Solder strip coating apparatus and solder strip

Abstract

The application relates to a solder strip coating device and a solder strip. The solder strip coating device comprises a containing member, a first coating mechanism and a transmission mechanism. The containing member is configured with a containing cavity for carrying a liquid to be coated; the transmission mechanism is used for transmitting a solder strip substrate along a preset transmission path; the first coating mechanism is arranged on the preset transmission path of the solder strip substrate and comprises a coating wheel rotating around a preset axis; the coating wheel is contained in the containing cavity along a radial part thereof and can be in contact with the liquid to be coated; when the coating wheel rotates around the preset axis, part of the outer circumferential surface of the coating wheel can abut against a first preset surface of the solder strip substrate. The solder strip coating device only performs a tin coating operation on the soldering surface of the solder strip substrate, and the non-soldering surface of the solder strip substrate is not subjected to the tin coating operation, so that the tin consumption is small during the preparation of the solder strip, the material cost is low, the optical reflectivity of the non-soldering surface of the solder strip on the prepared solar cell is high, and the light absorption efficiency of the solar cell is improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a solder ribbon coating apparatus and solder ribbon. Background Technology

[0002] In the fabrication of solar cells, multiple solar cell units need to be connected together using solder ribbons to form a complete photovoltaic module. To achieve good soldering performance, most related technologies employ a hot-dip coating process to apply tin to the surface of the solder ribbon. However, when the entire surface of the solder ribbon is coated with tin, not only does it result in a large amount of tin consumption, thus increasing the material cost of the solder ribbon, but the tin on the non-soldering surface of the solder ribbon also limits the optical reflectivity of the non-soldering surface due to the low reflectivity of the tin alloy, thereby reducing the light absorption efficiency of the solar cell. Utility Model Content

[0003] Therefore, it is necessary to provide a solder strip coating device and solder strip to address the problems of high material cost of existing solder strips and their impact on the light absorption efficiency of solar cells.

[0004] In a first aspect, this application provides a solder strip coating apparatus, comprising:

[0005] The receiving element is constructed with a receiving cavity for holding the liquid to be coated;

[0006] A transmission mechanism for transmitting the solder strip substrate along a preset transmission path;

[0007] The first coating mechanism is disposed on the preset transport path of the welding strip substrate and includes a coating wheel that rotates about a preset axis; the coating wheel is accommodated in the accommodating cavity along its radial portion and can contact the liquid to be coated;

[0008] When the coating wheel rotates around the preset axis, a portion of the outer peripheral surface of the coating wheel can abut against the first preset surface of the welding strip substrate.

[0009] In some embodiments, the first coating mechanism further includes a speed regulating element;

[0010] The speed adjustment component is connected to the coating wheel; the speed adjustment component is used to adjust the linear speed V1 of the coating wheel so that V1 is the same as the transmission speed V2 of the transmission mechanism.

[0011] In some embodiments, the first coating mechanism further includes a heating element;

[0012] The heating element is connected to the coating wheel to keep the temperature T of the coating wheel within a preset range.

[0013] In some embodiments, the ribbon coating apparatus further includes a limiting mechanism;

[0014] The limiting mechanism has a limiting hole that matches the cross-sectional shape of the welding strip substrate; the limiting hole is used to pass through the welding strip substrate.

[0015] In some embodiments, the number of the limiting mechanisms is at least two;

[0016] Along the transport direction of the solder strip substrate, at least two of the limiting mechanisms are respectively disposed upstream and downstream of the first coating mechanism.

[0017] In some embodiments, along the transport direction of the solder strip substrate, the distance d1 between the limiting mechanism located upstream of the first coating mechanism and closest to the coating wheel and the position where the coating wheel abuts the solder strip substrate is defined;

[0018] The distance between the limiting mechanism located downstream of the first coating mechanism and closest to the coating wheel and the position where the coating wheel abuts against the welding strip substrate is defined as d2;

[0019] The relationship between d1 and d2 is:

[0020] d1 < d2.

[0021] In some embodiments, the ribbon coating apparatus further includes a blower mechanism;

[0022] The blower mechanism and the coating wheel are arranged opposite each other along the thickness direction of the welding strip substrate;

[0023] The blower assembly is equipped with an air nozzle, which is used to blow air onto the second preset surface of the welding strip substrate.

[0024] In some embodiments, the first preset surface is the welding surface of the solder strip substrate; the second preset surface is the non-welding surface of the solder strip substrate.

[0025] In some embodiments, the ribbon coating apparatus further includes a blower mechanism;

[0026] Along the transport direction of the solder strip substrate, the blower is configured between the first coating mechanism and the limiting mechanism located downstream of the first coating mechanism and closest to the coating wheel; along the thickness direction of the solder strip substrate, the blower is configured on the side of the solder strip substrate away from the first coating mechanism.

[0027] The blower assembly is equipped with an air nozzle, which is used to blow air onto the second preset surface of the welding strip substrate.

[0028] In some embodiments, the first preset surface is the welding surface of the solder strip substrate; the second preset surface is the non-welding surface of the solder strip substrate.

[0029] In some embodiments, the ribbon coating apparatus further includes a cooling mechanism;

[0030] Along the transport direction of the welding strip substrate, the cooling mechanism is located downstream of the first coating mechanism; and the cooling mechanism is located downstream of the limiting mechanism that is furthest from the coating wheel.

[0031] The cooling mechanism is used to cool the solder strip substrate.

[0032] In some embodiments, the ribbon coating apparatus further includes an adjustment mechanism;

[0033] Along the transport direction of the welding strip substrate, the adjustment mechanism is disposed between the limiting mechanism and the cooling mechanism, which are located downstream of the first coating mechanism and furthest from the coating wheel;

[0034] The adjustment mechanism is used to adjust the thickness of the coating liquid applied to the solder ribbon substrate.

[0035] In some embodiments, the adjustment mechanism includes:

[0036] Air duct, used to connect to the air source;

[0037] An air knife is connected to one end of the air duct and is positioned toward the first preset surface of the welding strip substrate. The air knife is used to blow gas from the air duct to the first preset surface of the welding strip substrate to adjust the thickness of the coating liquid on the first preset surface of the welding strip substrate.

[0038] In some embodiments, the ribbon coating apparatus further includes a second coating mechanism;

[0039] Along the transport direction of the welding strip substrate, the second coating mechanism is located upstream of the limiting mechanism;

[0040] The second coating mechanism is used to coat the first preset surface of the solder strip substrate with flux.

