Adjustable chip device test fixture for high and low temperature environments
Patent Information
- Application Number
- CN202522040293.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-23
AI Technical Summary
[0004]（1）通用性差：一种夹具通常只能适配一种或少数几种特定尺寸的器件
[0021]本实用新型通过采用底部绝缘基座与可堆叠生瓷片单元的组合结构，实现了测试夹具在高低温环境下的优异尺寸稳定性和电气绝缘性；导电快速绕线结构设置的弹性顶针和绕线端既可保证与片式器件电极的可靠电接触又能高效绕线，模块化的生瓷片设计支持通过增减第一生瓷片数量或更换不同放置腔尺寸的第二生瓷片，快速适配多种尺寸规格的片式器件，极大提升了测试效率和夹具通用性，固定件的覆盖保护进一步增强了器件在严苛温度条件下的机械稳定性和测试一致性，整体结构兼顾了可调性、环境适应性与操作便利性。
Smart Images
Figure CN224840256U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic component testing technology, specifically relating to a test fixture for adjustable chip devices (such as chip resistors, capacitors, inductors, LTCC devices, etc.) in high and low temperature environments. Background Technology
[0002] In the production and R&D of electronic components, it is essential to test their performance under extreme high and low temperature environments to evaluate their reliability and stability. Due to their small size and leadless nature, surface-mount devices require specialized test fixtures to connect them to testing equipment.
[0003] Existing high and low temperature testing fixtures mostly use metal spring probes or fixed electrode clips. These traditional fixtures have the following obvious drawbacks:
[0004] (1) Poor versatility: A fixture can usually only be used for one or a few specific sizes of devices. For devices with different lengths, widths and thicknesses, multiple fixtures need to be prepared, which is costly and inconvenient to manage.
[0005] (2) Contact reliability issues: In high and low temperature cycling, the coefficient of thermal expansion (CTE) of the metal material and the ceramic / semiconductor device (DUT) may not match, which may lead to excessive contact pressure that damages the device, or insufficient pressure that leads to poor contact and introduces test errors.
[0006] (3) Inconvenient disassembly: Traditional fixtures usually use screw fastening or complex mechanical structures, which are very inconvenient to operate inside high temperature chambers or low temperature chambers, especially when the device under test needs to be frequently replaced, resulting in low efficiency.
[0007] (4) Heat conduction and distribution: The fixture itself may introduce additional heat capacity or thermal resistance, causing the actual temperature of the device to deviate from the ambient temperature, affecting the test accuracy.
[0008] Therefore, there is an urgent need for a general-purpose high and low temperature test fixture that can adapt to any size, has reliable contact, is easy to disassemble quickly, and has excellent thermal performance. Summary of the Invention
[0009] To address the shortcomings of existing technologies, this utility model provides an adjustable chip device test fixture for high and low temperature environments. This test fixture has a novel structure, strong versatility, reliable contact, and is easy to disassemble.
[0010] The technical solution provided by this utility model is as follows:
[0011] This utility model provides an adjustable chip device test fixture for high and low temperature environments, including a bottom insulating base and a green ceramic chip unit stacked on the bottom insulating base. The green ceramic chip unit includes several first green ceramic chips placed in the middle and second green ceramic chips placed on top. The second green ceramic chip has a placement cavity for accommodating the chip device. Several conductive fast winding structures penetrating the first green ceramic chips are embedded in the bottom insulating base. The conductive fast winding structure includes elastic pins and winding ends placed at the top and bottom. The elastic pins extend into the placement cavity to form electrical contact with the electrodes of the chip device. The placement cavity is covered with a fixing member for fixing the chip device. The green ceramic chip unit can adapt to chip devices of different sizes by increasing or decreasing the number of first green ceramic chips and / or combining second green ceramic chips with placement cavities of different sizes.
[0012] Furthermore, the conductive rapid winding structure includes a conductive hollow cylinder, and the elastic pin includes a T-shaped pin and a spring. The T-shaped pin includes a horizontal end and a vertical end. The spring is disposed inside the conductive hollow cylinder and has a horizontal end connected above it that contacts the inner wall of the conductive hollow cylinder. The vertical end penetrates the top of the conductive hollow cylinder and extends and retracts axially under the action of the spring to adapt to changes in the height of the chip device and maintain electrical contact.
[0013] Furthermore, the vertical end of the T-shaped pin that extends into the placement cavity is a flat surface.
[0014] Furthermore, an I-shaped column extends below the conductive hollow cylinder. The I-shaped column includes a first cylinder, a second cylinder, and a third cylinder connected in sequence to the conductive hollow cylinder. The diameters of the first cylinder and the third cylinder are equal and larger than the diameters of the conductive hollow cylinder and the second cylinder. The winding end is an annular groove structure formed by the first cylinder, the second cylinder, and the third cylinder. The annular groove structure is used to wind external test wires to achieve electrical connection.
