Refrigerator cooling device and refrigerator

Abstract

The application relates to the technical field of refrigerator refrigeration, in particular to a refrigerator refrigeration device and a refrigerator. The refrigerator refrigeration device comprises a semiconductor refrigerating sheet, a cold quantity transmission unit, a heat dissipation unit and a connecting piece, the semiconductor refrigerating sheet has a cold surface and a hot surface; the cold quantity transmission unit comprises a cold conducting assembly and a fan, one side of the cold conducting assembly is attached to the cold surface and is in thermal connection with the cold surface, the fan is installed on the other side of the cold conducting assembly, and the fan can provide the cold quantity transmitted from the cold surface to the storage cavity by the cold conducting assembly to refrigerate the storage cavity; the heat dissipation unit is attached to the hot surface and is in thermal connection with the hot surface, and is used for dissipating heat for the hot surface; the connecting piece connects and fixes the cold conducting assembly and the heat dissipation unit, and the thermal conductivity coefficient of the connecting piece is set as k, wherein k < 0.3 (W / (m*K)). The application can improve the refrigeration efficiency of the refrigeration device.

Description

Technical Field

[0001] This application relates to the field of refrigerator refrigeration technology, and in particular to a refrigerator refrigeration device and a refrigerator. Background Technology

[0002] With the miniaturization and energy efficiency of household refrigeration equipment, semiconductor refrigeration technology, with its advantages of no mechanical movement, precise temperature control, and low noise, is gradually being applied to small refrigerators. Compared to traditional compressor refrigeration, semiconductor refrigeration directly achieves heat transfer through the Peltier effect, providing a more flexible refrigeration solution.

[0003] Existing semiconductor refrigerators contain a semiconductor cooling chip, a cold energy transfer unit, and a heat dissipation unit. The cold energy transfer unit transfers the cold energy from the cold end of the cooling chip to the inside of the refrigerator, while the heat dissipation unit dissipates the heat from the hot end to the outside. In this type of technology, the cold energy transfer unit and the heat dissipation unit are usually connected by screws. When the cold energy transfer unit transfers cold energy, it is easy to cause cold energy accumulation. Moreover, due to the thermal conductivity of the screw itself, when the cold energy transfer unit and the heat dissipation unit are connected by screws, the cold energy of the cold energy transfer unit will be conducted to the heat dissipation unit, resulting in additional loss of cold energy from the cold energy transfer unit. Therefore, the refrigeration device has the problem of low refrigeration efficiency. Utility Model Content

[0004] Therefore, it is necessary to provide a refrigerator refrigeration device that can improve refrigeration efficiency.

[0005] To solve the above-mentioned technical problems, this application provides the following technical solution:

[0006] A refrigerator refrigeration device is used to cool the storage compartment of a refrigerator. The refrigerator refrigeration device includes:

[0007] A semiconductor refrigeration chip with a cold side and a hot side;

[0008] A cold energy transfer unit includes a cold conduction component and a fan. One side of the cold conduction component is attached to and thermally connected to the cold surface. The fan is installed on the other side of the cold conduction component and can provide the cold energy transferred from the cold surface by the cold conduction component to the storage chamber to cool the storage chamber.

[0009] A heat dissipation unit is attached to the hot surface and thermally connected to the hot surface for dissipating heat from the hot surface.

[0010] A connector is used to connect and fix the cooling component and the heat dissipation unit. The thermal conductivity of the connector is set to k, where k < 0.3 W / (m·K).

[0011] Understandably, by incorporating a cold air transfer unit including a fan and a connector with a thermal conductivity k < 0.3 W / (m·K), this application achieves two advantages. First, when the cold air transfer unit transfers cold air to the refrigerator's storage compartment, the fan circulates the air, preventing cold air accumulation around the unit and improving cooling efficiency. Second, the connection between the cold air transfer unit and the heat dissipation unit via the connector with a thermal conductivity k < 0.3 W / (m·K) prevents cold air from being transferred from the cold air transfer unit to the heat dissipation unit when they are connected, avoiding additional cold air loss and thus improving the cooling efficiency of the refrigeration device.