[0041] In some embodiments, the ribbon coating apparatus further includes an annealing mechanism;

[0042] Along the transport direction of the solder strip substrate, the annealing mechanism is located upstream of the second coating mechanism;

[0043] The annealing mechanism is used to anneal the solder strip substrate.

[0044] In some embodiments, the ribbon coating mechanism further includes a pressure roller forming mechanism;

[0045] Along the conveying direction of the welding strip substrate, the pressure roller forming mechanism is located upstream of the annealing mechanism;

[0046] The pressure roller forming mechanism is used to press the cross-sectional shape of the welding strip substrate into a preset shape.

[0047] In some embodiments, the first coating mechanism further includes a moving component;

[0048] The moving component is connected to the coating wheel, and the moving component can drive the coating wheel to move closer to or further away from the welding strip substrate.

[0049] In some embodiments, the entire outer circumferential surface of the coating wheel is configured with a coating surface that contacts the welding strip substrate.

[0050] In some embodiments, the coating wheel includes at least one protrusion and at least one recess along its circumference;

[0051] The minimum distance of the convex portion relative to the preset axis is greater than the maximum distance of the concave portion relative to the preset axis;

[0052] When the coating wheel rotates around the preset axis to the first preset position, the protrusion abuts against the first preset surface of the welding strip substrate along the radial direction of the coating wheel;

[0053] When the coating wheel rotates around the preset axis to the second preset position, the recess and the welding strip substrate are arranged opposite to each other along the thickness direction of the welding strip substrate and have a gap along the radial direction of the coating wheel.

[0054] In some embodiments, the minimum distance d3 of the convex portion relative to the preset axis and the maximum distance d4 of the concave portion relative to the preset axis satisfy the following condition:

[0055] d3-d4≥10mm.

[0056] In some embodiments, the coating wheel includes a plurality of the protrusions and a plurality of the recesses;

[0057] The protrusions and the recesses are arranged alternately in sequence.

[0058] In some embodiments, the solder strip substrate includes coated and uncoated sections that are connected to each other and arranged in a circular manner;

[0059] The welding strip coating device further includes a limiting mechanism, and the number of the limiting mechanisms is at least four.

[0060] Along the transport direction of the solder strip substrate, at least two of the limiting mechanisms are disposed upstream of the first coating mechanism; at least two of the limiting mechanisms are disposed downstream of the first coating mechanism;

[0061] Along the transport direction of the solder strip substrate, the minimum distance d5 between two adjacent limiting mechanisms upstream of the first coating mechanism is greater than the larger of the length d6 of the coated section and the length d7 of the uncoated section, and less than the sum of the length d6 of the coated section and the length d7 of the uncoated section; and / or

[0062] Along the transport direction of the solder strip substrate, the minimum distance d8 between two adjacent limiting mechanisms downstream of the first coating mechanism is greater than the larger of the length d6 of the coating section and the length d7 of the uncoated section, and less than the sum of the length d6 of the coating section and the length d7 of the uncoated section.

[0063] Secondly, this application also provides a solder strip, which is prepared using the solder strip coating apparatus described in some of the above embodiments;

[0064] The solder strip substrate includes coated and uncoated sections that are connected to each other and arranged in a cyclic manner;

[0065] When the coating wheel rotates around the preset axis to the first preset position, the protrusion abuts against the first preset surface of the coating section along the radial direction of the coating wheel;

[0066] When the coating wheel rotates around the preset axis to the second preset position, the recess and the uncoated section are arranged opposite to each other along the thickness direction of the welding strip substrate and have a gap along the radial direction of the coating wheel.

[0067] In some embodiments, the length of the coating section along the transport direction of the solder strip substrate is the same as the length of the protrusion along the circumference of the coating wheel.

[0068] When the solder ribbon coating device described above performs a tin coating operation on the solder ribbon substrate, the liquid to be coated in the receiving cavity of the receiving member is molten tin, and the first preset surface of the solder ribbon substrate is the welding surface of the solder ribbon. At this time, the transmission mechanism transmits the solder ribbon substrate along the preset transmission path, and the coating wheel is set on the transmission path of the solder ribbon substrate. Since the coating wheel is housed in the receiving cavity along its radial portion and can contact the molten tin in the receiving cavity, a portion of the outer peripheral surface of the coating wheel can abut against the first preset surface of the solder ribbon substrate when the coating wheel rotates around the preset axis, thereby coating the molten tin onto the first preset surface of the solder ribbon substrate and finally solidifying to form a solder ribbon with a tin coating layer. This solder ribbon coating device only performs a tin coating operation on the welding surface of the solder ribbon substrate, while the non-welding surface of the solder ribbon substrate is not tinned. This not only reduces the amount of tin consumed during solder ribbon preparation and lowers the material cost, but also allows for higher optical reflectivity of the non-welding surface of the solder ribbon on the final prepared solar cell, thereby improving the light absorption efficiency of the solar cell and ultimately resulting in a higher photoelectric conversion efficiency of the solar cell. Attached Figure Description

[0069] Figure 1 This is a schematic diagram of a solder strip coating apparatus provided in some embodiments of this application.

[0070] Figure 2 for Figure 1 The diagram shows the limiting mechanism, the first coating mechanism, and the solder strip substrate in the solder strip coating apparatus.

[0071] Figure 3 This is a schematic diagram of a limiting mechanism, a first coating mechanism, and a solder strip substrate in a solder strip coating apparatus provided for other embodiments of this application.

[0072] Figure 4 Schematic diagrams of the limiting mechanism, the first coating mechanism, and the solder strip substrate in some embodiments of this application are also provided.

[0073] Figure 5 for Figure 4 A schematic diagram of the solder strip substrate is shown.

[0074] Figure 6 for Figure 5 The diagram shows a cross-section at point AA.

[0075] Reference numerals: 100-accommodating component; 110-accommodating cavity; 200-first coating mechanism; 210-coating wheel; 211-protrusion; 212-recess; 220-preset axis; 300-transfer mechanism; 310-unwinding assembly; 320-rewinding assembly; 400-limiting mechanism; 410-limiting hole; 500-blowing mechanism; 510-blowing nozzle; 600-cooling mechanism; 700-second coating mechanism; 800-pressure roller forming mechanism; 810-first pressure roller; 820-second pressure roller; 900-welding strip substrate; 901-first preset surface; 902-second preset surface; 910-coated section; 920-uncoated section; 930-flux; 940-coating layer; 900a-welding strip. Detailed Implementation

[0076] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0077] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0078] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0079] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0080] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0081] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0082] See Figure 1 , Figure 1 A schematic diagram of a solder ribbon coating apparatus provided in some embodiments of this application is shown. The solder ribbon coating apparatus provided in some embodiments of this application includes a receiving member 100, a first coating mechanism 200, and a transmission mechanism 300. The receiving member 100 is configured with a receiving cavity 110 for carrying a coating liquid; the transmission mechanism 300 is used to transmit a solder ribbon substrate 900 along a preset transmission path; the first coating mechanism 200 is disposed on the preset transmission path of the solder ribbon substrate 900, and the first coating mechanism 200 includes a coating wheel 210 that rotates about a preset axis; the coating wheel 210 is radially housed within the receiving cavity 110 and contacts the coating liquid; when the coating wheel 210 rotates about the preset axis, a portion of the outer peripheral surface of the coating wheel 210 can abut against a first preset surface 901 of the solder ribbon substrate 900.

