Laser processing equipment

Abstract

This application discloses a laser processing device, including a support platform, a laser, a first optical path box, a second optical path box, a third optical path box, and a processing head assembly. The laser, the first optical path box, and the second optical path box are located on top of the support platform and propagate laser beams sequentially in a horizontal direction. The second optical path box protrudes from the support platform. The third optical path box and the processing head assembly are both located on the side of the support platform, with the third optical path box located below the second optical path box. The second optical path box propagates the laser beam vertically to the third optical path box, and the third optical path box propagates the laser beam horizontally to the processing head assembly. With this design, because the processing head assembly is located on the side of the support platform, its emitted laser beam is not obstructed by the support platform, allowing the processing head assembly to effectively process horizontally placed workpieces.

Description

Technical Field

[0001] This application relates to the field of laser technology, and in particular to a laser processing device. Background Technology

[0002] In laser cutting equipment, the laser beam propagates to the cutting head, which then cuts the workpiece. The laser and cutting head are typically positioned on top of a support table. To improve the stability of the optical path and reduce losses and interference, the laser employs a horizontal beam output design. This design ensures that the laser beam propagates horizontally only at the top of the support table. However, during laser processing, the workpiece is usually placed horizontally on the worktable, which prevents the cutting head from effectively cutting horizontally placed workpieces. Utility Model Content

[0003] In view of the shortcomings of the prior art, this application provides a laser processing device that can solve the problem that existing laser devices cannot effectively cut horizontally placed workpieces.

[0004] The following technical solution is adopted in this embodiment:

[0005] A laser processing device includes a support platform, a laser, a first optical path box, a second optical path box, a third optical path box, and a processing head assembly. The laser, the first optical path box, and the second optical path box are disposed on the top of the support platform and propagate laser beams sequentially in a horizontal direction. The second optical path box partially protrudes from the support platform. The third optical path box and the processing head assembly are both disposed on the side of the support platform, with the third optical path box located below the second optical path box. The second optical path box propagates laser beams vertically to the third optical path box, and the third optical path box propagates laser beams horizontally to the processing head assembly.

[0006] Furthermore, the laser processing equipment also includes an optical shutter assembly, which is fixed to the support platform. The first optical path box is fixed to the support platform and is spaced apart from the optical shutter assembly.

[0007] Furthermore, in the laser processing equipment, the optical shutter assembly includes a cylinder and an optical shutter baffle. The optical shutter baffle is disposed on the cylinder. The cylinder is used to drive the optical shutter baffle to extend in order to block the light propagation between the laser and the first optical path box, or to drive the optical shutter baffle to retract in order to allow the light propagation between the laser and the first optical path box.

[0008] Furthermore, in the laser processing equipment, the first optical path box includes a first housing and a first reflector, the first reflector being movably disposed in the first housing.

[0009] Furthermore, in the laser processing equipment, the first optical path box also includes a first adjustable mounting bracket, which is movably disposed on the first box body along a first direction and along a second direction, and the first reflector is disposed on the first adjustable mounting bracket.

[0010] Furthermore, in the laser processing equipment, the second optical path box includes a second box body, a second reflector, a first aperture component, a beam expander, a second aperture component, and a third reflector. The second reflector, the first aperture component, the beam expander, the second aperture component, and the third reflector are sequentially and movably disposed in the second box body along the direction of light propagation.

[0011] Furthermore, in the laser processing equipment, the second optical path box further includes a second adjustable mounting bracket, a third adjustable mounting bracket, and a fourth adjustable mounting bracket. The second adjustable mounting bracket is movably disposed on the second box body along a third direction and a fourth direction. The second reflector is disposed on the second adjustable mounting bracket. The third adjustable mounting bracket is fixedly disposed on the second box body. The beam expander is movably disposed on the third adjustable mounting bracket. The fourth adjustable mounting bracket is movably disposed on the second box body along a fifth direction. The third reflector is disposed on the fourth adjustable mounting bracket.

[0012] Furthermore, the laser processing equipment also includes an optical path connecting pipe, a corrugated pipe, and a threaded sleeve. The optical path connecting pipe connects the first optical path box and the second optical path box, the corrugated pipe connects the second optical path box and the third optical path box, and the threaded sleeve connects the third optical path box and the processing head assembly.

