Connection module and electronic device
By setting a wear-resistant electroplating layer on the surface of the conductive spring and conductive slip ring, the problem of unstable conductive contact in rotary motion electronic equipment is solved, and the service life of the connection module is extended.
Patent Information
- Application Number
- CN202521998210.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-17
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-17
AI Technical Summary
In rotating electronic devices, friction and wear between the conductive spring and the conductive ring track can lead to poor conductivity and affect the service life of the connection module.
The system employs a sliding contact structure between a conductive spring and a conductive slip ring, and applies an electroplated layer with excellent wear resistance and conductivity to the surfaces of both the conductive spring and the conductive slip ring to ensure good conductivity during rotation.
It extends the service life of the connection module, reduces the wear of conductive springs and conductive slip rings, and improves contact stability and conductivity.
Smart Images
Figure CN224683600U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic equipment technology, specifically to a connection module and an electronic device. Background Technology
[0002] Connection modules are widely used in electronic devices with rotational motion. They typically use conductive springs and conductive circular tracks to slide and connect the rotating and stationary parts of the electronic device, and can keep the rotating and stationary parts connected while the rotating parts are rotating.
[0003] During the rotation of the rotating component, the conductive spring and the conductive ring track rub against each other repeatedly. The conductive spring and the conductive ring track are prone to wear, which affects the conductivity and the service life of the connection module. Utility Model Content
[0004] An embodiment of the first aspect of this application provides a connection module, including a fixed circuit board, a rotating circuit board, and a conductive spring; the rotating circuit board and the fixed circuit board are arranged opposite to each other with a gap; the conductive spring is connected to one of the fixed circuit board and the rotating circuit board, and the other of the fixed circuit board and the rotating circuit board is provided with a conductive slip ring, and the conductive spring is slidably in contact with the conductive slip ring; the conductive spring has a first electroplated layer on the outermost side, and the conductive slip ring has a second electroplated layer on the outermost side.
[0005] The connection module provided in the embodiments of this application has at least the following beneficial effects: By connecting a conductive spring to one of a fixed circuit board and a rotating circuit board, and providing a conductive slip ring on the other of the fixed and rotating circuit boards, the conductive spring can slidably contact the conductive slip ring. Thus, when the rotating circuit board rotates, the conductive spring and the conductive slip ring can slide into contact, thereby conducting electricity between the rotating circuit board and the fixed circuit board. By providing a first electroplating layer on the surface of the conductive spring and a second electroplating layer on the surface of the conductive slip ring, the conductive spring and the conductive slip ring can slide into contact through the first and second electroplating layers. The electroplating layers have better wear resistance and conductivity, ensuring the conductivity between the conductive spring and the conductive slip ring while reducing wear on the conductive spring and / or the conductive slip ring, thus extending the service life of the connection module.
[0006] An embodiment of the second aspect of this application provides an electronic device including the connection module described in the above embodiments. Attached Figure Description
[0007] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A schematic diagram of the retractable data cable provided in an embodiment of this utility model is shown; Figure 2This diagram shows a cross-sectional view of the connection module provided in an embodiment of the present invention. Figure 3 This diagram illustrates the structure of the fixed circuit board and conductive spring provided in an embodiment of the present invention. Figure 4 This diagram shows a partial cross-sectional view of the conductive spring sheet provided in an embodiment of the present invention; Figure 5 A partial cross-sectional view of the fixed circuit board provided in an embodiment of the present invention is shown.
[0008] Figure label: Retractable data cable 100; connecting module 110; fixed circuit board 111; rotating circuit board 113; conductive spring 115; first electroplating layer 1151; spring body 1153; conductive slip ring 117; second electroplating layer 1171; slip ring body 1173; housing 130; winding mechanism 150; wire 170; wire body 171; first connector 173. Detailed Implementation
[0009] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0010] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0011] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0012] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0013] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0014] Please see Figure 1 This application provides an electronic device, which includes a connection module 110. The connection module 110 can be used to electrically connect a rotating component and a fixed component in the electronic device to ensure that the rotating component and the fixed component remain conductive when rotating.
[0015] The electronic device can be a rotatable camera, a rotatable radar, a rotatable lamp, a retractable data cable 100, or other electronic devices with rotational motion.
[0016] For ease of description, the following explanation will use the retractable data cable 100 as an example.
[0017] Please see Figures 1 to 2 In some embodiments, the electronic device includes a housing 130, a winding mechanism 150, a wire 170, a connection module 110, and functional components.