[0083] When the solder ribbon substrate 900 is tinned using the aforementioned solder ribbon coating apparatus, the liquid to be coated contained in the receiving cavity 110 of the receiving member 100 is molten solder, and the first preset surface 901 of the solder ribbon substrate 900 is the soldering surface of the solder ribbon 900a. At this time, the transmission mechanism 300 transmits the solder ribbon substrate 900 along a preset transmission path. The coating wheel 210 is positioned on the transmission path of the solder ribbon substrate 900. Since the coating wheel 210 is radially housed within the receiving cavity 110 and can contact the molten solder within the receiving cavity 110, a portion of the outer peripheral surface of the coating wheel 210 can abut against the first preset surface 901 of the solder ribbon substrate 900 when the coating wheel 210 rotates around a preset axis. This coats the solder ribbon 900a with the molten solder coating onto the first preset surface 901 of the solder ribbon substrate 900, and finally solidifies to form a tin coating layer 940 on the solder ribbon 900a. Figure 6 (As shown). This solder ribbon coating apparatus only applies tin to the soldering surface of the solder ribbon substrate 900, while the non-soldering surface of the solder ribbon substrate 900 is not tinned. This not only reduces tin consumption and material costs during the preparation of the solder ribbon 900a, but also results in higher optical reflectivity on the non-soldering surface of the final solar cell, thereby improving the light absorption efficiency of the solar cell and ultimately leading to higher photoelectric conversion efficiency.

[0084] The solder ribbon coating apparatus provided in this application is compatible with existing solder ribbon production lines. Users only need to add a coating wheel 210 above the existing solder bath to obtain molten solder, without requiring significant modifications to the existing production line. The equipment modification cost is low, facilitating industrialization. Furthermore, when the solder ribbon 900a ultimately prepared by this solder ribbon coating apparatus is soldered onto a solar cell, the module power is increased by up to approximately 0.8% under the same illumination conditions.

[0085] It should be noted that when the coating solution is molten tin, the molten tin can be a tin-lead alloy, a tin-bismuth alloy, a tin-silver-copper alloy, etc., and there are no special restrictions on this.

[0086] It should be noted that the solder strip substrate 900 can be made of metal materials such as copper or aluminum.

[0087] It should be noted that the coating liquid can be any other desired coating liquid, and the first preset surface 901 of the solder ribbon substrate 900 can also be any other surface on the surface of the solder ribbon substrate 900; no special limitation is made in this regard. If it is necessary to coat any surface or any area of ​​the solder ribbon substrate 900 with other coating liquids, the solder ribbon coating apparatus provided in this application can also be used for coating.

[0088] It should be noted that the material of the solder strip substrate 900 can be a highly conductive metal, alloy, or composite metal, such as copper, silver-clad copper, nickel-clad copper, copper-clad aluminum, etc., and there is no special limitation in this regard. In one specific embodiment, the material of the solder strip substrate 900 is copper. The cross-sectional shape of the solder strip substrate 900 can be triangular, flat (rectangular, square, trapezoidal, etc.), pentagonal, hexagonal, or other polygonal shapes and combinations thereof, and there is no special limitation in this regard.

[0089] It should be noted that after a series of coating and other operations are performed on the solder ribbon substrate 900, the final finished solder ribbon 900a is formed. In other words, the solder ribbon substrate 900 is an intermediate state in the processing of the solder ribbon 900a.

[0090] The following is a detailed description of the structure of the solder ribbon coating apparatus. Please refer to [link / reference needed]. Figure 2-4 , Figure 2 It shows Figure 1 A schematic diagram of the limiting mechanism 400, the first coating mechanism 200, and the solder strip substrate 900 in the solder strip coating apparatus shown. Figure 3 A schematic diagram of a limiting mechanism 400, a first coating mechanism 200, and a solder strip substrate 900 in a solder strip coating apparatus provided in other embodiments of this application is shown. Figure 4 The diagram shows a limiting mechanism 400, a first coating mechanism 200, and a solder strip substrate 900 in a solder strip coating apparatus provided in some embodiments of this application.

[0091] Please see Figures 1-4 In some embodiments, the first coating mechanism 200 further includes a rotating shaft 220, and a coating wheel 210 is sleeved and installed on the outer periphery of the rotating shaft 220, and the coating wheel 210 can rotate synchronously with the rotating shaft 220. The rotation of the coating wheel 210 around a preset axis is the same as the rotation around the axis of the rotating shaft 220.

[0092] Please see Figure 1 In some embodiments, the transmission mechanism 300 includes an unwinding assembly 310 located upstream of the first coating mechanism 200 and a winding assembly 320 located downstream of the first coating mechanism 200. The unwinding and winding operations of the unwinding assembly 310 and the winding assembly 320 cooperate to achieve the transmission of the solder strip substrate 900 along a preset transmission path.

[0093] In some embodiments, the first coating mechanism 200 further includes a speed regulating component; the speed regulating component is connected to the coating wheel 210; the speed regulating component is used to adjust the linear speed V1 of the coating wheel rotation so that V1 is the same as the transmission speed V2 of the transmission mechanism 300. By adjusting the linear speed V1 of the coating wheel rotation to be the same as the transmission speed V2 of the transmission mechanism 300, relative slippage will not occur between the solder ribbon substrate 900 and the coating wheel 210 during the coating process, thereby effectively ensuring the coating accuracy of the coating wheel 210 on the first preset surface 901 of the solder ribbon substrate 900 and reducing the possibility of interruption of the coating liquid applied to the first preset surface 901 of the solder ribbon substrate 900. The speed regulating component can be a speed-adjustable motor.

[0094] In some embodiments, the first coating mechanism 200 further includes a heating element connected to the coating wheel 210, so that the temperature T of the coating wheel 210 is within a preset range. By connecting the heating element to the coating wheel 210, the temperature of the coating wheel 210 can be kept within the preset range, thereby ensuring that when the coating wheel 210 is immersed in the liquid to be coated, the temperature of the liquid to be coated is relatively high, thus keeping it in a liquid state and ensuring a certain degree of fluidity. This facilitates the coating wheel 210 in moving the liquid to be coated and finally coating it onto the first preset surface 901 of the solder strip substrate 900.