[0013] Furthermore, in the laser processing equipment, the laser processing equipment also includes an adjustment plate, a plurality of adjustment screws and a plurality of positioning screws sleeved on springs. The processing head assembly is fixed to the adjustment plate. Each of the adjustment screws is movably connected to the adjustment plate and the support platform to adjust the level of the adjustment plate. Each of the positioning screws passes through the adjustment plate and is connected to the support platform. The spring abuts against the adjustment plate to fix the adjustment plate to the support platform.

[0014] Furthermore, in the laser processing equipment, the support platform includes a marble beam, a marble pad, and a support frame. The marble pad is located on the top of the marble beam and partially protrudes from the marble beam. The support frame is located on the side of the marble beam. The laser is located on the marble beam. The first optical path box and the second optical path box are both located on the marble pad. The third optical path box and the processing head assembly are both located on the support frame.

[0015] Compared to existing technologies, this application provides a laser processing device including a support platform, a laser, a first optical path box, a second optical path box, a third optical path box, and a processing head assembly. The laser, the first optical path box, and the second optical path box are located on top of the support platform and propagate laser beams horizontally in sequence. The second optical path box protrudes from the support platform. The third optical path box and the processing head assembly are both located on the side of the support platform, with the third optical path box located below the second optical path box. The second optical path box propagates the laser beam vertically to the third optical path box, and the third optical path box propagates the laser beam horizontally to the processing head assembly. With this design, because the processing head assembly is located on the side of the support platform, its emitted laser beam is not obstructed by the support platform, allowing the processing head assembly to effectively process horizontally placed workpieces downwards. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a specific embodiment of the laser processing equipment provided in this application.

[0017] Figure 2 This is a schematic diagram of a portion of the structure of a specific embodiment of the laser processing equipment provided in this application.

[0018] Figure 3 for Figure 2 Enlarged diagram of point A in the middle.

[0019] Figure 4 for Figure 2 Enlarged diagram of point B in the middle.

[0020] Figure 5 for Figure 2 Enlarged diagram of point C in the middle.

[0021] Figure 6 A cross-sectional view of the shutter assembly in a specific embodiment of the laser processing equipment provided in this application.

[0022] Among them, 11-Marble crossbeam; 12-Marble pad; 13-Support frame; 20-Laser; 30-First optical path box; 31-First box body; 32-First reflector; 33-First adjustable mounting bracket; 34-Current limiter; 40-Second optical path box; 41-Second box body; 42-Second reflector; 43-First aperture component; 44-Beam expander; 45-Second aperture component; 46-Third reflector; 47-Second adjustable mounting bracket; 48-Third adjustable mounting bracket; 481-Annular mounting bracket; 482-Adjustable positioning component; 49-Fourth adjustable mounting bracket; 50-Third optical path box; 60-Processing head assembly; 70-Optical shutter assembly; 71-Cylinder; 72-Optical shutter baffle; 80-Optical path connecting pipe; 90-Corrugated pipe; 100-Threaded pipe sleeve; 110-Adjusting plate; 120-Adjusting screw; 130-Positioning screw. Detailed Implementation

[0023] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description of this application is provided with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining this application and are not intended to limit this application. Unless further described, elements, structures, and features in one embodiment may be advantageously combined with other embodiments.

[0024] It should be noted that when a metastructure is referred to as "fixed to" or "set on" another metastructure, it can be directly on or indirectly on that other metastructure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0025] The terms “length”, “width”, “upper”, “lower”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0026] Please refer to the following: Figures 1 to 4 The laser processing equipment provided in this application includes a support platform, a laser 20, a first optical path box 30, a second optical path box 40, a third optical path box 50, and a processing head assembly 60. The laser 20, the first optical path box 30, and the second optical path box 40 are located on the top of the support platform and propagate laser beams sequentially in a horizontal direction. The second optical path box 40 partially protrudes from the support platform. The third optical path box 50 and the processing head assembly 60 are both located on the side of the support platform, with the third optical path box 50 located below the second optical path box 40. The second optical path box 40 propagates the laser beam vertically to the third optical path box 50, and the third optical path box 50 propagates the laser beam horizontally to the processing head assembly 60. With this design, since the processing head assembly 60 is located on the side of the support platform, the laser beam emitted by it is not blocked by the support platform, allowing the processing head assembly 60 to effectively process horizontally placed workpieces.

