A power consumption testing device

Abstract

The application discloses a power consumption testing device, mainly relates to the technical field of testing, and testing small plate includes main plate body, first type component, current voltage detection circuit unit, first probe and second probe, MCU data acquisition unit is connected with current voltage detection circuit unit;The first type component, the current voltage detection circuit unit, the first probe and the second probe are all arranged on the main plate body, and the first probe, the first type component, the current voltage detection circuit unit and the second probe are sequentially connected;The testing small plate further includes a fixing clamp, and the fixing clamp is connected with the main plate body;The fixing clamp is used for fixing the main plate body on the circuit board to be tested, the first probe is used for abutting with the first type component positive electrode pad of the circuit board to be tested, and the second probe is used for abutting with the first type component negative electrode pad of the circuit board to be tested, so that the power consumption test can be more rapid and convenient through the above design.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a power consumption testing device. Background Technology

[0002] In product hardware design, whether the power supply current is sufficient is a very important indicator. The power consumption of each power supply is usually estimated based on experience or by measuring similar products to optimize the new product. Common power consumption tests include testing the power consumption of the entire product and the power consumption of each power supply branch in the product.

[0003] Currently, testing the power consumption of power supply branches in products requires manually soldering wires, which is inconvenient, time-consuming, and labor-intensive. Utility Model Content

[0004] The purpose of this application is to provide a power consumption testing device that makes power consumption testing faster and more convenient.

[0005] This application discloses a power consumption testing device for testing the branch power consumption of a circuit board under test, wherein the circuit board under test includes a positive pad for a first type of component and a negative pad for a first type of component.

[0006] The power consumption testing device includes a test board and an MCU data acquisition unit. The test board includes a main board body, a first type of component, a current and voltage detection circuit unit, a first probe and a second probe. The MCU data acquisition unit is connected to the current and voltage detection circuit unit.

[0007] The first type of component, the current and voltage detection circuit unit, the first probe, and the second probe are all disposed on the main board, and the first probe, the first type of component, the current and voltage detection circuit unit, and the second probe are connected in sequence; the test board also includes a fixing clamp, which is connected to the main board.

[0008] The fixing clamp is used to fix the motherboard body on the circuit board to be tested. The first probe is used to abut against the positive pad of the first type of component on the circuit board to be tested, and the second probe is used to abut against the negative pad of the first type of component on the circuit board to be tested.

[0009] Optionally, the fixing clamp includes a left side plate, a base plate, an extension plate, a spring, and a right side plate; the left side plate is connected to one side of the base plate, the base plate is hollow inside, and an opening is provided on the side of the base plate opposite to the left side plate; the side of the base plate away from the left side plate is fitted onto the extension plate, the outer wall of the extension plate abuts against the inner wall of the base plate; the right side plate is connected to the side of the extension plate away from the left side plate, the extension plate is hollow inside, and an opening is provided on the side of the extension plate near the left side plate; the spring is at least partially located inside the extension plate, and both ends of the spring are connected to the base plate and the extension plate respectively; the main plate body is connected to the base plate.

[0010] Optionally, the motherboard body includes a connection through hole and a connection slot. The first probe passes through the connection through hole and connects to the motherboard body. The connection through hole is elongated. The second probe passes through the connection slot and connects to the motherboard body. The second probe can slide within the connection slot.

[0011] Optionally, the test board further includes a switching circuit and a second type of component. Both the switching circuit and the second type of component are disposed on the main board. The second type of component is also connected to the current and voltage detection circuit unit. One end of the switching circuit is connected to the first probe, and the other end is used to connect to one of the first type of component and the second type of component.

[0012] Optionally, the base plate is made of a magnetic material; the test board also includes a magnetic structure, which is disposed on the side of the main board near the base plate, and the magnetic structure attracts the base plate.

[0013] Optionally, the MCU data acquisition unit is mounted on the test board.

[0014] Optionally, the power consumption testing device includes multiple test boards and a control board. The MCU data acquisition unit is mounted on the control board and is connected to the current and voltage detection circuit unit on each test board.

[0015] Optionally, the first type of component includes an inductor or a ferrite bead, and the second type of component includes an inductor or a ferrite bead.

