High-temperature-resistant easy-to-tear double-sided adhesive tape

Abstract

The utility model discloses a kind of high-temperature-resistant easy-to-tear double-sided tapes, it is related to the technical field of double-sided tape, including double-sided tape strip, glass fiber net, silica gel pad and corrugated copper sheet, the outside of double-sided tape strip is symmetrically provided with release paper layer, one side of a group release paper layer is bonded with adhesive layer one, the other group release paper layer is bonded with adhesive layer two on one side, the outside of adhesive layer one is provided with bonding mechanism, the structural strength of adhesive layer one is increased by glass fiber net arranged on outside of bonding mechanism, avoid adhesive layer one and crack, damage due to excessive stress, the buffer mechanism is arranged below adhesive layer one, the buffer mechanism is buffered and radiated by silica gel pad and multiple corrugated copper sheets. As the structural support assembly of buffer mechanism, the corrugated structure of multiple corrugated copper sheets not only enhances the overall rigidity of mechanism, but also can share part of impact force by deformation, cooperate silica gel pad to further improve buffering effect.

Description

Technical Field

[0001] This utility model relates to the technical field of double-sided adhesive, specifically to a high-temperature resistant and easy-to-tear double-sided adhesive. Background Technology

[0002] Double-sided tape is a roll of adhesive tape made by uniformly coating an elastomer-type pressure-sensitive adhesive or a resin-type pressure-sensitive adhesive onto a paper, cloth, or plastic film substrate.

[0003] Elastomer-type pressure-sensitive adhesives contain a large number of flexible segments in their molecular chains. At high temperatures, these segments are prone to increased movement and weakened intermolecular forces. Since ordinary double-sided adhesives lack a dedicated heat dissipation structure, heat transfer encounters greater resistance. Even if the double-sided adhesive can temporarily bond the heat source and the heat dissipation medium, the high thermal resistance will prevent heat from dissipating in time, further aggravating the rise in the temperature of the heat source and shortening the lifespan of electronic components. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature resistant, easy-tear double-sided adhesive to solve the aforementioned defects caused by the prior art.

[0005] A high-temperature resistant, easy-tear double-sided adhesive includes a double-sided adhesive strip, a fiberglass mesh, a silicone pad, and corrugated copper sheets. Release paper layers are symmetrically arranged on the outer side of the double-sided adhesive strip. One set of release paper layers has an adhesive layer one bonded to one side, and another set of release paper layers has an adhesive layer two bonded to one side. An adhesive mechanism is provided on the outer side of the adhesive layer one. This adhesive mechanism uses the fiberglass mesh on the outer side to increase the structural strength of the adhesive layer one, preventing it from cracking or breaking due to excessive force. A buffer mechanism is provided below the adhesive layer one. This buffer mechanism uses the elastic buffering properties of the silicone pad and the mechanical support and thermal conductivity of multiple sets of corrugated copper sheets for buffering and heat dissipation.

[0006] Preferably, the bonding mechanism includes a release paper layer, tear pin holes, an adhesive layer, heat dissipation holes, and a fiberglass mesh. Tear pin holes are evenly spaced on the outer side of the release paper layer, an adhesive layer is provided at the bottom end of the release paper layer, heat dissipation holes are evenly spaced on the outer side of the adhesive layer, and a fiberglass mesh is provided at the bottom end of the adhesive layer.

[0007] Preferably, the buffer mechanism includes a silicone pad, a built-in groove, corrugated copper sheets, an adhesive layer two, vertical grooves, and an adhesive groove. The silicone pad is positioned directly above the adhesive layer two. The built-in groove is formed inside the silicone pad. Corrugated copper sheets are evenly spaced inside the built-in groove. A vertical groove is formed through the outer side of the silicone pad. The adhesive grooves are evenly spaced on the upper and lower sides of the silicone pad.

[0008] Preferably, the silicone pad is connected to the bottom end of the first adhesive layer through adhesive grooves evenly spaced on the outer side, and the other side of the silicone pad is also connected to the bottom end of the second adhesive layer through adhesive grooves.

