A domain controller, a domain controller deflector assembly, and a vehicle

Abstract

The application discloses a domain controller, a domain controller flow guide assembly and a vehicle. The domain controller comprises a shell, a first printed circuit assembly board and a second printed circuit assembly board, the second printed circuit assembly board comprises a second printed circuit, a flow guide strip unit and a MOS tube unit, the second printed circuit board is electrically connected with the first printed circuit board, the second printed circuit board has a first surface and a second surface opposite to each other, the flow guide strip unit and the MOS tube unit are arranged on the first surface, the second surface is in abutment with a bottom shell of the shell, the flow guide strip unit is electrically connected with the MOS tube unit, the MOS tube unit comprises a plurality of MOS tube groups, the flow guide strip unit comprises a plurality of flow guide strip groups, the plurality of flow guide strip groups and the plurality of MOS tube groups are alternately arranged along a first direction, each flow guide strip group comprises a flow guide strip, and the resistance of the flow guide strip is smaller than that of a printed conductor on the second printed circuit board. The domain controller is conducive to miniaturization and light weight setting while meeting the heat dissipation requirement.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and more particularly to a domain controller, a domain controller flow control component, and a vehicle. Background Technology

[0002] As automotive electronic and electrical architecture shifts from traditional distributed to centralized zone control, the Zone Controller (ZCU) has become the core structure of the vehicle's low-voltage power distribution system. It undertakes key functions such as cross-domain power distribution, intelligent load scheduling, and fault protection.

[0003] Domain controllers integrate multiple e-fuse (electronic fuse) power supply channels, significantly increasing power density. However, this also leads to a sharp increase in heat generated by the electronic components within the domain controller during operation. While forced air cooling can be used for heat dissipation in related technologies, this requires adding cooling fans and airflow structures both inside and outside the domain controller. This not only increases the size of the domain controller but also results in a larger number of components, hindering lightweight design. Utility Model Content

[0004] This application discloses a domain controller, a domain controller airflow assembly, and a vehicle, which can not only meet the heat dissipation requirements of the domain controller, but also meet the requirements for miniaturization and lightweighting of the domain controller.

[0005] To achieve the above objectives, in a first aspect, embodiments of this application disclose a domain controller, including:

[0006] The housing includes a bottom shell;

[0007] The first printed circuit assembly board includes a first printed circuit board;

[0008] The second printed circuit board assembly includes a second printed circuit board, a current guide bar unit, and a MOSFET unit. The second printed circuit board is electrically connected to the first printed circuit board via an electrical connector. The second printed circuit board has a first side and a second side facing away from each other. The current guide bar unit and the MOSFET unit are both disposed on the first side. At least a portion of the second side abuts against the bottom shell. The current guide bar unit and the MOSFET unit are electrically connected. The MOSFET unit includes multiple MOSFET groups. The current guide bar unit includes multiple current guide bar groups. The multiple current guide bar groups and the multiple MOSFET groups are arranged alternately along a first direction. Each current guide bar group includes at least one current guide bar. The resistance of the current guide bar is less than the resistance of the printed conductors on the second printed circuit board.

[0009] Optionally, each of the MOS transistor groups is provided with a current guide strip group on both sides along the first direction.

[0010] Optionally, each of the MOS transistor groups includes a plurality of MOS transistors arranged along a second direction, the second direction being perpendicular to the first direction and parallel to the first surface, and the plurality of MOS transistors in the same MOS transistor group being connected in parallel;

[0011] Each of the flow guide strip groups includes a plurality of flow guide strips arranged in an array along the first direction and the second direction.

[0012] Optionally, the first surface has a first region, and the MOS transistor unit and the current guide bar unit are both disposed in the first region; the second surface has a second region opposite to the first region.

[0013] The bottom shell has a boss on the side facing the second printed circuit board, and the boss abuts against the portion of the second surface located in the second region.

[0014] Optionally, a plurality of heat dissipation holes are provided in the first area, the heat dissipation holes penetrating the first surface and the second surface, and the heat dissipation holes are filled with a first heat-conducting element.

[0015] Optionally, the guide strip is made of copper.

[0016] Optionally, the bottom shell is made of metal.

[0017] Optionally, a second heat-conducting element is provided between the bottom shell and the second surface.

[0018] Optionally, the second thermal conductive element includes at least one of thermal conductive paste, thermal conductive adhesive, and thermal conductive pad.

