Capacitor with heat dissipation structure

Abstract

The utility model discloses a capacitor with heat dissipation structure belongs to capacitor technical field, including capacitor main part, the lower extreme fixed connection of capacitor main part has two pin, heat dissipation mechanism, the surface of heat dissipation mechanism installs in the capacitor main part, the surface of heat dissipation mechanism extends to the surface of heat dissipation mechanism away from pin, wherein, heat dissipation mechanism includes the heat dissipation subassembly of installing in the capacitor main part surface, the inside of heat dissipation subassembly is provided with the flow guide subassembly, through above -mentioned mode, through the heat dissipation air channel of spiral setting has increased the path of heat dissipation, has improved the heat dissipation effect, and through the cooling assembly that sets up can make outside gas will enter to the inside of heat dissipation air channel, assists the heat air mass in heat dissipation air channel inside to carry out the mixed heat dissipation, sets up the external fin and carries out the cooling heat dissipation operation to the heat air mass in heat dissipation air channel through the external heat dissipation sleeve, improves the heat dissipation effect of capacitor main part, guarantees the use effect of capacitor.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, and specifically to a capacitor with a heat dissipation structure. Background Technology

[0002] With the rapid development of electronic information technology, the pace of digital electronic product upgrades is accelerating, and the production and sales of consumer electronics are continuously growing, driving the growth of the capacitor industry. A capacitor, also known simply as a capacitor, is a major component of electronic circuits. It can store electrical energy and has the characteristics of charging, discharging, and passing AC while blocking DC. Starting capacitors refer to AC electrolytic capacitors or polypropylene / polyester capacitors used to start single-phase asynchronous motors. A search of existing Chinese patent technology reveals a "high-efficiency heat dissipation capacitor" with publication number "CN220627602U". This device achieves its heat dissipation effect through its open slot structure. However, the heat dissipation effect of this device is poor, which will lead to untimely heat dissipation of the capacitor and affect the performance of the capacitor.

[0003] Based on this, the present invention designs a capacitor with a heat dissipation structure to solve the above problems. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a capacitor with a heat dissipation structure.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A capacitor with a heat dissipation structure includes a capacitor body with two pins fixedly connected to its lower end, a heat dissipation mechanism mounted on the surface of the capacitor body, the surface of the heat dissipation mechanism extending to the surface of the capacitor body away from the pins; wherein, the heat dissipation mechanism includes a heat dissipation component mounted on the surface of the capacitor body, a current guiding component disposed inside the heat dissipation component, the current guiding component being located at the end of the capacitor body away from the pins, and a cooling component connected to the surface of the heat dissipation component away from the capacitor body.

[0006] Furthermore, the heat dissipation assembly includes an inner heat dissipation sleeve fixedly connected to the surface of the capacitor body, an outer heat dissipation sleeve is sleeved on the outside of the inner heat dissipation sleeve, the upper end of the outer heat dissipation sleeve extends to the top of the capacitor body, and a plurality of inner heat dissipation fins are fixedly connected between the inner heat dissipation sleeve and the outer heat dissipation sleeve, and the plurality of inner heat dissipation fins are evenly distributed in a ring shape along the surface of the inner heat dissipation sleeve.

[0007] Furthermore, the cooling component includes an outer flow guide ring fixedly connected to the surface of the outer heat dissipation sleeve away from the inner heat dissipation sleeve. Multiple outer heat dissipation fins are fixedly connected to the upper inclined surface of the outer flow guide ring. The outer heat dissipation fins are fixedly connected to the surface of the outer heat dissipation sleeve, and the multiple outer heat dissipation fins are evenly distributed in a ring shape along the surface of the outer heat dissipation sleeve.

[0008] Furthermore, the airflow guiding component includes an internal positioning ring fixedly connected to the inner wall of the outer heat dissipation sleeve. The internal positioning ring is located above the inner heat dissipation fin. A positioning frame is fixedly connected to the inner wall of the internal positioning ring. A motor fan is embedded in the upper end of the positioning frame. The motor fan is located inside the internal positioning ring.

[0009] Furthermore, the inner heat sink is arranged in a spiral shape, and the inner heat sink sleeve and the outer heat sink sleeve cooperate to form a heat dissipation air channel between adjacent inner heat sinks.

[0010] Furthermore, the upper end of the heat dissipation duct extends above the inner heat dissipation sleeve, and the lower end of the heat dissipation duct extends below the outer heat dissipation sleeve.

[0011] Furthermore, the inner wall of the outer flow guide ring is fixedly connected with multiple flow guide plates, which are matched with the adjacent inner heat sinks.

[0012] Furthermore, a plurality of guide vanes are fixedly connected to the lower end of the built-in positioning ring, and the plurality of guide vanes are evenly distributed in a ring shape along the lower end of the built-in positioning ring.