[0016] Optionally, the power consumption testing device further includes an OLED display screen, which is mounted on the control board and connected to the MCU data acquisition unit. The OLED display screen is used to display the current and voltage acquired by the MCU data acquisition unit.

[0017] Compared to existing methods that involve lifting an inductor or ferrite bead, soldering a wire, and then testing with an oscilloscope current clamp or multimeter, this application uses a test board and a fixing fixture to fix the test board onto the circuit board under test. The main body of the test board contains a first type of component, a current and voltage detection circuit unit, a first probe, and a second probe. The first probe abuts against the positive pad of the first type of component on the circuit board under test, and the second probe abuts against the negative pad of the first type of component. The current and voltage detection circuit unit detects the current and voltage flowing through the first type of component. The MCU data acquisition unit collects the current and voltage detected by the current and voltage detection circuit unit and uploads the data to a host computer to calculate the power consumption of the current branch. This eliminates the need for manual soldering, making power consumption testing faster and more convenient. Attached Figure Description

[0018] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:

[0019] Figure 1 This is a plan view of a power consumption testing device according to an embodiment of this application;

[0020] Figure 2 This is a cross-sectional schematic diagram of a power consumption testing device according to an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of a circuit board to be tested;

[0022] Figure 4 This is a schematic diagram of a power consumption testing device comprising multiple test boards, according to an embodiment of this application.

[0023] Figure 5 This is a schematic diagram of a fixing clamp according to an embodiment of this application;

[0024] Figure 6 This is a cross-sectional schematic diagram of a fixing clamp according to an embodiment of this application;

[0025] Figure 7 This is a schematic diagram of a motherboard body according to an embodiment of this application.

[0026] Among them, 10 is a power consumption testing device; 100 is a test board; 110 is a main board body; 121 is a connecting through hole; 122 is a connecting slot; 130 is a switching circuit; 141 is a first type of component; 142 is a second type of component; 150 is a current and voltage detection circuit unit; 151 is a first probe; 152 is a second probe; 160 is a magnetic structure; 170 is a fixing clamp; 171 is a left side plate; 172 is a base plate; 173 is an extension plate; 174 is a spring; 175 is a right side plate; 200 is a control board; 210 is an MCU data acquisition unit; 220 is an OLED display screen; 300 is a circuit board to be tested; 310 is a positive pad for a first type of component; 320 is a negative pad for a first type of component. Detailed Implementation

[0027] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0028] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0029] In addition, terms such as “center,” “horizontal,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” that indicate orientation or positional relationship are based on the orientation or relative positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] Furthermore, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments.

[0032] Figure 1 This is a plan view of a power consumption testing device according to an embodiment of this application. Figure 2 This is a cross-sectional schematic diagram of a power consumption testing device according to an embodiment of this application. Figure 3 This is a schematic diagram of a circuit board to be tested, combined with... Figures 1-3 As shown, this application discloses a power consumption testing device 10, which is used to test the branch power consumption of a circuit board 300 under test. The circuit board 300 under test includes a positive pad 310 for a first type of component and a negative pad 320 for a first type of component.

[0033] This application takes the solid-state drive as an example to illustrate the circuit board 300 under test. Generally, a solid-state drive includes 5-8 power supply branches, and each power supply branch is equipped with an inductor or a ferrite bead.

[0034] When it is necessary to test the power consumption of a power supply branch, the power line is usually disconnected by manually prying up the inductor or ferrite bead, and then a wire is soldered between the inductor or ferrite bead and the pad to form a loop. The test is then performed by connecting the oscilloscope current clamp to the wire or by inserting a multimeter. The current method requires manual soldering of the wire, which is quite demanding on the tester's skills, inconvenient, time-consuming and laborious. After the test is completed, the product is usually no longer usable.

[0035] This application discloses a power consumption testing device 10, which includes a test board 100 and an MCU data acquisition unit 210. The test board 100 includes a main board 110, a first type of component 141, a current and voltage detection circuit unit 150, a first probe 151 and a second probe 152. The MCU data acquisition unit 210 is connected to the current and voltage detection circuit unit 150.

