A controller structure

Abstract

The utility model provides a kind of controller structure, including upper shell, lower shell, upper layer circuit board, lower layer circuit board, upper layer circuit board is connected on lower layer circuit board, lower layer circuit board is connected on lower shell, lower layer circuit board is integrated with lower layer component and power tube, lower shell main body is fixed on radiator, lower shell main body is between upper shell and radiator, upper flow-through groove is set up in the side of lower shell main body towards radiator, upper inlet and upper outlet respectively communicated with the two ends of upper flow-through groove are set up on the side wall of lower shell main body, lower flow-through groove adapted with upper flow-through groove is set up in the side of radiator towards lower shell main body, lower inlet and lower outlet respectively communicated with the two ends of lower flow-through groove are set up on the side wall of radiator, first interface is formed between lower inlet and upper inlet, second interface is formed between lower outlet and upper outlet, first interface and second interface are used to connect with the cooling system of vehicle, reach the purpose of improving heat dissipation.

Description

Technical Field

[0001] This utility model relates to a motor controller, and more particularly, to a controller structure. Background Technology

[0002] As the core control component driving the motor, the motor controller is widely used in electric vehicles, electric bicycles, and other transportation vehicles, and is considered one of the three core components of electric vehicles. Currently, motor controller designs on the market typically use functional modules for partitioning, meaning components of the same functional module are soldered to the same area of ​​the circuit board. This reduces the complexity of the circuit design to some extent. However, this design approach often leads to an unreasonable overall circuit board structure, resulting in low utilization of the controller's internal space.

[0003] To address the aforementioned issues, a Chinese utility model patent with authorization publication number CN219960940U discloses a structurally optimized controller. This controller includes a housing containing a circuit board structure and several wiring posts and connectors electrically connected to the circuit board structure. The circuit board structure consists of an upper board and a lower board arranged vertically at intervals, with the wiring on the two boards electrically connected via pin connections. A key feature of this design is that the height of the components integrated on the upper board is within a first preset range, while the height of the components integrated on the lower board is within a second preset range. Specifically, the components integrated on the lower board include a drive control module and power transistors.

[0004] However, in practical applications, especially for electric vehicle controllers, the operating environment places stringent requirements on the product's airtightness and waterproof performance, thus typically employing a closed-shell design. In this structure, high-heat-density components such as power transistors inside the controller generate a significant amount of heat during operation. In patent CN219960940U, the power transistors are integrated on the lower plate, and their heat is primarily dissipated through the bottom shell. This heat dissipation method is inefficient when heat generation is high, potentially leading to excessively high internal temperatures within the controller, which adversely affects the performance and lifespan of the components. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a controller structure to improve heat dissipation.

[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is: a controller structure, including an upper housing, a lower housing, an upper circuit board, and a lower circuit board. The upper circuit board is connected to the lower circuit board, and the lower circuit board is connected to the lower housing. The upper housing is connected to the lower housing, and the upper and lower circuit boards are located between the upper and lower housings. The upper circuit board integrates upper-layer components, and the lower circuit board integrates lower-layer components and power transistors. The lower housing includes a lower housing body and a heat sink. The lower housing body is fixed to the heat sink. The main body is located between the upper shell and the heat sink. The lower shell has an upper flow groove on the side facing the heat sink. The side wall of the lower shell has an upper inlet and an upper outlet that are respectively connected to the two ends of the upper flow groove. The heat sink has a lower flow groove adapted to the upper flow groove on the side facing the lower shell. The side wall of the heat sink has a lower inlet and a lower outlet that are respectively connected to the two ends of the lower flow groove. A first interface is formed between the lower inlet and the upper inlet, and a second interface is formed between the lower outlet and the upper outlet. The first interface and the second interface are used to connect to the vehicle's cooling system.

[0007] To achieve the above technical solution, the lower housing is designed as a double-layer structure comprising the lower housing body and a heat sink, with an internal circulation channel connecting to the vehicle's cooling system built between them, fundamentally changing the controller's heat dissipation mode. During operation, the vehicle's cooling system drives the coolant to enter through the first interface, flowing through the sealed cavity formed by the upper and lower flow channels. During this process, the coolant undergoes efficient heat exchange with the lower housing body, which is adjacent to heat sources such as power transistors. After absorbing a large amount of heat, the coolant flows out through the second interface and returns to the vehicle's main cooling circuit. This process constitutes active forced liquid cooling, fundamentally solving the problem of low efficiency in traditional passive cooling. It can efficiently dissipate the large amount of heat generated inside the sealed controller, thereby ensuring the controller's operational stability under high load conditions, component performance, and long-term reliability.