[0013] Beneficial effects 1. The capacitor with the aforementioned heat dissipation structure, through the heat dissipation and cooling components, can reinforce the exterior of the capacitor body with the assistance of the designer's internal heat dissipation sleeve, and can also perform heat dissipation operations. The spirally arranged heat dissipation air channel increases the heat dissipation path and improves the heat dissipation effect. Furthermore, the cooling component allows external air to enter the interior of the heat dissipation air channel, assisting in the mixing and heat dissipation of the hot air mass inside the heat dissipation air channel. The external heat sink, through the external heat dissipation sleeve, cools and dissipates the hot air mass inside the heat dissipation air channel, improving the heat dissipation effect on the capacitor body and ensuring the performance of the capacitor. 2. The device, through its airflow guiding components and motor fan, actively guides the hot air mass, and multiple airflow guide vanes assist in quickly directing the airflow upwards towards the built-in positioning ring, improving heat dissipation and ensuring the performance of the capacitor. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a capacitor structure with a heat dissipation structure according to the present invention; Figure 2 This is an exploded view of a capacitor heat dissipation mechanism with a heat dissipation structure according to the present invention. Figure 3 This is a partially exploded cross-sectional view of a capacitor heat dissipation mechanism with a heat dissipation structure according to the present invention. Figure 4 This is an exploded structural diagram of a capacitor current-conducting assembly with a heat dissipation structure according to the present invention.

[0016] The labels in the diagram represent: 1. Capacitor body; 2. Pins; 3. Heat dissipation mechanism; 31. Heat dissipation component; 311. Inner heat dissipation sleeve; 312. Outer heat dissipation sleeve; 313. Inner heat sink; 314. Heat dissipation duct; 32. Cooling component; 321. Outer flow guide ring; 322. Outer heat sink; 323. Flow guide plate; 33. Flow guide component; 331. Built-in positioning ring; 332. Positioning frame; 333. Motor fan; 334. Flow guide plate. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0018] The present invention will be further described below with reference to the embodiments.

[0019] In some embodiments, please refer to the appendix to the instruction manual. Figure 1-4A capacitor with a heat dissipation structure includes a capacitor body 1, with two pins 2 fixedly connected to the lower end of the capacitor body 1, a heat dissipation mechanism 3, and a heat dissipation mechanism 3 mounted on the surface of the capacitor body 1, the surface of the heat dissipation mechanism 3 extending to the surface of the heat dissipation mechanism 3 away from the pins 2; wherein, the heat dissipation mechanism 3 includes a heat dissipation component 31 mounted on the surface of the capacitor body 1, a current guiding component 33 disposed inside the heat dissipation component 31, the current guiding component 33 being located at the end of the capacitor body 1 away from the pins 2, and a cooling component 32 connected to the surface of the heat dissipation component 31 away from the capacitor body 1; In some embodiments, such as Figure 1-3 As shown, in a preferred embodiment of the present invention, the heat dissipation assembly 31 includes an inner heat dissipation sleeve 311 fixedly connected to the surface of the capacitor body 1, an outer heat dissipation sleeve 312 sleeved on the outside of the inner heat dissipation sleeve 311, the upper end of the outer heat dissipation sleeve 312 extending to the top of the capacitor body 1, a plurality of inner heat dissipation fins 313 fixedly connected between the inner heat dissipation sleeve 311 and the outer heat dissipation sleeve 312, the plurality of inner heat dissipation fins 313 being evenly distributed in a ring along the surface of the inner heat dissipation sleeve 311, the inner heat dissipation fins 313 being spirally arranged, and adjacent inner heat dissipation fins 313 forming a heat dissipation channel 314 with the inner heat dissipation sleeve 311 and the outer heat dissipation sleeve 312, the upper end of the heat dissipation channel 314 extending to the top of the inner heat dissipation sleeve 311, and the lower end of the heat dissipation channel 314 extending to the bottom of the outer heat dissipation sleeve 312; In this embodiment of the utility model, the device uses an inner heat dissipation sleeve 311 to assist in the heat dissipation of the capacitor body 1. Furthermore, the inner heat dissipation fins 313 and the outer heat dissipation sleeve 312 work together to form a spiral heat dissipation channel 314. The inner heat dissipation fins 313 and the outer heat dissipation sleeve 312 enhance the protective effect of the inner heat dissipation sleeve 311 on the capacitor body 1. In addition, the heat dissipation channel 314 extends the heat dissipation path and improves the heat dissipation effect during the heat dissipation process. The cooling component 32 includes an outer flow guide ring 321 fixedly connected to the surface of the outer heat dissipation sleeve 312 away from the surface of the inner heat dissipation sleeve 311. Multiple outer heat dissipation fins 322 are fixedly connected to the upper inclined surface of the outer flow guide ring 321. The outer heat dissipation fins 322 are fixedly connected to the surface of the outer heat dissipation sleeve 312. The multiple outer heat dissipation fins 322 are evenly distributed in a ring shape along the surface of the outer heat dissipation sleeve 312. Multiple flow guide plates 323 are fixedly connected to the inner wall of the outer flow guide ring 321. The flow guide plates 323 are matched with the adjacent inner heat dissipation fins 313. In this embodiment of the utility model, the device uses an outer flow guide ring 321 to absorb some of the external gas in the heat dissipation channel 314, thus mitigating the heat inside the heat dissipation channel 314 and reducing the heat output. This improves the heat dissipation effect of the heat dissipation channel 314. Furthermore, the outer heat dissipation fins 322 allow the outer flow guide ring 321 to assist the heat dissipation channel 314 in its heat dissipation function. Adjacent outer heat dissipation fins 322 exchange heat with the internal heat of multiple heat dissipation channels 314 through the outer heat dissipation sleeves 312, resulting in a relatively uniform heat distribution within the multiple heat dissipation channels 314. In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, in a preferred embodiment of the present invention, the flow guiding component 33 includes an internal positioning ring 331 fixedly connected to the inner wall of the outer heat dissipation sleeve 312. The internal positioning ring 331 is located above the inner heat dissipation fin 313. A positioning frame 332 is fixedly connected to the inner wall of the internal positioning ring 331. A motor fan 333 is embedded in the upper end of the positioning frame 332. The motor fan 333 is located inside the internal positioning ring 331. A plurality of flow guiding plates 334 are fixedly connected to the lower end of the internal positioning ring 331. The plurality of flow guiding plates 334 are evenly distributed in a ring shape along the lower end of the internal positioning ring 331. In this embodiment of the invention, the device uses a built-in positioning ring 331 to guide the gathered airflow through a motor fan 333. Multiple guide vanes 334 assist the airflow to be quickly directed upwards towards the built-in positioning ring 331, thereby improving the heat dissipation effect.