[0018] The cable 170 includes a cable body 171 and a first connector 173. The winding mechanism 150 is located inside the housing 130. The cable body 171 is wound on the winding mechanism 150, and one end of the cable body 171 extends outward from the housing 130 and is connected to the first connector 173. The winding mechanism 150 is used to wind up or unwind the cable body 171, so that the winding mechanism 150 can accommodate a longer cable body 171, and the user does not need to organize the cable body 171, making it more convenient for the user.
[0019] As an example, the winding mechanism 150 may include a winding spool rotatably connected to the housing 130. A cable 171 may be partially wound onto the winding spool and partially extend outside the housing 130. A first connector 173 may be connected to the end of the cable 171 extending outside the housing 130.
[0020] The first connector 173 can be a Type-C connector, a Micro connector, a USB connector, or other types of connectors.
[0021] The winding mechanism 150 can be an automatic winding mechanism 150, that is, the user can manually pull the first connector 173 or the cable 171 to release the cable 171 from the winding mechanism 150, and when the user releases the first connector 173, the winding mechanism 150 can automatically wind up the cable 171 without the user having to manually rotate the winding mechanism 150. The specific structure of the winding mechanism 150 and the principle of automatic winding can be referred to the existing technology, and will not be described in detail here.
[0022] The cable 171 and the functional device can be electrically connected via the connecting module 110. The functional device can be one of a wireless charging coil, a power plug, or a second connector. When the functional device is a wireless charging coil, the first connector 173 can be connected to an external power source to power the wireless charging coil through the cable 171 and the connecting module 110, thus enabling the electronic device to perform wireless charging. When the functional device is a power plug, the electronic device can be used directly as a charging plug without the need for an external charging head. When the functional device is a second connector, the electronic device can be used simply as a retractable data cable.
[0023] The second connector can be a Type-C connector, Micro connector, USB connector, or other type of connector, or the second connector can also be an interface that allows external connectors (such as Type-C connectors, Micro connectors, or USB connectors) to be inserted.
[0024] Understandably, the winding mechanism 150 can be the rotating component in the above embodiments, and the functional device can be the fixing component in the above embodiments.
[0025] In some embodiments, the cable 170 includes two first connectors 173. The two ends of the cable 171 extend outward from the housing 130 and are respectively connected to a first connector 173. The two first connectors 173 can transmit power and / or data through the cable 171, which helps the electronic device to realize wired charging and / or wired data transmission functions through the two first connectors 173.
[0026] It should be noted that the two first connectors 173 can be of the same or different types.
[0027] As an example, one of the two first connectors 173 can be a Type-C connector and the other can be a USB connector.
[0028] As another example, both first connectors 173 can use Type-C connectors.
[0029] Understandably, when the functional component is the second connector, the two first connectors 173 and the second connector are connected in pairs. The three connectors can be of three different types to meet different user needs. Of course, the three connectors can also be of the same type, or two of the connectors can be of the same type.
[0030] In some embodiments, when the functional device is a power plug, the power plug can be pivotally connected to the housing 130, thereby facilitating the storage of the power plug.
[0031] As an example, the outer wall of the housing 130 may be provided with a storage slot for storing a power plug. The power plug can rotate relative to the housing 130 to switch between a use state and a storage state. In the storage state, the power plug can be stored in the storage slot. In the use state, the power plug can extend out of the storage slot for easy connection to an external power source.
[0032] Please see Figures 1 to 3 In some embodiments, the connection module 110 includes a fixed circuit board 111, a rotating circuit board 113, and a conductive spring 115.
[0033] The rotating circuit board 113 and the fixed circuit board 111 are arranged opposite each other at a distance. The conductive spring 115 is connected to one of the fixed circuit board 111 and the rotating circuit board 113. The other of the fixed circuit board 111 and the rotating circuit board 113 is provided with a conductive slip ring 117. The conductive spring 115 can slide in contact with the conductive slip ring 117, so that when the rotating circuit board 113 rotates, the conductive spring 115 and the conductive slip ring 117 can slide in contact to conduct electricity between the rotating circuit board 113 and the fixed circuit board 111.
[0034] As an example, the conductive slip ring 117 can be in the form of a ring.
[0035] It should be noted that circuits can be arranged on both the rotating circuit board 113 and the fixed circuit board 111 according to the actual situation, and this application does not impose any restrictions.
[0036] The conductive spring 115 has a first electroplated layer 1151 located on the outermost side (e.g. Figure 4 As shown), the conductive slip ring 117 has a second electroplated layer 1171 located on the outermost side (as shown). Figure 5 As shown, the conductive spring 115 and the conductive slip ring 117 can slide in contact through the first electroplating layer 1151 and the second electroplating layer 1171. The electroplating layers (i.e., the first electroplating layer 1151 and the second electroplating layer 1171) have better wear resistance and conductivity, which ensures the conductivity between the conductive spring 115 and the conductive slip ring 117 while reducing the wear of the conductive spring 115 and / or the conductive slip ring 117, thus extending the service life of the connection module 110.