[0095] In some embodiments, the heating element is integrated inside the coating wheel 210, thereby ensuring a more uniform temperature across the entire coating wheel 210. In some embodiments, the heating element may be a heating wire.

[0096] In some embodiments, when the liquid to be coated is molten tin, the temperature T of the coating wheel 210 is between 183°C and 250°C, and the temperature control accuracy is within ±2°C, thereby maintaining the fluidity of the molten tin.

[0097] Please see Figures 1-4 In some embodiments, the ribbon coating apparatus further includes a limiting mechanism 400; the limiting mechanism 400 has a limiting hole 410 adapted to the cross-sectional shape of the ribbon substrate 900; the limiting hole 410 is used to pass through the ribbon substrate 900.

[0098] By setting the limiting mechanism 400, the conveying posture of the solder strip substrate 900 can be limited and controlled through the limiting hole 410 during the transmission process, reducing the possibility of the solder strip substrate 900 twisting, thereby ensuring that the first preset surface 901 of the solder strip substrate 900 always faces downward, and further ensuring that when the solder strip substrate 900 is coated with the coating liquid, it can be accurately coated onto the first preset surface 901.

[0099] It should be noted that the limiting hole 410 has an opening on the side facing the solder strip substrate 900, so that the hole wall of the limiting hole 410 will not scratch the coating liquid when the solder strip substrate 900 is coated with coating liquid.

[0100] The solder ribbon coating apparatus provided in this application embodiment, through the limiting mechanism 400, enables the solder ribbon substrate 900 to be coated with tin only on the first preset surface 901, thereby reducing the light reflection loss of the non-soldering surface of the final formed solder ribbon 900a, and also reducing the consumption of solder.

[0101] In some of these embodiments, such as Figure 2 As shown, the cross-sectional shape of the solder strip substrate 900 is triangular, and the limiting hole 410 is a through hole with an opening facing the side of the solder strip substrate 900 and a triangular cross-sectional shape.

[0102] In some other embodiments, such as Figure 3 As shown, the cross-sectional shape of the solder strip substrate 900 is a pentagon (a combination of an upper triangle and a lower rectangle), and the limiting hole 410 is a through hole with an opening facing the side of the solder strip substrate 900 and a cross-sectional shape of a pentagon.

[0103] Of course, when the cross-sectional shape of the welding strip substrate 900 is a circle, rectangle or any other arbitrary shape, the limiting hole 410 will be adjusted accordingly.

[0104] Please see Figures 1-4 In some embodiments, the number of limiting mechanisms 400 is at least two; along the transport direction of the solder ribbon substrate 900, at least two limiting mechanisms 400 are respectively disposed upstream and downstream of the first coating mechanism 200. By providing at least two limiting mechanisms 400, and such that at least two limiting mechanisms 400 are respectively disposed upstream and downstream of the first coating mechanism 200, the position of the solder ribbon substrate 900 located between the at least two limiting mechanisms 400 is kept with high precision, thereby ensuring that the coating surface coated by the first coating mechanism 200 when coating the first preset surface 901 of the solder ribbon substrate 900 with the coating liquid has high accuracy.

[0105] Please see Figures 2-4In some embodiments, along the transport direction of the solder ribbon substrate 900, the distance d1 between the upstream limiting mechanism 400, which is closest to the coating wheel 210, and the position where the coating wheel 210 abuts against the solder ribbon substrate 900 is defined; the distance d2 between the downstream limiting mechanism 400, which is closest to the coating wheel 210, and the position where the coating wheel 210 abuts against the solder ribbon substrate 900 is defined; d1 and d2 satisfy the relationship: d1 < d2. By setting it up this way, the first coating mechanism 200 can be positioned close to the upstream first coating mechanism 200, so that after the solder ribbon substrate 900 is coated with the coating liquid, it can only reach the downstream limiting mechanism 400 after moving a relatively long distance d2. During this process, the coating liquid gradually cools and solidifies, making it less likely to be rubbed off by the downstream limiting mechanism 400.

[0106] Please see Figure 1 In some embodiments, the ribbon coating apparatus further includes a blower mechanism 500; the blower mechanism 500 and the coating wheel 210 are disposed opposite each other along the thickness direction of the ribbon substrate 900; specifically, the thickness direction of the ribbon substrate 900 located at the blower mechanism 500 is... Figure 1 In the yy' direction; the blower mechanism 500 is equipped with a blower nozzle 510, which is used to blow air onto the second preset surface 902 of the solder strip substrate 900.

[0107] The areas of the second preset surface 902 and the first preset surface 901 do not overlap, and the second preset surface 902 and the first preset surface 901 may not be coplanar. When the second preset surface 902 and the first preset surface 901 are not coplanar, the second preset surface 902 and the first preset surface 901 of the solder strip substrate 900 have an angle greater than 0°, such as... Figures 4-6 As shown, this allows for the application of molten solder to different areas of the solder strip substrate 900 in different planes.

[0108] In some embodiments, the second preset surface 902 is the non-welding surface of the solder strip substrate 900, and it has an angle greater than 0° with the first preset surface 901 of the solder strip substrate 900.

[0109] By setting the blower mechanism 500 and the coating wheel 210 opposite each other along the thickness direction of the solder strip substrate 900, the blower nozzle 510 blows air onto the second preset surface 902 of the solder strip substrate 900, thereby reducing the possibility of coating liquid being applied to the second preset surface 902.

[0110] In some embodiments, the first preset surface 901 is the soldering surface of the solder strip substrate 900; the second preset surface 902 is the non-soldering surface of the solder strip substrate 900. When the liquid to be coated is molten solder, it is possible to coat the molten solder only on the soldering surface of the solder strip substrate 900, while leaving the non-soldering surface uncoated.

[0111] In some embodiments, the ribbon coating apparatus further includes a blower mechanism 500; along the transport direction of the ribbon substrate 900, the blower mechanism 500 is disposed between the first coating mechanism 200 and the limiting mechanism 400 located downstream of the first coating mechanism (200) and having the coating wheel 210 closest to it; along the thickness direction of the ribbon substrate 900, the blower mechanism 500 is disposed on the side of the ribbon substrate 900 away from the first coating mechanism 200; the blower mechanism 500 is provided with a blower nozzle 510 for blowing air onto the second preset surface 902 of the ribbon substrate 900.