[0015] Furthermore, the bottom insulating base is provided with several arched mounting grooves, the inner diameter of the arc-shaped part of the mounting groove matching the outer diameter of the conductive hollow cylinder.
[0016] Furthermore, the mounting grooves are evenly and symmetrically arranged on both sides along the length or width of the bottom insulating base.
[0017] Furthermore, the fastener is a high-temperature adhesive tape that covers and secures the sheet-type device.
[0018] Furthermore, the second raw ceramic piece has symmetrically distributed hand-removal chambers along both sides of the placement chamber.
[0019] Furthermore, both the first and second raw ceramic pieces are low-temperature co-fired ceramics.
[0020] Beneficial effects
[0021] This invention achieves excellent dimensional stability and electrical insulation of the test fixture under high and low temperature environments by adopting a combination structure of bottom insulating base and stackable green ceramic sheet units. The elastic pins and winding ends of the conductive quick-winding structure ensure reliable electrical contact with the electrodes of the chip device while enabling efficient winding. The modular green ceramic sheet design allows for quick adaptation to various sizes of chip devices by increasing or decreasing the number of first green ceramic sheets or replacing second green ceramic sheets with different placement cavity sizes, greatly improving testing efficiency and fixture versatility. The covering protection of the fixing parts further enhances the mechanical stability and testing consistency of the device under harsh temperature conditions. The overall structure takes into account adjustability, environmental adaptability, and ease of operation.
[0022] This invention allows for flexible adaptation to sheet devices of any length, width, and thickness by replacing and stacking green ceramic tile units of different sizes, achieving "one clamp for multiple uses" and significantly reducing fixture costs and management complexity. The unique quick-lock mechanism, using high-temperature adhesive tape, enables disassembly and installation processes to be completed in just a few seconds, greatly improving testing efficiency and making it particularly suitable for R&D testing scenarios requiring frequent sample changes.
[0023] The LTCC green ceramic sheet of this invention has a thermal expansion coefficient close to that of the ceramic plate device under test. During high and low temperature cycling, it maintains good and consistent contact pressure, avoiding poor contact or device damage caused by thermal mismatch, thus improving the accuracy and reliability of test data. The LTCC material has excellent thermal conductivity, enabling rapid and uniform heat transfer to the device under test, reducing the temperature gradient introduced by the fixture itself, and ensuring the authenticity of the test environment. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the overall structure of an adjustable chip device test fixture for high and low temperature environments according to the present invention.
[0025] Figure 2 This is a schematic diagram showing the disassembled structure of an adjustable chip device test fixture for high and low temperature environments according to the present invention.
[0026] Figure 3 This is a schematic diagram of the structure of the second green ceramic piece of this utility model;
[0027] Figure 4 This is a schematic diagram of the structure of the first raw ceramic piece of this utility model;
[0028] Figure 5 This is a schematic diagram of the overall structure of the conductive rapid winding structure of this utility model;
[0029] Figure 6 This is a schematic diagram of the conductive rapid winding structure of this utility model.
[0030] Figure 7 This is a schematic diagram of the bottom insulating base of this utility model;
[0031] Figure 8 This is a perspective structural diagram of the test fixture of this utility model in its assembled state;
[0032] Figure 9 This is a schematic diagram illustrating the combined use of the chip device and the test fixture of this utility model.
[0033] Explanation of reference numerals in the attached drawings: 1. Bottom insulating base; 2. First green ceramic sheet; 3. Second green ceramic sheet; 3-1. Placement cavity; 3-2. Hand removal cavity; 4. Conductive rapid winding structure; 4-1. Conductive hollow cylinder; 4-2. T-shaped pin; 4-3. Spring; 4-4. Annular groove structure. Detailed Implementation
[0034] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.
[0035] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0037] Example 1
[0038] like Figure 1 and Figure 2 As shown, this utility model embodiment provides an adjustable chip device test fixture for high and low temperature environments, including a bottom insulating base 1 and green ceramic chip units stacked on the bottom insulating base 1. The green ceramic chip unit includes several first green ceramic chips 2 placed in the middle and second green ceramic chips 3 placed on the top. The second green ceramic chip 3 has a placement cavity 3-1 for accommodating the chip device. Several conductive fast winding structures 4 penetrating the first green ceramic chips 2 are embedded in the bottom insulating base 1. The conductive fast winding structure 4 includes elastic pins and winding ends placed at the top and bottom. The elastic pins extend into the placement cavity 3-1 to form electrical contact with the electrodes of the chip device. The placement cavity 3-1 is covered with a fixing member for fixing the chip device. The green ceramic chip unit can adapt to chip devices of different sizes by increasing or decreasing the number of first green ceramic chips 2 and / or combining second green ceramic chips 3 with different sized placement cavities 3-1.
