Surface oxide layer grinding removal device for copper alloy strip

Abstract

The application discloses a surface oxide layer grinding removal device for copper alloy strip, which comprises a base, a supporting frame arranged on the base, a driving roller and a driven roller rotatably arranged on the supporting frame, and a sand belt rotatably connected to the outer sides of the driving roller and the driven roller, and further comprises a first connecting plate arranged on the supporting frame and a polishing protective cover installed on the first connecting plate, wherein the copper alloy strip soaked in acid solution is put into the polishing protective cover for polishing. In the process of removing the oxide layer of the copper alloy strip, the copper alloy strip is first soaked in the acid solution, and then taken out for polishing. The acid solution forms a loose layer on the surface of the copper alloy strip, which is peeled off when polished by the sand belt, so that the oxide layer on the surface of the copper alloy strip is effectively removed. The polishing protective cover is arranged, so that the polishing action of the copper alloy strip is completely performed in the polishing protective cover, and the acid solution on the copper alloy strip is prevented from being splashed outward during polishing.

Description

Technical Field

[0001] This application relates to the field of copper strip cleaning technology, and in particular to a device for grinding and removing the surface oxide layer of copper alloy strips. Background Technology

[0002] C7025 copper alloy, also known as copper-nickel-silicon alloy, is a high-performance precipitation-hardening copper alloy mainly composed of copper, nickel, silicon, and magnesium. As a widely used alloy material, C7025 occupies an important position in many fields due to its excellent physical and mechanical properties.

[0003] However, in the production process of 7025 copper alloy, surface oxidation has become a key bottleneck restricting its yield and surface quality. The presence of the oxide layer not only affects the appearance quality of the alloy, but also causes problems such as welding and coating adhesion in subsequent processing, seriously affecting its market competitiveness and application performance.

[0004] Currently, methods for treating surface oxidation in copper-nickel-silicon alloys mainly focus on traditional techniques such as chemical cleaning. However, chemical cleaning has certain limitations in removing the oxide layer.

[0005] Therefore, it is necessary to propose a grinding and removal device for the surface oxide layer of copper alloy strips to improve the removal effect of the oxide layer, which has become an important technical problem that needs to be solved urgently. Utility Model Content

[0006] This application provides a grinding and removal apparatus for the surface oxide layer of copper alloy strips, aiming to address the problem that existing methods for treating surface oxides in copper-nickel-silicon alloys mainly rely on traditional techniques such as chemical cleaning. However, chemical cleaning has certain limitations in its effectiveness in removing oxide layers.

[0007] To achieve the above objectives, this application proposes a grinding and removal device for the surface oxide layer of copper alloy strip, comprising a base, a support frame on the base, a drive roller and a driven roller rotatably mounted on the support frame, and an abrasive belt rotatably connected to the outer sides of the drive roller and the driven roller, and further comprising: a first connecting plate mounted on the support frame; and a grinding cover mounted on the first connecting plate, wherein the copper alloy strip soaked in acid solution is placed into the grinding cover for grinding.

[0008] In some embodiments, the system further includes: a second connecting plate connected to the first connecting plate; and a support plate mounted on the second connecting plate.

[0009] In some embodiments, it further includes: a pressure roller, a rotatable connecting pressure roller inside the grinding cover.

[0010] In some embodiments, the device further includes: an absorbent roller disposed on the first connecting plate and located below the grinding cover; and absorbent cotton sleeved on the outside of the absorbent roller.

[0011] In some embodiments, the device further includes: a tensioning plate rotatably disposed on a support frame, with a driven roller rotatably connected to one side of the tensioning plate; and an elastic element, one end of which is connected to the support frame, and the other end of which is connected to the other side of the tensioning plate.

[0012] In some embodiments, the device further includes: an active shield disposed on the base; and a driven shield disposed on the tensioning plate.

[0013] In some embodiments, the base also includes a mounting hole.

[0014] This application proposes a device for grinding and removing the surface oxide layer of copper alloy strip. The device includes a base with a support frame mounted on it. Both a drive roller and a driven roller are rotatably mounted on the support frame. A sanding belt is rotatably connected to the outer sides of the drive roller and the driven roller. The device also includes a first connecting plate mounted on the support frame and a grinding cover mounted on the first connecting plate. The copper alloy strip, after being soaked in acid, is placed in the grinding cover for grinding. During the oxide layer removal process, the copper alloy strip is first soaked in acid, then removed and ground. The acid forms a loose layer on the surface of the copper alloy strip, which is peeled off during sanding, effectively removing the oxide layer from the surface of the copper alloy strip. The grinding cover ensures that the grinding action is performed entirely within the cover, preventing acid splashing from the copper alloy strip and potentially injuring workers. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a three-dimensional structural schematic diagram of a surface oxide layer grinding and removal device for copper alloy strip in one embodiment of this application; Figure 2 This is a three-dimensional structural schematic diagram of an apparatus for grinding and removing surface oxide layers of copper alloy strip according to an embodiment of this application; Figure 3 This is a front view of a surface oxide layer grinding and removal apparatus for copper alloy strip according to an embodiment of this application; Figure 4 for Figure 3 Sectional view at point AA.

