A high current chip testing apparatus

Abstract

The utility model relates to chip testing technical field especially, and it is a kind of large current chip testing device, including heat dissipation base and hinge on the chip pedestal of heat dissipation base, probe part is provided with multiple groups of each other independent probe holder, the circumferential of probe holder is provided with insulating filling colloid, to support probe holder and make adjacent probe holder between each other insulate, chip pedestal is heat conducting metal material, and insulating filling colloid is heat conducting colloid, by being provided with multiple groups of each other independent probe holder in probe part, and utilize insulating filling colloid and fill in the periphery of probe holder, to guarantee the insulating property between probe holder simultaneously, still can guarantee the support stability to probe holder, and insulating filling colloid is heat conducting colloid, can promptly export the heat generated on probe holder in testing process to chip pedestal, then by chip pedestal, heat is exported to outside, to be able to improve the heat dissipation effect of chip pedestal in testing process, reach and reduce the testing temperature at probe holder.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a high-current chip testing device. Background Technology

[0002] High-current chips (such as power semiconductor chips and power management chips) are widely used in new energy, industrial control, automotive electronics and other fields. Testing high-current chips with special pins requires testing the signals of each pin and effectively dissipating heat. This requires that the heat generated by the pin sockets during the test be dissipated in a timely manner to avoid excessive heat at the pin sockets, which could lead to errors in the test data and affect the test results. Traditional pin sockets are made of metal. In order to maintain good independence of each pin socket, it is necessary to use insulating materials to separate the pin sockets. However, traditional insulating materials such as plastics and ceramics have low thermal conductivity and cannot dissipate heat in time. Therefore, there is an urgent need for a high-current chip testing device to solve the above problems. Utility Model Content

[0003] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a high-current chip testing device to solve the problem of heat dissipation during chip testing in the prior art.

[0004] To achieve the above and other related objectives, this utility model provides the following technical solution: A high-current chip testing device, comprising: A heat sink base and a chip base hinged to the heat sink base; The chip base is provided with a probe section, and the probe section is provided with multiple sets of independent probe seats. The probe seats are provided with insulating filler colloid around their circumference to support the probe seats and insulate adjacent probe seats from each other. The chip base is made of thermally conductive metal, and the insulating filler colloid is made of thermally conductive colloid. A chip seat for supporting the chip is provided on the upper side of the probe section.

[0005] The above technical solution utilizes a chip base to support the chip, and the heat dissipation base can dissipate the heat generated during chip testing in a timely manner, reducing the testing temperature at the chip base to ensure the accuracy of the test data.

[0006] By setting multiple independent probe holders inside the probe section and filling the area around the probe holders with insulating filler, the insulation between the probe holders is ensured, as well as the stability of the probe holders. The insulating filler is a thermally conductive colloid, which can promptly conduct the heat generated on the probe holders during the test to the chip substrate, and then the chip substrate conducts the heat to the outside. This improves the heat dissipation effect of the chip substrate during the test, reduces the test temperature at the probe holders, and ensures the accuracy of the test data.

[0007] In one embodiment of this utility model, the thermal conductivity of the insulating filler colloid is 0.8-15 W / (m·K).

[0008] To achieve the above technical solution, the insulating filler colloid has good support stability after solidification, and its thermal conductivity is between that of metal and plastic, which improves the timely dissipation of heat generated in the test working surface through the heat dissipation base.

[0009] In one embodiment of the present invention, a detection groove is provided in the chip base, the probe is located at the bottom of the detection groove, the chip base is located in the detection groove, and a clamping bolt for clamping the chip base is provided on the chip base circumferentially to the detection groove.

[0010] By implementing the above technical solution, the setting of the detection groove can provide assembly space for chip testing. Combined with the clamping bolts and chip holder, it can improve the testing stability of the chip and avoid displacement deviation of the chip during the testing process.

[0011] In one embodiment of the present invention, a clamping seat is provided on the top of the clamping bolt, the clamping seat extends radially into the detection groove, and a limiting seat is provided on the chip holder, the radial dimension of the limiting seat matching the radial dimension of the clamping seat extending into the detection groove.

[0012] To achieve the above technical solution, by extending the clamping seat radially into the detection groove and cooperating with the limiting seat on the chip holder, the chip holder can be easily clamped, thereby improving the support stability of the chip holder during chip testing.

[0013] In one embodiment of the present invention, the chip holder is provided with a limiting protrusion for clamping the chip under test, and the limiting protrusion is arranged circumferentially along the probe portion.

[0014] By implementing the above technical solution, the setting of the limiting protrusion can easily clamp the chip, thereby improving the stability of the chip during the testing process.

