A high-low temperature testing device suitable for semiconductor chips

Abstract

The utility model provides a kind of high-low temperature testing device suitable for semiconductor chip, comprising: test box, the rotating assembly for being quickly transferred to chip is installed in the inside of test box upper side, the test box is internally installed and is used for the temperature barrier of rotating assembly, the rotating assembly includes carousel, the carousel is rotated and sealed by servo motor one and is installed in test box bottom, the front side, rear side inside of carousel is equipped with multiple for placing chip's rack, compared with prior art, the utility model has the beneficial effects as follows: by setting rotating assembly, the chip of test is quickly transferred to another temperature zone inside, without manual operation during, without opening the sealing door of corresponding temperature zone in process, it can be directly transferred to another temperature zone, avoid the problem of chip damage or test data misalignment caused by mechanical vibration or electrostatic interference to chip in transfer process.

Description

Technical Field

[0001] This utility model belongs to the field of high and low temperature testing technology, and specifically relates to a high and low temperature testing device suitable for semiconductor chips. Background Technology

[0002] Existing high and low temperature testing devices for chips struggle to meet the demands of rapid temperature changes. To address this, zoned temperature control and dual-chamber vacuum structures are commonly employed, but these designs have several drawbacks. First, the chip needs to be transferred between different temperature zones. This process requires opening the sealed door of the corresponding temperature zone to transfer it to another, which may expose it to mechanical vibration or electrostatic interference, potentially damaging the chip or causing inaccurate test data. This is particularly problematic for tiny, precision chips, posing significant safety risks. Conventional solutions include optimizing the chip transfer mechanism to reduce damage risks or introducing more efficient heating and cooling technologies to improve the temperature change rate. However, these methods have limitations: while improving the transfer mechanism reduces safety risks, it further increases the size and cost of the equipment; and while efficient heating and cooling technologies can improve temperature change performance, their application may be limited by high energy consumption or stringent material compatibility requirements. Therefore, we aim to design a novel high and low temperature testing device to solve this problem. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a high and low temperature testing device suitable for semiconductor chips, and to solve the problems mentioned in the background technology.

[0004] This utility model is achieved through the following technical solution: a high and low temperature testing device suitable for semiconductor chips, comprising: a test chamber, wherein a rotating component for rapidly rotating the chip is installed inside the upper side of the test chamber, a high and low temperature chamber for conducting high and low temperature tests is installed inside the test chamber, and a baffle for temperature isolation of the rotating component is installed inside the test chamber.

[0005] The rotating assembly includes a turntable, which is mounted on the bottom of the test chamber via a servo motor and a rotary seal. Multiple chip holders are installed inside the front and rear sides of the turntable.

[0006] In a preferred embodiment, the test chamber has an observation window on the front side, and a sealed door for placing or removing the chip is provided on the left and right sides of the test chamber. A base plate for installing the rotating component is provided in the middle of the test chamber, and a high and low temperature chamber is installed on the upper side of the base plate.

[0007] In a preferred embodiment, the high and low temperature chamber is provided with a movable door on the front right side and the rear left side for taking out or placing the chip. The two high and low temperature chambers are connected to two sealed doors on the left and right sides of the test chamber through the two movable doors, but the two are not connected to each other.

[0008] In a preferred embodiment, the high and low temperature chamber is equipped with a partition plate in the middle to separate the low temperature zone and the high temperature zone. The partition plate has a hollow design in the middle, and a baffle for movable sealing turntable is installed in the middle of the partition plate. The baffle includes a telescopic rod, and an insulation board is movably installed at the lower end of the telescopic rod. A panel is fixed to the front and rear sides of the insulation board to improve the strength and insulation performance of the insulation board. The width of the hollow part in the middle of the partition plate matches the width of the insulation board in the left and right direction. In actual use, the interior of the high and low temperature chamber is divided into a high temperature zone and a low temperature zone, which are separated by the partition plate. The thickness and material of the partition plate only need to meet the temperature separation requirements. The baffle is used to separate the temperature of the turntable to prevent the temperature between the two zones from affecting the accuracy of the high and low temperature test.

[0009] In a preferred embodiment, the front and rear sides of the upper surface of the turntable are respectively concave in an arc shape to form multiple mounting grooves. The mounting groove is a cylindrical groove. A guide cylinder is movably installed on the upper side of each mounting groove. The upper end of the guide cylinder is flush with the upper surface of the turntable. The upper surface of the turntable rotates and abuts against the lower surface of the partition plate. The connection between the lower end of the partition plate and the upper surface of the base plate is sealed and fixed with a high and low temperature resistant adhesive strip. In actual use, the turntable, the placement plate, and the baffle are all made of high and low temperature resistant materials, such as aerogel.