[0020] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A capacitor with a heat dissipation structure, comprising a capacitor body (1), wherein two leads (2) are fixedly connected to the lower end of the capacitor body (1), characterized in that: Includes a heat dissipation mechanism (3), which is mounted on the surface of the capacitor body (1) and the surface of the heat dissipation mechanism (3) extends to the surface of the capacitor body (1) away from the pin (2); The heat dissipation mechanism (3) includes a heat dissipation component (31) mounted on the surface of the capacitor body (1). The heat dissipation component (31) has a flow guiding component (33) inside. The flow guiding component (33) is located at the end of the capacitor body (1) away from the pin (2). The surface of the heat dissipation component (31) away from the capacitor body (1) is connected to a cooling component (32).

2. The capacitor with a heat dissipation structure according to claim 1, characterized in that, The heat dissipation assembly (31) includes an inner heat dissipation sleeve (311) fixedly connected to the surface of the capacitor body (1). An outer heat dissipation sleeve (312) is sleeved on the outside of the inner heat dissipation sleeve (311). The upper end of the outer heat dissipation sleeve (312) extends to the top of the capacitor body (1). A plurality of inner heat dissipation fins (313) are fixedly connected between the inner heat dissipation sleeve (311) and the outer heat dissipation sleeve (312). The plurality of inner heat dissipation fins (313) are evenly distributed in a ring shape along the surface of the inner heat dissipation sleeve (311).

3. The capacitor with a heat dissipation structure according to claim 2, characterized in that, The cooling component (32) includes an outer flow guide ring (321) fixedly connected to the surface of the outer heat dissipation sleeve (312) away from the inner heat dissipation sleeve (311). A plurality of outer heat dissipation fins (322) are fixedly connected to the upper inclined surface of the outer flow guide ring (321). The outer heat dissipation fins (322) are fixedly connected to the surface of the outer heat dissipation sleeve (312). The plurality of outer heat dissipation fins (322) are evenly distributed in a ring shape along the surface of the outer heat dissipation sleeve (312).

4. The capacitor with a heat dissipation structure according to claim 2, characterized in that, The airflow guiding component (33) includes an internal positioning ring (331) fixedly connected to the inner wall of the outer heat dissipation sleeve (312). The internal positioning ring (331) is located above the inner heat dissipation fin (313). A positioning frame (332) is fixedly connected to the inner wall of the internal positioning ring (331). A motor fan (333) is embedded in the upper end of the positioning frame (332). The motor fan (333) is located inside the internal positioning ring (331).

5. The capacitor with a heat dissipation structure according to claim 2, characterized in that, The inner heat sink (313) is arranged in a spiral shape, and the inner heat sink sleeve (311) and the outer heat sink sleeve (312) of adjacent inner heat sinks (313) cooperate to form a heat dissipation air channel (314).

6. The capacitor with a heat dissipation structure according to claim 5, characterized in that... The upper end of the heat dissipation duct (314) extends above the inner heat dissipation sleeve (311), and the lower end of the heat dissipation duct (314) extends below the outer heat dissipation sleeve (312).

7. The capacitor with a heat dissipation structure according to claim 3, characterized in that, The inner wall of the outer flow guide ring (321) is fixedly connected with a plurality of flow guide plates (323), and the flow guide plates (323) are matched with the adjacent inner heat sink (313).

8. The capacitor with a heat dissipation structure according to claim 4, characterized in that, The lower end of the built-in positioning ring (331) is fixedly connected to a plurality of guide vanes (334), and the plurality of guide vanes (334) are evenly distributed in a ring shape along the lower end of the built-in positioning ring (331).

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