[0019] Optionally, the second printed circuit board includes a signal layer and a plurality of circuit layers stacked along the thickness direction of the second printed circuit board, and each circuit layer is provided with a thermally conductive metal layer.

[0020] Optionally, a liquid cooling pipe is provided inside the bottom shell, and coolant flows through the liquid cooling pipe.

[0021] Secondly, embodiments of this application also disclose a domain controller routing component, comprising:

[0022] The first printed circuit assembly board includes a first printed circuit board;

[0023] The second printed circuit board assembly includes a second printed circuit board, a power connector, a current guide unit, and a MOSFET unit. The second printed circuit board is electrically connected to the first printed circuit board via the power connector. The power connector, the current guide unit, and the MOSFET unit are all disposed on the second printed circuit board. The power connector is used to electrically connect to a power source. The power connector is electrically connected to the MOSFET unit via the current guide unit. A grounding line is provided on the second printed circuit board. The MOSFET unit is electrically connected to the grounding line. The grounding line is used to electrically connect to metal parts in the vehicle.

[0024] Optionally, the domain controller routing assembly further includes a housing, the housing including a bottom shell, the bottom shell being made of metal;

[0025] The second printed circuit board is provided with a connection hole. The second printed circuit board is connected to the bottom shell by screws passing through the connection hole. A metal layer is laid around the periphery of the connection hole on the side of the second printed circuit board facing the bottom shell. The grounding line is electrically connected to the bottom shell through the metal layer. The bottom shell is used to electrically connect to the metal parts in the vehicle.

[0026] Optionally, the bottom shell is fixedly connected to a metal component in the vehicle by bolts made of metal, so that the current flowing from the grounding line can flow sequentially through the bottom shell and the bolts to the metal component in the vehicle; or

[0027] The domain controller flow guide assembly also includes a grounding harness, one end of which is electrically connected to the bottom housing, and the other end is used to electrically connect to a metal component in the vehicle.

[0028] Optionally, the second printed circuit assembly board further includes a copper resistor disposed on the second printed circuit board, and the MOS transistor unit is electrically connected to the ground line through the copper resistor.

[0029] Optionally, the power connector includes one of a screw terminal, a conductive stud, and a copper busbar.

[0030] Thirdly, embodiments of this application also disclose a vehicle, including:

[0031] The vehicle body, which has metal components;

[0032] The domain controller of any one of the first aspects, wherein the housing is connected to the vehicle body; or, the domain controller flow guide assembly of any one of the second aspects, wherein the ground line on the second printed circuit board is electrically connected to the metal component.

[0033] Compared with the prior art, the beneficial effects of this application are as follows:

[0034] Therefore, the current guide bar unit is electrically connected to the MOS transistor unit and is disposed on the first surface of the second printed circuit board. The multiple current guide bar groups of the current guide bar unit and the multiple MOS transistor groups of the MOS transistor unit are arranged alternately along the first direction. Furthermore, the resistance of the current guide bar is less than that of the printed wires on the second printed circuit board. This not only effectively reduces the heat generated during the current transfer to the MOS transistor group, but also effectively reduces the heat accumulation of the MOS transistor group. At the same time, the heat generated can be transferred away in a timely manner through the bottom shell, effectively avoiding local overheating of the second printed circuit board. That is, it can effectively avoid local overheating of the domain controller. While meeting the heat dissipation requirements of the domain controller, it can also effectively reduce the number of components of the domain controller, simplify the heat dissipation structure of the domain controller, and facilitate the miniaturization and lightweight design of the domain controller. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 An exploded view of a domain controller provided in an embodiment of this utility model;

[0037] Figure 2 A schematic diagram of the structure of a second printed circuit board provided in an embodiment of this utility model;

[0038] Figure 3 A perspective view of a second printed circuit board provided for an embodiment of this utility model;

[0039] Figure 4 A cross-sectional view of a second printed circuit board assembly and a bottom shell assembly provided for an embodiment of this utility model;

[0040] Figure 5 This invention provides a perspective view of a second printed circuit board after it has been flipped at a certain angle, according to an embodiment of the present invention.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1-Shell shell; 11-Bottom shell; 111-Boss; 12-Upper shell;

[0043] 2-First printed circuit board; 21-First printed circuit board;

[0044] 3-Second printed circuit board assembly; 31-Second printed circuit board; 311-Connecting hole; 312-Metal layer; 313-First side; 3131-First region; 314-Second side; 32-Conduction strip unit; 321-Conduction strip group; 3211-Conduction strip; 33-MOS transistor unit; 331-MOS transistor group; 3311-MOS transistor; 34-Power connector; 35-Copper resistor;

