5G antenna welding equipment

Abstract

The invention discloses 5G antenna welding equipment which comprises a bearing device used for bearing a to-be-processed substrate with a signal line to sequentially flow through a chip mounting station, a conductive column welding station, a cooling fin assembling station and a circuit board welding station; the radio frequency chip mounting device is arranged at the chip mounting station and is used for mounting a radio frequency chip on the substrate; the conductive column welding device is arranged at the conductive column welding station and is used for welding a conductive column on the substrate so as to enable the radio frequency chip and the conductive column to form circuit connection; the cooling fin assembling device is arranged at the cooling fin assembling station and is used for mounting cooling fins on the substrate; and the circuit board welding device is arranged at the circuit board welding station and is used for welding a circuit board on the conductive column so as to obtain the 5G antenna. According to the invention, chip mounting, conductive column welding, cooling fin assembling, circuit board welding and other operations are completed in sequence in a limited operation space, and the problem of poor precision caused by mounting and welding offset of each structure in a 5G antenna is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of antenna welding equipment, and in particular to a 5G antenna welding equipment. Background Art

[0002] The existing 5G antenna welding equipment has the following disadvantages:

[0003] (1) Due to limited operating space, it is difficult to meet the requirements of multi-device and multi-station configuration, and cannot be applied to mass production needs;

[0004] (2) During the chip and circuit board mounting process, the chip area to be mounted and the circuit board area to be welded on the substrate are not identified and positioned, and there is a lack of equipment to fine-tune the position of the chip and circuit board, resulting in positioning deviations, which in turn leads to problems such as poor welding and poor welding accuracy, and cannot meet the precision welding requirements of micro and small parts. Summary of the invention

[0005] In order to overcome the above technical problems, the present invention discloses a 5G antenna welding device.

[0006] The technical solution adopted by the present invention to achieve the above-mentioned purpose is:

[0007] A 5G antenna welding device, comprising:

[0008] A carrying device, used for carrying the substrate with signal lines to be processed, which flows through the chip mounting station, the conductive column welding station, the heat sink assembly station and the circuit board welding station in sequence;

[0009] A radio frequency chip mounting device, disposed at the chip mounting station, for mounting a radio frequency chip on the substrate;

[0010] A conductive column welding device, disposed at the conductive column welding station, for welding the conductive column on the substrate so as to form a circuit connection between the radio frequency chip and the conductive column;

[0011] A heat sink assembly device, disposed at the heat sink assembly station, for mounting a heat sink on the substrate;

[0012] A circuit board welding device is arranged at the circuit board welding station and is used to weld the circuit board on the conductive column to obtain a 5G antenna.

[0013] The above-mentioned 5G antenna welding equipment, wherein the carrying device includes a turntable mechanism, and a plurality of sets of product positioning mechanisms are arranged on the turntable mechanism at intervals;

[0014] The product positioning mechanism includes a product fixing seat, several groups of positioning clamping columns, and a first lateral movement component for driving the positioning clamping columns to move laterally. The product fixing seat is provided with a substrate positioning cavity matching the shape of the substrate. Several groups of positioning clamping columns extend transversely through the product fixing seat around the substrate positioning cavity.

[0015] The above-mentioned 5G antenna welding equipment, wherein the RF chip mounting device includes a chip feeding mechanism, a first picking mechanism and a first identification and positioning mechanism, the first picking mechanism travels back and forth between the chip feeding mechanism and the carrying device, and the first identification and positioning mechanism is arranged corresponding to the carrying device and is electrically connected to the first picking mechanism;

[0016] The chip feeding mechanism comprises a first discharge tray arranged corresponding to the first picking mechanism, and a first driving assembly for driving the first discharge tray to move laterally, wherein the first discharge tray is provided with a plurality of chip placement slots matching the shape of the chips and having a qualified orientation at intervals, and the chip placement slots are used to place chips having a qualified orientation;

[0017] The first picking mechanism includes a first picking component, a second lateral movement component for driving the first picking component to move horizontally, and a first longitudinal movement component for driving the first picking component to move vertically. The first picking component includes a first negative pressure suction nozzle for adsorbing the chip, and the first negative pressure suction nozzle is connected to a negative pressure air source through a first negative pressure tube.

