Module light plate, display module and display screen

Abstract

The application discloses a module lamp plate, a display module and a display screen. The module lamp plate comprises a lamp plate body and a plurality of LED lamp beads. The lamp plate body is provided with a plurality of lamp bead welding areas. Each LED lamp bead is provided with a plurality of welding legs. Each lamp bead welding area is provided with a plurality of welding sites. The plurality of welding sites are spacedly distributed in the corresponding lamp bead welding area to form a plurality of gap areas between the plurality of welding sites. In each lamp bead welding area, welding agents are arranged on all the welding sites, and underfill glue is arranged on at least part of the gap areas. The plurality of welding legs of each LED lamp bead are welded on the corresponding welding sites through the corresponding welding agents, and the underfill glue fills the gap between each LED lamp bead and the corresponding welding site. The technical scheme can enhance the bonding force between the LED lamp bead and the lamp plate body, and ensure sufficient filling protection between the lamp bead welding area of the lamp plate body and the welding leg of each LED lamp bead, so as to reduce short circuit, caterpillar and other problems caused by moisture absorption.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a module light board, a display module, and a display screen. Background Technology

[0002] Mini LED display packaging technology mainly uses COB packaging. However, with the development of Mini LED displays and market demand, various packaging methods have emerged, and their application scenarios are becoming more and more diverse.

[0003] Currently, the most common Mini LED display packaging processes on the market are molding + film lamination and spraying + integrated film (also called mold-free process). These two processes typically involve soldering the Mini LED chip (i.e., LED beads) onto the main body of the light board, then directly wrapping the Mini LED chip with epoxy resin through molding or spraying for protection and moisture resistance. However, in actual use, it has been found that gaps exist between the solder pads in the soldering area. Even after the Mini LED chip is soldered and fixed to the main body of the light board, gaps remain between the Mini LED chip and the main body. Current Mini LED display packaging processes cannot ensure that the epoxy resin fully fills these gaps. This not only leads to insufficient adhesion between the Mini LED chip and the main body of the light board, but also prevents adequate filling and protection between the Mini LED chip and the main body, making it prone to short circuits and "caterpillar" defects due to moisture absorption. Utility Model Content

[0004] This application provides a module lamp board, a display module, and a display screen, aiming to improve the technical problems of existing processes that cannot ensure that epoxy resin is fully filled into the gap between the LED beads and the lamp board body. This not only results in insufficient adhesion between the LED beads and the lamp board body, but also makes it impossible to fully fill and protect the Mini LED chip with the lamp board body, which can easily lead to short circuits, caterpillar-like phenomena caused by moisture absorption.

[0005] Therefore, this application provides a modular light board, which includes a light board body and a plurality of LED beads. A plurality of LED bead welding areas are provided on one side surface of the light board body, and the plurality of LED bead welding areas are provided in a one-to-one correspondence with the plurality of LED beads. Each LED bead is provided with multiple solder feet, and each LED bead welding area is provided with multiple welding positions corresponding to the multiple solder feet one by one. The multiple welding positions are distributed at intervals in the corresponding LED bead welding area to form multiple gap areas between the multiple welding positions. In each of the LED bead welding areas, welding flux is provided on all the welding positions, and at least some of the gap areas are provided with underfill adhesive. The plurality of welding feet of each LED bead are welded to the corresponding welding positions by the corresponding welding flux, and the underfill adhesive fills the gap between each LED bead and the corresponding welding position.

[0006] Optionally, in some embodiments of this application, the underfill is an epoxy resin adhesive.

[0007] Optionally, in some embodiments of this application, the underfill is a composite structure of epoxy resin adhesive and thixotropic agent.

[0008] Optionally, in some embodiments of this application, all the welding positions in each of the lamp bead welding areas are arranged in two columns, and a first gap area is formed between each pair of oppositely arranged welding positions in the two columns, and the bottom filler is dotted in each of the first gap areas.

[0009] Optionally, in some embodiments of this application, all the welding positions in each of the lamp bead welding areas are arranged in two columns, and a first gap area is formed between each pair of oppositely arranged welding positions in the two columns, and the bottom filler extends in strips in all the first gap areas.

[0010] Optionally, in some embodiments of this application, the underfill and the welding agent on the adjacent welding position are spaced apart.

[0011] Optionally, in some embodiments of this application, the module light board further includes an encapsulating adhesive layer, which covers and is disposed on one side surface of the light board body on which a plurality of LED beads are disposed, and places all the plurality of LED beads in the sealed protection of the encapsulating adhesive layer.

[0012] Optionally, in some embodiments of this application, the module light panel further includes a black functional film, which is attached to the surface of the encapsulating adhesive layer away from the main body of the light panel.