[0008] As a preferred embodiment of this utility model, a heat dissipation groove is provided on the side of the heat sink away from the lower shell body, and a plurality of parallel heat dissipation strips are fixedly connected to the inner wall of the heat dissipation groove, and the plurality of heat dissipation strips are arranged along the length direction of the heat dissipation groove.

[0009] To achieve the above technical solution, when the controller is working, some of the heat transferred to the heat sink is carried away by the internally flowing coolant, while the rest is transferred to the external heat sink fins. The heat sink fins significantly increase the contact surface area between the heat sink and the outside air, accelerating the natural convection and radiation of heat to the environment. This forms a dual cooling mode combining active liquid cooling and passive air cooling, further enhancing the overall heat dissipation capacity of the system, improving adaptability to extreme operating conditions and thermal redundancy, and ensuring that the controller maintains excellent temperature control performance under any operating condition.

[0010] As a preferred embodiment of this utility model, the lower shell body has a positioning groove corresponding to the power tube on the side facing the lower circuit board. An elastic spacer is fixedly connected in the positioning groove. The side of the elastic spacer away from the positioning groove is used to abut against the lower surface of the lower circuit board. Thermal grease is provided in the elastic spacer.

[0011] To achieve the above technical solution, during assembly, the positioning groove precisely limits the position of the power transistor; thermally conductive grease is filled between the power transistor and the lower housing body, using its high thermal conductivity to fill the microscopic gap between them; the elastic spacer ring provides buffering, absorbs vibration and tolerances, while effectively sealing the thermally conductive grease area and applying stable pressure. This design greatly reduces contact thermal resistance, constructs an efficient, stable and reliable heat conduction path from the heat source core to the liquid cooling channel, and maximizes the heat transfer efficiency from the generation point to the dissipation point, which is the key guarantee for achieving overall efficient heat dissipation.

[0012] In a preferred embodiment of this utility model, both the upper and lower flow channels are S-shaped.

[0013] To achieve the above technical solution, when the coolant flows in the S-shaped channel, its flow path is significantly extended compared to a straight path, which increases the contact time between the coolant and the wall of the S-shaped channel and the effective heat exchange area.

[0014] As a preferred embodiment of this utility model, the upper-layer components include a busbar support capacitor, an inductor, and a wiring socket.

[0015] The above technical solution achieves efficient utilization of the controller's internal space and modular division of functions. Placing these typically larger components or those used as interfaces on the upper layer not only optimizes the overall structural compactness but, more importantly, achieves physical isolation between high-heat areas and non-primary heat-generating components, helping to ensure the operational stability of the upper-layer components.

[0016] In a preferred embodiment of this utility model, a connecting hole is provided on the upper circuit board, and a copper terminal is electrically connected to the lower circuit board, with the copper terminal passing through the connecting hole.

[0017] To achieve the above technical solution, the copper terminal block, as a rigid connector, can not only reliably transmit large currents to meet the needs of power electronic devices, but also play a role in mechanical support and fixation, thereby enhancing the overall rigidity of the double-layer circuit board structure.

[0018] As a preferred embodiment of this utility model, a wear-resistant pad is fixedly connected to the side of the upper circuit board facing away from the lower circuit board, and a fixing bolt for threaded connection of the lower shell body is inserted inside the wear-resistant pad, with the head of the fixing bolt abutting against the wear-resistant pad.

[0019] To achieve the above technical solution, during assembly, the fixing bolt passes through the wear-resistant pad and is threadedly connected to the lower shell body, with its head pressed against the surface of the wear-resistant pad. The introduction of the wear-resistant pad increases the effective area of ​​the fastening force on the circuit board surface, avoiding damage or micro-cracks to the circuit board caused by stress concentration. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the external structure of this utility model; Figure 2 This is a schematic diagram illustrating the connection structure between the upper and lower shells; Figure 3 This is a schematic diagram of the exploded structure of this utility model; Figure 4 This is a schematic diagram of the lower shell structure; Figure 5 This is a schematic diagram of the lower shell structure.

[0021] Reference numerals: 1. Upper housing; 2. Upper circuit board; 3. Upper components; 4. Busbar support capacitor; 5. Inductor; 6. Wiring socket; 7. Lower circuit board; 8. Lower components; 9. Power transistor; 10. Wiring copper post; 11. Connecting hole; 12. Support tube; 13. Wear-resistant pad; 14. Lower housing body; 15. Heat sink; 16. Upper flow channel; 17. Lower flow channel; 18. Upper inlet; 19. Upper outlet; 20. Lower inlet; 21. Lower outlet; 22. Heat sink groove; 23. Heat sink strip; 24. Positioning groove; 25. Thermal grease; 26. Elastic spacer ring; 27. Lower housing; 28. Fixing bolt. Detailed Implementation

[0022] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, so that the technical solution of this utility model can be more easily understood and mastered.

