Defrosting device for experimental apparatuses

Abstract

The utility model provides a kind of experimental device defrosting device, comprising: chamber, heating system and air intake and exhaust system, when working, crossflow fan rotates, drive air from air inlet into chamber, semiconductor heating sheet heats the air into chamber, and the air driven by crossflow fan rotation makes heated air pass through the air duct formed by fin and flow limiting plate and blow warm air from air outlet to the upper surface of the built-in sample platform to the outside, to defrost the experimental device sample placed.The optimization structure design of the special defrosting device of the utility model can effectively avoid the pollution of each experimental device sample during operation and defrosting cleaning is carried out independently, and at the same time, when sample is loaded or transferred, effectively avoid the possible introduction of trace moisture, cause the emergence of local frost and effectively solve the situation that the experimenter uses hair dryer for a long time, time-consuming and laborious, low efficiency, high cost and poor effect.

Description

Technical Field

[0001] This invention belongs to the field of drying experimental device care technology in electron microscope sample preparation, and more specifically relates to a defrosting device for experimental devices. Background Technology

[0002] Cryo-electron microscopy (cryo-EM) is a high-resolution imaging technique used to observe samples such as biological macromolecules and organelles. To preserve the samples in their natural state, they are typically rapidly frozen to liquid nitrogen temperatures (-196°C) or lower, forming vitreous ice to prevent ice crystal formation from damaging the sample. A cryo-transfer system is an essential component of the electron microscope, used to safely transfer samples from sample preparation equipment (such as a plugging freezer) to the microscope for observation in a cryogenic environment.

[0003] During cryogenic transport, small parts in the system (such as sample rods, sample stages, seals, valves, etc.) may frost over due to temperature gradients or exposure to humid environments. The main sources of frost include: ambient moisture condensation: when cryogenic components are exposed to room temperature air, water vapor in the air condenses and freezes on their surfaces, forming a frost layer.

[0004] Contamination during operation: Improper handling during sample loading or transfer may introduce trace amounts of moisture, leading to localized frost formation.

[0005] Currently, dealing with frost formation is a task that laboratory technicians must undertake. In the past, without specialized equipment, technicians used hair dryers to blow away frost for extended periods, which was time-consuming, laborious, and ineffective. Utility Model Content

[0006] (I) The main purpose of this utility model is to overcome the above-mentioned technical defects and provide a defrosting device for experimental devices, so as to at least partially solve the technical problem of how to improve and optimize the design of a dedicated defrosting device for independent defrosting of experimental devices, and further solve the technical problem of how to optimize a dedicated defrosting device with high efficiency and low cost by improving the structural design of hot air generation and heat dissipation blowing.

[0007] (II) Technical Solution To solve the above-mentioned technical problems, this utility model proposes a defrosting device for experimental devices, comprising: a chamber, a heating system, and an air inlet / outlet system; the chamber includes a housing, with a recessed area on the top surface of the housing near the fourth side perpendicular to the top surface, forming an internal sample stage; the heating system is located below the internal sample stage inside the chamber, and includes a hot air generation system and an air inlet / outlet system; the air inlet / outlet system includes an air inlet, a crossflow fan, and an air outlet; the hot air generation system includes a semiconductor heating element and a heat sink; the crossflow fan is located inside the chamber near the third side parallel to the fourth side; the air inlet is located on the bottom surface parallel to the top surface and near the fourth side perpendicularly connected; the air outlet is oriented opposite to the air inlet, located near the position of the encapsulated crossflow fan, facing the fourth side, and directly facing the recessed internal sample stage. The upper surface blows the generated warm air onto the upper surface of the built-in sample stage facing outwards, delivering warm air to the sample located on the upper surface; one or more sets of heat sinks are arranged horizontally or vertically in the chamber near the fourth side and parallel to the fourth side, with the height of the heat sinks lower than the height of the air outlet and higher than the height of the air inlet to facilitate the entry of cold air and the exit of hot air; one or more sets of semiconductor heating elements are located directly below the built-in sample stage, with a flow limiting plate matching the shape of the built-in sample stage above them, and are located between the air inlet and the air outlet; during operation, the crossflow fan rotates, driving air to enter the chamber from the air inlet, the semiconductor heating elements heat the air entering the chamber, and the air driven by the rotation of the crossflow fan causes the heated air to pass through the heat sinks and the flow limiting plate to form an air duct and blow warm air out from the air outlet to the upper surface of the built-in sample stage facing outwards, so as to defrost the experimental device sample placed there.