[0016] In the diagram: 1. Base; 2. Motor; 3. Sanding belt; 4. Elastic element; 5. Tensioning plate; 6. Driven guard; 7. Driven roller; 8. Driven shaft; 9. Grinding guard; 10. Support plate; 11. Second connecting plate; 12. Absorbent roller; 13. Absorbent cotton; 14. Active guard; 15. Active shaft; 16. Active roller; 17. Support frame; 18. Mounting hole; 19. First connecting plate; 20. Pressure roller. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0018] See Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, this application proposes a surface oxide layer grinding and removal device for copper alloy strip, including a base 1, a support frame 17 on the base 1, a drive roller 16 and a driven roller 7 rotatably mounted on the support frame 17, and an abrasive belt 3 rotatably connected to the outer side of the drive roller 16 and the driven roller 7. The device also includes: a first connecting plate 19, which is mounted on the support frame 17; and a grinding cover 9, which is installed on the first connecting plate 19. The copper alloy strip that has been soaked in acid is placed into the grinding cover 9 for grinding.

[0019] The base 1 is connected to a motor 2 via screws. The motor 2 has an output shaft. The drive roller 16 is keyed to a drive shaft 15. The output shaft of the motor 2 is connected to the drive shaft 15 via a coupling to transmit the power of the motor 2 to the drive roller 16. The rotation of the drive roller 16 drives the abrasive belt 3 to rotate, thereby driving the abrasive belt 3 to grind the copper alloy strip that has been soaked in acid. The driven roller 7 and the drive roller 16 work together to maintain the shape of the abrasive belt 3.

[0020] The first connecting plate 19 is fixed to the support frame 17 with screws, and the grinding cover 9 is also fixed to the first connecting plate 19 with screws. By setting the grinding cover 9, the grinding action of the copper alloy strip is completely carried out inside the grinding cover 9, so as to avoid acid splashing on the copper alloy strip during the grinding process and injuring the relevant personnel.

[0021] In this embodiment, the acid solution consists of sulfuric acid and hydrogen peroxide. The hydrogen peroxide enhances the corrosive effect of the sulfuric acid, forming a loose layer on the surface of the copper alloy strip. This loose layer is peeled off when polished with abrasive belt 3, exposing the natural copper color. Grinding with hydrogen peroxide + sulfuric acid + abrasive belt 3 is very effective in removing the surface oxide layer.

[0022] Specifically, in the process of removing the oxide layer from copper alloy strip, the copper alloy strip is first immersed in acid, then removed and polished. The acid forms a loose layer on the surface of the copper alloy strip, which is peeled off when polished by the abrasive belt 3, effectively removing the oxide layer from the surface of the copper alloy strip. The setting of the polishing shield 9 ensures that the polishing action of the copper alloy strip is carried out entirely within the polishing shield 9, preventing acid splashes from the copper alloy strip during the polishing process and avoiding injury to relevant personnel.

[0023] Among them, the support frame 17, the first connecting plate 19 and the grinding cover 9 are made of 316 stainless steel. 316 stainless steel has good corrosion resistance and mechanical strength, which helps the support frame 17, the first connecting plate 19 and the grinding cover 9 to adapt to harsh use environments.

[0024] In detail, the process for removing the oxide layer from the surface of copper alloy strip mainly includes the following steps: 1. Reagent preparation: Prepare a 12% sulfuric acid solution and add hydrogen peroxide to achieve a hydrogen peroxide concentration of 1% in the sulfuric acid solution. 2. Uniform mixing: Ensure that the hydrogen peroxide and sulfuric acid are thoroughly mixed. 3. Immersion: Immerse the copper alloy strip in the mixed solution for 10 seconds. 4. Grinding treatment: Grind the immersed copper alloy strip using a 2000-mesh abrasive belt on a grinding removal device, grinding both sides for 2 seconds each. 5. Cleaning and drying: Remove the copper alloy strip and clean it with deionized water, then dry the copper alloy strip.

[0025] See Figure 1 , Figure 3 and Figure 4 As shown, in some embodiments, the system further includes: a second connecting plate 11 connected to a first connecting plate 19, the second connecting plate 11 being fixed to the first connecting plate 19 by screws; and a support plate 10 mounted on the second connecting plate 11. The support plate 10 is fixed to the second connecting plate 11 by screws and is used to effectively support the copper alloy strip, preventing excessive deformation of the abrasive belt 3 during the grinding process, which would affect the surface grinding effect of the copper alloy strip.