[0023] A controller structure includes an upper housing 1 and a lower housing 27, which are connected to each other by bolts to form a sealed internal housing space. An upper circuit board 2 and a lower circuit board 7 are disposed within this internal housing space. The lower circuit board 7 is mounted on the lower housing 27, and the upper circuit board 2 is disposed above the lower circuit board 7 via a specific connection structure.

[0024] The upper circuit board 2 integrates a busbar support capacitor 4, an inductor 5, and a wiring socket 6 for external connections, which serve as upper-layer components 3. The lower circuit board 7 integrates circuitry as lower-layer components 8 and a power transistor 9, which serves as the main heat source. To achieve electrical connection between the two circuit boards, several copper terminals 10 are vertically connected on the lower circuit board 7, and corresponding circular through holes 11 are provided on the upper circuit board 2, allowing the copper terminals 10 to pass through the through holes 11 and connect electrically with the circuitry on the upper circuit board 2, thus forming a stable and reliable signal and power transmission path.

[0025] To ensure a constant spacing and structural stability between the upper circuit board 2 and the lower circuit board 7, several hollow support tubes 12 are fixedly connected to the upper surface of the lower circuit board 7. The upper end face of the support tube 12 abuts against the lower surface of the upper circuit board 2 to form a rigid support.

[0026] The upper circuit board 2 and the lower circuit board 7 are securely connected to the lower housing 27 via fixing bolts 28. Specifically, a copper wear-resistant pad 13 is fixedly connected to the side of the upper circuit board 2 facing away from the lower circuit board 7. The fixing bolt 28 passes through the wear-resistant pad 13, the upper circuit board 2, the hollow support tube 12, and the lower circuit board 7 sequentially from top to bottom, and its end is threaded into the threaded hole of the lower housing 27. The head diameter of the fixing bolt 28 is larger than its rod, and after tightening, it abuts against the upper surface of the wear-resistant pad 13. The application of the wear-resistant pad 13 increases the effective area of ​​the fastening force on the circuit board surface, preventing stress concentration from damaging the upper circuit board 2 and ensuring the structural reliability for long-term use.

[0027] The lower housing 27 consists of two parts: the lower housing body 14 and the heat sink 15, both made of aluminum. The lower housing body 14 is fixed to the heat sink 15 and is located between the upper housing 1 and the heat sink 15.

[0028] An S-shaped upper flow channel 16 is formed on the surface of the lower housing body 14 facing the heat sink 15. Correspondingly, an S-shaped lower flow channel 17 is formed on the surface of the heat sink 15 facing the lower housing body 14, which is perfectly adapted to the upper flow channel 16. After the lower housing body 14 and the heat sink 15 are assembled and fixed, the upper flow channel 16 and the lower flow channel 17 are precisely aligned to form a complete, S-shaped, internally sealed coolant channel.

[0029] To facilitate connection with the external cooling system, an upper inlet 18 and an upper outlet 19 are respectively provided on the side wall of the lower housing 14, communicating with both ends of the S-shaped upper flow channel 16; similarly, a lower inlet 20 and a lower outlet 21 are respectively provided on the side wall of the radiator 15, communicating with both ends of the S-shaped lower flow channel 17. The upper inlet 18 and lower inlet 20 are aligned to form a unified first interface, and the upper outlet 19 and lower outlet 21 are aligned to form a unified second interface. The first and second interfaces can be directly connected to the vehicle's cooling system piping.

[0030] A heat dissipation groove 22 is provided on the side of the heat sink 15 away from the lower shell body 14, and multiple heat dissipation strips 23 are integrally connected to the inner wall of the heat dissipation groove 22 and arranged in parallel along its length. These heat dissipation strips 23 greatly increase the contact area between the heat sink 15 and the outside air.

[0031] To ensure that the heat generated by the power transistor 9 can be efficiently transferred to the lower housing body 14, a positioning groove 24 corresponding to the outer dimensions of the power transistor 9 is provided on the side of the lower housing body 14 facing the lower circuit board 7. During assembly, the position of the lower circuit board 7 corresponding to the power transistor 9 is precisely placed in the positioning groove 24. The bottom of the positioning groove 24 is pre-filled with thermally conductive silicone grease 25 with a high thermal conductivity. At the same time, an elastic spacer 26 made of silicone rubber is fixedly connected in the positioning groove 24. After assembly, the upper end face of the elastic spacer 26 abuts against the lower surface of the lower circuit board 7, forming a tight fit. This structure ensures that a gapless, low thermal resistance heat conduction path is formed between the power transistor 9 and the lower housing body 14 through the thermally conductive silicone grease 25, while the elastic spacer 26 plays the roles of buffering, sealing, and applying continuous pressure, ensuring the stability and reliability of the heat conduction effect.