[0009] Preferably, the silicone pad is connected to the outer side of multiple sets of corrugated copper sheets through an internally formed groove, wherein the width of the corrugated copper sheets is smaller than the width of the internal groove.

[0010] Preferably, one bottom end of the adhesive layer is bonded to the top end of the silicone pad via a glass fiber mesh.

[0011] Compared with the prior art, the present invention has the following advantages: 1. Multiple sets of corrugated copper sheets serve as structural support components for the buffer mechanism. Their corrugated structure not only enhances the overall rigidity of the mechanism but also distributes some of the impact force through deformation. Combined with silicone pads, this further improves the buffering effect. At the same time, the high thermal conductivity of the corrugated copper sheets can quickly conduct the heat generated by the heat source inside the equipment to the silicone pads or other heat dissipation media. The corrugated structure increases the surface area of ​​the copper sheets, strengthens the convective heat transfer with the air, and accelerates the diffusion of heat from the inside of the mechanism to the external environment.

[0012] 2. The fiberglass mesh effectively disperses the external forces on the adhesive layer and silicone pad, preventing the adhesive layer from cracking or breaking due to excessive local stress. At the same time, the mesh structure of the fiberglass mesh restricts excessive deformation of the silicone pad, ensuring the contact stability between the bonding mechanism and the adhered object, and avoiding bonding failure caused by silicone pad deformation. The equally spaced heat dissipation holes divide the adhesive layer into multiple independent areas, which reduces the thermal resistance of the adhesive layer and avoids heat accumulation caused by large-area bonding. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall three-dimensional side section structure of this utility model.

[0014] Figure 2 This is a bottom view of the adhesive layer structure in this utility model.

[0015] Figure 3 This is a schematic diagram of the buffer mechanism in this utility model.

[0016] Figure 4 This is a schematic diagram of the overall side section structure of this utility model.

[0017] Figure 5 This is a schematic diagram of the connection structure between the silicone pad and the adhesive layer in this utility model.

[0018] The components include: 1. Double-sided adhesive strip; 2. Release paper layer; 3. Tear pinhole; 4. Adhesive layer one; 5. Heat dissipation holes; 6. Fiberglass mesh; 7. Adhesive mechanism; 8. Silicone pad; 9. Built-in groove; 10. Corrugated copper sheet; 11. Adhesive layer two; 12. Buffer mechanism; 13. Vertical cutting groove; 14. Adhesive groove. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0020] like Figures 1 to 5 As shown, a high-temperature resistant, easy-tear double-sided adhesive includes a double-sided adhesive strip 1, a fiberglass mesh 6, a silicone pad 8, and corrugated copper sheets 10. Release paper layers 2 are symmetrically arranged on the outer side of the double-sided adhesive strip 1. One side of one set of release paper layers 2 is bonded with an adhesive layer 4, and another side of the release paper layers 2 is bonded with an adhesive layer 11. An adhesive mechanism 7 is provided on the outer side of the adhesive layer 4. The adhesive mechanism 7 increases the structural strength of the adhesive layer 4 through the fiberglass mesh 6 on the outer side, preventing the adhesive layer 4 from cracking or breaking due to excessive force. A buffer mechanism 12 is provided below the adhesive layer 4. The buffer mechanism 12 buffers and dissipates heat through a combination of the elastic buffering characteristics of the silicone pad 8 and the mechanical support and thermal conductivity characteristics of multiple sets of corrugated copper sheets 10.

[0021] Among them, the outer side of the release paper layer 2 is provided with tear-off pinholes 3 at equal intervals. These pinholes reduce the tear strength of the release paper, allowing users to easily tear the release paper along the pinholes, avoiding tearing difficulties caused by the release paper being too tough. This is especially suitable for scenarios that require quick bonding.