[0015] In one embodiment of this utility model, a locking rod is provided on the chip base away from the hinge point with the heat sink base, and a locking buckle is provided on the heat sink base away from the hinge point with the chip base. When the chip base is pressed against the heat sink base, the locking buckle hooks the locking rod to prevent the chip base from springing off.

[0016] To achieve the above technical solution, during chip testing, the chip base needs to be closed onto the heat sink. At that time, a locking buckle and a locking rod are used to lock the chip base onto the heat sink, ensuring the reliability of the closure between the chip base and the heat sink throughout the testing process, thereby improving the testing stability.

[0017] In one embodiment of the present invention, a cooling fan is detachably connected to the heat sink on the side away from the chip base.

[0018] To achieve the above technical solution, the use of a cooling fan can improve the heat dissipation effect at the chip base during chip testing.

[0019] In one embodiment of this utility model, the chip base is made of aluminum alloy.

[0020] The above technical solution can meet the heat dissipation requirements of the chip base and has good support stability.

[0021] As described above, the high-current chip testing device of this utility model has the following beneficial effects: by setting multiple sets of independent probe seats in the probe section and filling the area around the probe seats with insulating filler, the insulation between the probe seats is ensured, while also ensuring the stability of the support for the probe seats. The insulating filler is a thermally conductive colloid, which can promptly conduct the heat generated on the probe seats during the test to the chip base, and then the chip base conducts the heat to the outside, thereby improving the heat dissipation effect of the chip base during the test, reducing the test temperature at the probe seats, and ensuring the accuracy of the test data. Attached Figure Description

[0022] Figure 1 The diagram shown is a structural schematic of the high-current chip testing device disclosed in this embodiment of the present invention.

[0023] Figure 2 The diagram shown is a schematic diagram of the chip base structure of the high-current chip testing device disclosed in this embodiment of the present invention.

[0024] Figure 3 The diagram shown is a schematic diagram of the chip socket structure of the high-current chip testing device disclosed in this embodiment of the present invention.

[0025] Figure 4The diagram shown is a schematic diagram of the insulating filler colloid structure of the high-current chip testing device disclosed in this embodiment of the present invention.

[0026] Figure 5 The diagram shown is a cross-sectional view of the chip base structure of the high-current chip testing device disclosed in this embodiment of the present invention.

[0027] Figure 6 The diagram shown is a schematic diagram of the probe holder structure of the high-current chip testing device disclosed in this embodiment of the present invention.

[0028] Explanation of the technical feature labels in the attached drawings: 1. Heat sink base; 2. Chip base; 3. Probe section; 4. Probe holder; 5. Insulating filler colloid; 6. Chip holder; 7. Detection groove; 8. Clamping bolt; 9. Clamping seat; 10. Limiting seat; 11. Limiting protrusion; 12. Locking rod; 13. Locking buckle; 14. Cooling fan. Detailed Implementation

[0029] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0030] Please see Figures 1 to 6 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0031] Please see Figures 1 to 6 This utility model provides a high-current chip testing device, including a heat sink 1 and a chip base 2 hinged to the heat sink 1. A probe part 3 is provided in the chip base 2, and multiple sets of independent probe seats 4 are provided in the probe part 3. An insulating filling colloid 5 is provided around the probe seats 4 to support the probe seats 4 and to insulate adjacent probe seats 4 from each other. The chip base 2 is made of thermally conductive metal, and the insulating filling colloid 5 is a thermally conductive colloid. A chip seat 6 for supporting the chip is provided on the upper side of the probe part 3.

[0032] By using the chip base 2 to support the chip, the heat dissipation base 1 can dissipate the heat generated during chip testing in a timely manner, thereby reducing the testing temperature at the chip base 2 and ensuring the accuracy of the test data.

[0033] By setting multiple independent probe holders 4 inside the probe section 3 and filling the area around the probe holders 4 with insulating filler 5, the insulation between the probe holders 4 is ensured, as well as the support stability of the probe holders 4. The insulating filler 5 is a thermally conductive colloid, which can promptly conduct the heat generated on the probe holders 4 during the test to the chip base 2, and then conduct the heat to the outside. This improves the heat dissipation effect of the chip base 2 during the test, reduces the test temperature at the probe holders 4, and ensures the accuracy of the test data.

[0034] The thermal conductivity of insulating filler colloid 5 is 0.8-15 W / (m·K). Insulating filler colloid 5 has good support stability after solidification, and its thermal conductivity is between that of metal and plastic, which improves the timely dissipation of heat generated in the test working surface through the heat dissipation base.