[0013] In addition, this application embodiment also provides a display module, which includes the module light panel of any of the above.

[0014] In addition, this application embodiment also provides a display screen, which includes at least one of the above-described display modules.

[0015] The technical solution provided in this application, through the aforementioned structural arrangement, ensures that in each LED chip welding area, in addition to providing solder at all welding positions, a base filler is at least partially provided in the gap area formed between each welding position. This allows the base filler to fill the gap between each LED chip and its corresponding welding position when multiple solder feet of each LED chip are welded to their respective welding positions with the corresponding solder. This ensures sufficient filling and protection between the LED chip welding area of ​​the lamp board body and the solder feet of each LED chip, enhancing the adhesion between each LED chip and the lamp board body while reducing problems such as short circuits and "caterpillar" defects caused by moisture absorption. Therefore, this technical solution effectively improves the technical problem of existing processes failing to ensure sufficient filling of the gap between the LED chip and the lamp board body with epoxy resin, resulting in insufficient adhesion between the LED chip and the lamp board body, and inadequate filling and protection between the Mini LED chip and the lamp board body, which easily leads to short circuits and "caterpillar" defects caused by moisture absorption. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the first structure of the module light board in the embodiments of this application.

[0018] Figure 2 for Figure 1 The diagram shows a first top view of the main body of the module light panel.

[0019] Figure 3 for Figure 1 The diagram shows a second structural representation of the main body of the module light panel.

[0020] Figure 4 This is a schematic diagram of a second structure of the module light board in an embodiment of this application.

[0021] Figure label: 1. Module light board; 10. Light board body; 11. Lamp bead welding area; 111. Welding position; 112. First gap area; 113. Second gap area; 13. Welding flux; 14. Bottom filler; 20. LED lamp bead; 21. Solder foot; 30. Encapsulating adhesive layer; 40. Black functional film. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0024] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, the user should consider such a combination of technical solutions to be non-existent and not within the scope of protection claimed in this application.

[0025] In one embodiment, such as Figures 1 to 4 As shown, this application embodiment provides a modular light board 1, which includes a light board body 10 and a plurality of LED beads 20. A plurality of LED bead welding areas 11 are provided on one side surface of the light board body 10, with each LED bead welding area 11 corresponding to one of the LED beads 20. Each LED bead 20 has a plurality of solder feet 21, and each LED bead welding area 11 has a plurality of welding positions 111 corresponding to the solder feet 21. The welding positions 111 are spaced apart in their respective LED bead welding areas 11 to form a plurality of gap areas between the welding positions 111. In each LED bead welding area 11, all welding positions 111 are provided with soldering flux 13, and at least some gap areas are provided with underfill adhesive 14. The solder feet 21 of each LED bead 20 are welded to their respective welding positions 111 by the corresponding soldering flux 13, and the underfill adhesive 14 fills the gaps between each LED bead 20 and its corresponding welding position 111.

[0026] It is understood that the module light board 1 in this embodiment is mainly used for LED display, that is, through the control of the corresponding LED display driving circuit, the LED beads 20 of the module light board 1 are made to work to realize the display of corresponding content. Depending on the type of LED beads 20 used for LED display, the number of solder feet 21 on the LED beads 20 can be set to two, three, four or six. In this case, each bead soldering area 11 needs to be provided with a corresponding number of soldering positions 111, so that the soldering positions 111 provided correspond one-to-one with the solder feet 21 on the corresponding LED beads 20. The aforementioned multiple soldering positions 111 are spaced apart in the corresponding LED chip soldering area 11. Specifically, this means that a certain gap is reserved between any two adjacent soldering positions 111 (this gap can specifically form a gap area). The distance of this gap is generally closely related to the distance between the two corresponding solder feet 21 on the corresponding LED chip 20 (i.e., the distance between them is equal or close). By setting this gap, it is ensured that when each solder foot 21 is soldered to the corresponding soldering position 111, there will be no short circuit caused by contact with other adjacent soldering positions 111. The aforementioned soldering agent 13 is preferably solder paste to ensure its soldering performance. The aforementioned underfill adhesive 14 is preferably an organic adhesive of the same or similar material as the encapsulation adhesive layer 30 used to encapsulate and protect the display surface of the module light board 1 (i.e., the side surface of the light board body 10 where a number of LED chips 20 are provided), to ensure the consistency of its overall structure and to achieve better encapsulation and protection of the display surface of the module light board 1.