[0008] Preferably, it further includes: a heat sink located at the top of the bottom surface close to the lower surface of the built-in sample stage facing the cavity and near the fourth side and the air inlet; a flow restrictor plate is installed above the heat sink to ensure that the height of the heat sink does not exceed the height of the flow restrictor plate, thus forming an air duct with a defined flow direction; the flow restrictor plate is hollow and is fastened above the semiconductor heating plate. During operation, the air entering the cavity through the air inlet flows through the air duct formed by the heat sink and the flow restrictor plate, passes through the space below the flow restrictor plate, is heated by the semiconductor heating plate, and is then blown out from the air outlet as warm air.

[0009] Preferably, it further includes: temperature control switches are provided at both ends of the heat sink; the temperature control switches are protrudingly installed on the outer surfaces of the fifth side that is vertically connected to the top surface, bottom surface, third side surface and fourth side surface and the sixth side surface (long side) that is parallel to and opposite to the fifth side surface, and are located between the semiconductor heating elements below the current limiting plate, so that constant temperature and overheat protection can be achieved by manually operating the temperature control switches.

[0010] Preferably, the air inlet includes: a row of air vents located on the bottom surface near and parallel to the fourth side surface, each air vent being evenly spaced at a preset gap or a small distance at the bottom of the heating system, penetrating the inner and outer walls of the bottom surface of the chamber.

[0011] Preferably, it further includes: the attached flow limiting plate is located directly above the hot air generation system, laid flat in a manner parallel to the top surface, and the flow limiting plate is located directly below the sample stage inside the cavity. The first end near the fourth side is connected to the heat sink, and the second end near the third side is connected to the air outlet. The crossflow fan rotates to drive the air entering through the air inlet to pass through the heat sink and then the flow limiting plate forms a flow channel that restricts the flow direction and blows the heated air out from the air outlet.

[0012] Preferably, the heat sink includes a grid-like structure with vertical top and bottom surfaces, allowing air to fully contact the heat sink and flow smoothly through the air duct for heating.

[0013] Preferably, the semiconductor heating element includes a heat source that provides heating for the air entering the chamber, and the semiconductor heating elements are arranged in two parallel groups.

[0014] Preferably, the temperature control switch is set at a preset distance between the intervals of the two sets of semiconductor heating elements.

[0015] Preferably, it also includes: a rubber pad is provided at the bottom of the built-in sample stage, and the rubber pad is located directly above the flow restrictor for heat insulation and scratch prevention.

[0016] Preferably, it further includes: an operation indicator light for observing the defrosting status, located near the junction of the third and sixth sides, away from the built-in sample stage, between the third side and the crossflow fan, and protruding outside the top surface of the chamber; and / or, a manual timer for setting the working time of the defrosting device, located near the junction of the third and fifth sides, away from the built-in sample stage, between the third side and the crossflow fan, and protruding outside the top surface of the chamber, which stops the defrosting operation when the timer expires; and / or, a power interface and fuse for connecting the power supply to start the defrosting operation, located on the third side of the chamber and near the sixth side.

[0017] (III) Beneficial Effects The optimized structural design of the special defrosting device of this utility model can effectively avoid contamination of each experimental device sample during operation and perform defrosting and cleaning independently. At the same time, it can effectively avoid the introduction of trace amounts of water vapor during sample loading or transfer, which may lead to local frost formation. It also effectively solves the problem of experimenters using hair dryers to blow clean for a long time, which is time-consuming, laborious, inefficient, low-cost and ineffective. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the external structure of an embodiment of the defrosting device for experimental devices according to this utility model from one angle. Figure 2 This is another external difference from one embodiment of the defrosting device for experimental apparatus of this utility model. Figure 1 A schematic diagram of the structure at an angle; Figure 3 This is a schematic diagram of the main structure of the hot air generation system and the air inlet / outlet system in the internal chamber of an embodiment of the defrosting device for experimental devices according to this utility model.