[0112] By providing a blower mechanism 500 between the first coating mechanism 200 and the limiting mechanism 400 located downstream of the first coating mechanism 200 and closest to the coating wheel 210, when the coating liquid is applied to the first preset surface 901 of the solder ribbon substrate 900 by the first coating mechanism 200, the second preset surface 902 of the solder ribbon substrate 900 can be blown by the air outlet 510 of the blower mechanism 500 during the transmission process, thereby reducing the possibility that the coating liquid is applied to the second preset surface 902.

[0113] Please see Figure 1 In some embodiments, the ribbon coating apparatus further includes a cooling mechanism 600; the cooling mechanism 600 is located downstream of the first coating mechanism 200 along the transport direction of the ribbon substrate 900; and the cooling mechanism 600 is located downstream of the limiting mechanism 400 furthest from the coating wheel 210, and also downstream of the receiving member 100; the cooling mechanism 600 is used to cool the ribbon substrate 900; specifically, the transport direction of the ribbon substrate 900 is... Figure 1 The arrow in the diagram points in the direction of A.

[0114] By setting up a cooling mechanism 600, the liquid to be coated on the first preset surface 901 of the solder ribbon substrate 900 can be rapidly cooled and solidified to form a coating layer 940. Figure 6 As shown, this improves the adhesion strength between the coating layer 940 and the solder ribbon substrate 900, thereby facilitating subsequent winding operations of the solder ribbon substrate 900. In some embodiments, the cooling mechanism 600 is an air duct cooling mechanism.

[0115] In some embodiments, the ribbon coating apparatus further includes an adjustment mechanism; along the transport direction of the ribbon substrate 900, the adjustment mechanism is disposed between the limiting mechanism 400, located downstream of the first coating mechanism 200 and furthest from the coating wheel 210, and the cooling mechanism 600; the adjustment mechanism is used to adjust the thickness of the coating liquid applied to the ribbon substrate 900. By providing the adjustment mechanism, the thickness of the coating liquid applied to the first preset surface 901 of the ribbon substrate 900 can be adjusted, making the thickness of the final cured coating layer 940 more precise. Furthermore, by placing the adjustment mechanism downstream of the first coating mechanism 200 and furthest from the coating wheel 210, between the limiting mechanism 400 and the cooling mechanism 600, it is easier to adjust the thickness of the coating liquid before it has completely cooled and cured onto the ribbon substrate 900.

[0116] In some embodiments, the adjustment mechanism includes an air duct and an air knife. The air duct is connected to an air source; the air knife is connected to one end of the air duct and is positioned facing the first preset surface 901 of the solder strip substrate 900; the air knife is used to blow the gas in the air duct onto the first preset surface 901 of the solder strip substrate 900 to adjust the thickness of the coating liquid on the first preset surface 901 of the solder strip substrate 900. By blowing the airflow in the air duct onto the first preset surface 901 of the solder strip substrate 900 through the air knife, the thickness of the coating liquid on the first preset surface 901 of the solder strip substrate 900 is adjusted, so that the thickness of the coating liquid on the first preset surface 901 of the solder strip substrate 900 is more uniform.

[0117] In some embodiments, the first coating mechanism 200 further includes a moving component; the moving component is connected to the coating wheel 210 and is capable of driving the coating wheel 210 to move closer to or further away from the solder strip substrate 900.

[0118] By setting a moving component to drive the coating wheel 210 to move closer to or further away from the solder ribbon substrate 900, the thickness of the coating liquid applied to the first preset surface 901 of the solder ribbon substrate 900 can be adjusted according to processing requirements, making the solder ribbon coating device more versatile. Simultaneously, the distance between the first preset surface 901 and the coating wheel 210 can be adjusted, ensuring that the coating reaches the first preset surface 901 during the coating process and reducing the possibility of coating on the second preset surface 902.

[0119] Please see Figure 1In some embodiments, the solder ribbon coating apparatus further includes a second coating mechanism 700; the second coating mechanism 700 is disposed upstream of the limiting mechanism 400 along the conveying direction of the solder ribbon substrate 900; the second coating mechanism 700 is used to coat flux 930 onto the first preset surface 901 of the solder ribbon substrate 900. By coating the first preset surface 901 of the solder ribbon substrate 900 with flux 930 by the second coating mechanism 700, the solder ribbon substrate 900 can have a better welding effect during subsequent welding operations. Specifically, the second coating mechanism 700 includes a flux tank, in which a felt is placed, and the felt is impregnated with flux 930. When the first preset surface 901 of the solder ribbon substrate 900 passes through the flux tank, flux 930 can adhere to the surface of the solder ribbon substrate 900.

[0120] In some embodiments, the solder ribbon coating apparatus further includes an annealing mechanism; the annealing mechanism is located upstream of the second coating mechanism 700 along the transport direction of the solder ribbon substrate 900; the annealing mechanism is used to anneal the solder ribbon substrate 900. By providing the annealing mechanism, the internal stress of the solder ribbon substrate 900 is eliminated, thereby improving the dimensional stability and safety of the solder ribbon substrate 900, and also improving the grain structure of the solder ribbon substrate 900, thereby improving the plasticity of the solder ribbon substrate 900.

[0121] Please see Figure 1 In some embodiments, the ribbon 900a coating mechanism further includes a pressure roller forming mechanism 800; the pressure roller forming mechanism 800 is disposed upstream of the annealing mechanism along the conveying direction of the ribbon substrate 900; the pressure roller forming mechanism 800 is used to press the cross-sectional shape of the ribbon substrate 900 into a preset shape. By providing the pressure roller forming mechanism 800, the cross-sectional shape of the ribbon substrate 900 is pressed into a preset shape. For example... Figure 2 The cross-sectional shape of the solder strip substrate 900 is triangular. Figure 3 The cross-sectional shape of the welding strip substrate 900 is pentagonal. Figure 4 The welding strip substrate 900 in the text is a composite welding strip substrate 900 with different cross-sectional areas in different sections along the length direction of the welding strip substrate 900.

[0122] In some of these embodiments, when it is necessary to prepare such Figure 4 When the composite welding strip substrate 900 has different cross-sectional shapes and sizes, as shown, the pressure roller forming mechanism 800 includes a first pressure roller 810 with a normal outer peripheral surface and a second pressure roller 820 with convex and concave outer peripheral surfaces. When the welding strip substrate 900 passes between the two pressure rollers, it can be formed under the pressing action of the two pressure rollers to produce a composite welding strip substrate 900 with different cross-sectional shapes and sizes. Figure 4 The diagram shows a coated section 910 with a large cross-sectional area and an uncoated section 920 with a small cross-sectional area, which are connected to each other and arranged in a loop.