[0018] The above-mentioned 5G antenna welding equipment, wherein the product fixing seat is provided with a first alignment base point;

[0019] The first identification and positioning mechanism includes a second alignment base point, a first identification and positioning CCD and a first dimmer. The second alignment base point is set corresponding to the first alignment base point, the first identification and positioning CCD is set corresponding to the carrying device, the first dimmer is used to provide light for the chip area to be mounted on the substrate, and a first adjustment aperture is set at the light-emitting end of the first dimmer for adjusting to form a focusing or astigmatism effect.

[0020] The above-mentioned 5G antenna welding equipment, wherein the conductive column welding device includes a second identification and positioning mechanism and a conductive column welding mechanism that are electrically connected, and the conductive column welding mechanism is arranged corresponding to the carrying device;

[0021] The second identification and positioning mechanism includes a third alignment base point, a second identification and positioning CCD and a second dimmer. The third alignment base point is set corresponding to the first alignment base point, the second identification and positioning CCD is set corresponding to the carrying device, and the second dimmer is used to provide light for the conductive column area to be welded on the substrate, and the second dimmer is provided with a second adjustment aperture for adjusting to form a focusing or diffusing effect.

[0022] The above-mentioned 5G antenna welding equipment, wherein the heat sink assembly device includes a heat sink feeding mechanism and a second picking mechanism, and the second picking mechanism travels back and forth between the heat sink feeding mechanism and the carrying device;

[0023] The heat sink feeding mechanism comprises a second discharge tray arranged corresponding to the second picking mechanism, and a second driving assembly for driving the second discharge tray to move laterally, wherein the second discharge tray is provided with a plurality of heat sink placement slots matching the shape of the heat sink and having a qualified orientation at intervals, and the heat sink placement slots are used to place heat sinks having a qualified orientation;

[0024] A first visual inspection mechanism for inspecting external features of the heat sink is disposed on the second discharge tray, and the first visual inspection mechanism is disposed corresponding to the heat sink placement slot.

[0025] The above-mentioned 5G antenna welding equipment, wherein the second pickup mechanism includes a second pickup component, a third lateral movement component for driving the second pickup component to move laterally, and a second longitudinal movement component for driving the second pickup component to move longitudinally;

[0026] A third identification and positioning CCD for locating the area of ​​the substrate to be mounted with the heat sink is also provided on the second longitudinal movement component, and the third identification and positioning CCD is electrically connected to the second pickup component;

[0027] The second pickup assembly includes a first pressure head and a plurality of groups of second negative pressure suction nozzles arranged around the first pressure head, and the second negative pressure suction nozzles are connected to a negative pressure air source through a second negative pressure tube.

[0028] The above-mentioned 5G antenna welding equipment, wherein the circuit board welding device includes a circuit board feeding mechanism, a third picking mechanism and a circuit board welding mechanism, the circuit board picking mechanism travels back and forth between the circuit board feeding mechanism and the carrying device, and the circuit board welding mechanism is arranged corresponding to the carrying device;

[0029] The circuit board feeding mechanism comprises a third discharge tray arranged corresponding to the third picking mechanism, and a third driving assembly for driving the third discharge tray to move laterally, the third discharge tray is provided with a plurality of circuit board placement slots matching the shape of the circuit board and having a qualified orientation at intervals, and the circuit board placement slots are used to place circuit boards with a qualified orientation;

[0030] A second visual inspection mechanism for inspecting external features of the circuit board is disposed on the third discharge tray, and the second visual inspection mechanism is disposed corresponding to the circuit board placement slot;

[0031] The third picking mechanism includes a third picking assembly, a fourth lateral moving assembly for driving the third picking assembly to move lateral, and a third longitudinal moving assembly for driving the third picking assembly to move longitudinally;

[0032] The third pickup assembly includes a plurality of groups of third negative pressure suction nozzles for sucking circuit boards, and the third negative pressure suction nozzles are connected to a negative pressure air source through a third negative pressure pipe.

[0033] The above-mentioned 5G antenna welding equipment, wherein the second welding mechanism includes a fourth identification and positioning CCD, a circuit board fixing component, a third driving component and a welding head, the fourth identification and positioning CCD is electrically connected to the circuit board fixing component and the third driving component respectively, and the fourth identification and positioning CCD is used to locate the position of the welded conductive column.