[0045] 4-Second heat-conducting component;

[0046] 5- Bolts;

[0047] 10-Domain controller. Detailed Implementation

[0048] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0049] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0050] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0051] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0052] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0053] A domain controller is a distributed control unit based on the physical location of a vehicle. It is a core component of the electronic and electrical architecture of intelligent vehicles, and its importance is increasingly prominent. Domain controllers not only serve as regional data centers and power distribution centers, but also play a crucial role in vehicle power, sensor management, and infotainment. Through efficient data processing, signal control, and power distribution, domain controllers provide strong support for the stable operation and efficient collaboration of intelligent vehicles.

[0054] Domain controllers integrate multiple power supply channels, significantly increasing power density. During operation, the heat generated by the electronic components within the domain controller increases dramatically. In related technologies, forced air cooling can be used for heat dissipation. However, such cooling setups require the addition of cooling fans, air duct structures, etc., both internally and externally to the domain controller. This not only increases the size of the domain controller but also results in a larger number of components, hindering lightweight design.

[0055] In view of this, the present invention provides a domain controller, a domain controller airflow assembly, and a vehicle, which not only meets the heat dissipation requirements of the domain controller, but also facilitates the miniaturization and lightweight design of the domain controller.

[0056] The technical solution of this application will be described in detail below with reference to specific embodiments and accompanying drawings:

[0057] This application provides a domain controller, such as... Figures 1-4 As shown, the system includes a housing 1, a first printed circuit board 2, and a second printed circuit board 3. The housing 1 includes a bottom shell 11; the first printed circuit board 2 includes a first printed circuit; the second printed circuit board 3 includes a second printed circuit, a current guide bar unit 32, and a MOSFET unit 33. The second printed circuit board 31 is electrically connected to the first printed circuit board 21 via an electrical connector. The second printed circuit board 31 has a first side 313 and a second side 314 facing away from each other. The current guide bar unit 32 and the MOSFET unit 33 are both disposed on the first side 313. At least a portion of the second side 314 abuts against the bottom shell 11. The current guide bar unit 32 is electrically connected to the MOSFET unit 33. The MOSFET unit 33 includes multiple MOSFET groups 331, and the current guide bar unit 32 includes multiple current guide bar groups 321. The multiple current guide bar groups 321 and the multiple MOSFET groups 331 are aligned along a first direction (e.g., ...). Figure 2The guide strips (in the direction shown in x) are arranged alternately, and each guide strip group 321 includes at least one guide strip 3211. The resistance of the guide strip 3211 is less than the resistance of the printed wires on the second printed circuit board 31.

[0058] In this embodiment, by making the resistance of the current guide strip 3211 less than that of the printed wires on the second printed circuit board 31, the resistance of the current guide strip 3211 is reduced, thereby reducing the Joule heat and voltage drop generated by the current guide strip 3211 when current flows through it. This reduces the probability of the current guide strip unit 32 overheating when current flows from the current guide strip 3211 to the MOS transistor 3311, thus reducing the heat generated by the second printed circuit board 3, which is beneficial for meeting the heat dissipation requirements of the domain controller 10 and reducing the voltage loss of the domain controller 10 after power-on. In addition, the current guide strip 3211 can be more securely soldered to the second printed circuit board 31, improving the connection reliability of the current guide strip 3211 and effectively avoiding the situation of local overheating caused by loose connection points of the current guide strip 3211.

[0059] Both the current guide bar unit 32 and the MOS transistor unit 33 are disposed on the first surface 313 of the second printed circuit board 31. The current guide bar unit 32 and the MOS transistor unit 33 are electrically connected. The MOS transistor unit 33 includes multiple MOS transistor groups 331, and the current guide bar unit 32 includes multiple current guide bar groups 321. The multiple current guide bar groups 321 and the multiple MOS transistor groups 331 are arranged alternately along the first direction. On the one hand, this facilitates the electrical connection between the current guide bar groups 321 and the MOS transistor groups 331, reducing the manufacturing difficulty of the second printed circuit board 3. On the other hand, it also allows the MOS transistor groups 331 to be more dispersed on the second printed circuit board 31, effectively avoiding the situation of local overheating of the second printed circuit board 3 due to the concentration of MOS transistor groups 331. This is beneficial to the heat dissipation setting of the second printed circuit board 3, thereby helping to meet the heat dissipation requirements of the domain controller 10.