[0019] 1-Temperature control switch, 2-Crossflow fan, 3-Heat sink, 4-Semiconductor heating element, 5-Air inlet, 6-Flow limiter, 7-Air outlet, 8-Gasket, 9-Manual timer, 10-Power interface and fuse, 11-Run indicator light. Detailed Implementation

[0020] In the description of specific embodiments, detailed descriptions of structures, performance, effects, or other features are provided to enable those skilled in the art to fully understand the embodiments. However, this does not preclude those skilled in the art from implementing this utility model under specific circumstances with technical solutions that do not contain the aforementioned structures, performance, effects, or other features.

[0021] The box in the attached diagram Figure 1 Generally, these refer to functional entities, and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processing unit devices and / or microcontroller devices.

[0022] The same reference numerals in the accompanying drawings denote the same or similar elements, components, or parts, and therefore repeated descriptions of the same or similar elements, components, or parts may be omitted below. It should also be understood that although terms such as first, second, third, etc., indicating designations, may be used herein to describe various devices, elements, components, or parts, these devices, elements, components, or parts should not be limited by these terms. That is, these terms are only used to distinguish one from another. For example, a first device may also be referred to as a second device, without departing from the essential technical solution of this utility model. Furthermore, the terms "and / or" and "and / or" refer to all combinations including any one or more of the listed items.

[0023] The following description, in conjunction with the accompanying drawings, illustrates an embodiment of the present invention to demonstrate the implementation of the specific solution of the present invention.

[0024] Figure 1 , 2 This is a schematic diagram of the external structure of an embodiment of the defrosting device for experimental equipment of this utility model from two different angles. Figure 3 This is a schematic diagram of the main structure of the internal chamber of an embodiment of the device of this utility model.

[0025] The device specifically includes: an outer shell, preferably a hexahedron, and more preferably a cuboid-shaped box, which encloses a chamber containing a heating system and an air inlet / outlet system.

[0026] In one specific embodiment, the outer casing has a running indicator light 11 protruding from the top surface, facilitating observation of the defrosting device's operating status. Similar to the running indicator light 11, the outer casing also has a manual timer 9 protruding from the top surface, positioned at a distance from the running indicator light 11. This timer serves as a switch for the defrosting device. For example, during operation, the user can directly set the desired blowing time by rotating the knob of the manual timer 9. Upon completion of the time, an alarm will sound or the power will be cut off to stop the defrosting operation. Both the running indicator light 11 and the manual timer 9 are located near a side perpendicular to the short sides of the top and bottom surfaces, referred to as the third side. Preferably, this side of the outer casing perpendicular to the top and bottom surfaces is located on the third side, i.e., the side closest to the running indicator light 11 and the manual timer 9. Furthermore, the power interface and fuse are located near the running indicator light 11. In one example, a fuse is installed at the power interface, forming a power interface and fuse 10 structure, and the defrosting is powered by mains electricity. In one specific embodiment, the chamber includes a (cubic) box having a top surface (first side surface), a bottom surface (second side surface) that are parallel to each other, and a third, fourth, fifth, and sixth side surface that are perpendicularly connected to both the first and second side surfaces; the third and fourth side surfaces are parallel to each other and located in the direction of the short side of the top and bottom surfaces, and the fifth and sixth side surfaces are parallel to each other and located in the direction of the long side of the top and bottom surfaces.

[0027] Preferably, the power interface and fuse 10 that connect to the power supply to start the defrosting operation are located on the third side of the chamber and close to the sixth side, closer to the operation indicator light 11.