[0026] See Figure 1 , Figure 3 and Figure 4As shown, in some embodiments, the system further includes a pressure roller 20, which is rotatably connected within the grinding cover 9. The pressure roller 20 has connecting shafts at both ends, which are welded to the inside of the grinding cover 9. The copper alloy strip is located in the gap between the pressure roller 20 and the abrasive belt 3. The pressure roller 20 can effectively press the copper alloy strip against the abrasive belt 3 to ensure stable grinding results.

[0027] See Figure 1 , Figure 3 and Figure 4 As shown, in some embodiments, it further includes: an absorption roller 12, which is disposed on the first connecting plate 19 and located below the grinding cover 9; the end of the absorption roller 12 is connected to the first connecting plate 19 by screws. Absorbent cotton 13 is sleeved on the outside of the absorption roller 12. The absorbent cotton 13 is used to absorb the acid remaining on the sanding belt 3, preventing the acid from continuously adhering to the sanding belt 3 and preventing the acid on the sanding belt 3 from splashing outwards during the grinding process, ensuring operational safety.

[0028] In this embodiment, the main material of the absorbent cotton 13 is meltblown polypropylene (MBPP). The absorbent cotton 13 is planar. The absorbent cotton 13 is placed on the absorbent roller 12 and rolled into a cylinder. The joint is bonded with an adhesive so that the absorbent cotton 13 is sleeved on the outside of the absorbent roller 12. The absorbent roller 12 is provided with a shoulder for positioning the absorbent cotton 13. The absorbent cotton 13 is disposed between two shoulders.

[0029] See Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the system further includes: a tensioning plate 5, rotatably mounted on the support frame 17, with a driven roller 7 rotatably connected to one side of the tensioning plate 5; a tensioning shaft rotatably mounted on the support frame 17, and a driven shaft 8 rotatably mounted on the tensioning plate 5, with one end of the tensioning plate 17 connected to the support frame 17 and the other end connected to the other side of the tensioning plate 5. The elastic element 4 is a spring, with connecting hooks at both ends. The support frame 17 has hook holes for connecting the elastic element 4, and the other side of the tensioning plate 5 also has hook holes for connecting the elastic element 4. The driven roller 7 is tensioned by the elastic force of the elastic element 4, keeping the sanding belt 3 taut and increasing the contact force between the sanding belt 3 and the driving roller 16, thereby enhancing the transmission effect.

[0030] See Figure 1 , Figure 2 , Figure 3 and Figure 4In some embodiments, the system further includes: an active shield 14 disposed on the base 1; the active shield 14 is connected to the end of the motor 2 by screws; and a driven shield 6 disposed on the tension plate 5. The driven shield 6 is connected to the tension plate 5 by screws. The active shield 14 and the driven shield 6 can effectively prevent acid splashing.

[0031] See Figure 1 and Figure 2 In some embodiments, the device further includes a mounting hole 18, which is provided on the base 1. The base 1 is fixed to the external component via the mounting hole 18 and screws to ensure the stability of the base 1, thereby ensuring the stable operation of the grinding and removing device.

[0032] The above description is only a part or preferred embodiment of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A device for grinding and removing surface oxide layer of copper alloy strip, comprising a base (1), a support frame (17) provided on the base (1), a drive roller (16) and a driven roller (7) rotatably disposed on the support frame (17), and an abrasive belt (3) rotatably connected to the outer sides of the drive roller (16) and the driven roller (7), characterized in that, Also includes: The first connecting plate (19) is disposed on the support frame (17). A polishing cover (9) is installed on the first connecting plate (19). The copper alloy strip that has been soaked in acid is placed into the polishing cover (9) for polishing.

2. The grinding and removal device for surface oxide layer of copper alloy strip according to claim 1, characterized in that, Also includes: The second connecting plate (11) is connected to the first connecting plate (19). Support plate (10), which is mounted on the second connecting plate (11).

3. The grinding and removal device for surface oxide layer of copper alloy strip according to claim 1, characterized in that, Also includes: The pressure roller (20) is rotatably connected inside the grinding cover (9).

4. The grinding and removal device for surface oxide layer of copper alloy strip according to claim 1, characterized in that, Also includes: Absorption roller (12), the absorption roller (12) is disposed on the first connecting plate (19) and located below the polishing cover (9); Absorbent cotton (13), the absorbent roller (12) is covered with absorbent cotton (13) on the outside.

5. The grinding and removal apparatus for surface oxide layer of copper alloy strip according to claim 1, characterized in that, Also includes: Tensioning plate (5), which is rotatably mounted on the support frame (17), and the driven roller (7) is rotatably connected to one side of the tensioning plate (5). An elastic element (4) is connected at one end to the support frame (17) and at the other end to the tension plate (5).

6. The grinding and removal apparatus for surface oxide layer of copper alloy strip according to claim 5, characterized in that, Also includes: An active shield (14) is disposed on the base (1); The driven guard (6) is disposed on the tensioning plate (5).

7. The grinding and removal apparatus for surface oxide layer of copper alloy strip according to claim 1, characterized in that, include: Mounting hole (18) is provided on the base (1).

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