[0034] The above-mentioned 5G antenna welding equipment, wherein the circuit board fixing component includes a fixing seat, and a fourth longitudinal movement component for driving the fixing seat to move longitudinally, a second pressure head and a plurality of fourth negative pressure nozzles arranged around the second pressure head are arranged on the fixing seat corresponding to the carrying device, and the fourth negative pressure nozzle is connected to the negative pressure gas source through a fourth negative pressure pipe;

[0035] The third driving mechanism includes a first rotating assembly, a second rotating assembly and a third rotating assembly respectively used to drive the welding head to rotate along the X direction, the Y direction and the Z direction. The welding head is arranged corresponding to the carrying device to adjust the welding angle to realize the welding of the conductive column and the circuit board.

[0036] The beneficial effects of the present invention are as follows: the present invention uses the carrying device to carry the substrate to be processed and sequentially flows through the chip mounting station, the conductive column welding station, the heat sink assembly station and the circuit board welding station, so as to sequentially complete the chip mounting, conductive column welding, heat sink assembly and circuit board welding operations in a limited operating space, with strong processing continuity, solving the problem of poor accuracy caused by the mounting and welding offset of various structures in the 5G antenna, high processing efficiency and small equipment space occupation. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0038] Figure 1 It is a schematic top view of the structure of the present invention. DETAILED DESCRIPTION

[0039] The present invention is further described below by means of specific embodiments to make the technical solution of the present invention easier to understand and grasp, rather than to limit the present invention.

[0040] Example: See Figure 1 , this embodiment provides a 5G antenna welding device, which includes:

[0041] Carrying device 1, used for carrying the substrate with signal lines to be processed to flow through the chip mounting station, conductive column welding station, heat sink assembly station and circuit board welding station in sequence;

[0042] A radio frequency chip mounting device 2, arranged at the chip mounting station, for mounting a radio frequency chip on the substrate;

[0043] A conductive column welding device 3, disposed at the conductive column welding station, for welding the conductive column on the substrate so as to form a circuit connection between the radio frequency chip and the conductive column;

[0044] A heat sink assembly device 4, disposed at the heat sink assembly station, for mounting a heat sink on the substrate;

[0045] The circuit board welding device 5 is arranged at the circuit board welding station and is used to weld the circuit board on the conductive column to obtain a 5G antenna.

[0046] Specifically, the substrate to be processed is carried by the carrying device 1 and flows through the chip mounting station, the conductive column welding station, the heat sink assembly station and the circuit board welding station in sequence, so as to complete the chip mounting, conductive column welding, heat sink assembly and circuit board welding operations in sequence within a limited operating space. The processing continuity is strong, and the problem of poor accuracy caused by the mounting and welding offset of various structures in the 5G antenna is solved. The processing efficiency is high and the equipment occupies a small space.

[0047] Preferably, the carrying device 1 comprises a turntable mechanism, on which a plurality of product positioning mechanisms are arranged at intervals; the turntable mechanism is used to drive the product positioning mechanism to rotate, so as to drive the substrate to be processed to flow through the chip mounting station, the conductive column welding station, the heat sink assembly station and the circuit board welding station in sequence;

[0048] The product positioning mechanism includes a product fixing seat, several groups of positioning clamping columns, and a first transverse movement component for driving the positioning clamping columns to move transversely. The product fixing seat is provided with a substrate positioning cavity matching the shape of the substrate, and several groups of positioning clamping columns extend transversely through the product fixing seat around the substrate positioning cavity. Specifically, the first transverse movement component preferably adopts a component driven by a cylinder, a screw rod, etc. When the substrate to be processed is placed in the substrate positioning cavity, the first transverse movement component drives the positioning clamping columns to approach the substrate to fix the substrate and prevent the substrate from shaking and affecting the subsequent processing accuracy.

[0049] Preferably, the RF chip mounting device 2 includes a chip feeding mechanism, a first picking mechanism and a first identification and positioning mechanism, the first picking mechanism travels back and forth between the chip feeding mechanism and the carrier device 1, and the first identification and positioning mechanism is arranged corresponding to the carrier device 1 and is electrically connected to the first picking mechanism;

[0050] The chip feeding mechanism comprises a first discharge tray arranged corresponding to the first picking mechanism, and a first driving assembly for driving the first discharge tray to move horizontally, the first discharge tray is provided with a plurality of chip placement slots matching the shape of the chip and having a qualified orientation at intervals, and the chip placement slots are used to place chips with a qualified orientation; specifically, the first driving assembly preferably adopts an assembly driven by a cylinder, a screw rod, etc.; when the first discharge tray fully loaded with chips to be mounted is placed on the first driving assembly, the first discharge tray is driven to move horizontally to the bottom of the first picking mechanism to wait for the first picking mechanism to pick up the chip, and when the chip feeding is completed, the first driving assembly drives the first empty discharge tray to move out;