[0028] The top surface (first side) of the housing has a recessed area in the middle region near the fourth side (short side) perpendicular to the top surface, forming an internal sample stage. Preferably, the recessed bottom of the internal sample stage can be square, with the central recess forming a three-dimensional receiving space for placing the experimental device requiring defrosting, preferably a single sample. Each side of the three-dimensional receiving space is parallel to the four sides of both the top and bottom surfaces. A rubber pad 8 is placed on the outer surface of the three-dimensional receiving space of the internal sample stage, facing upwards. The sample requiring defrosting is then placed on the pad 8. The rubber pad has good heat insulation properties, preventing damage from hard contact between the low-temperature sample requiring cleaning and defrosting and the metal sample stage, thus providing heat insulation and scratch prevention.

[0029] In one specific embodiment, the heating system is located below the built-in sample stage inside the chamber and includes a hot air generation system and an air inlet / outlet system. The air inlet / outlet system includes an air inlet 5, a crossflow fan 2, and an air outlet 7; the hot air generation system includes a semiconductor heating element 4, a heat sink 3, a flow restrictor 6, a temperature control switch 1, etc.

[0030] In the air intake and exhaust system, the crossflow fan 2 is located near the third side, which is parallel to and corresponds to the fourth side within the chamber; the air inlet 5 is located near the bottom surface (second side), which is parallel to the top surface, and close to the vertically connected fourth side; the air outlet 7 is opposite to the air inlet 5, located near the position where the crossflow fan 2 is encapsulated, and faces the fourth side, directly opposite the upper surface of the recessed built-in sample stage, blowing the generated warm air onto the upper surface of the built-in sample stage facing outward, delivering warm air to the experimental device sample located on the upper surface, i.e., the air outlet 7 blows out hot air to defrost and clean the sample. The crossflow fan 2 is the power source for driving the airflow, driving the air to enter from the air inlet 5, pass through the air duct formed by the heat sink 3 and the flow restrictor 6, and then be blown out from the air outlet 7.

[0031] Preferably, the air inlet 5 includes a row of air vents located on the bottom surface, close to and parallel to the fourth side surface. Each air vent is evenly spaced at a preset gap or a small distance from the bottom of the heating system, penetrating the inner and outer walls of the bottom surface of the chamber.

[0032] In the hot air generation system, one or more sets of heat sinks are arranged in the chamber, close to and parallel to the fourth side, either horizontally or vertically. The height of the heat sinks 3 is lower than the height of the air outlet 7 but higher than the height of the air inlet 5, so that the hot air can be blown onto the sample after the cold air enters. One or more sets of semiconductor heating elements 4 are located directly below the built-in sample stage, with a flow-limiting plate 6 matching the shape of the built-in sample stage above them, and are positioned between the air inlet 5 and the air outlet 7. Air enters the chamber from the air inlet 5, passes through the heat sinks 3, and is heated to the specified temperature by the semiconductor heating elements 4.

[0033] For example, when the defrosting device is working, the crossflow fan rotates, driving air into the chamber from the air inlet. The semiconductor heating element heats the air entering the chamber. The crossflow fan rotates, driving the air in and causing the heated air to pass through the heat sink and flow restrictor to form an air duct. Warm air is blown out from the air outlet to the upper surface of the built-in sample stage facing outward, so as to defrost the experimental device sample placed there.

[0034] Specifically, the heat sink 3 is located at the top of the bottom surface (second side surface), close to the lower surface of the built-in sample stage facing the cavity, and near the fourth side surface and the air inlet 5. A flow restrictor 6 is installed above the heat sink 3 to ensure that the height of the heat sink 3 does not exceed the height of the flow restrictor 6, thus forming a defined airflow channel. The flow restrictor 6 is hollow and is fastened above the semiconductor heating element 4. During operation, the air entering the cavity through the air inlet 5 flows through the airflow channel formed by the heat sink 3 and the flow restrictor 6, passes through the space below the flow restrictor 6, is heated by the semiconductor heating element 4, and is then blown out from the air outlet 7. Preferably, the heat sink 3 includes a grid-like structure with vertical top and bottom surfaces, allowing air to fully contact the heat sink 3 and flow smoothly through the airflow channel for heating. Furthermore, the structural design of the heat sink 3 enables full contact with the air and heats the air. Additionally, the heat source for the heat sink 3 comes from the semiconductor heating element 4 designed on the bottom surface of the cavity.