[0123] Please see Figures 1-3 In some embodiments, the entire outer peripheral surface of the coating wheel 210 is configured with a coating surface that contacts the solder ribbon substrate 900. By configuring the entire outer peripheral surface of the coating wheel 210 with a coating surface that contacts the solder ribbon substrate 900, it is possible to achieve the following: Figures 1-3 As shown, the first predetermined surface 901 of the final coated solder ribbon substrate 900 is continuously coated with the coating liquid, and then the first predetermined surface 901 of the solder ribbon substrate 900 is cooled and solidified to form a continuous coating layer 940. Figure 6 (As shown).

[0124] Please see Figure 4 In some embodiments, the coating wheel 210 includes at least one protrusion 211 and at least one recess 212 along its circumference; the minimum distance of the protrusion 211 relative to a preset axis is greater than the maximum distance of the recess 212 relative to the preset axis; when the coating wheel 210 rotates around the preset axis to a first preset position, the protrusion 211 abuts against the first preset surface 901 of the solder strip substrate 900 along the radial direction of the coating wheel 210; specifically, the first preset position is the position where the minimum distance of the protrusion 211 relative to the solder strip substrate 900 is when the coating wheel 210 rotates around the preset axis; when the coating wheel 210 rotates around the preset axis to a second preset position, the recess 212 and the solder strip substrate 900 are disposed opposite to each other along the thickness direction of the solder strip substrate 900 and have a gap along the radial direction of the coating wheel 210; specifically, the second preset position is the position where the minimum distance of the recess 212 relative to the solder strip substrate 900 is when the coating wheel 210 rotates around the preset axis.

[0125] By configuring the coating wheel 210 circumferentially to include at least one protrusion 211 and at least one recess 212, when the coating wheel 210 rotates around a preset axis, the protrusion 211 can abut against the first preset surface 901 of the solder ribbon substrate 900 and coat the solder ribbon substrate 900 at the point of contact with it with the coating liquid. The recess 212, since it does not abut against the first preset surface 901 of the solder ribbon substrate 900, will not coat the opposite solder ribbon substrate 900 with the coating liquid. Therefore, the coating liquid applied to the first preset surface 901 of the final solder ribbon substrate 900 has an intermittent structure, and the final coating layer 940 formed by cooling and solidification also has an intermittent structure, to meet the needs of different welding scenarios.

[0126] It should be noted that the lengths of the protrusion 211 and the concave portion 212 are matched to the dimensions of the photovoltaic cell. This ensures that the final solder ribbon 900a is coated with a coating layer 940 (tin layer) in the soldering area of ​​the photovoltaic cell. Figure 6 As shown in the figure, the non-soldering area is not coated with coating layer 940, which further reduces solder consumption.

[0127] Please see Figure 4 In some embodiments, the minimum distance d3 of the protrusion 211 relative to a preset axis and the maximum distance d4 of the concave portion 212 relative to a preset axis satisfy the condition: d3-d4≥10mm. By setting the minimum distance d3 of the protrusion 211 relative to the preset axis to be greater than or equal to the maximum distance d4 of the concave portion 212 relative to the preset axis by 10mm, the height difference between the protrusion 211 and the concave portion 212 is sufficiently large, reducing the possibility that the coating liquid on the protrusion 211 will flow to the concave portion 212 due to rotational inertia and come into contact with the uncoated section 920 of the solder strip substrate 900 during the rotation of the coating wheel 210.

[0128] In one embodiment, d3-d4 = 10 mm. In another embodiment, d3-d4 = 20 mm. In yet another embodiment, d3-d4 = 15 mm.

[0129] Please see Figure 4 In some embodiments, the coating wheel 210 includes a plurality of protrusions 211 and a plurality of recesses 212; the protrusions 211 and recesses 212 are arranged alternately in sequence. By configuring the coating wheel 210 with a plurality of protrusions 211 and a plurality of recesses 212, and arranging them alternately in sequence, that is, each end of any protrusion 211 is connected to a recess 212, and each end of any recess 212 is connected to a protrusion 211. This results in the final solder ribbon 900a having interconnected and cyclically arranged coated sections 910 and uncoated sections 920. When the coating liquid is molten solder, the selective segmented tinning effect of the irregularly shaped solder ribbon 900a is achieved.

[0130] Please see Figure 4 and combined Figure 5 In some embodiments, the solder ribbon substrate 900 includes coated sections 910 and uncoated sections 920 that are connected to each other and arranged in a circular manner; the solder ribbon coating apparatus also includes limiting mechanisms 400, the number of which is at least four; at least two limiting mechanisms 400 are disposed upstream of the first coating mechanism 200; at least two limiting mechanisms 400 are disposed downstream of the first coating mechanism 200; along the transport direction of the solder ribbon substrate 900, the minimum distance d5 between two adjacent limiting mechanisms 400 located upstream of the first coating mechanism 200 is greater than the larger of the length d6 of the coated section 910 and the length d7 of the uncoated section 920, and less than the sum of the length d6 of the coated section 910 and the length d7 of the uncoated section 920.

[0131] If the length d6 of the coated section 910 is greater than the length d7 of the uncoated section 920, then d5 is greater than d6 and less than the sum of d6 and d7. If the length d6 of the coated section 910 is less than the length d7 of the uncoated section 920, then d5 is greater than d7 and less than the sum of d6 and d7. This arrangement ensures that when the solder ribbon substrate 900 passes upstream of the first coating mechanism 200, at least one of the at least two limiting mechanisms 400 passes through the coated section 910, and the other passes through the uncoated section 920. When the cross-sectional sizes of the coated section 910 and the uncoated section 920 are different, at least two limiting mechanisms 400 will respectively limit the coated section 910 and the uncoated section 920 with different cross-sectional sizes, thereby reducing the possibility of the solder ribbon substrate 900 getting stuck or shaking during transmission. For example, when both limiting mechanisms 400 limit the coated section 910, and when the solder strip substrate 900 needs to be transferred, the limiting mechanism 400 needs to limit the uncoated section 920 again. Since the coated section 910 and the uncoated section 920 have different cross-sectional sizes, jamming or shaking may easily occur during the switching process. This application can reduce such jamming or shaking.

[0132] In some embodiments, along the transport direction of the solder strip substrate 900, the minimum distance d8 between two adjacent limiting mechanisms 400 downstream of the first coating mechanism 200 is greater than the larger of the length d6 of the coated section 910 and the length d7 of the uncoated section 920, and less than the sum of the length d6 of the coated section 910 and the length d7 of the uncoated section 920.