[0060] By having at least a portion of the second surface 314 of the second printed circuit board 31 abut against the bottom case 11, the heat generated by the MOSFET group 331 and the current guide group 321 can be transferred to the second printed circuit board 31 first, and then transferred to the bottom case 11 through the second printed circuit board 31. The heat is then dissipated to the air or other structures through the bottom case 11, further preventing local overheating of the second printed circuit assembly board 3, thus better meeting the heat dissipation requirements of the domain controller 10.

[0061] Therefore, the current guide bar unit 32 is electrically connected to the MOS transistor unit 33 and is disposed on the first surface 313 of the second printed circuit board 31. The multiple current guide bar groups 321 of the current guide bar unit 32 and the multiple MOS transistor groups 331 of the MOS transistor unit 33 are alternately arranged along the first direction. Furthermore, the resistance of the current guide bar 3211 is less than that of the printed wires on the second printed circuit board 31. This not only effectively reduces the heat generated during the current transfer to the MOS transistor group 331, but also effectively reduces the heat accumulation in the MOS transistor group 331. At the same time, the heat generated can be transferred out more promptly through the bottom shell 11, effectively avoiding local overheating of the second printed circuit assembly board 3. That is, it can effectively avoid local overheating of the domain controller 10. Compared with the method of cooling the second printed circuit assembly board 3 by forced air cooling, this method can meet the heat dissipation requirements of the domain controller 10 while reducing the number of components of the domain controller 10, simplifying the heat dissipation structure of the domain controller 10, and facilitating the miniaturization and lightweight design of the domain controller 10.

[0062] The housing 1 also includes an upper shell 12, which is detachably connected to the bottom shell 11. This connection can be achieved through screws, snap-fitting, or adhesive bonding. Furthermore, the first printed circuit board 21 can be easily and quickly connected to the upper shell 12 via screws.

[0063] The second printed circuit board 31 is electrically connected to the first printed circuit board 21 via an electrical connector. The electrical connection between the second printed circuit board 31 and the first printed circuit board 21 can be achieved through at least one of the following: a connecting terminal, a wire, a flexible circuit board, etc., and is not limited here.

[0064] In addition, at least a portion of the second surface 314 of the second printed circuit board 31 abuts against the bottom shell 11. This can be either the area of ​​the second printed circuit board 31 in which the MOS transistor unit 33 and the current guide bar unit 32 are disposed abut against the bottom shell 11, or the entire second surface 314 of the second printed circuit board 31 abuts against the bottom shell 11. No limitation is made here.

[0065] The aforementioned flow guide strip 3211 can be made of copper, which gives the flow guide strip 3211 good conductivity and low resistance, effectively reducing the Joule heat generated by the flow guide strip 3211.

[0066] In addition, the material of the guide strip 3211 can also be at least one of aluminum, gold, etc., and there is no limitation here.

[0067] Optionally, the cross-sectional area of ​​the current guide strip 3211 can be much larger than the cross-sectional area of ​​the printed circuit on the second printed circuit board 31, so that the current guide strip 3211 can conduct a larger current.

[0068] The aforementioned multiple current guide strip groups 321 and multiple MOSFET groups 331 are arranged alternately along the first direction. This can be achieved by having a MOSFET group 331 on each side of each current guide strip group 321 along the first direction; or it can be, as... Figure 2 and Figure 3 As shown, each MOS transistor group 331 is provided with a current guide group 321 on both sides along the first direction. This allows the current guide group 321 and the MOS transistor group 331 to be disposed relatively dispersed on the first surface 313, making it less likely for local overheating to occur at the location where the current guide group 321 is disposed, and further avoiding local overheating of the second printed circuit board 31.

[0069] like Figure 2 and Figure 3 As shown, each MOSFET group 331 includes components along the second direction (e.g. Figure 3 Multiple MOS transistors 3311 arranged in the direction shown in the middle (y) have a second direction that is perpendicular to the first direction and parallel to the second surface 314. Multiple MOS transistors 3311 in the same MOS transistor group 331 are connected in parallel. Each current guide bar group 321 includes multiple current guide bars 3211 arranged in an array along the first direction and the second direction.

[0070] Therefore, by connecting multiple MOSFETs 3311 in parallel within the same MOSFET group 331, the average current flowing through each MOSFET 3311 can be reduced, thereby reducing the heat generated by each MOSFET 3311 and further avoiding local overheating at the location where the MOSFET 3311 is located, which is more conducive to meeting the heat dissipation requirements of the domain controller 10.