[0036] The first type of component 141, the current and voltage detection circuit unit 150, the first probe 151 and the second probe 152 are all disposed on the main board 110, and the first probe 151, the first type of component 141, the current and voltage detection circuit unit 150 and the second probe 152 are connected in sequence; the test board 100 also includes a fixing clamp 170, which is connected to the main board 110.

[0037] The fixing clamp 170 is used to fix the motherboard body 110 on the circuit board to be tested 300. The first probe 151 is used to abut against the positive pad 310 of the first type of component on the circuit board to be tested 300, and the second probe 152 is used to abut against the negative pad 320 of the first type of component on the circuit board to be tested 300.

[0038] The current and voltage detection circuit unit 150 is used to detect the current and voltage flowing through the first type of component 141; the MCU data acquisition unit 210 is used to acquire the current and voltage detected by the current and voltage detection circuit unit 150, and can upload it to the host computer for calculation to obtain the power consumption of the current branch.

[0039] Among them, the first type of component 141 is the same as the first type of component positive pad 310 and first type of component negative pad 320 on the test pad that need to be soldered. Simply put, for example, if the inductor on the test circuit board 300 is removed, the inductor positive pad and inductor negative pad will be exposed on the test circuit board 300. Then, the same type of inductor can be used for the first type of component 141 on the motherboard body 110.

[0040] Compared to existing methods that involve prying up an inductor or ferrite bead, soldering a wire, and then testing with an oscilloscope current clamp or multimeter, this application uses a test board 100 and a fixing fixture 170 to fix the test board 100 onto the circuit board 300 under test. The main body 110 of the test board 100 is equipped with a first type of component 141, a current and voltage detection circuit unit 150, a first probe 151, and a second probe 152. The first probe 151 is connected to the circuit board 300 under test. The first type of component positive pad 310 abuts, and the second probe 152 abuts with the first type of component negative pad 320 of the circuit board to be tested 300. The current and voltage detection circuit unit 150 detects the current and voltage flowing through the first type of component 141. The MCU data acquisition unit 210 acquires the current and voltage detected by the current and voltage detection circuit unit 150, which can be uploaded to the host computer to calculate the power consumption of the current branch. No manual soldering is required, making power consumption testing faster and more convenient.

[0041] Moreover, compared with the test method using an oscilloscope current clamp, the power consumption test device 10 of this application does not suffer from insufficient accuracy due to background noise caused by small current. More importantly, since the test board 100 is fixed on the circuit board 300 under test by the fixing fixture 170, the entire power consumption test device 10 can be placed in a high-temperature furnace for testing, thereby enriching the test scenarios.

[0042] The MCU data acquisition unit 210 can be mounted on the test board 100. One test board 100 can perform power consumption testing on one power supply branch, thereby reducing the size of the power consumption testing device 10.

[0043] This application uses the example of the MCU data acquisition unit 210 being installed on the control board 200 for explanation and illustration:

[0044] Figure 4 This is a schematic diagram of a power consumption testing device according to an embodiment of this application, comprising multiple test boards, as shown below. Figure 4 As shown, the power consumption testing device 10 includes multiple test boards 100 and a control board 200. The MCU data acquisition unit 210 is disposed on the control board 200 and is connected to the current and voltage detection circuit unit 150 on each test board 100.

[0045] The MCU data acquisition unit 210 can acquire the current and voltage measured on multiple test boards 100, thereby enabling a power consumption test device 10 to test multiple power supply branches on the circuit board 300 to be tested, thus improving the efficiency of power consumption testing.

[0046] Furthermore, the current and voltage acquired by the MCU data acquisition unit 210 can be directly output to the host computer for power consumption calculation via connection to the host computer. To further facilitate operation, an OLED display screen 220 can also be installed. Specifically:

[0047] The power consumption testing device 10 also includes an OLED display screen 220, which is mounted on the control board 200 and connected to the MCU data acquisition unit 210. The OLED display screen 220 is used to display the current and voltage acquired by the MCU data acquisition unit 210.

[0048] In this way, the current and voltage collected by the MCU data acquisition unit 210 can be directly displayed on the OLED display screen 220. Then, the staff only needs to perform simple calculations to obtain the power consumption of the power supply branch, without the need to connect to a host computer for processing. This improves the applicability of the power consumption test device 10, and tests can be performed even in situations where there is no host computer.