[0027] The processing head assembly 60 can be a cutting head or a welding head, etc., and is not limited to it. In this embodiment, the processing head assembly 60 is used as a cutting head for example.

[0028] In some embodiments, the support platform includes a marble beam 11, a marble pad 12, and a support frame 13. The marble pad 12 is located on top of the marble beam 11 and partially protrudes from it. The support frame 13 is located on the side of the marble beam 11. The laser 20 is located on the marble beam 11. The first optical path box 30 and the second optical path box 40 are both located on the marble pad 12. The third optical path box 50 and the processing head assembly 60 are both located on the support frame 13. With this design, the support platform, by using the marble beam 11 and the marble pad 12, leverages the high hardness, high density, and uniform texture of marble to effectively absorb and buffer external vibration interference, significantly improving the overall structure's vibration damping performance. Because marble itself has good resistance to deformation, it reduces minor displacement or swaying of the support platform caused by vibration, providing a stable mounting foundation for key components such as the laser 20, the first optical path box 30, and the second optical path box 40, thus reducing the impact of vibration on the laser optical path accuracy. Meanwhile, the coordinated design of the support frame 13 and the marble beam 11 not only ensures the stable installation of the third optical path box 50 and the processing head assembly 60, but also indirectly reduces the vibration transmission to these components by utilizing the overall vibration damping effect of the marble beam 11, further improving the stability of the entire device during operation. In summary, by integrating the core components onto the marble structure with excellent vibration damping characteristics and the matching support frame 13, this support platform can effectively reduce external vibration interference, ensure a stable laser transmission path and accurate positioning of the processing head assembly 60, ultimately improving the working accuracy and operational reliability of the equipment.

[0029] In some embodiments, the first optical path box 30 may include a first box body 31 and a first reflector 32, with the first reflector 32 movably disposed on the first box body 31. With this design, since the first reflector 32 is movably disposed on the first box body 31, the first reflector 32 can be finely adjusted according to actual conditions to regulate the angle of laser reflection.

[0030] Furthermore, the first optical path box 30 may also include a first adjustable mounting bracket 33, which is adjustable along a first direction (e.g., Figure 3 (As shown by the middle arrow x1) and can be along the second direction (such as...) Figure 3 (As indicated by the middle arrow x2) The first reflector 32 is movably mounted on the first housing 31, and the first adjustable mounting bracket 33 is mounted on the first adjustable mounting bracket 33. With this design, the position of the first adjustable mounting bracket 33 on the first housing 31 can be adjusted along the first direction or the second direction.

[0031] In some embodiments, the second optical path box 40 may include a second box body 41, a second reflector 42, a first aperture component 43, a beam expander 44, a second aperture component 45, and a third reflector 46. The second reflector 42, the first aperture component 43, the beam expander 44, the second aperture component 45, and the third reflector 46 are sequentially and movably disposed in the second box body 41 along the direction of light propagation. With this design, on the one hand, the beam expander 44 can expand the laser beam; on the other hand, the first aperture component 43 and the second aperture component 45 can precisely filter out stray light before and after beam expansion through dual interception, improving beam purity; simultaneously, the optical path can be quickly calibrated, improving debugging efficiency.

[0032] Furthermore, the second optical path box 40 may also include a second adjustable mounting bracket 47, a third adjustable mounting bracket 48, and a fourth adjustable mounting bracket 49, wherein the second adjustable mounting bracket 47 can be mounted along a third direction (e.g., Figure 4 (As shown by the middle arrow x3) and can be along the fourth direction (such as...) Figure 4 (As indicated by arrow x4) The second reflector 42 is mounted on the second adjustable mounting bracket 47, and the third adjustable mounting bracket 48 is fixed to the second housing 41. The beam expander 44 is movably mounted on the third adjustable mounting bracket 48, and the fourth adjustable mounting bracket 49 can be mounted along the fifth direction (e.g., ...). Figure 4 (As indicated by arrow x5) The second reflector 42 is movably mounted on the second housing 41, and the third reflector 46 is mounted on the fourth adjustable mounting bracket 49. With this design, adjusting the position of the second adjustable mounting bracket 47 in the second housing 41 along the third or fourth direction allows adjustment of the position of the second reflector 42 in the second housing 41 along either the third or fourth direction. Similarly, the positions of the beam expander 44 and the third reflector 46 in the second housing 41 can be adjusted.