[0010] In a preferred embodiment, the upper surface of the turntable is recessed downward in the left-right direction to form a sealing groove. The width of the sealing groove matches the sum of the thickness of the insulation board and the two panels. The insulation board and the panels are movably inserted into the upper side of the turntable through the sealing groove.

[0011] In a preferred embodiment, the placement rack includes a second servo motor, a second telescopic rod is mounted on the upper side of the second servo motor, and a placement plate is fixed on the upper side of the second telescopic rod. A baffle for limiting the chip is respectively provided on the front, rear, left and right sides of the upper surface of the placement plate. The diameter of the placement plate matches the inner diameter of the guide tube.

[0012] In a preferred embodiment, the height of the placement rack in the retracted state is less than the depth of the mounting groove, and the bottom of the mounting groove is provided with a reserved wiring hole for wiring of the servo motor 2 and the telescopic rod 2.

[0013] After adopting the above technical solution, the beneficial effects of this utility model are as follows: 1. By setting a rotating component, the chip being tested can be quickly transferred to another temperature zone without manual operation. During the process, there is no need to open the sealing door of the corresponding temperature zone. The chip can be directly transferred to another temperature zone, avoiding the problem of chip damage or inaccurate test data caused by mechanical vibration or electrostatic interference during the transfer process. The setting of the second servo motor allows the chip to be repeatedly rotated forward and backward after being pushed out by the second telescopic rod, thereby adjusting the chip's tolerance to ambient temperature uniformity and avoiding local temperature unevenness. The second telescopic rod can be an electric cylinder or hydraulic cylinder that is resistant to high and low temperatures. The servo motor also needs to meet the requirements of high and low temperature resistance. Its wiring can be done by opening holes in the turntable as needed. The turntable with heat insulation performance, together with the placement plate, can prevent the second servo motor from being in a high or low temperature state. The lower part of the placement rack is placed on the lower side of the base plate, that is, the bottom of the test box. The bottom of the test box is provided with ventilation holes, which also prevents the second servo motor from being in a high or low temperature state, allowing it to work normally.

[0014] 2. By installing baffles and partitions inside the high and low temperature chamber, after the turntable has completed the temperature zone transfer of the chip, the telescopic rod one in the baffle is activated again to push the insulation board connecting panel downward from the partition until it enters the mounting slot of the turntable, thus blocking the middle part of the turntable and effectively preventing the temperature in the two zones from transferring to each other and affecting the accuracy of the high and low temperature test. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of a high and low temperature testing device for semiconductor chips according to the present invention.

[0017] Figure 2 This is a schematic diagram of the internal structure of the test chamber of a high and low temperature testing device for semiconductor chips according to this utility model.

[0018] Figure 3 This is a schematic diagram of the connection structure between the barrier and the turntable in a high and low temperature testing device for semiconductor chips according to this utility model.

[0019] Figure 4 This is a schematic diagram of the turntable structure of a high and low temperature testing device for semiconductor chips according to the present invention.

[0020] Figure 5 This is a schematic diagram of the overall structure of a placement rack for a high and low temperature testing device for semiconductor chips according to this utility model.

[0021] Figure 6 This is a schematic diagram of the split structure of a high and low temperature testing device for semiconductor chips according to this utility model.

[0022] In the diagram, 100-test box, 110-observation window, 120-sealed door, 130-base plate, 140-sealed high and low temperature chamber, 150-barrier, 151-telescopic rod one, 152-insulation board, 153-panel;

[0023] 200-Rotating component, 210-Turntable, 211-Mounting slot, 212-Sealing slot, 213-Guide cylinder, 220-Placement rack, 221-Servo motor II, 222-Telescopic rod II, 223-Placement plate, 224-Baffle. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] As the first embodiment of this utility model:

[0026] Please see Figures 1 to 6 A high and low temperature testing device suitable for semiconductor chips includes: a test chamber 100, a rotating component 200 for rapidly rotating the chip is installed inside the upper side of the test chamber 100, a high and low temperature chamber for conducting high and low temperature tests is installed inside the test chamber 100, and a baffle 150 for temperature isolation of the rotating component 200 is installed inside the test chamber 100.

[0027] The rotating assembly 200 includes a turntable 210, which is mounted on the bottom of the test chamber 100 by a servo motor. Multiple placement racks 220 for placing chips are installed inside the front and rear sides of the turntable 210.

[0028] The test chamber 100 has an observation window 110 on the front side, and a sealed door 120 for placing or removing chips is provided on the left and right sides of the test chamber 100. The test chamber 100 has a base plate 130 for installing the rotating component 200 in the middle, and a high and low temperature chamber is installed on the top of the base plate 130.