[0027] In this way, the module lamp board 1 of this application embodiment, through the above-described structural configuration, not only provides soldering agent 13 on all soldering positions 111 in each lamp bead soldering area 11, but also provides at least partially a bottom filler 14 in the gap area formed between each soldering position 111. Thus, when the multiple solder feet 21 of each LED lamp bead 20 are soldered to the corresponding soldering positions 111 by the corresponding soldering agent 13, the bottom filler 14 can fill the gap between each LED lamp bead 20 and the corresponding soldering position 111. In this way, the bottom filler 14 ensures that the lamp bead soldering area 11 of the lamp board body 10 and the solder feet 21 of each LED lamp bead 20 are fully filled and protected, thereby enhancing the adhesion between each LED lamp bead 20 and the lamp board body 10, while reducing problems such as short circuits and "caterpillar" caused by moisture absorption.

[0028] In some examples, such as Figure 1 , Figure 2 and Figure 3As shown, the aforementioned underfill adhesive 14 can specifically be epoxy resin. Since the module light board 1 generally uses epoxy resin to encapsulate several LED beads 20 for corresponding protection through molding or spraying, the consistency of its overall structure can be ensured by setting the underfill adhesive 14 to be of the same material, thereby achieving better encapsulation and protection of the display surface of the module light board 1.

[0029] In some examples, such as Figure 1 , Figure 2 and Figure 3 As shown, the underfill 14 is a composite structure of epoxy resin and thixotropic agent. Thus, through the above structural configuration, since the underfill 14 in this example uses a composite structure of epoxy resin and thixotropic agent (i.e., thixotropic epoxy resin), compared to the previous example where the underfill 14 only used pure epoxy resin, it not only possesses the aforementioned technical effects but also allows the underfill 14 to have very high viscosity (like a paste) in a static or shear-free state. This enables it to resist its own gravity flow and the spreading caused by surface tension. This ensures that the underfill 14 can be precisely "piled" in narrow gaps and form the desired adhesive outline (such as dots or strips) without collapsing, flowing onto the adjacent welding position 111 (which would lead to poor welding or electrical connection failure) or contaminating other areas. In addition, the high thixotropic adhesive will temporarily thin out when subjected to shear force (such as when sprayed from the spray valve), which is conducive to spraying. When it comes into contact with the surface of the lamp board body 10 and the shear force disappears, it will instantly return to a high viscosity state. This characteristic allows it to advance in a "propelling" manner rather than a "scouring" flow when filling the gap between each LED bead 20 and the corresponding welding position 111. This can more effectively expel the air in the gap, thereby greatly reducing the risk of air bubble residue and achieving dense and defect-free filling.

[0030] In some examples, such as Figure 1 and Figure 2 As shown, all welding positions 111 in each LED bead welding area 11 are arranged in two rows. Between each pair of opposite welding positions 111, a first gap area 112 is formed. The underfill adhesive 14 is dotted in each first gap area 112. Thus, with the above structural arrangement, the dotted distribution of the underfill adhesive 14 in each first gap area 112 ensures that after the multiple solder feet 21 of each LED bead 20 are welded to the corresponding welding positions 111 by the corresponding soldering agent 13, the gap between each LED bead welding area 11 and the corresponding LED bead 20 can be better filled and protected without affecting the welding connection performance of the corresponding welding positions 111.

[0031] It should be noted that in this example, the underfill 14 is dot-shaped in each first gap area 112, specifically meaning that each first gap area 112 has a dot-shaped underfill 14. In this example, between the two rows of welding positions 111, each pair of oppositely positioned welding positions 111 forms a first gap area 112. Figure 2 As shown, a first gap region 112 is formed between each pair of horizontally adjacent welding positions 111. Simultaneously, a second gap region 113 is formed between each pair of vertically adjacent welding positions 111 in each column of welding positions 111. Generally, the length of the second gap region 113 in the vertical direction is less than the length of the first gap region 112 in the horizontal direction. Therefore, compared to setting a single point of underfill adhesive 14 in each of the second gap regions 113, this example sets a single point of underfill adhesive 14 in each of the first gap regions 112. This better fills and protects the gap between each LED chip welding area 11 and the corresponding LED chip 20, while minimizing the impact of the underfill adhesive 14 on the welding connection performance of adjacent welding positions 111.

[0032] In some examples, such as Figure 1 and Figure 3 As shown, all welding positions 111 of each LED chip welding area 11 are arranged in two rows. Between each pair of opposite welding positions 111, a first gap area 112 is formed. The underfill adhesive 14 extends in a strip within all the first gap areas 112. Thus, with the above structural arrangement, the underfill adhesive 14 extending in a strip within all the first gap areas 112 ensures that after the multiple solder feet 21 of each LED chip 20 are welded to the corresponding welding positions 111 by the corresponding soldering agent 13, the gap between each LED chip welding area 11 and the corresponding LED chip 20 can be better filled and protected without affecting the welding connection performance of the corresponding welding positions 111.