[0133] If the length d6 of the coated section 910 is greater than the length d7 of the uncoated section 920, then d8 is greater than d6 and less than the sum of d6 and d7. If the length d6 of the coated section 910 is less than the length d7 of the uncoated section 920, then d8 is greater than d7 and less than the sum of d6 and d7. This arrangement ensures that when the solder ribbon substrate 900 passes downstream of the first coating mechanism 200, at least one of the at least two limiting mechanisms 400 passes through the coated section 910, and the other passes through the uncoated section 920. When the cross-sectional sizes of the coated section 910 and the uncoated section 920 are different, at least two limiting mechanisms 400 will respectively limit the coated section 910 and the uncoated section 920 with different cross-sectional sizes, thereby reducing the possibility of the solder ribbon substrate 900 getting stuck or shaking during transmission. For example, when both limiting mechanisms 400 limit the coated section 910, and when the solder strip substrate 900 needs to be transferred, the limiting mechanism 400 needs to limit the uncoated section 920 again. Since the coated section 910 and the uncoated section 920 have different cross-sectional sizes, jamming or shaking may easily occur during the switching process. This application can reduce such jamming or shaking.

[0134] In some embodiments, the coated section 910 has a triangular cross-sectional shape, while the uncoated section 920 has a rectangular cross-sectional shape.

[0135] Please see Figure 5 and Figure 6 , Figure 5 It shows Figure 4 A schematic diagram of the solder strip substrate is shown. Figure 6 It shows Figure 5 The cross-sectional schematic diagram at point AA is shown. This application also provides a solder strip 900a, which is prepared using the solder strip coating apparatus described in some of the above embodiments. Figure 4 (As shown); the solder strip substrate 900 includes coated sections 910 and uncoated sections 920 that are connected to each other and arranged in a circular manner; when the coating wheel 210 rotates around a preset axis to a first preset position, the protrusion 211 abuts against the first preset surface 901 of the coating section 910 along the radial direction of the coating wheel 210; when the coating wheel 210 rotates around the preset axis to a second preset position, the concave portion 212 and the uncoated section 920 are arranged opposite to each other along the thickness direction of the solder strip substrate 900 and have a gap.

[0136] The solder ribbon 900a to be protected in this application embodiment is prepared by the solder ribbon coating apparatus provided in this application, so that the final solder ribbon 900a includes coated sections 910 and uncoated sections 920 that are connected to each other and arranged in a circular manner. The coated sections 910 are finally coated to form a coating layer 940 (tin layer). Figure 6 As shown), the uncoated section 920 does not have a coating layer 940, which results in less tin consumption and lower material costs when preparing the solder ribbon 900a. It also allows for higher optical reflectivity of the non-soldering surface of the solder ribbon 900a on the final solar cell, thereby improving the light absorption efficiency of the solar cell and ultimately resulting in higher photoelectric conversion efficiency.

[0137] In some embodiments, along the transport direction of the solder ribbon substrate 900, the length of the coating section 910 is the same as the length of the protrusion 211 along the circumferential direction of the coating wheel 210. By making the length of the coating section 910 the same as the length of the protrusion 211 along the circumferential direction of the coating wheel 210, the protrusion 211 can be coated over the entire coating section 910 during the rotation of the coating wheel 210. This results in the coating section 910 of the prepared solder ribbon 900a having the same length as the coating layer 940, leading to better welding performance with the solar cell and reducing the possibility of incomplete soldering.

[0138] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0139] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A welding strip coating apparatus, characterized in that, The welding strip coating device includes: The receiving element (100) is configured with a receiving cavity (110) for holding the liquid to be coated. A transmission mechanism (300) is used to transmit the welding strip substrate (900) along a preset transmission path. The first coating mechanism (200) is disposed on the preset transmission path of the welding strip substrate (900) and includes a coating wheel (210) that rotates about a preset axis; the coating wheel (210) is accommodated in the accommodating cavity (110) along its radial portion and is able to contact the liquid to be coated; When the coating wheel (210) rotates around the preset axis, a portion of the outer peripheral surface of the coating wheel (210) can abut against the first preset surface (901) of the welding strip substrate (900).

2. The welding strip coating apparatus according to claim 1, characterized in that, The first coating mechanism (200) also includes a speed regulating element; The speed adjustment component is connected to the coating wheel (210); the speed adjustment component is used to adjust the linear speed V1 of the coating wheel (210) so that V1 is the same as the transmission speed V2 of the transmission mechanism (300).

3. The welding strip coating apparatus according to claim 1, characterized in that, The first coating mechanism (200) also includes a heating element; The heating element is connected to the coating wheel (210) so that the temperature T of the coating wheel (210) is within a preset range.

4. The welding strip coating apparatus according to claim 1, characterized in that, The welding strip coating device also includes a limiting mechanism (400). The limiting mechanism (400) has a limiting hole (410) that is adapted to the cross-sectional shape of the welding strip substrate (900); the limiting hole (410) is used to pass through the welding strip substrate (900).

5. The welding strip coating apparatus according to claim 4, characterized in that, The number of the limiting mechanisms (400) is at least two; Along the transport direction of the solder strip substrate (900), at least two of the limiting mechanisms (400) are respectively disposed upstream and downstream of the first coating mechanism (200).

6. The welding strip coating apparatus according to claim 5, characterized in that, Along the transport direction of the solder strip substrate (900), the distance between the limiting mechanism (400) located upstream of the first coating mechanism (200) and closest to the coating wheel (210) and the position where the coating wheel (210) abuts against the solder strip substrate (900) is defined as d1; The distance between the limiting mechanism (400) located downstream of the first coating mechanism (200) and closest to the coating wheel (210) and the position where the coating wheel (210) abuts the solder strip substrate (900) is defined as d2; The relationship between d1 and d2 is: d1 < d2.

7. The welding strip coating apparatus according to claim 5, characterized in that, The welding strip coating device also includes a blower mechanism (500). The blower mechanism (500) and the coating wheel (210) are arranged opposite to each other along the thickness direction of the welding strip substrate (900); The blower mechanism (500) is equipped with a blower nozzle (510) for blowing air onto the second preset surface (902) of the solder strip substrate (900).

8. The welding strip coating apparatus according to claim 7, characterized in that, The first preset surface (901) is the welding surface of the solder strip substrate (900); the second preset surface (902) is the non-welding surface of the solder strip substrate (900).

