Moisture-proof micro capacitor
By employing a triple-protection structure of ceramic sealing shell, buffer cavity, and epoxy resin potting layer in the miniature capacitor, combined with the inclined plane transmission and spring reset design of the quick-installation component, the problems of sealing failure caused by thermal expansion and contraction of the encapsulation structure and the cumbersome traditional installation and disassembly are solved, achieving the technical effects of moisture resistance and rapid installation.
Patent Information
- Application Number
- CN202522520090.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-27
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-11-27
AI Technical Summary
Existing miniature capacitor packaging structures are prone to sealing failure due to thermal expansion and contraction. Traditional installation methods are cumbersome to install and remove, affecting equipment maintenance efficiency.
It adopts a triple protection structure of ceramic sealing shell, buffer cavity and epoxy resin potting layer, combined with quick installation components, and realizes tool-free installation by using inclined plane transmission and spring return.
It effectively prevents moisture intrusion, improves the stability and service life of capacitors in humid environments, enables quick disassembly and assembly, and improves maintenance and repair efficiency.
Smart Images

Figure CN224934621U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component packaging and mounting technology, and in particular to a moisture-proof miniature capacitor. Background Technology
[0002] Miniature capacitors, as indispensable energy storage and filtering components in electronic circuits, are widely used in various precision electronic devices. With the increasing diversity of application environments for electronic devices, capacitors often need to operate in harsh environments with high humidity, rain, or large temperature differences. However, existing miniature capacitor packaging structures are usually quite simple, often using direct resin encapsulation. Due to the difference in thermal expansion coefficients between the packaging material and the internal metal or ceramic components, significant thermal stress can occur between different material layers when the ambient temperature fluctuates drastically, easily leading to microcracks in the rigid packaging layer. These microcracks, invisible to the naked eye, become channels for moisture intrusion. Once external moisture penetrates into the capacitor, it can cause a decrease in insulation resistance, an increase in leakage current, and even short-circuit breakdown, severely affecting the operational reliability of electronic devices.
[0003] In addition to their inherent protective properties, the mounting method of miniature capacitors on the circuit board is also a key factor affecting the overall maintenance efficiency of the equipment. Currently, most miniature capacitors are fixed to the PCB board using traditional methods such as lead soldering or bolt locking. While this method meets basic connection requirements, it is extremely cumbersome when capacitors fail due to moisture or aging and need repair or replacement. Maintenance personnel often need to use specialized tools such as soldering irons or screwdrivers for disassembly, which is not only time-consuming but also prone to damaging other delicate components in the confined space of the circuit board. Especially in industrial control or outdoor communication equipment requiring rapid maintenance response, the lack of a structure that provides both efficient moisture protection and tool-free quick assembly and disassembly has become a major pain point restricting the improvement of equipment maintenance efficiency.
[0004] Therefore, this invention proposes a moisture-proof miniature capacitor to address the shortcomings of existing technologies. Utility Model Content
[0005] In view of the problems in the prior art, such as the easy cracking of the packaging structure of micro capacitors due to thermal expansion and contraction, resulting in loss of sealing, and the cumbersome disassembly and maintenance efficiency caused by traditional installation methods that rely on welding or bolt fixing, this utility model aims to provide a moisture-proof micro capacitor with an improved structure that can effectively solve the above problems.
[0006] This utility model provides a moisture-proof miniature capacitor, comprising: a quick-installation assembly, a moisture-proof assembly installed on top of the quick-installation assembly, and a capacitor body encapsulated inside the moisture-proof assembly; the output end of the capacitor body is fixedly connected to an anode connector and a cathode connector.
[0007] The quick-installation assembly includes a base plate, a support base, and a sliding plate. A support block is fixedly connected to the top of the base plate, and a hollow block is fixedly connected to the top of the support block. A spring is housed inside the hollow block, with one end of the spring fixedly connected to the inner wall of the support block and the other end fixedly connected to a connecting block. A groove is formed on the top of the base plate, and a slider is fixedly connected to the bottom of the sliding plate, slidably connected to the inside of the groove. The inner side wall of the sliding plate is fixedly connected to the end of the connecting block away from the spring, and a lower pressure plate is fixedly connected to the outer side wall of the sliding plate. The support base is positioned above the base plate, with its top fixedly connected to the moisture-proof assembly and its bottom fixedly connected to an upper pressure plate.
[0008] Furthermore, the upper pressure plate, the lower pressure plate, and the support base are combined by abutting engagement, and the bottom plane of the lower pressure plate is engaged with the top plane of the upper pressure plate, thereby achieving the locking and fixing of the support base on the base plate.