[0029] The high and low temperature chambers are equipped with a movable door on the front right side and the rear left side for taking out or placing the chip. The two high and low temperature chambers are connected to the two sealed doors 120 on the left and right sides of the test chamber 100 through the two movable doors, but the two are not connected to each other.

[0030] The high and low temperature chamber is equipped with a partition plate in the middle to separate the low temperature zone and the high temperature zone. The partition plate has a hollow design in the middle, and a baffle 150 for movable sealing turntable 210 is installed in the middle of the partition plate. The baffle 150 includes a telescopic rod 151, and an insulation board 152 is movably installed at the lower end of the telescopic rod 151. A panel 153 is fixed to the front and rear sides of the insulation board 152 to improve the strength and insulation performance of the insulation board 152. The width of the hollow part in the middle of the partition plate in the left and right direction matches the width of the insulation board 152. In actual use, the interior of the high and low temperature chamber is divided into a high temperature zone and a low temperature zone, which are separated by the partition plate. The thickness and material of the partition plate only need to meet the temperature separation requirements. The baffle 150 is used to separate the temperature of the turntable 210 to prevent the temperature between the two zones from affecting the accuracy of the high and low temperature test.

[0031] Specifically, by installing a baffle 150 and a partition plate inside the high and low temperature chamber, after the turntable 210 has completed the temperature zone transfer of the chip, the telescopic rod 151 in the baffle 150 is activated again to push the insulation plate 152 connected to the panel 153 downward from the partition plate until it enters the mounting slot 211 of the turntable 210, thus blocking the middle part of the turntable 210 and effectively preventing the temperature in the two zones from transferring to each other and affecting the accuracy of the high and low temperature test.

[0032] As a second embodiment of this utility model:

[0033] Please see Figures 1 to 6 The front and rear sides of the upper surface of the turntable 210 are respectively arc-shaped and recessed to form multiple mounting grooves 211. The mounting groove 211 is a cylindrical groove. A guide tube 213 is movably installed on the upper side of each mounting groove 211. The upper end of the guide tube 213 is flush with the upper surface of the turntable 210. The upper surface of the turntable 210 rotates and abuts against the lower surface of the partition plate. The lower end of the partition plate is sealed and fixed to the upper surface of the base plate 130 with a high and low temperature resistant adhesive strip. In actual use, the turntable 210, the placement plate 223, and the baffle 224 are all made of high and low temperature resistant materials, such as aerogel.

[0034] The upper surface of the turntable 210 is recessed downward in the left-right direction to form a sealing groove 212. The width of the sealing groove 212 matches the sum of the thickness of the insulation board 152 and the two panels 153. The insulation board 152 and the panels 153 are movably inserted into the upper side of the turntable 210 through the sealing groove 212.

[0035] The placement rack 220 includes a servo motor 221, a telescopic rod 222 is mounted on the upper side of the servo motor 221, and a placement plate 223 is fixed on the upper side of the telescopic rod 222. A baffle 224 for limiting the chip is respectively provided on the front, rear, left and right sides of the upper surface of the placement plate 223. The diameter of the placement plate 223 matches the inner diameter of the guide tube 213.

[0036] The height of the placement rack 220 in the retracted state is less than the depth of the mounting groove 211. The bottom of the mounting groove 211 is provided with a reserved wiring hole for wiring of the servo motor 221 and the telescopic rod 222.