[0049] Figure 5 This is a schematic diagram of a fixing clamp according to an embodiment of this application. Figure 6 This is a cross-sectional schematic diagram of a fixing clamp according to an embodiment of this application, as shown below. Figure 2 , Figures 5-6As shown, the fixing clamp 170 includes a left side plate 171, a bottom plate 172, an extension plate 173, a spring 174, and a right side plate 175; the left side plate 171 is connected to one side of the bottom plate 172, the bottom plate 172 is hollow inside, and the bottom plate 172 has an opening on the side away from the left side plate 171.

[0050] The base plate 172 is fitted onto the extension plate 173 on the side away from the left side plate 171. The outer wall of the extension plate 173 abuts against the inner wall of the base plate 172. The right side plate 175 is connected to the side of the extension plate 173 away from the left side plate 171. The extension plate 173 is hollow inside and has an opening on the side of the extension plate 173 near the left side plate 171. The spring 174 is at least partially located inside the extension plate 173, and both ends of the spring 174 are connected to the base plate 172 and the extension plate 173, respectively. The main plate body 110 is connected to the base plate 172.

[0051] The two ends of the spring 174 are connected to the base plate 172 and the extension plate 173 respectively. The contraction of the spring 174 reduces the distance between the left side plate 171 and the right side plate 175, thereby clamping the side of the circuit board 300 to be tested and fixing the main board body 110 on the circuit board 300 to be tested.

[0052] Furthermore, to facilitate the positioning of the motherboard 110 on the base plate 172, this application employs a magnetic connection, specifically:

[0053] The base plate 172 is made of magnetic material; the test board 100 also includes a magnetic structure 160, which is disposed on the side of the main board 110 near the base plate 172, and the magnetic structure 160 and the base plate 172 attract each other.

[0054] For example, the base plate 172 can be made of iron, the magnetic structure 160 is a magnet, and the magnetic structure 160 surrounds the edge of the main board body 110. In this way, the main board body 110 can be flexibly set on the base plate 172, which makes it easier to align the first probe 151, the second probe 152, the positive pad 310 of the first type of component, and the negative pad 320 of the first type of component.

[0055] Figure 7 This is a schematic diagram of a motherboard body according to an embodiment of this application, as shown below. Figure 7As shown, in order to further improve the applicability of the power consumption testing device 10, a connection through hole 121 and a connection slot 122 are provided on the motherboard body 110. The first probe 151 passes through the connection through hole 121 and is connected to the motherboard body 110. The connection through hole 121 is elongated. The second probe 152 passes through the connection slot 122 and is connected to the motherboard body 110. The second probe 152 can slide within the connection slot 122.

[0056] For example, the first probe 151 can be directly fixed to the connecting through hole 121 by welding.

[0057] The distance between the first probe 151 and the second probe 152 can be adjusted by sliding the second probe 152 within the connection slot 122. This allows the device to handle products with different spacing between the positive pad 310 and the negative pad 320 of the first type of component, thereby improving the applicability of the power consumption test device 10.

[0058] Furthermore, both the first probe 151 and the second probe 152 are spring probes 174, which allows the first probe 151, the second probe 152 and the positive pad 310 and negative pad 320 of the first type of component to make flexible contact, avoiding hard compression that could damage the circuit board 300 under test or the power consumption test device 10.

[0059] The test board 100 also includes a switching circuit 130 and a second type of component 142. Both the switching circuit 130 and the second type of component 142 are disposed on the main board 110. The second type of component 142 is also connected to the current and voltage detection circuit unit 150. One end of the switching circuit 130 is connected to the first probe 151, and the other end is used to connect to one of the first type of component 141 and the second type of component 142.

[0060] For example, the switching circuit 130 can use a jumper cap. Specifically, a jumper interface is led out from the first probe 151, a jumper interface is led out from the first type component 141, and a jumper interface is led out from the second type component 142. Then, the jumper cap is used to connect either the jumper interface led out from the first probe 151 or the jumper interface led out from the first type component 141 or the jumper interface led out from the second type component 142, so as to realize the connection between the first probe 151 and the first type component 141 or the first probe 151 and the second type component 142.