[0012] In one embodiment, the cooling component includes a cooling block and a cooling plate assembly, one end face of the cooling block abutting against the cold surface, and the other end face of the cooling block abutting and limiting the cooling plate assembly;

[0013] The fan is mounted on the side of the cooling plate assembly away from the cooling block via a fan bracket.

[0014] It is understandable that by mounting the fan on the side of the cooling plate assembly away from the cooling block, the air near the cooling block can flow through the fan to a position in the storage chamber that is far from the cooling plate assembly, thereby accelerating the conduction of cold energy and improving the efficiency of the cold energy transfer unit in transferring cold energy to the storage chamber.

[0015] In one embodiment, the cold-conducting plate assembly includes a heat pipe pressure plate, a heat pipe, and a cold-conducting plate. The heat pipe pressure limiter is located between the heat pipe pressure plate and the cold-conducting plate, and the heat pipe is in surface-to-surface contact with the heat pipe pressure plate and the cold-conducting plate, respectively.

[0016] The heat pipe pressure plate is attached to one end face of the cooling block, and the fan bracket is mounted on the cooling plate.

[0017] It is understandable that by placing the heat pipe between the heat pipe plate and the cold conduction plate, and making the heat pipe contact the heat pipe plate and the cold conduction plate in a surface-to-surface manner, the problem of high thermal resistance caused by air between the heat pipe and the heat pipe plate and the cold conduction plate can be avoided, thereby reducing the loss of cold energy during the cold energy conduction process and improving the cold energy conduction efficiency.

[0018] In one embodiment, the refrigerator cooling device further includes a fan bracket and a fan cover. The fan is mounted on the cooling guide assembly via the fan bracket, and the fan cover is mounted on the fan bracket to cover the fan. The fan is capable of blowing cold air into the storage chamber through the fan cover.

[0019] The fan cover is connected to the fan bracket to form a first connecting part, and the fan is connected to the fan bracket to form a second connecting part. The first connecting part and the second connecting part are correspondingly arranged, and the first connecting part and a plurality of corresponding second connecting parts are arranged in the same area of ​​the fan in the radial direction of the fan.

[0020] It is understandable that by placing the first connecting part and the corresponding second connecting part in the same area of ​​the fan in the radial direction of the fan, the obstruction of airflow can be reduced, thereby reducing airflow loss and improving the uniformity of cooling.

[0021] In one embodiment, the number of the first connecting parts is set to 3.

[0022] In one embodiment, the connector is configured as a sleeve structure, and the connector is configured as a one-piece plastic part.

[0023] In one embodiment, the connector extends toward the cooling assembly after passing through the heat dissipation unit;

[0024] One end of the connector abuts against and limits the heat dissipation unit, and the other end of the connector is screwed into a connecting fitting that passes through the cooling conductive assembly.

[0025] In one embodiment, the refrigerator cooling device further includes a heat insulation pad, which is disposed around the semiconductor cooling chip and is pressed and limited by the heat dissipation unit;

[0026] The heat insulation pad is provided with a foolproof part.

[0027] Understandably, by setting up a heat insulation pad with a foolproof feature, the heat insulation pad can isolate the cold energy transfer unit and the heat dissipation unit, preventing them from interfering with each other and thus reducing heat dissipation efficiency. At the same time, the foolproof feature can prevent incorrect installation of the heat insulation pad and improve the assembly efficiency of the heat insulation pad.

[0028] In one embodiment, the number of connectors is set to two, and the two connectors are disposed on two opposite sides of the thermoelectric cooler.

[0029] The heat insulation pad has two through holes with different shapes. Each through hole corresponds to one of the two connectors, and the connectors can pass through the corresponding through holes and abut against the hole walls.

[0030] This application also provides the following technical solutions:

[0031] A refrigerator includes a refrigerator refrigeration device as described in any of the above embodiments.