[0033] The third adjustable mounting bracket 48 includes an annular mounting bracket 481 with a mounting cavity and multiple adjustable positioning elements 482. The beam expander 44 passes through the mounting cavity. The multiple adjustable positioning elements 482 are spaced apart from each other on the annular mounting bracket 481 and are movably inserted into the mounting cavity to clamp the beam expander 44 onto the annular mounting bracket 481. With this design, the position of the beam expander 44 can be changed by adjusting the multiple adjustable positioning elements 482.

[0034] In some embodiments, the laser processing equipment further includes an optical path connector 80, which connects the first optical path box 30 and the second optical path box 40. This design allows the optical path connector 80 to enclose the optical path, reducing the entry of airborne dust.

[0035] Similarly, the processing head assembly 60 is movably mounted on the support platform. The laser processing equipment also includes a bellows 90, and the third optical path box 50 is connected to the second optical path box 40 via the bellows 90. With this design, when the processing head assembly 60 moves relative to the support platform due to product thickness issues or focal length adjustments, the third optical path box 50 moves with the processing head assembly 60 relative to the support platform to ensure proper light propagation between them. The bellows 90 expands and contracts under the action of the third optical path box 50, allowing the optical path between the second optical path box 40 and the third optical path box 50 to remain closed, preventing dust from entering the optical path.

[0036] Similarly, the laser processing equipment also includes a threaded sleeve 100, and the third optical path box 50 is connected to the processing head assembly 60 through the threaded sleeve 100. With this design, when the cutting head needs to be adjusted, the threaded sleeve 100 can be manually rotated to extend or retract, so that the optical path between the third optical path box 50 and the processing head assembly 60 can be in a closed state, preventing dust from entering the optical path.

[0037] In some embodiments, the first optical path box 30 is equipped with a current limiter 34. With this design, the current limiter 34 can fill the first optical path box 30 and the second optical path box 40 with protective gas to maintain the stability of laser energy.

[0038] Please see Figure 1 and Figure 6 As shown, in some embodiments, considering that the laser 20 needs to be preheated before powering on and that laser power needs to be supplied frequently during laser processing, and that frequent switching on and off would affect the lifespan of the laser 20, this solution may further include an optical shutter assembly 70. The optical shutter assembly 70 is fixed to the support platform, and the first optical path box 30 is fixed to the support platform and spaced apart from the optical shutter assembly 70. With this design, on the one hand, during laser processing, the laser 20 is always on, and the optical shutter assembly 70 can block or allow light propagation between the laser 20 and the first optical path box 30, thereby achieving intermittent light propagation between the laser 20 and the first optical path box 30; on the other hand, the first optical path box 30 is fixed to the support platform spaced apart from the optical shutter assembly 70, which can prevent vibrations generated by the optical shutter assembly 70 during use from being transmitted to the first optical path box 30 and affecting the light output of the first optical path box 30.

[0039] Furthermore, the optical shutter assembly 70 may include a cylinder 71 and an optical shutter baffle 72. The optical shutter baffle 72 is disposed on the cylinder 71. The cylinder 71 is used to extend the optical shutter baffle 72 to block light propagation between the laser 20 and the first optical path box 30, or to retract the optical shutter baffle 72 to allow light propagation between the laser 20 and the first optical path box 30. This design, using the cylinder 71 to extend and retract the optical shutter baffle 72, achieves laser blocking or conduction, resulting in a simple structure.

[0040] Please see Figure 5 In some embodiments, the laser processing equipment further includes an adjustment plate 110, a plurality of adjustment screws 120, and a plurality of positioning screws 130 sleeved on springs. The processing head assembly 60 is fixed to the adjustment plate 110. Each adjustment screw 120 is movably connected to the adjustment plate 110 and the support platform. The levelness of the adjustment plate 110 can be adjusted by adjusting the connection depth between any one or more positioning screws 130 and the adjustment plate 110 and the support platform. Each positioning screw 130 passes through the adjustment plate 110 and is connected to the support platform. The spring abuts against the adjustment plate 110 to fix the adjustment plate 110 to the support platform.