[0051] The first picking mechanism includes a first picking component, a second lateral moving component for driving the first picking component to move horizontally, and a first longitudinal moving component for driving the first picking component to move vertically, the first picking component includes a first negative pressure suction nozzle for adsorbing the chip, and the first negative pressure suction nozzle is connected to the negative pressure air source through a first negative pressure tube; specifically, the second lateral moving component and the first longitudinal moving component are preferably components driven by a cylinder, a screw rod, etc.; when the negative pressure air source works, the first negative pressure suction nozzle absorbs the chip to achieve chip absorption and mounting.

[0052] Further, the product fixing seat is provided with a first alignment base point;

[0053] The first identification and positioning mechanism includes a second alignment base point, a first identification and positioning CCD and a first dimmer, the second alignment base point is set corresponding to the first alignment base point, the first identification and positioning CCD is set corresponding to the carrier device 1, the first dimmer is used to provide light for the chip area to be mounted on the substrate, and a first adjustment aperture for adjusting to form a focusing or astigmatism effect is set at the light-emitting end of the first dimmer; specifically, when the carrier device 1 moves to the bottom of the first picking mechanism, the first identification and positioning mechanism identifies and positions the carrier device 1, at which time the first alignment base point is aligned with the second alignment base point, the first identification and positioning CCD detects the position deviation and / or angle deviation between the chip adsorbed by the first negative pressure suction nozzle and the chip area to be mounted on the substrate, thereby driving the first picking mechanism to adjust the position and / or angle, so as to achieve precise alignment of the chip with the chip area to be mounted, thereby improving the chip mounting accuracy; and the first dimmer emits light, and adjusts the light effect through the first adjustment aperture to increase the shooting clarity of the first identification and positioning CCD, thereby further improving the mounting accuracy.

[0054] Preferably, the conductive column welding device 3 comprises a second identification and positioning mechanism and a conductive column welding mechanism which are electrically connected, and the conductive column welding mechanism is arranged corresponding to the carrying device 1;

[0055] The second identification and positioning mechanism includes a third alignment base point, a second identification and positioning CCD, and a second dimmer. The third alignment base point is set corresponding to the first alignment base point, the second identification and positioning CCD is set corresponding to the carrying device 1, and the second dimmer is used to provide light for the conductive column area to be welded on the substrate, and the second dimmer is provided with a second adjustment aperture for adjusting to form a focusing or diffusing effect;

[0056] Specifically, when the carrying device 1 moves to the bottom of the conductive column welding mechanism, the second identification and positioning mechanism identifies and positions the carrying device 1. At this time, the third alignment base point is aligned with the first alignment base point. The second identification and positioning CCD detects the position deviation and / or angle deviation between the conductive column welding mechanism and the conductive column area to be welded of the substrate, thereby driving the conductive column welding mechanism to adjust the position and / or angle, so as to achieve precise alignment of the conductive column welding mechanism with the conductive column area to be welded, thereby improving the welding accuracy of the conductive column; and the second dimmer emits light, and adjusts the light effect through the second adjustment aperture to increase the shooting clarity of the second identification and positioning CCD, thereby further improving the welding accuracy.

[0057] Preferably, the heat sink assembly device 4 comprises a heat sink feeding mechanism and a second picking mechanism, and the second picking mechanism moves back and forth between the heat sink feeding mechanism and the carrying device 1;

[0058] The heat sink feeding mechanism comprises a second discharge tray arranged corresponding to the second picking mechanism, and a second driving assembly for driving the second discharge tray to move horizontally, wherein the second discharge tray is provided with a plurality of heat sink placement slots matching the shape of the heat sink and having a qualified orientation at intervals, and the heat sink placement slots are used to place heat sinks with a qualified orientation; specifically, the second driving assembly preferably adopts an assembly driven by a cylinder, a screw rod, etc.; when the second discharge tray fully loaded with heat sinks to be assembled is placed on the second driving assembly, the second discharge tray is driven to move horizontally to the bottom of the second picking mechanism to wait for the second picking mechanism to pick up the heat sink, and when the heat sink feeding is completed, the second driving assembly drives the unloaded second discharge tray to move out;

[0059] A first visual inspection mechanism for inspecting the external features of the heat sink is provided on the second discharge tray, and the first visual inspection mechanism is provided corresponding to the heat sink placement slot; specifically, the first visual inspection mechanism pre-inspects whether the external features of the heat sink are qualified. If qualified, the heat sink can be picked up by the second picking mechanism. If unqualified, the heat sink is discarded.