[0032] Compared with existing technologies, the refrigerator refrigeration device described herein, by incorporating a cold energy transfer unit including a fan and a connector with a thermal conductivity k < 0.3 W / (m·K), achieves several advantages. Firstly, when the cold energy transfer unit transfers cold energy to the refrigerator's storage compartment, the fan facilitates airflow, preventing cold energy accumulation around the unit and improving refrigeration efficiency. Secondly, the connection between the cold energy transfer unit and the heat dissipation unit via the connector with a thermal conductivity k < 0.3 W / (m·K) reduces the transfer of cold energy from the cold energy transfer unit to the heat dissipation unit during their connection, preventing additional cold energy loss and further enhancing the refrigeration efficiency of the device. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the refrigerator refrigeration device provided in this application installed in a refrigerator.

[0035] Figure 2 A top view of the refrigerator refrigeration device provided in this application installed in the refrigerator.

[0036] Figure 3 For this application Figure 2 Sectional view at point AA.

[0037] Figure 4 This is a schematic diagram of the refrigerator refrigeration device provided in this application.

[0038] Figure 5 An exploded view of the refrigerator refrigeration unit provided in this application.

[0039] The component labels are as follows:

[0040] 100. Refrigerator refrigeration unit; 10. Semiconductor refrigeration chip; 11. Cold side; 12. Hot side; 20. Cold energy transfer unit; 21. Cooling component; 211. Cooling block; 212. Cooling plate assembly; 213. Heat pipe pressure plate; 214. Heat pipe; 215. Cooling plate; 216. Groove; 22. Fan; 23. Fan bracket; 231. First connecting part; 232. Second connecting part; 233. Third connecting part; 24. Fan cover; 30. Heat dissipation unit; 31. Heat dissipation fins; 32. Hot end fan; 40. Connector; 41. Connecting mating part; 50. Heat insulation pad; 51. Through hole;

[0041] 200. Refrigerator; 201. Storage chamber; 202. Shell; 203. Door. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0043] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0046] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0047] Please see Figures 1 to 5 This application provides a refrigerator refrigeration device 100 for cooling the storage compartment 201 of a refrigerator 200. Here, the storage compartment 201 can be the refrigerator compartment or the freezer compartment of the refrigerator 200. The refrigerator 200 includes a shell 202 and a door 203, which enclose the storage compartment 201, and the refrigerator refrigeration device 100 is installed on the side wall of the refrigerator shell 202 away from the door 203.

[0048] Specifically, the refrigerator refrigeration device 100 includes a thermoelectric cooler 10, a cold energy transfer unit 20, a heat dissipation unit 30, and a connector 40. The thermoelectric cooler 10 has a cold surface 11 and a hot surface 12. The cold energy transfer unit 20 includes a cold-conducting component 21 and a fan 22. One side of the cold-conducting component 21 is attached to and thermally connected to the cold surface 11. The fan 22 is installed on the other side of the cold-conducting component 21 and can provide the cold energy transferred from the cold surface 11 by the cold-conducting component 21 to the storage chamber 201 to cool the storage chamber 201. The heat dissipation unit 30 is attached to and thermally connected to the hot surface 12 to dissipate heat from the hot surface 12. The connector 40 connects and fixes the cold-conducting component 21 and the heat dissipation unit 30. The thermal conductivity of the connector 40 is set to k, where k < 0.3 W / (m·K).

[0049] As can be seen from the above, this application, by setting up a cold energy transfer unit 20 including a fan 22 and a connector 40 with a thermal conductivity k < 0.3 W / (m·K), achieves the following: Firstly, when the cold energy transfer unit 20 transfers cold energy to the storage chamber 201 of the refrigerator 200, the fan 22 can circulate the air, thereby preventing the accumulation of cold energy around the cold energy transfer unit 20 and improving the refrigeration efficiency. Secondly, the connection between the cold energy transfer unit 20 and the heat dissipation unit 30 via the connector 40 with a thermal conductivity k < 0.3 W / (m·K) prevents the cold energy from being transferred from the cold energy transfer unit 20 to the heat dissipation unit 30 when they are connected, avoiding additional loss of cold energy and thus improving the refrigeration efficiency of the refrigeration device.