[0035] The chip base 2 is provided with a detection groove 7, the probe part 3 is located at the bottom of the detection groove 7, and the chip holder 6 is located in the detection groove 7. The chip base 2 around the detection groove 7 is provided with a clamping bolt 8 for clamping the chip holder 6. The setting of the detection groove 7 can provide assembly space for chip testing. The clamping bolt 8 and the chip holder 6 together can improve the testing stability of the chip and avoid displacement deviation of the chip during the testing process.

[0036] A clamping seat 9 is provided on the top of the clamping bolt 8. The clamping seat 9 extends radially into the detection groove 7. A limiting seat 10 is provided on the chip holder 6. The radial dimension of the limiting seat 10 matches the radial dimension of the clamping seat 9 extending into the detection groove 7. By extending the clamping seat 9 radially into the detection groove 7 and cooperating with the limiting seat 10 on the chip holder 6, the clamping process of the chip holder 6 can be facilitated, and the support stability of the chip holder 6 during chip testing can be improved.

[0037] The chip holder 6 is provided with a limiting protrusion 11 for clamping the chip under test. The limiting protrusion 11 is arranged around the probe part 3. The setting of the limiting protrusion 11 can easily clamp the chip, thereby improving the stability of the chip during the test.

[0038] A locking rod 12 is provided on the chip base 2 away from the hinge point with the heat sink 1. A locking buckle 13 is provided on the heat sink 1 away from the hinge point with the chip base 2. When the chip base 2 is pressed against the heat sink 1, the locking buckle 13 hooks the locking rod 12 to prevent the chip base 2 from popping open. When the chip is being tested, the chip base 2 needs to be closed onto the heat sink 1. At that time, the locking buckle 13 and the locking rod 12 are used to lock the chip base 2 onto the heat sink 1, ensuring the reliability of the closure between the chip base 2 and the heat sink 1 during the entire test process, thereby improving the test stability.

[0039] A cooling fan 14 is detachably connected to the side of the heat sink 1 away from the chip base 2. The cooling fan 14 can improve the heat dissipation effect at the chip base 2 during chip testing.

[0040] The chip base 2 is made of aluminum alloy, which can meet the heat dissipation requirements of the chip base 2 and has good support stability.

[0041] This invention features multiple independent probe holders within the probe section, surrounded by an insulating filler. This ensures insulation between the probe holders while maintaining stability. The insulating filler is thermally conductive, effectively transferring heat generated on the probe holders during testing to the chip substrate, which then dissipates the heat to the outside. This improves heat dissipation on the chip substrate during testing, reducing the testing temperature at the probe holders and ensuring accurate test data.

[0042] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A high-current chip testing device, characterized in that, include: A heat sink base and a chip base hinged to the heat sink base; The chip base is provided with a probe section, and the probe section is provided with multiple sets of independent probe seats. The probe seats are provided with insulating filler colloid around their circumference to support the probe seats and insulate adjacent probe seats from each other. The chip base is made of thermally conductive metal, and the insulating filler colloid is made of thermally conductive colloid. A chip seat for supporting the chip is provided on the upper side of the probe section.

2. The high-current chip testing device according to claim 1, characterized in that, The thermal conductivity of the insulating filler colloid is 0.8-15 W / (m·K).

3. The high-current chip testing device according to claim 1, characterized in that, The chip base is provided with a detection groove, the probe is located at the bottom of the detection groove, the chip base is located in the detection groove, and the chip base is provided with clamping bolts for clamping the chip base on the circumference of the detection groove.

4. The high-current chip testing device according to claim 1, characterized in that, A clamping seat is provided on the top of the clamping bolt, the clamping seat extends radially into the detection groove, and a limiting seat is provided on the chip holder, the radial dimension of the limiting seat matching the radial dimension of the clamping seat extending into the detection groove.

5. The high-current chip testing device according to claim 1, characterized in that, The chip holder is provided with a limiting protrusion for clamping the chip under test, and the limiting protrusion is arranged circumferentially along the probe portion.

6. The high-current chip testing device according to claim 1, characterized in that, A locking rod is provided on the chip base away from the hinge point with the heat sink, and a locking buckle is provided on the heat sink away from the hinge point with the chip base. When the chip base is pressed against the heat sink, the locking buckle hooks the locking rod to prevent the chip base from popping open.

7. The high-current chip testing device according to claim 1, characterized in that, A cooling fan is detachably connected to the heat sink base on the side away from the chip base.

8. The high-current chip testing device according to claim 1, characterized in that, The chip base is made of aluminum alloy.

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