[0041] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and concept of this application, and all such substitutions or changes should fall within the protection scope of the appended claims.

Claims

1. A laser processing apparatus characterized by comprising: The device includes a support platform, a laser, a first optical path box, a second optical path box, a third optical path box, and a processing head assembly. The laser, the first optical path box, and the second optical path box are located on the top of the support platform and propagate laser beams sequentially in a horizontal direction. The second optical path box partially protrudes from the support platform. The third optical path box and the processing head assembly are both located on the side of the support platform, with the third optical path box located below the second optical path box. The second optical path box propagates laser beams vertically to the third optical path box, and the third optical path box propagates laser beams horizontally to the processing head assembly.

2. The laser processing apparatus according to claim 1, characterized by, The laser processing equipment also includes an optical shutter assembly, which is fixed to the support platform. The first optical path box is fixed to the support platform and is spaced apart from the optical shutter assembly.

3. The laser processing apparatus according to claim 2, characterized by, The optical shutter assembly includes a cylinder and an optical shutter baffle. The optical shutter baffle is disposed on the cylinder. The cylinder is used to drive the optical shutter baffle to extend to block the light propagation between the laser and the first optical path box, or to drive the optical shutter baffle to retract to allow the light propagation between the laser and the first optical path box.

4. The laser processing apparatus according to any one of claims 1 to 3, characterized by, The first optical path box includes a first box body and a first reflector, the first reflector being movably disposed on the first box body.

5. The laser processing apparatus according to claim 4, characterized by The first optical path box further includes a first adjustable mounting bracket, which is movably disposed on the first box body along a first direction and along a second direction, and the first reflector is disposed on the first adjustable mounting bracket.

6. The laser processing apparatus according to any one of claims 1 to 3, characterized by, The second optical path box includes a second box body, a second reflector, a first aperture component, a beam expander, a second aperture component, and a third reflector. The second reflector, the first aperture component, the beam expander, the second aperture component, and the third reflector are sequentially and movably disposed in the second box body along the direction of light propagation.

7. The laser processing apparatus according to claim 6, characterized by The second optical path box further includes a second adjustable mounting bracket, a third adjustable mounting bracket, and a fourth adjustable mounting bracket. The second adjustable mounting bracket is movably disposed on the second box body along a third direction and a fourth direction. The second reflector is disposed on the second adjustable mounting bracket. The third adjustable mounting bracket is fixedly disposed on the second box body. The beam expander is movably disposed on the third adjustable mounting bracket. The fourth adjustable mounting bracket is movably disposed on the second box body along a fifth direction. The third reflector is disposed on the fourth adjustable mounting bracket.

8. The laser processing apparatus according to any one of claims 1 to 3, characterized by, The laser processing equipment also includes an optical path connecting pipe, a corrugated pipe, and a threaded pipe sleeve. The optical path connecting pipe connects the first optical path box and the second optical path box. The corrugated pipe connects the second optical path box and the third optical path box. The threaded pipe sleeve connects the third optical path box and the processing head assembly.

9. The laser processing apparatus according to any one of claims 1 to 3, characterized by, The laser processing equipment further comprises an adjusting plate, a plurality of adjusting screws and a plurality of spring-loaded positioning screws, the processing head assembly is fixed to the adjusting plate, each adjusting screw is movably connected to the adjusting plate and the support table to adjust the levelness of the adjusting plate, each positioning screw is arranged through the adjusting plate and connected to the support table, and the spring abuts against the adjusting plate to fix the adjusting plate to the support table.

10. The laser processing apparatus according to any one of claims 1 to 3, characterized by The support table comprises a marble beam, a marble pad and a support frame, the marble pad is arranged on the top of the marble beam and partially protrudes from the marble beam, the support frame is arranged on the side of the marble beam, the laser is arranged on the marble beam, the first light path box and the second light path box are arranged on the marble pad, and the third light path box and the processing head assembly are arranged on the support frame.

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