[0050] like Figures 3 to 5 As shown, the cooling assembly 21 includes a cooling block 211 and a cooling plate assembly 212. One end face of the cooling block 211 abuts against the cold surface 11, and the other end face of the cooling block 211 abuts and limits its position against the cooling plate assembly 212. A fan 22 is mounted on the cooling plate assembly 212 away from the cooling block 211 via a fan bracket 23. Thus, by mounting the fan 22 on the cooling plate assembly 212 away from the cooling block 211, air near the cooling block 211 can flow via the fan 22 to a position in the storage chamber 201 farther from the cooling plate assembly 212, thereby accelerating the conduction of cold energy and improving the efficiency of the cold energy transfer unit 20 in transferring cold energy to the storage chamber 201. Here, the cooling block 211 can be a copper block, an aluminum block, etc.

[0051] In one embodiment, the cold-conducting plate assembly 212 includes a heat pipe pressure plate 213, a heat pipe 214, and a cold-conducting plate 215. The heat pipe 214 is positioned between the heat pipe pressure plate 213 and the cold-conducting plate 215, and the heat pipe 214 is in surface-to-surface contact with both the heat pipe pressure plate 213 and the cold-conducting plate 215. The heat pipe pressure plate 213 rests against one end face of the cold-conducting block 211, and the fan bracket 23 is mounted on the cold-conducting plate 215. By placing the heat pipe 214 between the heat pipe pressure plate 213 and the cold-conducting plate 215, and ensuring that the heat pipe 214 is in surface-to-surface contact with both the heat pipe pressure plate 213 and the cold-conducting plate 215, the loss of cold energy transferred from the thermoelectric cooler 10 to the cold-conducting plate 215 via the heat pipe 214 can be reduced, thereby improving the efficiency of cold energy conduction. Here, multiple heat pipes 214 are used, such as 3, 4, 6, or 8.

[0052] In this embodiment, there are four heat pipes 214, and four semi-circular grooves 216 are provided on both the heat pipe pressure plate 213 and the cold conduction plate 215. After the two are installed, two corresponding grooves 216 form four cylindrical gaps to accommodate the four heat pipes 214, so that the four heat pipes 214, the heat pipe pressure plate 213, and the cold conduction plate 215 form a surface-to-surface fit structure.

[0053] like Figure 4 and Figure 5 As shown, the refrigerator refrigeration unit 100 also includes a fan bracket 23 and a fan cover 24. The fan 22 is mounted on the cooling conduction assembly 21 via the fan bracket 23, and the fan cover 24 is mounted on the fan bracket 23 to cover the fan 22. The fan 22 can blow cold air into the storage chamber 201 through the fan cover 24. The fan cover 24 is connected to the fan bracket 23 to form a first connecting part 231, and the fan 22 is connected to the fan bracket 23 to form a second connecting part 232. The first connecting part 231 and the second connecting part 232 are correspondingly arranged, and the first connecting part 231 and the corresponding second connecting part 232 are located in the same area of ​​the fan 22 in the radial direction of the fan 22. By arranging the first connecting part 231 and the corresponding second connecting part 232 in the same area of ​​the fan 22 in the radial direction of the fan 22, the obstruction of air blowing out through the fan 22 and the fan cover 24 can be reduced, thus reducing airflow loss and improving the uniformity of cooling conduction of the cold energy transfer unit 20. It should be noted that the first connecting part 231 and the corresponding second connecting part 232 are located in the same area of ​​the fan 22 along the radial direction of the fan 22. This means that the first connecting part 231 and the corresponding second connecting part 232 are on the same radial line of the fan 22, that is, the line connecting the first connecting part 231 and the corresponding second connecting part 232 can pass through the center of the fan 22.