[0037] The first electroplated layer 1151 can be formed on the outermost side of the conductive spring 115 by electroplating, and the second electroplated layer 1171 can be formed on the outermost side of the conductive slip ring 117 by electroplating. Compared with the plating layer formed by chemical deposition process in related technologies, the electroplated layer used in this embodiment has higher hardness and better wear resistance.
[0038] Understandably, the conductive spring 115 may be electroplated with the first electroplating layer 1151 only at the end that slides in contact with the conductive slip ring 117 to reduce the manufacturing cost of the conductive spring 115, or the conductive spring 115 may be electroplated with the first electroplating layer 1151 throughout. When the connecting module 110 is applied to the above-mentioned electronic device with functional components, the rotating circuit board 113 is provided on the winding mechanism 150, and the rotating circuit board 113 can rotate synchronously with the winding mechanism 150 during the winding or unwinding process. The rotating circuit board 113 and the wire 171 are electrically connected. The fixed circuit board 111 is located inside the housing 130 and can be connected to the housing 130. The functional device can be electrically connected to the fixed circuit board 111, so that the first connector 173 can be connected to an external power source to supply power to the functional device through the wire 171 and the connecting module 110. Since the wire 171 is connected to the rotating circuit board 113, when the winding mechanism 150 rotates, the wire 171 and the rotating circuit board 113 rotate synchronously, thereby avoiding the circuit between the wire 171 and the functional device when the winding mechanism 150 rotates. In addition, since the conductive spring 115 and the conductive slip ring 117 are both provided with a wear-resistant electroplated layer, the service life of the electronic device can be extended.
[0039] The wire body 171 may include multiple wire cores. The rotating circuit board 113 may be provided with multiple solder points to connect each wire core respectively. Each wire core can conduct the functional device and the first connector 173 through the conductive spring 115 and the conductive slip ring 117.
[0040] Taking a wireless charging coil as an example, where: As an example, when the wire 170 includes only one first connector 173, the multiple wire cores may include at least a positive power supply wire (VBUS wire), a negative power supply wire (GND wire), and a first signal wire (CC1 wire). The fixed circuit board 111 may be provided with at least three conductive slip rings 117, which may be radially spaced and have gradually increasing diameters. The number of conductive springs 115 is at least three. The three conductive springs 115 can be electrically connected to the positive power supply wire, the negative power supply wire, and the first signal wire respectively by rotating the circuit on the circuit board 113, and each conductive spring 115 can slidably contact a conductive slip ring 117, thereby connecting the first connector 173 and the wireless charging coil. It should be noted that in this example, the multiple wire cores may also include other wire cores besides the positive power supply wire, the negative power supply wire, and the first signal wire to achieve more functions.
[0041] As another example, when the wire 170 includes two first connectors 173, in addition to the aforementioned positive power wire, negative power wire, and first signal wire, the multiple wire cores may also include a second signal wire (CC2 wire), and / or, the wire body 171 may also include a positive data transmission wire (D+ wire) and a negative data transmission wire (D- wire). Both ends of the positive power wire, negative power wire, first signal wire, second signal wire, positive data transmission wire, and negative data transmission wire can be connected between the two first connectors 173, thereby enabling wired power transmission and wired data transmission functions between the two first connectors 173, and wireless charging functionality can be achieved through a wireless charging coil.
[0042] In the two examples above, each wire core and each conductive slip ring 117 can be connected by one or more conductive springs 115. Furthermore, each wire core can be partially electrically connected to the rotating circuit board 113 between its two ends, or it can be partially disconnected between its two ends to form two segments. Both segments can be electrically connected to the rotating circuit board 113 at the disconnected position to connect the first connector 173 and the wireless charging coil.
[0043] When the connection module 110 is applied to an electronic device whose functional component is a power plug or a second connector, the wire body 171 may also include multiple wire cores. Each wire core may also be electrically connected to the rotating circuit board 113 and conduct the rotating circuit board 113 and the fixed circuit board 111 through the conductive spring 115 and the conductive slip ring 117, thereby conducting the first connector 173 and the power plug. The specific structure of the wire body 171 can refer to the prior art and will not be described in detail here.