[0071] In addition, each guide bar group 321 includes multiple guide bars 3211 arranged in an array along the first direction and the second direction, which makes it convenient to set multiple guide bars 3211.

[0072] The guide strips 3211 in each group of guide strips 321 can be arranged in one row and one column, or two rows and two columns, or two rows and three columns, etc., and there is no limitation here.

[0073] The number of MOSFETs 3311 in each MOSFET group 331 can be two, three or more, and there is no limit to this.

[0074] In addition, the MOSFET 3311 can be a low on-resistance MOSFET 3311, which can effectively reduce the heat generated by the MOSFET 3311 and avoid overheating at the location of the MOSFET 3311.

[0075] In some embodiments, such as Figure 1 and Figure 4 As shown, the first surface 313 has a first region 3131, where the MOS transistor unit 33 and the current guide bar unit 32 are both disposed. The second surface 314 has a second region opposite to the first region 3131. The bottom shell 11 has a boss 111 on the side facing the second printed circuit board 31, and the boss 111 abuts against the portion of the second surface 314 located in the second region.

[0076] Therefore, heat can be transferred from the second printed circuit board 31 to the boss 111 on the bottom shell 11, and then transferred to the air through the bottom shell 11 to dissipate heat from the domain controller 10. At the same time, it also allows for a certain gap between the area of ​​the second printed circuit board 31 without the guide bar 3211 and the MOS transistor 3311 and the bottom shell 11, so that the pins of other electronic components on the second printed circuit board 31 can extend out of the second printed circuit board 31 and be located on one side of the second surface 314, which facilitates the placement of other electronic components.

[0077] The bottom shell 11 may include a bottom shell 11 body and a boss 111 disposed on the bottom shell 11 body. The boss 111 may be integrally formed with the bottom shell 11 body, such as integral casting; or the boss 111 may be welded to the bottom shell 11 body, which is not limited here.

[0078] The bottom housing 11 can be threaded to the vehicle body via a threaded connection. When the bottom housing 11 is connected to a metal part in the vehicle body, the heat transferred to the bottom housing 11 can also be transferred to the metal part in the vehicle body, and then transferred to the air by the metal part, so as to improve the heat dissipation effect of the domain controller 10.

[0079] Optionally, a plurality of heat dissipation holes are provided in the first region 3131, the heat dissipation holes penetrate the first surface 313 and the second surface 314, and the heat dissipation holes are filled with a first heat-conducting element.

[0080] Therefore, the heat generated by the MOSFET 3311 and the current guide bar 3211 can be quickly transferred to the boss 111 through the first heat-conducting element in the heat dissipation via, avoiding the accumulation of heat in the first region 3131, thereby further avoiding local overheating of the second printed circuit board 3.

[0081] The first heat-conducting component can be at least one of the following: a heat-conducting paste column, a copper column, a copper-aluminum alloy column, an aluminum column, etc., and is not limited to any one of them.

[0082] In addition, the number of heat dissipation holes can be two, three or more, and there is no limitation here.

[0083] The bottom shell 11 is made of metal so that it has good thermal conductivity, which can quickly dissipate the heat transferred from the second printed circuit board 3 into the air, thus improving the heat dissipation effect.

[0084] In some embodiments, such as Figure 1 and Figure 4 As shown, a second heat-conducting element 4 is provided between the bottom shell 11 and the second surface 314. This allows the second printed circuit board 3 to be transferred to the bottom shell 11 more quickly, which is beneficial for heat dissipation of the second printed circuit board 3 and further avoids heat accumulation on the second printed circuit board 31, thereby further avoiding local overheating on the second printed circuit board 3.

[0085] When the bottom shell 11 is provided with a boss 111 on the side facing the second printed circuit board 31, and the boss 111 abuts against the part of the second surface 314 located in the second region, the second heat-conducting element 4 can be disposed between the second printed circuit board 31 and the boss 111 so that heat can be transferred to the boss 111 more quickly.

[0086] In addition, the second thermal conductive element 4 includes at least one of thermal conductive paste, thermal conductive adhesive and thermal conductive pad, which enables the second thermal conductive element 4 to have a better thermal conductivity and has a simple structure that is easy to implement.

[0087] In other embodiments, the second printed circuit board 31 includes a signal layer and a plurality of circuit layers stacked along the thickness direction of the second printed circuit board 31, and each circuit layer is provided with a thermally conductive metal layer.