[0032] During electrical operation, the power transistor 9 located on the lower circuit board 7 is the main source of heat and generates a large amount of heat. This heat is efficiently transferred to the lower housing body 14 via thermal grease 25 through thermal conduction.

[0033] The vehicle's cooling system starts, and the water pump drives the coolant from the first interface into the S-shaped flow channel of the lower housing 27 of the controller. Because of the S-shape of the channel, the coolant's flow path inside is extended, allowing for a longer and more thorough heat exchange with the inner wall of the lower housing 14. The coolant, having absorbed a large amount of heat, rises in temperature and flows out from the second interface, returning to the vehicle's main radiator for cooling, completing one cycle. This process repeats continuously, actively and forcibly removing the heat generated by the controller's core heat source.

[0034] Meanwhile, some of the heat from the lower shell 14 continues to be conducted to the heat sink 15 below. This heat is further conducted to the heat dissipation strips 23 on the outside of the heat sink 15. Due to the presence of the heat dissipation strips 23, the contact area between the heat sink 15 and the external ambient air is greatly increased, and heat is efficiently dissipated into the air through natural convection and thermal radiation, forming an auxiliary heat dissipation channel.

[0035] Of course, the above are just typical examples of this utility model. In addition, this utility model may have many other specific implementation methods. All technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of protection claimed by this utility model.

Claims

1. A controller structure, comprising an upper housing (1), a lower housing (27), an upper circuit board (2), and a lower circuit board (7), wherein the upper circuit board (2) is connected to the lower circuit board (7), the lower circuit board (7) is connected to the lower housing (27), the upper housing (1) is connected to the lower housing (27), and the upper circuit board (2) and the lower circuit board (7) are located between the upper housing (1) and the lower housing (27), wherein the upper circuit board (2) integrates upper-level components (3), and the lower circuit board (7) integrates lower-level components (8) and a power transistor (9), characterized in that: The lower housing (27) includes a lower housing body (14) and a heat sink (15). The lower housing body (14) is fixed to the heat sink (15) and is located between the upper housing (1) and the heat sink (15). An upper flow groove (16) is provided on the side of the lower housing body (14) facing the heat sink (15). An upper inlet (18) and an upper outlet (19) are provided on the side wall of the lower housing body (14) respectively communicating with the two ends of the upper flow groove (16). The body (15) has a lower flow groove (17) adapted to the upper flow groove (16) on the side facing the lower shell body (14). The side wall of the heat sink (15) has a lower inlet (20) and a lower outlet (21) that are respectively connected to the two ends of the lower flow groove (17). A first interface is formed between the lower inlet (20) and the upper inlet (18), and a second interface is formed between the lower outlet (21) and the upper outlet (19). The first interface and the second interface are used to connect to the vehicle's cooling system.

2. The controller structure according to claim 1, characterized in that: The heat sink (15) has a heat dissipation groove (22) on the side away from the lower shell body (14). Multiple heat dissipation strips (23) are fixedly connected to the inner wall of the heat dissipation groove (22), and the multiple heat dissipation strips (23) are arranged along the length of the heat dissipation groove (22).

3. The controller structure according to claim 1, characterized in that: The lower housing body (14) has a positioning groove (24) corresponding to the power tube (9) on the side facing the lower circuit board (7). An elastic spacer (26) is fixedly connected in the positioning groove (24). The side of the elastic spacer (26) away from the positioning groove (24) is used to abut against the lower surface of the lower circuit board (7). Thermal grease (25) is provided in the elastic spacer (26).

4. The controller structure according to claim 1, characterized in that: Both the upper flow channel (16) and the lower flow channel (17) are S-shaped.

5. The controller structure according to claim 1, characterized in that: The upper-level components (3) include a busbar support capacitor (4), an inductor (5), and a wiring socket (6).

6. The controller structure according to claim 1, characterized in that: The upper circuit board (2) has a connecting hole (11), and the lower circuit board (7) is electrically connected to a copper terminal (10), which passes through the connecting hole (11).

7. The controller structure according to claim 1, characterized in that: The upper circuit board (2) is fixedly connected to a wear-resistant pad (13) on the side facing away from the lower circuit board (7). A fixing bolt (28) for threaded connection of the lower shell body (14) is inserted inside the wear-resistant pad (13). The head of the fixing bolt (28) is pressed against the wear-resistant pad (13).

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