[0039] This invention achieves excellent dimensional stability and electrical insulation of the test fixture under high and low temperature environments by adopting a combination structure of bottom insulating base and stackable green ceramic sheet units. The elastic pins and winding ends of the conductive quick-winding structure ensure reliable electrical contact with the electrodes of the chip device while enabling efficient winding. The modular green ceramic sheet design allows for quick adaptation to various sizes of chip devices by increasing or decreasing the number of first green ceramic sheets or replacing second green ceramic sheets with different placement cavity sizes, greatly improving testing efficiency and fixture versatility. The covering protection of the fixing parts further enhances the mechanical stability and testing consistency of the device under harsh temperature conditions. The overall structure takes into account adjustability, environmental adaptability, and ease of operation.
[0040] Example 2
[0041] like Figure 1 and Figure 2 As shown, this utility model embodiment provides an adjustable chip device test fixture for high and low temperature environments, including a bottom insulating base 1, green ceramic chip units, and conductive fast winding structures 4. The green ceramic chip units are stacked on the bottom insulating base 1. Each green ceramic chip unit includes several first green ceramic chips 2 placed in the middle and second green ceramic chips 3 placed on top. The second green ceramic chips 3 have placement cavities 3-1 for accommodating chip devices. Several conductive fast winding structures 4 penetrating the first green ceramic chips 2 are embedded in the bottom insulating base 1. Figure 2 As shown, specifically, the conductive fast winding structure 4 has four holes, and the first green ceramic sheet 2 has four through holes. Figure 4The conductive fast winding structure 4 includes an elastic pin positioned above and a winding end positioned below. The elastic pin extends into the placement cavity 3-1 to form electrical contact with the electrodes of the chip device. The placement cavity 3-1 is covered with a fixing member for fixing the chip device. The green ceramic tile unit adapts to chip devices of different sizes by increasing or decreasing the number of first green ceramic tiles 2 and / or combining second green ceramic tiles 3 with different sizes of placement cavities 3-1. Specifically, the green ceramic tile unit adapts to chip devices of different thicknesses by adjusting the stacking number of first green ceramic tiles 2, and adapts to chip devices of different length and width specifications by replacing second green ceramic tiles 3 with different sizes of placement cavities 3-1. Figure 8 and Figure 9 ).
[0042] In this embodiment, as Figure 5 and Figure 6 As shown, the conductive rapid winding structure 4 includes a conductive hollow cylinder 4-1, and the elastic pin includes a T-shaped pin 4-2 and a spring 4-3. The T-shaped pin 4-2 includes a horizontal end and a vertical end. The spring 4-3 is disposed inside the conductive hollow cylinder 4-1 and has a horizontal end connected above it that contacts the inner wall of the conductive hollow cylinder 4-1. The vertical end penetrates the top of the conductive hollow cylinder 4-1 and extends and retracts axially under the action of the spring 4-3 to adapt to the height change of the chip device and maintain electrical contact.
[0043] In this embodiment, the vertical end of the T-shaped ejector pin 4-2 that extends into the placement cavity 3-1 is a flat surface.
[0044] In this embodiment, an I-shaped column extends below the conductive hollow cylinder 4-1. The I-shaped column includes a first cylinder, a second cylinder, and a third cylinder connected in sequence to the conductive hollow cylinder 4-1. The diameters of the first cylinder and the third cylinder are equal and larger than the diameters of the conductive hollow cylinder 4-1 and the second cylinder. The winding end is an annular groove structure 4-4 formed by the first cylinder, the second cylinder, and the third cylinder. The annular groove structure 4-4 is used to wind external test wires to achieve electrical connection.
[0045] In this embodiment, the bottom insulating base 1 has several arched mounting grooves, specifically, as shown in the example below. Figure 7 As shown, there are 4 mounting slots, and the inner diameter of the arc-shaped part of the mounting slot matches the outer diameter of the conductive hollow cylinder 4-1.
[0046] In this embodiment, the mounting grooves are uniformly and symmetrically arranged on both sides along the length or width of the bottom insulating base 1.
[0047] In this embodiment, the fastener is a high-temperature adhesive tape that covers and secures the sheet-type device.
[0048] In this embodiment, as Figure 3As shown, the second raw ceramic piece 3 has symmetrically distributed hand-removal chambers 3-2 along both sides of the placement chamber 3-1.
[0049] In this embodiment, both the first green ceramic sheet 2 and the second green ceramic sheet 3 are low-temperature co-fired ceramics (LTCC).