[0088] This allows the second printed circuit board 31 to quickly transfer heat from components such as the current guide strip 3211 and MOSFET 3311 to the bottom case 11, further preventing heat accumulation in the current guide strip 3211 and MOSFET 3311. This not only further prevents local overheating of the second printed circuit board 3, but also effectively reduces the thermal aging effect of MOSFET 3311, improving the operational reliability of the domain controller 10.

[0089] The thermally conductive metal layer can be any of the following: copper layer, aluminum layer, copper-aluminum alloy layer, etc., and there is no limitation, as long as it can improve the thermal conductivity of the second printed circuit board 31.

[0090] In some embodiments, a liquid cooling pipe is provided inside the bottom shell 11, and coolant flows through the liquid cooling pipe.

[0091] Therefore, the heat transferred to the bottom case 11 can be transferred to the air and also to the coolant in the liquid cooling pipe, which improves the heat dissipation effect and allows the heat to be transferred from the second printed circuit board 31 to the bottom case 11 more quickly, thus making it easier to meet the heat dissipation requirements of the domain controller 10.

[0092] This application also discloses a domain controller routing component, such as... Figures 1-5 As shown, the system includes a first printed circuit board 2 and a second printed circuit board 3. The first printed circuit board 2 includes a first printed circuit board 21. The second printed circuit board 3 includes a second printed circuit board 31, a power connector 34, a current guide unit 32, and a MOSFET unit 33. The second printed circuit board 31 is electrically connected to the first printed circuit board 21 through the power connector. The power connector 34, the current guide unit 32, and the MOSFET unit 33 are all disposed on the second printed circuit board 31. The power connector 34 is used to electrically connect to the power supply. The power connector 34 is electrically connected to the MOSFET unit 33 through the current guide unit 32. A grounding line is provided on the second printed circuit board 31. The MOSFET unit 33 is electrically connected to the grounding line. The grounding line is used to electrically connect to metal parts in the vehicle.

[0093] Therefore, the power connector 34 can be connected to an external power source, and the current can flow from the external power source to the power connector 34, then through the current guide bar 3211 to the MOSFET 3311, then through the MOSFET 3311 to the grounding line on the second printed circuit board 31, and then through the grounding line to the metal parts in the vehicle, so as to realize the grounding of the domain controller 10, which is beneficial to the stability of signal transmission in the first printed circuit board 2 and the second printed circuit board 3. At the same time, when the first printed circuit board 2 and the second printed circuit board 3 fail, the fault current can be quickly guided to the ground, avoiding the breakdown of electronic components (such as MOSFETs) in the first printed circuit board 2 and the second printed circuit board 3.

[0094] The first printed circuit board 2 in the domain controller routing assembly can be any of the first printed circuit board 2 in the above embodiments. The second printed circuit board 3 in the domain controller routing assembly can be any of the second printed circuit board 3 in the above embodiments.

[0095] The way in which the second printed circuit board 31 is electrically connected to the first printed circuit board 21 via an electrical connector can be the same as the electrical connection between the second printed circuit board 31 and the first printed circuit board 21 in the above embodiments.

[0096] The arrangement and layout of the MOS transistor unit 33 and the current guide bar unit 32 on the second printed circuit board 31 can also be the same as in the above embodiments.

[0097] Furthermore, the grounding line used for electrical connection to metal parts in the vehicle can be implemented in various ways. In one possible implementation, such as... Figures 1-5 As shown, the domain controller flow guide assembly also includes a housing 1, which includes a bottom shell 11 made of metal. A second printed circuit board 31 is provided with a connection hole 311. The second printed circuit board 31 is connected to the bottom shell 11 by screws passing through the connection hole 311. A metal layer 312 is laid around the periphery of the connection hole 311 on the side of the second printed circuit board 31 facing the bottom shell 11. The grounding line is electrically connected to the bottom shell 11 through the metal layer 312. The bottom shell 11 is used for electrical connection with metal parts in the vehicle.

[0098] This allows the current in the grounding line to flow through the metal layer 312 surrounding the connection hole 311 on the second printed circuit board 31 to the bottom shell 11, and then through the bottom shell 11 to the metal parts in the vehicle. This eliminates the need for other grounding structures inside the housing 1, which is beneficial for miniaturization and weight reduction of the domain controller 10.