[0033] In some examples, such as Figure 2 and Figure 3 As shown, the underfill 14 and the soldering agent 13 on the adjacent soldering positions 111 are spaced apart. This structural arrangement ensures that the underfill 14 and the soldering agent 13 on the adjacent soldering positions 111 do not come into contact, preventing the underfill 14 from flowing onto the adjacent soldering positions 111 and causing poor soldering or electrical connection failures. This allows for better filling and protection of the gap between each LED chip soldering area 11 and the corresponding LED chip 20, while the underfill 14 does not affect the soldering connection performance of the corresponding soldering position 111.

[0034] In some examples, such as Figure 4As shown, the module light board 1 also includes an encapsulating adhesive layer 30, which covers and is disposed on one side surface of the light board body 10 where a plurality of LED beads 20 are disposed, and places all the LED beads 20 within the sealed protection of the encapsulating adhesive layer 30. Thus, through the above structural arrangement, the encapsulating adhesive layer 30 can achieve encapsulation protection and moisture protection for the display surface of the module light board 1.

[0035] It should be noted that the encapsulating adhesive layer 30 in this example can be formed by molding epoxy resin onto the surface of several LED beads 20, or by spraying epoxy resin onto the surface of several LED beads 20.

[0036] In some examples, such as Figure 4 As shown, the module light panel 1 also includes a black functional film 40, which is attached to the surface of the encapsulating adhesive layer 30 away from the light panel body 10. Thus, through the above structural arrangement, the black functional film 40 can effectively improve the contrast and ink color consistency of the module light panel 1.

[0037] In one embodiment, this application also provides a display module, which may specifically include a module light panel 1, which may be the module light panel 1 in the above embodiment.

[0038] It is understood that the display module in this application embodiment can be used for standalone display, i.e., a single display module can be used as a display screen, or several display modules can be arranged in a certain way to form a corresponding display screen. The display module in this application embodiment can adopt a bottom shell structure design or a bottom shell structure design. When it adopts a bottom shell structure design, in addition to including the module lamp board 1, it also includes a module bottom shell, which is installed on the surface of the module lamp board 1 away from the display surface.

[0039] Thus, since the display module in this embodiment adopts the module light board 1 in the above embodiment, it has the same function and technical effect as the above embodiment, which will not be repeated here.

[0040] In one embodiment, this application also provides a display screen, which may specifically include at least one display module as described in the above embodiments.

[0041] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A modular light panel, characterized in that, The module light board includes a light board body and a number of LED beads. A number of LED bead welding areas are provided on one side surface of the light board body, and the number of LED bead welding areas are provided one-to-one with the number of LED beads. Each LED bead is provided with multiple solder feet, and each LED bead welding area is provided with multiple welding positions corresponding to the multiple solder feet one by one. The multiple welding positions are distributed at intervals in the corresponding LED bead welding area to form multiple gap areas between the multiple welding positions. In each of the LED bead welding areas, welding flux is provided on all the welding positions, and at least some of the gap areas are provided with underfill adhesive. The plurality of welding feet of each LED bead are welded to the corresponding welding positions by the corresponding welding flux, and the underfill adhesive fills the gap between each LED bead and the corresponding welding position.

2. The module light board according to claim 1, characterized in that, The underfill is an epoxy resin adhesive.

3. The module light board according to claim 1, characterized in that, The underfill is a composite structure of epoxy resin and thixotropic agent.

4. The module light panel according to claim 1, characterized in that, All the welding positions in each of the lamp bead welding areas are arranged in two columns. Between the two columns of welding positions, a first gap area is formed between each pair of opposite welding positions. The bottom filler is dotted in each of the first gap areas.

5. The module light board according to claim 1, characterized in that, All the welding positions in each of the lamp bead welding areas are arranged in two columns, and a first gap area is formed between each pair of opposite welding positions in the two columns. The bottom filler extends in strips in all the first gap areas.

6. The module light panel according to claim 1, characterized in that, The underfill adhesive and the welding agent on the adjacent welding position are spaced apart.

7. The module light panel according to any one of claims 1-6, characterized in that, The module light board also includes an encapsulating adhesive layer, which covers and is disposed on one side surface of the light board body on which a plurality of LED beads are disposed, and places the plurality of LED beads in the sealed protection of the encapsulating adhesive layer.

8. The module light board according to claim 7, characterized in that, The module light panel also includes a black functional film, which is attached to the surface of the encapsulating adhesive layer away from the main body of the light panel.

9. A display module, characterized in that, The display module includes the module light panel as described in any one of claims 1-8.

10. A display screen, characterized in that, The display screen includes at least one display module as described in claim 9.

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