9. The welding strip coating apparatus according to claim 7, characterized in that, The welding strip coating device also includes a blower mechanism (500). Along the transport direction of the solder strip substrate (900), the blower mechanism (500) is disposed between the first coating mechanism (200) and the limiting mechanism (400) located downstream of the first coating mechanism (200) and closest to the coating wheel (210); along the thickness direction of the solder strip substrate (900), the blower mechanism (500) is disposed on the side of the solder strip substrate (900) away from the first coating mechanism (200); The blower mechanism (500) is equipped with a blower nozzle (510) for blowing air onto the second preset surface (902) of the solder strip substrate (900).

10. The welding strip coating apparatus according to claim 9, characterized in that, The first preset surface (901) is the welding surface of the solder strip substrate (900); the second preset surface (902) is the non-welding surface of the solder strip substrate (900).

11. The welding strip coating apparatus according to claim 5, characterized in that, The welding strip coating device also includes a cooling mechanism (600). Along the transport direction of the welding strip substrate (900), the cooling mechanism (600) is disposed downstream of the first coating mechanism (200); and the cooling mechanism (600) is located downstream of the limiting mechanism (400) which is furthest from the coating wheel (210); The cooling mechanism (600) is used to cool the solder strip substrate (900).

12. The welding strip coating apparatus according to claim 11, characterized in that, The welding strip coating device also includes an adjustment mechanism; Along the transport direction of the welding strip substrate (900), the adjustment mechanism is disposed between the limiting mechanism (400) and the cooling mechanism (600), which is located downstream of the first coating mechanism (200) and furthest from the coating wheel (210); The adjustment mechanism is used to adjust the thickness of the coating liquid applied to the solder strip substrate (900).

13. The welding strip coating apparatus according to claim 12, characterized in that, The adjustment mechanism includes: Air duct, used to connect to the air source; An air knife is connected to one end of the air duct and is positioned toward the first preset surface (901) of the welding strip substrate (900). The air knife is used to blow the gas in the air duct to the first preset surface (901) of the welding strip substrate (900) to adjust the thickness of the coating liquid on the first preset surface (901) of the welding strip substrate (900).

14. The welding strip coating apparatus according to claim 4, characterized in that, The ribbon coating apparatus further includes a second coating mechanism (700). Along the transport direction of the solder strip substrate (900), the second coating mechanism (700) is disposed upstream of the limiting mechanism (400); The second coating mechanism (700) is used to coat the first preset surface (901) of the solder strip substrate (900) with flux (930).

15. The welding strip coating apparatus according to claim 14, characterized in that, The welding strip coating apparatus also includes an annealing mechanism; Along the transport direction of the solder strip substrate (900), the annealing mechanism is located upstream of the second coating mechanism (700); The annealing mechanism is used to anneal the solder strip substrate (900).

16. The welding strip coating apparatus according to claim 15, characterized in that, The welding strip (900a) coating mechanism also includes a pressure roller forming mechanism (800). Along the conveying direction of the welding strip substrate (900), the pressure roller forming mechanism (800) is located upstream of the annealing mechanism; The pressure roller forming mechanism (800) is used to press the cross-sectional shape of the welding strip substrate (900) into a preset shape.

17. The welding strip coating apparatus according to claim 1, characterized in that, The first coating mechanism (200) also includes a moving component; The moving component is connected to the coating wheel (210), and the moving component can drive the coating wheel (210) to move closer to or further away from the solder strip substrate (900).

18. The welding strip coating apparatus according to any one of claims 1-17, characterized in that, The entire outer circumferential surface of the coating wheel (210) is provided with a coating surface that contacts the welding strip substrate (900).

19. The welding strip coating apparatus according to any one of claims 1-17, characterized in that, The coating wheel (210) includes at least one protrusion (211) and at least one recess (212) along its circumference. The minimum distance of the protrusion (211) relative to the preset axis is greater than the maximum distance of the concave portion (212) relative to the preset axis; When the coating wheel (210) rotates around the preset axis to the first preset position, the protrusion (211) abuts against the first preset surface (901) of the welding strip substrate (900) along the radial direction of the coating wheel (210); When the coating wheel (210) rotates around the preset axis to the second preset position, along the radial direction of the coating wheel (210), the recess (212) and the welding strip substrate (900) are arranged opposite to each other along the thickness direction of the welding strip substrate (900) and have a gap.

20. The welding strip coating apparatus according to claim 19, characterized in that, The minimum distance d3 of the protrusion (211) relative to the preset axis and the maximum distance d4 of the concave portion (212) relative to the preset axis satisfy the following condition: d3-d4≥10mm.

21. The welding strip coating apparatus according to claim 19, characterized in that, The coating wheel (210) includes a plurality of the protrusions (211) and a plurality of the recesses (212). The protrusions (211) and the recesses (212) are arranged alternately in sequence.

22. The welding strip coating apparatus according to claim 19, characterized in that, The solder strip substrate (900) includes coated sections (910) and uncoated sections (920) that are connected to each other and arranged in a loop. The welding strip coating device further includes a limiting mechanism (400), and the number of the limiting mechanisms (400) is at least four; Along the transport direction of the solder strip substrate (900), at least two of the limiting mechanisms (400) are disposed upstream of the first coating mechanism (200); at least two of the limiting mechanisms (400) are disposed downstream of the first coating mechanism (200); Along the transport direction of the solder strip substrate (900), the minimum distance d5 between two adjacent limiting mechanisms (400) upstream of the first coating mechanism (200) is greater than the larger of the length d6 of the coated section (910) and the length d7 of the uncoated section (920), and less than the sum of the length d6 of the coated section (910) and the length d7 of the uncoated section (920); and / or Along the transport direction of the solder strip substrate (900), the minimum distance d8 between two adjacent limiting mechanisms (400) located downstream of the first coating mechanism (200) is greater than the larger of the length d6 of the coated section (910) and the length d7 of the uncoated section (920), and less than the sum of the length d6 of the coated section (910) and the length d7 of the uncoated section (920).

23. A welding strip, characterized in that, It is prepared using the solder strip coating apparatus as described in any one of claims 19-22; The solder strip substrate (900) includes coated sections (910) and uncoated sections (920) that are connected to each other and arranged in a loop. When the coating wheel (210) rotates around the preset axis to the first preset position, the protrusion (211) abuts against the first preset surface (901) of the coating section (910) along the radial direction of the coating wheel (210); When the coating wheel (210) rotates around the preset axis to the second preset position, along the radial direction of the coating wheel (210), the recess (212) and the uncoated section (920) are arranged opposite to each other along the thickness direction of the solder strip substrate (900) and have a gap.

24. The welding strip according to claim 23, characterized in that, Along the transport direction of the solder strip substrate (900), the length of the coating section (910) is the same as the length of the protrusion (211) along the circumferential direction of the coating wheel (210).

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