[0099] The electrical connection between the bottom shell 11 and the metal parts in the vehicle can be implemented in various ways. For example, in some embodiments, the bottom shell 11 can be fixedly connected to the metal parts in the vehicle by bolts 5. The bolts 5 are made of metal so that the current flowing from the grounding line flows through the bottom shell 11 and the bolts 5 in sequence and flows to the metal parts in the vehicle. This can effectively reduce the number of components in the grounding setup of the domain controller 10, which is conducive to the miniaturization and thinning of the domain controller 10 and reduces the space occupied by the domain controller 10.

[0100] Among them, bolt 5 can be a self-discharging grounding bolt, which makes it easy for housing 1 to be installed on conductive parts in the vehicle. At the same time, it can also make the conductivity of bolt 5 better, which is conducive to improving the grounding effect.

[0101] In other embodiments that achieve electrical connection between the base 11 and the metal parts in the vehicle, the domain controller flow guide assembly also includes a grounding harness, through which the base 11 can be electrically connected to the metal parts in the vehicle, which is convenient and easy to assemble.

[0102] In another possible implementation of the grounding line being electrically connected to a metal component in the vehicle, the domain controller current distribution assembly also includes a grounding harness, with the grounding line electrically connected to one end of the grounding harness via a terminal block, and the other end of the grounding harness being used for electrical connection to a metal component in the vehicle.

[0103] This makes the electrical connection between the grounding line and the metal parts in the vehicle relatively simple and easy to implement.

[0104] In other embodiments, the second printed circuit assembly board 3 further includes a copper resistor 35 disposed on the second printed circuit board 31, and the MOS transistor unit 33 is electrically connected to the ground line through the copper resistor 35.

[0105] This effectively reduces the resistivity in the grounding settings of the domain controller 10, which helps improve the stability of signal transmission. At the same time, the copper resistor 35 is not easily oxidized or corroded, reducing the later maintenance costs.

[0106] The power connector 34 described above may include one of a screw terminal, a conductive stud, and a copper busbar, thereby making the power connector 34 easy to implement.

[0107] When the power connection includes a conductive stud, it can be a high-current conductive stud so that the power connection 34 can carry a large current.

[0108] This application also discloses a vehicle, including a vehicle body and the domain controller 10 of any of the above embodiments, wherein the vehicle body has metal parts and the housing 1 is connected to the vehicle body.

[0109] Therefore, by using the domain controller 10 in the vehicle as any of the domain controllers 10 in the above embodiments, the heat dissipation requirements of the domain controller 10 can be met, while also facilitating the miniaturization and thinning of the domain controller 10, thus making the assembly of the domain controller 10 on the vehicle body easier.

[0110] Furthermore, since the domain controller 10 in the vehicle is any of the domain controller 10 in the above embodiments, the vehicle can produce the same or similar beneficial effects as the domain controller 10 in the above embodiments, which will not be described in detail here.

[0111] This application also discloses another vehicle, including a vehicle body and a domain controller flow guide assembly as described in any of the above embodiments, wherein the vehicle body has a metal component, and a grounding line on a second printed circuit board is electrically connected to the metal component.

[0112] Since the domain controller flow guiding component in the vehicle is any of the domain controller flow guiding components in the above embodiments, the vehicle can produce the same or similar beneficial effects as the domain controller flow guiding components in the above embodiments, which will not be described in detail here.

[0113] In addition, when the domain controller involved in the area control flow guiding component in any of the above embodiments is the domain controller 10 in any of the above embodiments, the vehicle can also produce the same or similar beneficial effects as the domain controller 10 in the above embodiments, which will not be described in detail here.

[0114] The metal parts in the vehicle body mentioned above can be any of the following: sheet metal parts, machined parts, castings, etc., without limitation. Furthermore, the material of the metal parts can be any of the following: stainless steel, copper and copper alloys, aluminum and aluminum alloys, etc., without limitation.

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A domain controller, characterized in that, include: The housing includes a bottom shell; The first printed circuit assembly board includes a first printed circuit board; The second printed circuit board assembly includes a second printed circuit board, a current guide bar unit, and a MOSFET unit. The second printed circuit board is electrically connected to the first printed circuit board via an electrical connector. The second printed circuit board has a first side and a second side facing away from each other. The current guide bar unit and the MOSFET unit are both disposed on the first side. At least a portion of the second side abuts against the bottom shell. The current guide bar unit and the MOSFET unit are electrically connected. The MOSFET unit includes multiple MOSFET groups. The current guide bar unit includes multiple current guide bar groups. The multiple current guide bar groups and the multiple MOSFET groups are arranged alternately along a first direction. Each current guide bar group includes at least one current guide bar. The resistance of the current guide bar is less than the resistance of the printed conductors on the second printed circuit board.