[0009] Preferably, the outer side wall of the upper pressure plate has an inwardly inclined wedge-shaped structure, and the inner side wall of the lower pressure plate has an outwardly inclined wedge-shaped structure that cooperates with the upper pressure plate. During the downward movement of the support seat, the inclined surface of the upper pressure plate slides into contact with the inclined surface of the lower pressure plate, thereby converting the vertical pressure into a horizontal driving force.
[0010] Preferably, the sliding plate is provided in two sets, and the two sets of sliding plates are symmetrically distributed about the central axis of the base plate. The hollow block is located between the two sets of sliding plates, and the connecting block slides through the side wall of the hollow block, thereby ensuring the force balance and guiding stability of the sliding mechanism.
[0011] Preferably, the moisture-proof component includes a ceramic sealing shell, a buffer cavity, and an epoxy resin potting layer arranged sequentially from the inside to the outside; the ceramic sealing shell covers the outside of the capacitor body, and the ceramic sealing shell and the capacitor body are connected by laser welding to form a core airtight barrier.
[0012] Preferably, the epoxy resin potting layer covers the outer side of the ceramic sealing shell, and the buffer cavity is formed between the inner wall of the epoxy resin potting layer and the outer wall of the ceramic sealing shell, providing physical isolation space through the layered structure design.
[0013] Preferably, the buffer cavity is filled with moisture-proof silicone, and the thickness of the buffer cavity is between 0.1 mm and 0.3 mm, so as to absorb the stress generated by thermal expansion and contraction and adsorb residual moisture.
[0014] Preferably, the bottom of the epoxy resin potting layer is fixedly connected to the top of the support base, and the epoxy resin potting layer is doped with nano-silica filler to improve the density and corrosion resistance of the outer encapsulation material.
[0015] Preferably, one end of the anode connector and the cathode connector are electrically connected to the capacitor body, and the other end of the anode connector and the cathode connector pass through the ceramic sealing shell, the buffer cavity and the epoxy resin potting layer in sequence and extend to the outside of the moisture-proof component, so as to realize the conduction of internal and external circuits.
[0016] This utility model has the following beneficial effects:
[0017] 1. This utility model solves the problem that existing microcapacitor encapsulation materials are prone to cracking and loss of sealing due to thermal expansion and contraction by setting up a triple protection structure consisting of an inner-outer ceramic sealing shell, a moisture-proof silicone buffer cavity, and an epoxy resin potting layer with added nano-silica. It achieves the technical effects of effectively buffering thermal stress, preventing the encapsulation layer from cracking, completely isolating moisture intrusion, and significantly improving the working stability and service life of the capacitor in humid environments.
[0018] 2. This utility model, by setting up a quick-installation assembly including a base plate, spring, slide plate and upper and lower pressure plates with matching inclined surfaces, uses inclined surface transmission to convert vertical pressing force into horizontal driving force and cooperates with spring reset to achieve snap-fit connection. It solves the problem of traditional capacitor installation relying on welding or bolt fixing, which leads to cumbersome disassembly and maintenance and low replacement efficiency. It achieves the technical effect of automatic locking and fixing by pressing without auxiliary tools, convenient and quick disassembly, and greatly improves the efficiency of later maintenance and repair.
[0019] 3. This utility model solves the problems of easily damaged exposed spring components and poor sliding guide plate movement guidance that can easily cause deflection and jamming by setting hollow blocks between two sets of symmetrically distributed sliding plates and using hollow blocks to cover springs and guide connecting blocks to slide. It achieves the technical effects of protecting internal elastic elements, ensuring smooth and stable operation of the sliding mechanism, and further improving the overall structural stability of the device. Attached Figure Description
[0020] Figure 1 This is a three-dimensional schematic diagram of a moisture-proof miniature capacitor proposed in this utility model;
[0021] Figure 2An exploded view of a quick-installation assembly for a moisture-proof miniature capacitor proposed in this utility model;
[0022] Figure 3 This is a cross-sectional view of the hollow block of a moisture-proof miniature capacitor proposed in this utility model;
[0023] Figure 4 This is a cross-sectional view of the ceramic sealing shell of a moisture-proof miniature capacitor proposed in this utility model.
[0024] Legend:
[0025] 1. Capacitor body; 2. Anode connector; 3. Cathode connector; 4. Quick-install assembly; 401. Support base; 402. Upper pressure plate; 403. Slide plate; 404. Lower pressure plate; 405. Base plate; 406. Hollow block; 407. Support block; 408. Slide groove; 409. Slider; 410. Connecting block; 411. Spring; 5. Moisture-proof assembly; 501. Epoxy resin potting layer; 502. Buffer cavity; 503. Ceramic sealing shell. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0027] Example:
[0028] Please refer to Figures 1 to 4 This utility model provides a moisture-proof miniature capacitor, which aims to solve the problems of the existing miniature capacitor packaging structure being prone to sealing failure due to thermal expansion and contraction, resulting in moisture damage, and the traditional fixing method being cumbersome to disassemble and repair.