[0054] Furthermore, the fan bracket 23 is connected to the cooling plate 215 to form a third connection part 233. The first connection part 231, the second connection part 232 and the third connection part 233 are arranged on the same radial line of the fan 22, which can reduce the obstruction of air flowing from outside the fan 22 to the fan 22 and then out through the fan cover 24, reduce air volume loss, and thus improve the uniformity of cooling of the cooling transfer unit 20.

[0055] Here, the fan bracket 23 and the cooling plate 215, the fan cover 24 and the fan bracket 23, and the fan 22 and the fan bracket 23 can be connected by screws or by snap-fit.

[0056] In this embodiment, the number of first connecting parts 231 is set to three. Correspondingly, the number of second connecting parts 232 is also three. Thus, by setting three first connecting parts 231 and three second connecting parts 232, it is possible to reduce interference with airflow while achieving a stable connection of the fan 22 structure, thereby improving the efficiency of cold energy transfer unit 20.

[0057] like Figures 1 to 5 As shown, the heat dissipation unit 30 includes heat dissipation fins 31 and a hot-end fan 32. The heat dissipation fins 31 are fixed by connectors 40, and the hot-end fan 32 is fixed to the heat dissipation fins 31. By setting the heat dissipation fins 31 and the hot-end fan 32, the heat conduction from the hot surface 12 of the thermoelectric cooler 10 to the outside can be accelerated, thereby improving the heat dissipation efficiency of the thermoelectric cooler 10. Here, the hot-end fan 32 can be fixed to the heat dissipation fins 31 by screws, clips, or other means.

[0058] In one embodiment, the connector 40 is configured as a sleeve structure, and the connector 40 is configured as a one-piece plastic part. Here, the connector 40 can be made of materials such as polystyrene or polypropylene.

[0059] In one embodiment, the connector 40 extends toward the cooling guide assembly 21 after passing through the heat dissipation unit 30; one end of the connector 40 abuts against and limits the heat dissipation unit 30, and the other end of the connector 40 is screwed to the connecting fitting 41 passing through the cooling guide assembly 21. In this embodiment, the connecting fitting 41 is configured as a screw.

[0060] like Figures 3 to 5 As shown, the refrigerator cooling device 100 also includes a heat insulation pad 50, which is disposed around the semiconductor cooling chip 10 and pressed and limited by the heat dissipation unit 30; wherein, the heat insulation pad 50 is provided with a foolproof part. Thus, by providing the heat insulation pad 50 and the foolproof part on the heat insulation pad 50, the heat insulation pad 50 can isolate the cold air transfer unit 20 and the heat dissipation unit 30, preventing them from interfering with each other and causing a reduction in heat dissipation efficiency. At the same time, the foolproof part can prevent incorrect installation of the heat insulation pad 50, thereby improving the assembly efficiency of the heat insulation pad 50.

[0061] In one embodiment, two connectors 40 are provided, positioned on opposite sides of the thermoelectric cooler 10. The heat insulation pad 50 has two through holes 51 of different shapes, each corresponding to one of the two connectors 40. The connectors 40 can pass through the corresponding through holes 51 and abut against the hole walls. Thus, by providing two connectors 40 of different shapes and through holes 51 of different shapes, both fixing and error-proofing functions can be achieved, thereby improving the assembly efficiency of the heat insulation pad 50.

[0062] This application also provides the following technical solutions:

[0063] A refrigerator 200 includes a refrigerator refrigeration device 100 as described in any of the above embodiments.