2. The domain controller according to claim 1, characterized in that, Each of the MOS transistor groups is provided with a current guide bar group on both sides along the first direction.

3. The domain controller according to claim 2, characterized in that, Each of the MOS transistor groups includes a plurality of MOS transistors arranged along a second direction, which is perpendicular to the first direction and parallel to the first surface, and the plurality of MOS transistors in the same MOS transistor group are connected in parallel; Each of the flow guide strip groups includes a plurality of flow guide strips arranged in an array along the first direction and the second direction.

4. The domain controller according to claim 1, characterized in that, The first surface has a first region, and the MOS transistor unit and the current guide bar unit are both disposed in the first region; the second surface has a second region opposite to the first region. The bottom shell has a boss on the side facing the second printed circuit board, and the boss abuts against the portion of the second surface located in the second region.

5. The domain controller according to claim 4, characterized in that, Multiple heat dissipation holes are provided in the first area. The heat dissipation holes penetrate the first surface and the second surface, and the heat dissipation holes are filled with a first heat-conducting element.

6. The domain controller according to any one of claims 1-5, characterized in that, The guide strip is made of copper.

7. The domain controller according to any one of claims 1-5, characterized in that, The bottom shell is made of metal.

8. The domain controller according to any one of claims 1-5, characterized in that, A second heat-conducting element is provided between the bottom shell and the second surface.

9. The domain controller according to claim 8, characterized in that, The second thermal conductive component includes at least one of thermal conductive paste, thermal conductive adhesive, and thermal conductive pad.

10. The domain controller according to any one of claims 1-5, characterized in that, The second printed circuit board includes a signal layer and a plurality of circuit layers stacked along the thickness direction of the second printed circuit board, and each circuit layer is provided with a thermally conductive metal layer.

11. The domain controller according to any one of claims 1-5, characterized in that, The bottom shell is equipped with a liquid cooling pipe, and coolant flows through the liquid cooling pipe.

12. A domain controller flow routing component, characterized in that, include: The first printed circuit assembly board includes a first printed circuit board; The second printed circuit board assembly includes a second printed circuit board, a power connector, a current guide unit, and a MOSFET unit. The second printed circuit board is electrically connected to the first printed circuit board via the power connector. The power connector, the current guide unit, and the MOSFET unit are all disposed on the second printed circuit board. The power connector is used to electrically connect to a power source. The power connector is electrically connected to the MOSFET unit via the current guide unit. A grounding line is provided on the second printed circuit board. The MOSFET unit is electrically connected to the grounding line. The grounding line is used to electrically connect to metal parts in the vehicle.

13. The domain controller routing component according to claim 12, characterized in that, The domain controller routing assembly also includes a housing, which includes a bottom shell made of metal. The second printed circuit board is provided with a connection hole. The second printed circuit board is connected to the bottom shell by screws passing through the connection hole. A metal layer is laid around the periphery of the connection hole on the side of the second printed circuit board facing the bottom shell. The grounding line is electrically connected to the bottom shell through the metal layer. The bottom shell is used to electrically connect to the metal parts in the vehicle.

14. The domain controller routing component according to claim 13, characterized in that, The bottom shell is fixedly connected to the metal parts in the vehicle by bolts made of metal, so that the current flowing from the grounding line can flow sequentially through the bottom shell and the bolts to the metal parts in the vehicle; or The domain controller flow guide assembly also includes a grounding harness, one end of which is electrically connected to the bottom housing, and the other end is used to electrically connect to a metal component in the vehicle.

15. The domain controller routing component according to any one of claims 12-14, characterized in that, The second printed circuit assembly board also includes a copper resistor disposed on the second printed circuit board, and the MOS transistor unit is electrically connected to the ground line through the copper resistor.

16. The domain controller routing component according to any one of claims 12-14, characterized in that, The power connector includes one of a screw terminal, a conductive stud, and a copper busbar.

17. A vehicle, characterized in that, include: The vehicle body has metal components; The domain controller according to any one of claims 1-11, wherein the housing is connected to the vehicle body; or, the domain controller flow guide assembly according to any one of claims 12-16, wherein the ground line on the second printed circuit board is electrically connected to the metal component.

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