[0022] In this embodiment, the adhesive mechanism 7 includes a release paper layer 2, tear pin holes 3, an adhesive layer 4, heat dissipation holes 5, and a fiberglass mesh 6. The release paper layer 2 has tear pin holes 3 at equal intervals on its outer side. The adhesive layer 4 is provided at the bottom end of the release paper layer 2. The adhesive layer 4 has heat dissipation holes 5 at equal intervals on its outer side. The fiberglass mesh 6 is provided at the bottom end of the adhesive layer 4. The bottom end of the adhesive layer 4 is bonded to the top end of the silicone pad 8 through the fiberglass mesh 6.

[0023] Among them, the fiberglass mesh 6 is set at the bottom of the adhesive layer 4, serving as a reinforcing skeleton for the double-sided adhesive strip 1. It can effectively disperse the external forces on the adhesive layer and the silicone pad 8, preventing the adhesive layer from cracking or breaking due to excessive local stress. At the same time, the mesh structure of the fiberglass mesh 6 limits the excessive deformation of the silicone pad 8.

[0024] In this embodiment, the buffer mechanism 12 includes a silicone pad 8, a built-in groove 9, corrugated copper sheets 10, an adhesive layer 11, vertical grooves 13, and adhesive grooves 14. The silicone pad 8 is positioned directly above the adhesive layer 11. The built-in groove 9 is formed inside the silicone pad 8, and corrugated copper sheets 10 are evenly spaced inside the built-in groove 9. The vertical groove 13 is formed through the outer side of the silicone pad 8. The adhesive grooves 14 are evenly spaced on the upper and lower sides of the silicone pad 8. The silicone pad 8 is connected to the bottom end of the adhesive layer 4 through the equally spaced adhesive grooves 14 on the outer side. The other side of the silicone pad 8 is also connected to the bottom end of the adhesive layer 11 through the adhesive grooves 14. The silicone pad 8 is connected to the outer side of multiple sets of corrugated copper sheets 10 through the built-in groove 9, and the width of the corrugated copper sheets 10 is smaller than the width of the built-in groove 9.

[0025] The silicone pad 8 has an internal groove 9 for placing the corrugated copper sheet 10; a vertical groove 13 is cut through the outside to enhance the deformation capability of the silicone pad 8 and enable it to adapt to impacts from different directions; adhesive grooves 14 are equally spaced on the upper and lower sides. Through the connection with adhesive layer 1 4 and adhesive layer 2 11, the corrugated structure increases the surface area of ​​the copper sheet and enhances the convective heat transfer with the air.

[0026] In practical applications, this high-temperature resistant, easy-tear double-sided tape includes the following tasks: Step 1: The production staff first process the surface of the release paper layer 2 by making tear pinholes 3 at equal intervals. Using a pinhole mold, small pinholes are punched at equal intervals on the outside of the release paper. The pinholes reduce the tear strength of the release paper layer 2. Then, the prepared adhesive is evenly coated on one side of the release paper layer 2 through a glue coating machine to form an adhesive layer 4. The adhesive layer 4 is dried with a desiccant to remove the solvent in the adhesive layer 4 and at the same time, the adhesive is cured into a film. Step 2: Lay a fiberglass mesh 6 on the outside of the adhesive layer 4, so that the fiberglass mesh 6 covers the entire surface of the adhesive layer 4. Then apply a thin layer of adhesive to the fiberglass mesh 6 and attach the other side of the fiberglass mesh 6 to the silicone pad 8. At the same time, apply a portion of the adhesive to the inside of the adhesive groove 14 so that the fiberglass mesh 6 and the silicone pad 8 are bonded at the top. Punch a linear vertical groove 13 on the outside of the silicone pad 8 to facilitate the cutting and bonding of the double-sided adhesive strip 1 later. Step 3: Create a semi-through internal groove 9 inside the silicone pad 8. The size of the corrugated copper sheet 10 is smaller than the size of the internal groove 9. The operator embeds multiple sets of corrugated copper sheets 10 of the same size and places them into the internal groove 9, ensuring that the corrugated copper sheet 10 fits tightly with the silicone pad 8. The operator can fill the gaps inside the internal groove 9 by injecting some liquid glue to prevent the corrugated copper sheet 10 from loosening. Step 4: Then, apply the same material and thickness of adhesive layer 2 11 and adhesive layer 1 4 to the other side of the silicone pad 8 to form the bottom layer structure of the double-sided adhesive. Finally, attach release paper layer 2 to the outside of adhesive layer 2 11 to complete the overall assembly of the double-sided adhesive. After bonding, roll it with a roller press to ensure that release paper layer 2 is tightly bonded to glass fiber mesh 6, adhesive layer 1 4 and adhesive layer 2 11 without air bubbles or gaps.