[0035] Preferably, temperature control switches 1 are provided at both ends of the heat sink 3. The temperature control switches 1 are protruding and installed on the outer surfaces of the fifth side (long side) that is vertically connected to the top surface, bottom surface, third side side and fourth side side and the sixth side side (long side) that is parallel to and opposite to the fifth side side, and are located between the semiconductor heating elements 4 below the current limiting plate 6. Constant temperature and overheat protection can be achieved by manually operating the temperature control switches 1.

[0036] Preferably, the flow-limiting plate 6 is located directly above the hot air generation system, for example, it is clipped onto the hot air generation system and laid flat parallel to the top surface. Further, the flow-limiting plate 6 is located directly below the internal sample stage, with its first end near the fourth side communicating with the heat sink 3, and its second end near the third side communicating with the air outlet 7. The crossflow fan 2 rotates, driving the air entering through the air inlet 5 through the heat sink 3, and then the flow-limiting plate 6 forms a confined airflow channel to prevent turbulence of cold and hot air on the internal wall of the cavity, and blows the heated air out from the air outlet 7. Furthermore, a rubber pad is provided at the bottom of the internal sample stage, located directly above the flow-limiting plate 6, for heat insulation and scratch prevention.

[0037] Preferably, the semiconductor heating element 4 includes a heat source for heating the air entering the chamber, and two sets of semiconductor heating elements 4 are arranged in parallel. Preferably, the temperature control switch 1 is arranged between the intervals of the two sets of semiconductor heating elements 4 at a preset distance.

[0038] Preferably, the operation indicator light 11 for observing the defrosting status is located near the junction of the third side and the sixth side, away from the built-in sample stage, between the third side and the crossflow fan 2, and protruding from the top surface of the chamber.

[0039] Furthermore, a manual timer 9 for setting the defrosting device's operating time is located near the junction of the third and fifth sides, away from the built-in sample stage, between the third side and the crossflow fan 2, and protruding from the top surface of the chamber. When the timer expires, the defrosting operation stops. It also functions as a device switch, triggering the power interface and fuse to disconnect the power supply. For example, the user can directly set the required blowing time using a knob, and the device will automatically shut down after the time is up.

[0040] This invention provides an optimized structural design for a dedicated defrosting device. It utilizes warm air to defrost each experimental device sample individually. The improved structural design of the specific hot air generation and heat dissipation air supply enables a dedicated independent cleaning and defrosting device. It achieves stable defrosting and cleaning airflow and constant temperature control defrosting, which can effectively avoid contamination of each experimental device sample during operation and allows for independent defrosting and cleaning. At the same time, it effectively avoids the possible introduction of trace amounts of moisture during sample loading or transfer, which may lead to localized frost formation. It also effectively solves the problem of experimenters using hair dryers for long periods of time, labor, and with high efficiency, low cost, and poor results.