[0060] Further, the second picking mechanism includes a second picking assembly, a third lateral moving assembly for driving the second picking assembly to move lateral, and a second longitudinal moving assembly for driving the second picking assembly to move longitudinally; specifically, the third lateral moving assembly and the second longitudinal moving assembly are preferably driven by a cylinder, a screw rod, or the like;

[0061] A third identification and positioning CCD for locating the area of ​​the substrate to be mounted with the heat sink is also provided on the second longitudinal movement component, and the third identification and positioning CCD is electrically connected to the second pickup component;

[0062] The second picking component includes a first pressure head, and several groups of second negative pressure nozzles arranged around the first pressure head, and the second negative pressure nozzle is connected to the negative pressure air source through a second negative pressure tube; specifically, the second negative pressure nozzle picks up the heat sink and moves to the top of the carrying device 1, at this time, the third identification and positioning CCD detects and locates the heat sink area to be mounted on the substrate, and drives the heat sink adsorbed by the negative pressure nozzle to be precisely aligned with the heat sink area to be mounted on the substrate, and then the second longitudinal movement component drives the second picking component to descend, and at this time the first pressure head presses down the heat sink to assemble the heat sink on the substrate, and after the heat sink is assembled, the second negative pressure nozzle releases the heat sink.

[0063] Preferably, the circuit board welding device 5 comprises a circuit board feeding mechanism, a third picking mechanism and a circuit board welding mechanism, the circuit board picking mechanism moves back and forth between the circuit board feeding mechanism and the carrying device 1, and the circuit board welding mechanism is arranged corresponding to the carrying device 1;

[0064] The circuit board feeding mechanism comprises a third discharge tray arranged corresponding to the third picking mechanism, and a third driving assembly for driving the third discharge tray to move horizontally, the third discharge tray is provided with a plurality of circuit board placement slots matching the shape of the circuit board and having a qualified orientation at intervals, and the circuit board placement slots are used to place circuit boards with a qualified orientation; specifically, the third driving assembly preferably adopts an assembly driven by a cylinder, a screw rod, etc.; when the third discharge tray fully loaded with circuit boards to be welded is placed on the third driving assembly, the third discharge tray is driven to move horizontally to the bottom of the third picking mechanism to wait for the third picking mechanism to pick up the circuit board, and when the circuit board feeding is completed, the third driving assembly drives the empty third discharge tray to move out;

[0065] A second visual inspection mechanism for inspecting the external features of the circuit board is provided on the third discharge tray, and the second visual inspection mechanism is provided corresponding to the circuit board placement slot; specifically, the second visual inspection mechanism pre-inspects whether the external features of the circuit board are qualified, and if qualified, the third picking mechanism can be waited for to pick up the good circuit board, and if unqualified, the circuit board is discharged as waste;

[0066] The third picking mechanism includes a third picking assembly, a fourth lateral moving assembly for driving the third picking assembly to move horizontally, and a third longitudinal moving assembly for driving the third picking assembly to move vertically; specifically, the fourth lateral moving assembly and the third longitudinal moving assembly are preferably driven by cylinders, screw rods, etc.;

[0067] The third picking component includes several groups of third negative pressure suction nozzles for sucking circuit boards, and the third negative pressure suction nozzles are connected to a negative pressure air source through a third negative pressure tube; specifically, when the negative pressure air source works, the third negative pressure suction nozzle sucks the circuit board to achieve picking up of the circuit board.

[0068] Furthermore, the second welding mechanism includes a fourth identification and positioning CCD, a circuit board fixing component, a third driving component and a welding head, the fourth identification and positioning CCD is electrically connected to the circuit board fixing component and the third driving component, respectively, and the fourth identification and positioning CCD is used to locate the position of the welded conductive column; specifically, when the third pickup component picks up the circuit board and places it on the substrate, the circuit board fixing component fixes the circuit board, and at this time the fourth identification and positioning CCD identifies and locates the position of the welded conductive column, drives the welding head to descend to the position of the conductive column, and under the action of the third driving component, the circuit board is welded to the conductive column.