[0037] Based on the first embodiment described above, further, in actual use, by placing the chip on the placement rack 220 on the turntable 210, the chip is in a high-temperature or low-temperature environment when the high-low temperature chamber is working, thus enabling high-temperature or low-temperature testing. After the high-temperature or low-temperature test is completed, if a reverse temperature test is required (high temperature to low temperature, low temperature to high temperature), the high-low temperature zones of the high-low temperature chamber can be fully opened in advance (or started individually for testing; the manufacturing principle and structure of the high-low temperature chamber are the same as those in the prior art, and its specific structure and working principle will not be elaborated here). When switching temperatures, the user can activate the telescopic rod 222 to retract the placement plate 223 extending from the mounting slot 211 into the paper guide tube 213, and then activate the servo motor 1 at the bottom of the rotating assembly 200, which rotates 180 degrees to quickly transfer the tested chip to another temperature zone, without the need for manual intervention. During operation, the chip can be directly transferred to another temperature zone without opening the sealed door 120 of the corresponding temperature zone. This avoids chip damage or inaccurate test data caused by mechanical vibration or electrostatic interference during the transfer process. The servo motor 221 allows the chip to be repeatedly rotated forward and backward after being pushed out by the telescopic rod 222, thereby adjusting the chip's tolerance to ambient temperature uniformity and avoiding local temperature unevenness. The telescopic rod 222 can be an electric cylinder or hydraulic cylinder resistant to high and low temperatures. The servo motor also needs to meet the requirements of high and low temperature resistance. Its wiring can be achieved by opening holes in the turntable 210 as needed. The heat-insulated turntable 210, together with the placement plate 223, can prevent the servo motor 221 from being in a high or low temperature state. The lower part of the placement rack 220 is located on the lower side of the base plate 130, that is, the bottom of the test box 100. The bottom of the test box 100 is provided with ventilation holes (see the instruction manual for details). Figure 1 This also prevents the servo motor 221 from being in a high or low temperature state, allowing it to work normally.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high and low temperature testing device suitable for semiconductor chips, comprising: The test chamber (100) is characterized in that a rotating assembly (200) for rapidly rotating the chip is installed inside the upper side of the test chamber (100), a high and low temperature chamber for high temperature and low temperature testing is installed inside the test chamber (100), and a baffle (150) for temperature isolation of the rotating assembly (200) is installed inside the test chamber (100). The rotating assembly (200) includes a turntable (210), which is mounted on the bottom of the test chamber (100) by a servo motor. Multiple placement racks (220) for placing chips are installed inside the front and rear sides of the turntable (210).

2. The high and low temperature testing device for semiconductor chips as described in claim 1, characterized in that: The test chamber (100) has an observation window (110) on the front side. The test chamber (100) has a sealed door (120) on the left and right sides for placing or taking out the chip. The test chamber (100) has a base plate (130) in the middle for installing the rotating component (200). A high and low temperature chamber is installed on the upper side of the base plate (130).

3. The high and low temperature testing device for semiconductor chips as described in claim 2, characterized in that: The high and low temperature chambers are provided with a movable door on the front right side and the rear left side for taking out or placing the chip. The two high and low temperature chambers are connected to the two sealed doors (120) on the left and right sides of the test chamber (100) through the two movable doors, respectively, but the two are not connected to each other.

4. The high and low temperature testing device for semiconductor chips as described in claim 3, characterized in that: The high and low temperature chamber is provided with a partition plate in the middle to separate the low temperature zone and the high temperature zone. The partition plate is hollow in the middle and a baffle (150) for a movable sealing turntable (210) is installed in the middle of the partition plate. The baffle (150) includes a telescopic rod (151). An insulation board (152) is movably installed at the lower end of the telescopic rod (151). A panel (153) is fixed on the front and rear sides of the insulation board (152) to improve the strength and insulation performance of the insulation board (152). The width of the hollow part in the middle of the partition plate in the left and right direction matches the width of the insulation board (152).

5. The high and low temperature testing device for semiconductor chips as described in claim 4, characterized in that: The front and rear sides of the upper surface of the turntable (210) are respectively arc-shaped and recessed to form multiple mounting grooves (211). The mounting groove (211) is a cylindrical groove. A guide cylinder (213) is movably installed on the upper side of each mounting groove (211). The upper end of the guide cylinder (213) is flush with the upper surface of the turntable (210). The upper surface of the turntable (210) rotates and abuts against the lower surface of the partition plate. The lower end of the partition plate is sealed and fixed to the upper surface of the base plate (130) with a high and low temperature resistant rubber strip.

6. The high and low temperature testing device for semiconductor chips as described in claim 5, characterized in that: The upper surface of the turntable (210) is recessed downward in the left-right direction to form a sealing groove (212). The width of the sealing groove (212) matches the sum of the thickness of the insulation board (152) and the two panels (153). The insulation board (152) and the panels (153) are movably inserted into the upper side of the turntable (210) through the sealing groove (212).

7. The high and low temperature testing device for semiconductor chips as described in claim 5, characterized in that: The placement rack (220) includes a second servo motor (221), a second telescopic rod (222) is mounted on the upper side of the second servo motor (221), and a placement plate (223) is fixed on the upper side of the second telescopic rod (222). A baffle (224) for limiting the chip is respectively provided on the front, rear, left and right sides of the upper surface of the placement plate (223). The diameter of the placement plate (223) matches the inner diameter of the guide tube (213).

8. The high and low temperature testing device for semiconductor chips as described in claim 7, characterized in that: The height of the placement rack (220) in the retracted state is less than the depth of the mounting groove (211). The bottom of the mounting groove (211) is provided with a reserved wiring hole for wiring of the servo motor (221) and the telescopic rod (222).

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