[0041] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that this utility model is not inherently related to any specific computer, virtual device, or electronic device, and various general-purpose devices can also implement this utility model. The above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A defrosting device for experimental instruments, characterized in that, include: Chambers, heating system, and air intake / exhaust system; The chamber includes a box, which has a top surface, a bottom surface parallel to the top surface, and a third side surface, a fourth side surface, a fifth side surface, and a sixth side surface perpendicularly connecting the top surface and the bottom surface. The third side surface and the fourth side surface are parallel to each other, and the fifth side surface and the sixth side surface are parallel to each other. The middle area of ​​the top surface of the box is recessed downwards near the fourth side that is perpendicular to the top surface to form an internal sample stage; The heating system is located below the built-in sample stage inside the chamber and includes a hot air generation system and an air inlet / outlet system. The air intake and exhaust system includes an air inlet, a crossflow fan, and an air outlet; The crossflow fan is located inside the cavity, near the third side. The air inlet is located on the bottom surface parallel to the top surface and near the fourth side surface that is perpendicular to it. When the crossflow fan rotates, it can drive air from the air inlet into the chamber. The air outlet is located near the position of the encapsulation crossflow fan, facing the fourth side, and the air outlet is directly facing the upper surface of the recessed built-in sample stage, blowing the warm air formed by the heated air onto the upper surface of the built-in sample stage facing outward, and delivering warm air to the sample located on the upper surface. The hot air generation system includes a semiconductor heating element and a heat sink; One or more heat sinks are arranged horizontally or vertically in the cavity near the fourth side and parallel to the fourth side. The height of the heat sinks is lower than the height of the air outlet and higher than the height of the air inlet, so that the hot air can be blown out after the cold air enters. One or more sets of semiconductor heating elements are located directly below the built-in sample stage, with a flow-limiting plate matching the shape of the built-in sample stage above them, and are positioned between the air inlet and the air outlet. The semiconductor heating elements can heat the air entering the chamber. A flow limiting plate is installed above the heat sink. The flow limiting plate is hollow and is fastened above the semiconductor heating plate. The height of the heat sink does not exceed the height of the flow limiting plate. The heat sink and the flow limiting plate form an air duct with a defined flow direction. When the crossflow fan rotates, it can drive the air through the air duct and the air outlet to the upper surface of the built-in sample stage facing the outside.

2. The apparatus as claimed in claim 1, characterized in that, Also includes: The heat sink is located at the top of the bottom surface, close to the lower surface of the built-in sample stage facing the chamber, and near the fourth side and the air inlet. Air can flow through the space below the flow restrictor.

3. The apparatus as described in claim 1, characterized in that, It also includes a temperature control switch; The temperature control switches are located at both ends of the heat sink; The temperature control switch is protruding and installed on the outer surface of the fifth and sixth sides respectively. The temperature control switch extends into the cavity and is located between the semiconductor heating elements below the current limiting plate. Constant temperature and overheat protection can be achieved by manually operating the temperature control switch.

4. The apparatus as claimed in claim 1, characterized in that, The air inlet includes a horizontal row of air vents located on the bottom surface near and parallel to the fourth side surface. Each air vent is evenly spaced at a preset gap or a small distance from the bottom of the heating system, penetrating the inner and outer walls of the bottom surface of the chamber.

5. The apparatus as claimed in claim 1, characterized in that, Also includes: The flow-limiting plate is located directly above the hot air generation system, laid flat parallel to the top surface, and located directly below the sample stage inside the chamber. The cross-flow fan drives the air entering through the air inlet to pass through the heat sink and then the flow-limiting plate forms a flow channel that restricts the flow direction and blows the heated air out from the air outlet.

6. The apparatus according to claim 1, characterized in that, The heat sink includes: It is designed with a grid pattern on the top and bottom surfaces to allow air to fully contact the heat sink and flow smoothly through the air duct for heating.

7. The apparatus according to claim 1, characterized in that, The semiconductor heating element includes a heat source that provides heating for the air entering the chamber, and two sets of semiconductor heating elements are arranged in parallel.

8. The apparatus according to claim 3, characterized in that, The temperature control switch is set at a preset distance between the two sets of semiconductor heating elements.

9. The apparatus according to claim 1, characterized in that, Also includes: A rubber pad is installed at the bottom of the built-in sample stage. The rubber pad is located directly above the flow restrictor for heat insulation and scratch prevention.

10. The apparatus according to claim 1, characterized in that, Also includes: The defrosting status indicator light is located near the junction of the third and sixth sides, away from the built-in sample stage, between the third side and the crossflow fan, and protruding beyond the top surface of the chamber; and / or, a manual timer for setting the defrosting device's operating time is located near the junction of the third and fifth sides, away from the built-in sample stage, between the third side and the crossflow fan, and protruding beyond the top surface of the chamber. When the timer expires, the defrosting operation stops; and / or, The power interface and fuse for connecting to the power supply to start the defrosting operation are located on the third side of the chamber and close to the sixth side.

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