[0069] Further, the circuit board fixing assembly includes a fixing seat, and a fourth longitudinal movement assembly for driving the fixing seat to move longitudinally, and a second pressure head and a plurality of fourth negative pressure suction nozzles arranged around the second pressure head are arranged on the fixing seat corresponding to the carrying device 1, and the fourth negative pressure suction nozzles are connected to a negative pressure gas source through a fourth negative pressure tube; specifically, the fourth longitudinal movement assembly preferably adopts an assembly driven by a cylinder, a screw rod, etc.; when the third pickup assembly picks up the circuit board and places it on the substrate, the fourth longitudinal movement assembly drives the fourth negative pressure suction nozzle to absorb and fix the circuit board, and during the welding process, the second pressure head maintains pressure on the circuit board to ensure the welding consistency and reliability of the circuit board and each conductive column;

[0070] The third driving mechanism includes a first rotating assembly, a second rotating assembly and a third rotating assembly, which are respectively used to drive the welding head to rotate along the X direction, the Y direction and the Z direction. The welding head is arranged corresponding to the carrying device 1 to adjust the welding angle to realize the welding of the conductive column and the circuit board; specifically, the first rotating assembly, the second rotating assembly and the third rotating assembly preferably adopt components driven by rotating cylinders or the like; according to actual welding requirements, the welding angle and / or position of the welding head are adjusted by the first rotating assembly, the second rotating assembly and the third rotating assembly.

[0071] The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Any technician familiar with the field can make many possible changes and modifications to the technical solution of the present invention by using the technical means and technical contents disclosed above without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the present invention without departing from the content of the technical solution of the present invention should be covered by the protection scope of the present invention.

Claims

1. A 5G antenna welding device, characterized in that: It includes: A carrying device, used for carrying the substrate with signal lines to be processed, which flows through the chip mounting station, the conductive column welding station, the heat sink assembly station and the circuit board welding station in sequence; A radio frequency chip mounting device, disposed at the chip mounting station, for mounting a radio frequency chip on the substrate; A conductive column welding device, disposed at the conductive column welding station, for welding the conductive column on the substrate so as to form a circuit connection between the radio frequency chip and the conductive column; A heat sink assembly device, disposed at the heat sink assembly station, for mounting a heat sink on the substrate; A circuit board welding device is arranged at the circuit board welding station and is used to weld the circuit board on the conductive column to obtain a 5G antenna.

2. The 5G antenna welding equipment according to claim 1, characterized in that: The carrying device comprises a turntable mechanism, on which a plurality of sets of product positioning mechanisms are arranged at intervals; The product positioning mechanism includes a product fixing seat, several groups of positioning clamping columns, and a first lateral movement component for driving the positioning clamping columns to move laterally. The product fixing seat is provided with a substrate positioning cavity matching the shape of the substrate. Several groups of positioning clamping columns extend transversely through the product fixing seat around the substrate positioning cavity.

3. The 5G antenna welding equipment according to claim 2, characterized in that: The RF chip mounting device comprises a chip feeding mechanism, a first picking mechanism and a first identification and positioning mechanism, wherein the first picking mechanism moves back and forth between the chip feeding mechanism and the carrying device, and the first identification and positioning mechanism is arranged corresponding to the carrying device and is electrically connected to the first picking mechanism; The chip feeding mechanism comprises a first discharge tray arranged corresponding to the first picking mechanism, and a first driving assembly for driving the first discharge tray to move laterally, wherein the first discharge tray is provided with a plurality of chip placement slots matching the shape of the chips and having a qualified orientation at intervals, and the chip placement slots are used to place chips having a qualified orientation; The first picking mechanism includes a first picking component, a second lateral movement component for driving the first picking component to move horizontally, and a first longitudinal movement component for driving the first picking component to move vertically. The first picking component includes a first negative pressure suction nozzle for adsorbing the chip, and the first negative pressure suction nozzle is connected to a negative pressure air source through a first negative pressure tube.

4. The 5G antenna welding equipment according to claim 3, characterized in that: The product fixing seat is provided with a first alignment base point; The first identification and positioning mechanism includes a second alignment base point, a first identification and positioning CCD and a first dimmer. The second alignment base point is set corresponding to the first alignment base point, the first identification and positioning CCD is set corresponding to the carrying device, the first dimmer is used to provide light for the chip area to be mounted on the substrate, and a first adjustment aperture is set at the light-emitting end of the first dimmer for adjusting to form a focusing or astigmatism effect.