[0044] Please see Figures 3 to 4In some embodiments, the thickness of the first electroplated layer 1151 is ≥0.07 micrometers, which ensures that the first electroplated layer 1151 has sufficient thickness to withstand long-term sliding friction, reduces the situation where the substrate material is exposed due to the rapid wear of the first electroplated layer 1151, helps the conductive spring 115 and the conductive slip ring 117 to maintain good conductivity and contact stability for a long time, and further extends the service life of the connection module 110.
[0045] As an example, the thickness of the first electroplated layer 1151 can be 0.07 micrometers, 0.08 micrometers, 1 micrometer, 2 micrometers, or other values ≥0.07 micrometers.
[0046] Please see Figure 3 and Figure 5 In some embodiments, the thickness of the second electroplated layer 1171 is ≥0.07 micrometers, which ensures that the second electroplated layer 1171 has sufficient thickness to withstand long-term sliding friction, reduces the situation where the substrate material is exposed due to the rapid wear of the second electroplated layer 1171, helps the conductive spring 115 and the conductive slip ring 117 to maintain good conductivity and contact stability for a long time, and further extends the service life of the connection module 110.
[0047] As an example, the thickness of the second electroplated layer 1171 can be 0.07 micrometers (approximately 3 micrometers), 0.09 micrometers, 1.2 micrometers, 3 micrometers, or other values ≥0.07 micrometers.
[0048] It should be noted that the thicknesses of the first electroplated layer 1151 and the second electroplated layer 1171 may be equal or unequal.
[0049] Please see Figures 3 to 4 In some embodiments, the first electroplating layer 1151 may be one of an electroplated gold layer, an electroplated rhodium-ruthenium layer, or a composite electroplating layer of nickel-tungsten and platinum. All three of them have good conductivity, wear resistance and oxidation resistance, which can meet the needs of long-term friction between the conductive spring 115 and the conductive slip ring 117, and help extend the service life of the conductive spring 115.
[0050] Please see Figure 3 and Figure 5 In some embodiments, the second electroplating layer 1171 is one of a gold plating layer, a rhodium-ruthenium plating layer, a nickel-tungsten and platinum composite electroplating layer, so that the second electroplating layer 1171 can meet the requirements of long-term friction between the conductive spring 115 and the conductive slip ring 117, which helps to extend the service life of the conductive slip ring 117.
[0051] It should be noted that the first electroplating layer 1151 and the second electroplating layer 1171 can be made of the same material or different materials.
[0052] As an example, both the first electroplating layer 1151 and the second electroplating layer 1171 can be made of gold plating, or both the first electroplating layer 1151 and the second electroplating layer 1171 can be made of rhodium-ruthenium plating, or both the first electroplating layer 1151 and the second electroplating layer 1171 can be made of composite electroplating (i.e., a composite electroplating layer of nickel-tungsten and platinum).
[0053] As another example, the first electroplating layer 1151 can be an electroplated gold layer, and the second electroplating layer 1171 can be an electroplated rhodium-ruthenium layer or a composite electroplating layer.
[0054] Please see Figures 3 to 4 In some embodiments, the conductive spring 115 may include a spring body 1153, and a first electroplating layer 1151 is disposed on the surface of the spring body 1153. The first electroplating layer 1151 may be electroplated onto the outer surface of the spring body 1153 using an electroplating process.
[0055] The conductivity of the first electroplated layer 1151 is greater than that of the spring body 1153, which reduces the material requirements for the spring body 1153. The range of materials for the spring body 1153 is wider, and the manufacturing cost of the conductive spring 115 can be reduced. In addition, when the first electroplated layer 1151 wears out, the spring body 1153 can replace the first electroplated layer 1151 to make contact with the conductive slip ring 117 and conduct electricity, which helps to extend the service life of electronic equipment.
[0056] As an example, the spring body 1153 can be made of copper or other conductive materials.
[0057] In some embodiments, the spring body 1153 can be a high-conductivity copper spring body. High-conductivity copper has good conductivity, which can improve the conductivity of the spring body 1153. In addition, high-conductivity copper also has a certain degree of elasticity, which helps to make the contact between the conductive spring 115 and the conductive slip ring 117 more stable.
[0058] In some embodiments, the spring body 1153 can be a beryllium copper spring body. Beryllium copper (i.e., beryllium bronze) has better elasticity and fatigue strength, which helps to make the contact between the conductive spring 115 and the conductive slip ring 117 more stable.
[0059] Please see Figure 3 and Figure 5 In some embodiments, the conductive slip ring 117 may include a slip ring body 1173.
[0060] The second electroplating layer 1171 can be disposed on the surface of the slip ring body 1173, and the second electroplating layer 1171 can be electroplated on the surface of the slip ring body 1173 by an electroplating process.