[0050] Test operation procedure:
[0051] (1) Prepare the cavity: Based on the thickness of the device under test (DUT), select and stack the appropriate number of first green ceramic plates and / or combine second green ceramic plates with different sized placement cavities to form a size-fitting placement cavity.
[0052] (2) Install the winding mechanism: Insert the four conductive fast winding mechanisms into the corresponding mounting slots of the bottom insulating base to ensure that they are firmly installed and have good electrical contact.
[0053] (3) Placement of the device: Carefully place the chip device into the placement cavity formed by the stacking of the first and second green ceramic chips, ensuring that the electrodes of the chip device are aligned with the contact points on the green ceramic chips.
[0054] (4) Fixing the device: Use high temperature tape to fix the top surface of the chip device so that the bottom lead of the chip device forms a reliable electrical contact with the elastic pin.
[0055] (5) Connecting wires: Securely wind the ends of the test equipment wires into the rapid annular groove structure of the conductive rapid winding mechanism and connect them to the test system.
[0056] (6) Conduct the test: Place the assembled test fixture into the high and low temperature test chamber, set the target temperature, and start the electrical performance test after the temperature stabilizes.
[0057] (7) Sample replacement: After the test is completed, open the high and low temperature chamber, peel off the high temperature tape on the top, and take out the tested device. You can then quickly and easily replace the next sample to be tested and repeat the above steps.
[0058] The above description is merely a preferred embodiment of this utility model and does not constitute any limitation on this utility model. Any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model, or modify it into equivalent embodiments, without departing from the scope of the technical solution of this utility model. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technology of this utility model without departing from the scope of the technical solution of this utility model shall fall within the protection scope of this technical solution.
Claims
1. An adjustable chip device test fixture for high and low temperature environments, characterized in that, The device includes a bottom insulating base and green ceramic chip units stacked on the bottom insulating base. Each green ceramic chip unit includes several first green ceramic chips placed in the middle and second green ceramic chips placed on top. The second green ceramic chips have placement cavities for accommodating chip devices. Several conductive fast-winding structures penetrating the first green ceramic chips are embedded in the bottom insulating base. Each conductive fast-winding structure includes elastic pins and winding ends placed at the top and bottom. The elastic pins extend into the placement cavities to form electrical contact with the electrodes of the chip devices. The placement cavities are covered with fasteners for fixing the chip devices. The green ceramic chip unit can adapt to chip devices of different sizes by increasing or decreasing the number of first green ceramic chips and / or combining second green ceramic chips with placement cavities of different sizes.
2. The adjustable chip device test fixture for high and low temperature environments according to claim 1, characterized in that, The conductive rapid winding structure includes a conductive hollow cylinder, and the elastic pin includes a T-shaped pin and a spring. The T-shaped pin includes a horizontal end and a vertical end. The spring is located inside the conductive hollow cylinder and has a horizontal end connected above it that contacts the inner wall of the conductive hollow cylinder. The vertical end penetrates the top of the conductive hollow cylinder and extends and retracts axially under the action of the spring to adapt to changes in the height of the chip device and maintain electrical contact.
3. The adjustable chip device test fixture for high and low temperature environments according to claim 2, characterized in that, The vertical end of the T-shaped pin that extends into the placement cavity is a flat surface.
4. The adjustable chip device test fixture for high and low temperature environments according to claim 2, characterized in that, Below the conductive hollow cylinder extends an I-shaped column, which includes a first cylinder, a second cylinder, and a third cylinder connected in sequence to the conductive hollow cylinder. The diameters of the first cylinder and the third cylinder are equal and larger than the diameters of the conductive hollow cylinder and the second cylinder. The winding end is an annular groove structure formed by the first cylinder, the second cylinder, and the third cylinder. The annular groove structure is used to wind external test wires to achieve electrical connection.
5. The adjustable chip device test fixture for high and low temperature environments according to claim 2, characterized in that, The bottom insulating base has several arched mounting grooves, the inner diameter of which matches the outer diameter of the conductive hollow cylinder.
6. The adjustable chip device test fixture for high and low temperature environments according to claim 5, characterized in that, The mounting grooves are evenly and symmetrically arranged on both sides along the length or width of the bottom insulating base.
7. The adjustable chip device test fixture for high and low temperature environments according to claim 1, characterized in that, The fastener is a high-temperature adhesive tape that covers and secures the sheet-type device.
8. The adjustable chip device test fixture for high and low temperature environments according to claim 1, characterized in that, The second raw ceramic piece has symmetrically distributed hand-removal chambers along both sides of the placement chamber.
9. The adjustable chip device test fixture for high and low temperature environments according to claim 1, characterized in that, Both the first and second raw ceramic pieces are low-temperature co-fired ceramics.