5. The 5G antenna welding equipment according to claim 2, characterized in that: The conductive column welding device comprises a second identification and positioning mechanism and a conductive column welding mechanism which are electrically connected, and the conductive column welding mechanism is arranged corresponding to the carrying device; The second identification and positioning mechanism includes a third alignment base point, a second identification and positioning CCD and a second dimmer. The third alignment base point is set corresponding to the first alignment base point, the second identification and positioning CCD is set corresponding to the carrying device, and the second dimmer is used to provide light for the conductive column area to be welded on the substrate, and the second dimmer is provided with a second adjustment aperture for adjusting to form a focusing or diffusing effect.

6. The 5G antenna welding equipment according to claim 2, characterized in that: The heat sink assembly device comprises a heat sink feeding mechanism and a second picking mechanism, and the second picking mechanism moves back and forth between the heat sink feeding mechanism and the carrying device; The heat sink feeding mechanism comprises a second discharge tray arranged corresponding to the second picking mechanism, and a second driving assembly for driving the second discharge tray to move laterally, wherein the second discharge tray is provided with a plurality of heat sink placement slots matching the shape of the heat sink and having a qualified orientation at intervals, and the heat sink placement slots are used to place heat sinks having a qualified orientation; A first visual inspection mechanism for inspecting external features of the heat sink is disposed on the second discharge tray, and the first visual inspection mechanism is disposed corresponding to the heat sink placement slot.

7. The 5G antenna welding equipment according to claim 6, characterized in that: The second picking mechanism includes a second picking assembly, a third lateral moving assembly for driving the second picking assembly to move lateral, and a second longitudinal moving assembly for driving the second picking assembly to move longitudinally; A third identification and positioning CCD for locating the area of ​​the substrate to be mounted with the heat sink is also provided on the second longitudinal movement component, and the third identification and positioning CCD is electrically connected to the second pickup component; The second pickup assembly includes a first pressure head and a plurality of groups of second negative pressure suction nozzles arranged around the first pressure head, and the second negative pressure suction nozzles are connected to a negative pressure air source through a second negative pressure tube.

8. The 5G antenna welding equipment according to claim 2, characterized in that: The circuit board welding device comprises a circuit board feeding mechanism, a third picking mechanism and a circuit board welding mechanism, the circuit board picking mechanism moves back and forth between the circuit board feeding mechanism and the carrying device, and the circuit board welding mechanism is arranged corresponding to the carrying device; The circuit board feeding mechanism comprises a third discharge tray arranged corresponding to the third picking mechanism, and a third driving assembly for driving the third discharge tray to move laterally, the third discharge tray is provided with a plurality of circuit board placement slots matching the shape of the circuit board and having a qualified orientation at intervals, and the circuit board placement slots are used to place circuit boards with a qualified orientation; A second visual inspection mechanism for inspecting external features of the circuit board is disposed on the third discharge tray, and the second visual inspection mechanism is disposed corresponding to the circuit board placement slot; The third picking mechanism includes a third picking assembly, a fourth lateral moving assembly for driving the third picking assembly to move lateral, and a third longitudinal moving assembly for driving the third picking assembly to move longitudinally; The third pickup assembly includes a plurality of groups of third negative pressure suction nozzles for sucking circuit boards, and the third negative pressure suction nozzles are connected to a negative pressure air source through a third negative pressure pipe.

9. The 5G antenna welding equipment according to claim 8, characterized in that: The second welding mechanism includes a fourth identification and positioning CCD, a circuit board fixing component, a third driving component and a welding head. The fourth identification and positioning CCD is electrically connected to the circuit board fixing component and the third driving component respectively, and the fourth identification and positioning CCD is used to locate the position of the welded conductive column.

10. The 5G antenna welding equipment according to claim 9, characterized in that: The circuit board fixing assembly includes a fixing seat and a fourth longitudinal movement assembly for driving the fixing seat to move longitudinally, a second pressure head and a plurality of fourth negative pressure nozzles arranged around the second pressure head are arranged on the fixing seat corresponding to the carrying device, and the fourth negative pressure nozzles are connected to a negative pressure gas source through a fourth negative pressure pipe; The third driving mechanism includes a first rotating assembly, a second rotating assembly and a third rotating assembly respectively used to drive the welding head to rotate along the X direction, the Y direction and the Z direction. The welding head is arranged corresponding to the carrying device to adjust the welding angle to realize the welding of the conductive column and the circuit board.

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