[0027] Therefore, the above-disclosed embodiments are merely illustrative in all respects and are not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

Claims

1. A high-temperature resistant, easy-tear double-sided adhesive, characterized in that: The device includes a double-sided adhesive strip (1), a fiberglass mesh (6), a silicone pad (8), and a corrugated copper sheet (10). A release paper layer (2) is symmetrically arranged on the outer side of the double-sided adhesive strip (1). One side of one set of the release paper layer (2) is bonded with an adhesive layer one (4), and the other side of the release paper layer (2) is bonded with an adhesive layer two (11). An adhesive mechanism (7) is arranged on the outer side of the adhesive layer one (4). The adhesive mechanism (7) increases the structural strength of the adhesive layer one (4) through the fiberglass mesh (6) arranged on the outer side, and prevents the adhesive layer one (4) from cracking or breaking due to excessive force. A buffer mechanism (12) is arranged below the adhesive layer one (4). The buffer mechanism (12) buffers and dissipates heat through the combination of the elastic buffering characteristics of the silicone pad (8) and the mechanical support and thermal conductivity characteristics of multiple sets of corrugated copper sheets (10).

2. The high-temperature resistant, easy-tear double-sided adhesive according to claim 1, characterized in that: The bonding mechanism (7) includes a release paper layer (2), tear pin holes (3), adhesive layer one (4), heat dissipation holes (5), and glass fiber mesh (6). Tear pin holes (3) are provided at equal intervals on the outer side of the release paper layer (2). Adhesive layer one (4) is provided at the bottom end of the release paper layer (2). Heat dissipation holes (5) are provided at equal intervals on the outer side of the adhesive layer one (4). Glass fiber mesh (6) is provided at the bottom end of the adhesive layer one (4).

3. The high-temperature resistant, easy-tear double-sided adhesive according to claim 1, characterized in that: The buffer mechanism (12) includes a silicone pad (8), an internal groove (9), a corrugated copper sheet (10), an adhesive layer (11), a vertical groove (13), and an adhesive groove (14). The silicone pad (8) is located directly above the adhesive layer (11). The internal groove (9) is provided inside the silicone pad (8). Corrugated copper sheets (10) are provided at equal intervals inside the internal groove (9). The vertical groove (13) is provided through the outside of the silicone pad (8). The adhesive groove (14) is provided at equal intervals on the upper and lower sides of the silicone pad (8).

4. The high-temperature resistant, easy-tear double-sided adhesive according to claim 3, characterized in that: The silicone pad (8) is connected to the bottom end of the first adhesive layer (4) through adhesive grooves (14) arranged at equal intervals on the outside. The other side of the silicone pad (8) is also connected to the bottom end of the second adhesive layer (11) through adhesive grooves (14).

5. The high-temperature resistant, easy-tear double-sided adhesive according to claim 4, characterized in that: The silicone pad (8) is connected to the outside of multiple sets of corrugated copper sheets (10) through an internally opened groove (9), the width of which is smaller than the width of the internal groove (9).

6. The high-temperature resistant, easy-tear double-sided adhesive according to claim 4, characterized in that: The bottom end of the adhesive layer (4) is bonded to the top end of the silicone pad (8) via a glass fiber mesh (6).

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