[0061] The conductivity of the second electroplated layer 1171 can be greater than that of the slip ring body 1173, thereby reducing the material requirements for the slip ring body 1173. The slip ring body 1173 has a wider range of material options and can reduce the manufacturing cost of the slip ring body 1173. In addition, when the second electroplated layer 1171 wears out, the slip ring body 1173 can replace the second electroplated layer 1171 to make contact with the conductive spring 115 and conduct electricity, which helps to extend the service life of electronic equipment.
[0062] As an example, the slip ring body 1173 can be made of copper or other conductive materials.
[0063] In some embodiments, the thickness of the slip ring body 1173 is ≥35 micrometers, which ensures that the slip ring body 1173 has sufficient thickness and current carrying capacity, helping to reduce the possibility of damage to the slip ring body 1173 due to excessive current or large friction. In addition, the slip ring body 1173 can also provide a stable substrate for the second electroplated layer 1171, which helps the second electroplated layer 1171 to adhere more stably to the outside of the slip ring body 1173.
[0064] As an example, the thickness of the slip ring body 1173 can be 35 micrometers (i.e., 1 ounce), 38 micrometers, 39.5 micrometers, 45 micrometers, or other values ≥35 micrometers.
[0065] In the connection module 110 and electronic device provided in this application embodiment, a conductive spring 115 is connected to one of the fixed circuit board 111 and the rotating circuit board 113, and a conductive slip ring 117 is provided on the other of the fixed circuit board 111 and the rotating circuit board 113. The conductive spring 115 can slidably contact the conductive slip ring 117, so that when the rotating circuit board 113 rotates, the conductive spring 115 and the conductive slip ring 117 can slide to contact each other to conduct electricity between the rotating circuit board 113 and the fixed circuit board 111. By providing a first electroplated layer 1151 on the surface of the conductive spring 115 and a second electroplated layer 1171 on the surface of the conductive slip ring 117, the conductive spring 115 and the conductive slip ring 117 can slide in contact through the first electroplated layer 1151 and the second electroplated layer 1171. The electroplated layers have better wear resistance and conductivity, ensuring the conductivity between the conductive spring 115 and the conductive slip ring 117 while reducing wear on the conductive spring 115 and / or the conductive slip ring 117, thus extending the service life of the connection module 110.
[0066] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.
Claims
1. A connection module, characterized in that, include: Fix the circuit board; The rotating circuit board is positioned relative to the fixed circuit board at a distance. A conductive spring is connected to one of the fixed circuit board and the rotating circuit board. The other of the fixed circuit board and the rotating circuit board is provided with a conductive slip ring. The conductive spring is slidably in contact with the conductive slip ring. The conductive spring has a first electroplated layer on the outermost side, and the conductive slip ring has a second electroplated layer on the outermost side.
2. The connection module according to claim 1, characterized in that, The thickness of the first electroplated layer and / or the second electroplated layer is ≥0.07 micrometers.
3. The connection module according to claim 1, characterized in that, The first electroplating layer is either an electroplated gold layer or an electroplated rhodium-ruthenium layer; And / or, the second electroplating layer is one of an electroplated gold layer and an electroplated rhodium-ruthenium layer.
4. The connection module according to claim 1, characterized in that, The conductive spring includes a spring body, and the first electroplating layer is disposed on the surface of the spring body; The conductivity of the first electroplated layer is greater than that of the spring sheet body.
5. The connection module according to claim 4, characterized in that, The spring body is a high-conductivity copper spring body or a beryllium copper spring body.
6. The connection module according to claim 1, characterized in that, The conductive slip ring includes a slip ring body, and the second electroplating layer is disposed on the surface of the slip ring body; The conductivity of the second electroplated layer is greater than that of the slip ring body.
7. The connection module according to claim 6, characterized in that, The thickness of the slip ring body is ≥35 micrometers.
8. An electronic device, characterized in that, Includes the connection module according to any one of claims 1 to 7.
9. The electronic device according to claim 8, characterized in that, The electronic device also includes: The housing, wherein the fixed circuit board is disposed within the housing; A winding mechanism is disposed within the housing, and the rotating circuit board is disposed within the winding mechanism; The wire includes a wire body and a first connector. The wire body is wound on the winding mechanism, and one end of the wire body extends outward from the housing and is connected to the first connector. The wire body is electrically connected to the rotating circuit board. The winding mechanism is used to wind up or unwind the wire body. A functional device is electrically connected to the fixed circuit board; the functional device is one of a wireless charging coil, a power plug, or a second connector.
10. The electronic device according to claim 9, characterized in that, The wire includes two first connectors, and both ends of the wire extend outward from the housing and are respectively connected to a first connector.