores 7.

[0034] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. Any obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A vulcanization mold for processing a semiconductor seal ring, comprising an upper mold (1) and a lower mold (2), characterized in that: The upper mold (1) and the lower mold (2) are connected by a hinge at their rear sides and near each other. The upper mold (1) and the lower mold (2) are respectively provided with placement grooves (6) on their near sides. Mold cores (7) are respectively fitted inside the placement grooves (6). Limiting mechanisms (3) are respectively installed at the front end of the interior of the placement grooves (6). The limiting mechanism (3) includes a movable groove (301), which is respectively provided through the front end of the interior of the placement groove (6). The mold cores (7) are engaged with the movable grooves (301). L-shaped baffles (302) are movably installed inside the movable groove (301). The L-shaped baffles (302) are respectively engaged with the mold core (7). Fixed rods (303) are respectively installed inside the movable groove (301) at opposite ends. The rods (303) are movably installed through the inside of the L-shaped baffles (302). Several abutting rods (304) are respectively installed on the side of the L-shaped baffles (302) near the mold core (7). The abutting rods (304) are abutted against the mold core (7).

2. The vulcanizing mold for processing semiconductor sealing rings according to claim 1, characterized in that: The placement groove (6) is provided with a sliding groove (9) on the side away from each other. The front end of the sliding groove (9) is connected to the movable groove (301). The mold core (7) is provided with a slider (8) on the side away from each other. The slider (8) is respectively engaged and installed inside the sliding groove (9).

3. The vulcanizing mold for processing semiconductor sealing rings according to claim 1, characterized in that: A connecting block (4) is installed in the middle of the front surface of the L-shaped baffle (302) located at the upper end, and an outer frame (5) is installed in the middle of the front surface of the L-shaped baffle (302) located at the lower end. The lower end of the connecting block (4) is engaged and installed inside the outer frame (5).

4. The vulcanizing mold for processing semiconductor sealing rings according to claim 1, characterized in that: The upper mold (1) and the lower mold (2) are respectively provided with guide grooves (305) at both ends of their front surfaces. Movable blocks (306) are movably installed inside the guide grooves (305). Positioning rods (307) are installed on the side of the movable blocks (306) near the L-shaped baffle (302). The rods of the positioning rods (307) movably pass through the interior of the guide grooves (305) and the movable grooves (301), and are engaged inside the L-shaped baffle (302).

5. The vulcanizing mold for processing semiconductor sealing rings according to claim 4, characterized in that: The L-shaped baffle (302) has positioning holes (308) on both sides, and the positioning rods (307) are respectively engaged and installed inside the positioning holes (308).

6. The vulcanizing mold for processing semiconductor sealing rings according to claim 4, characterized in that: Guide rods (309) are respectively installed at the rear end of the inner guide groove (305). The rods of the guide rods (309) are respectively movably installed inside the movable block (306). Springs (310) are respectively sleeved on the outer side of the rods of the guide rods (309) located between the movable block (306) and the guide groove (305).

Images