[0061] For example, when testing a circuit board 300 containing a first type of component 141, the switching circuit 130 can be connected to the first probe 151 and the first type of component 141. When testing a circuit board 300 containing a second type of component 142, the switching circuit 130 can be connected to the first probe 151 and the second type of component 142. This way, it is not necessary to replace the entire power consumption testing device 10, thus reducing the testing cost.

[0062] The first type of component 141 includes an inductor or a ferrite bead, and the second type of component 142 includes an inductor or a ferrite bead.

[0063] For example, the first type of component 141 is an inductor and the second type of component 142 is a ferrite bead; or the first type of component 141 is an inductor and the second type of component 142 is also an inductor, but the two inductors have different models; or the first type of component 141 is a ferrite bead and the second type of component 142 is also a ferrite bead, but the two ferrite beads have different models.

[0064] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0065] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A power consumption testing device, characterized in that, The power consumption testing device is used to test the branch power consumption of the circuit board under test, which includes a positive pad for a first type of component and a negative pad for a first type of component. The power consumption testing device includes a test board and an MCU data acquisition unit. The test board includes a main board body, a first type of component, a current and voltage detection circuit unit, a first probe and a second probe. The MCU data acquisition unit is connected to the current and voltage detection circuit unit. The first type of component, the current and voltage detection circuit unit, the first probe, and the second probe are all disposed on the main board, and the first probe, the first type of component, the current and voltage detection circuit unit, and the second probe are connected in sequence; the test board also includes a fixing clamp, which is connected to the main board. The fixing clamp is used to fix the motherboard body on the circuit board to be tested. The first probe is used to abut against the positive pad of the first type of component on the circuit board to be tested, and the second probe is used to abut against the negative pad of the first type of component on the circuit board to be tested.

2. The power consumption testing device according to claim 1, characterized in that, The fixing clamp includes a left side plate, a base plate, an extension plate, a spring, and a right side plate; the left side plate is connected to one side of the base plate, the base plate is hollow inside, and an opening is provided on the side of the base plate opposite to the left side plate; the side of the base plate away from the left side plate is fitted onto the extension plate, the outer wall of the extension plate abuts against the inner wall of the base plate; the right side plate is connected to the side of the extension plate away from the left side plate, the extension plate is hollow inside, and an opening is provided on the side of the extension plate near the left side plate; the spring is at least partially located inside the extension plate, and both ends of the spring are connected to the base plate and the extension plate respectively; the main plate body is connected to the base plate.

3. The power consumption testing device according to claim 1, characterized in that, The motherboard body includes a connecting through hole and a connecting slot. The first probe passes through the connecting through hole and connects to the motherboard body. The connecting through hole is elongated in shape. The second probe passes through the connecting slot and connects to the motherboard body. The second probe can slide within the connecting slot.

4. The power consumption testing device according to claim 3, characterized in that, The test board also includes a switching circuit and a second type of component. Both the switching circuit and the second type of component are located on the main board. The second type of component is also connected to the current and voltage detection circuit unit. One end of the switching circuit is connected to the first probe, and the other end is used to connect to one of the first type of component and the second type of component.

5. The power consumption testing device according to claim 2, characterized in that, The base plate is made of magnetic material; the test board also includes a magnetic structure, which is disposed on the side of the main board near the base plate, and the magnetic structure attracts the base plate.

6. The power consumption testing device according to claim 1, characterized in that, The MCU data acquisition unit is mounted on the test board.

7. The power consumption testing device according to claim 1, characterized in that, The power consumption testing device includes multiple test boards and a control board. The MCU data acquisition unit is mounted on the control board and is connected to the current and voltage detection circuit unit on each test board.

8. The power consumption testing device according to claim 4, characterized in that, The first type of component includes an inductor or a ferrite bead, and the second type of component includes an inductor or a ferrite bead.

9. The power consumption testing device according to claim 7, characterized in that, The power consumption testing device also includes an OLED display screen, which is mounted on the control board and connected to the MCU data acquisition unit. The OLED display screen is used to display the current and voltage acquired by the MCU data acquisition unit.

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