[0064] The refrigerator cooling device 100 can be controlled by a voice module, which is equipped with a controller, a voice receiving module, and a voice parsing module. The voice receiving module receives user commands, and the voice parsing module parses the commands. Based on the parsed commands, the controller controls the refrigerator cooling device 100 to perform corresponding operations, thereby realizing intelligent control of the refrigerator cooling device 100 and improving the user experience.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A refrigerator cooling device for cooling a storage chamber (201) of a refrigerator (200), characterized in that, The refrigerator refrigeration unit (100) includes: A semiconductor cooling chip (10) has a cold side (11) and a hot side (12). The cold energy transfer unit (20) includes a cold conduction component (21) and a fan (22). One side of the cold conduction component (21) is attached to the cold surface (11) and is thermally connected to the cold surface (11). The fan (22) is installed on the other side of the cold conduction component (21) and the fan (22) can provide the cold energy transferred by the cold conduction component (21) from the cold surface (11) to the storage chamber (201) to cool the storage chamber (201). The heat dissipation unit (30) is attached to the hot surface (12) and thermally connected to the hot surface (12) for dissipating heat from the hot surface (12); A connector (40) is used to connect and fix the cooling component (21) and the heat dissipation unit (30). The thermal conductivity of the connector (40) is set to k, where k < 0.3 W / (m·K).

2. The refrigerator refrigerating apparatus according to claim 1, characterized in that, The cooling component (21) includes a cooling block (211) and a cooling plate assembly (212). One end face of the cooling block (211) is attached to the cold surface (11), and the other end face of the cooling block (211) is in contact with and limited by the cooling plate assembly (212). The fan (22) is mounted on the side of the cooling plate assembly (212) away from the cooling block (211) via a fan bracket (23).

3. The refrigerator refrigeration device according to claim 2, characterized in that, The cold-conducting plate assembly (212) includes a heat pipe pressure plate (213), a heat pipe (214), and a cold-conducting plate (215). The heat pipe (214) is located between the heat pipe pressure plate (213) and the cold-conducting plate (215). The heat pipe (214) is in surface-to-surface contact with the heat pipe pressure plate (213) and the cold-conducting plate (215). The heat pipe pressure plate (213) is attached to one end face of the cooling block (211), and the fan bracket (23) is mounted on the cooling plate (215).

4. The refrigerator refrigerating apparatus according to claim 1, characterized in that, The refrigerator refrigeration device (100) further includes a fan bracket (23) and a fan cover (24). The fan (22) is mounted on the cooling component (21) via the fan bracket (23). The fan cover (24) is mounted on the fan bracket (23) to cover the fan (22). The fan (22) can blow cold air into the storage chamber (201) through the fan cover (24). The fan cover (24) is connected to the fan bracket (23) to form a first connecting part (231), and the fan (22) is connected to the fan bracket (23) to form a second connecting part (232). The first connecting part (231) and the second connecting part (232) are correspondingly arranged, and the first connecting part (231) and the corresponding plurality of second connecting parts (232) are arranged in the same area of ​​the fan (22) in the radial direction of the fan (22).

5. The refrigerator refrigerating apparatus according to claim 4, characterized in that, The number of the first connecting parts (231) is set to 3.

6. The refrigerator refrigeration device according to claim 1, characterized in that, The connector (40) is configured as a sleeve structure, and the connector (40) is configured as an integral plastic part.

7. The refrigerator refrigeration apparatus of claim 1, wherein, The connector (40) extends toward the cooling assembly (21) after passing through the heat dissipation unit (30); One end of the connector (40) abuts against and limits the heat dissipation unit (30), and the other end of the connector (40) is screwed to the connecting fitting (41) that passes through the cooling conductive assembly (21).

8. The refrigerator refrigeration apparatus of claim 1, wherein, The refrigerator refrigeration device (100) also includes a heat insulation pad (50), which is disposed on the periphery of the semiconductor refrigeration chip (10) and is pressed and limited by the heat dissipation unit (30); The heat insulation pad (50) is provided with a foolproof part.

9. The refrigerator cooling device according to claim 8, characterized in that The number of the connectors (40) is set to two, and the two connectors (40) are disposed on two opposite sides of the semiconductor cooling chip (10); The heat insulation pad (50) has two through holes (51) with different shapes. The two through holes (51) correspond one-to-one with the two connectors (40), and the connectors (40) can pass through the corresponding through holes (51) and abut against the hole wall of the through holes (51).

10. A refrigerator characterized by comprising: Includes the refrigerator refrigeration device (100) according to any one of claims 1-9.

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