[0029] like Figure 1 and Figure 2As shown, the moisture-proof miniature capacitor mainly includes a quick-installation assembly 4 and a moisture-proof assembly 5 fixedly connected to the top of the quick-installation assembly 4. The quick-installation assembly 4 serves as the basic support and quick-disassembly platform for the entire device, used to securely install the device on the external circuit board. The moisture-proof assembly 5 serves as the core protection unit, used to provide multiple layers of isolation protection for the internal components. The moisture-proof assembly 5 encapsulates the capacitor body 1, which is the core electrical component for realizing the storage and release of electrical energy. The output end of the capacitor body 1 is fixedly connected to an anode connector 2 and a cathode connector 3, which are used to realize the electrical conduction between the capacitor body 1 and the external circuit.
[0030] Specifically, the quick-installation component 4 achieves tool-free installation through a mechanical snap-fit mechanism combined with a spring-loaded 411-position principle, such as... Figure 2 and Figure 3 As shown, the quick-installation assembly 4 includes a base plate 405, a support base 401, and a sliding plate 403. The base plate 405 is fixedly connected to the PCB board as a base. A support block 407 is fixedly connected to the top of the base plate 405. The support block 407 is used to provide central support positioning. A hollow block 406 is fixedly connected to the top of the support block 407. A receiving cavity is formed inside the hollow block 406. A spring 411 is installed inside the hollow block 406. One end of the spring 411 is fixedly connected to the inner wall of the support block 407. The other end of the spring 411 is fixedly connected to a connecting block 410. The connecting block 410 is used to transmit the elastic restoring force of the spring 411.
[0031] The top of the base plate 405 has symmetrical grooves 408 on both sides. The grooves 408 are used to limit the sliding trajectory direction. The bottom of the slide plate 403 is fixedly connected to a slider 409. The slider 409 is slidably connected inside the groove 408. Through the cooperation of the slider 409 and the groove 408, the slide plate 403 can make linear reciprocating motion on the top of the base plate 405. The inner side wall of the slide plate 403 is fixedly connected to the end of the connecting block 410 away from the spring 411. The connecting block 410 slides through the side wall opening of the hollow block 406, so that the movement of the slide plate 403 can drive the spring 411 to undergo elastic deformation. The outer side wall of the slide plate 403 is fixedly connected to a lower pressure plate 404. The lower pressure plate 404 serves as the force-bearing component and locking component of the locking mechanism.
[0032] The support base 401 is disposed above the base plate 405. The support base 401 is used to support the moisture-proof component 5 above. The top of the support base 401 is fixedly connected to the outer wall of the moisture-proof component 5. The bottom of the support base 401 is fixedly connected to the upper pressure plate 402. The upper pressure plate 402 acts as an active pressure component and cooperates with the lower pressure plate 404. The upper pressure plate 402 and the lower pressure plate 404 achieve quick locking and releasing through inclined surface compression and planar snap-fit. When the support base 401 moves downward, the upper pressure plate 402 can push the lower pressure plate 404 to move outward until the two are snap-fitted together, thereby fixing the support base 401 on the base plate 405. The number of sliding plates 403 is preferably two sets. The two sets of sliding plates 403 are symmetrically distributed about the central axis of the base plate 405. The hollow block 406 is located between the two sets of sliding plates 403. This symmetrical layout can ensure force balance and improve the stability of installation.
[0033] To solve the technical problems of cumbersome fixing and difficulty in quick positioning and locking during the installation of the aforementioned micro capacitor, the moisture-proof micro capacitor also includes an upper pressure plate 402 and a lower pressure plate 404 with a specific inclined guide design, and the upper pressure plate 402 and the lower pressure plate 404 form a specific sliding contact and snap-locking engagement relationship.
[0034] Please refer to the following carefully. Figure 2 and Figure 3 The core locking structure is described in detail below: The upper pressure plate 402 is fixedly connected to the bottom two sides of the support base 401. The outer side wall of the upper pressure plate 402 has an inwardly inclined wedge-shaped structure or guide slope. The lower pressure plate 404 is fixedly connected to the outer side of the slide plate 403. The inner side wall of the lower pressure plate 404 is correspondingly provided with an outwardly inclined wedge-shaped structure or guide slope that matches the shape and size of the upper pressure plate 402. The design of this mating structure is intended to convert the vertical pressing force into the horizontal driving force.
[0035] In the assembled state, when the support base 401 is pressed downwards, the inclined surface of the upper pressure plate 402 first abuts against the inclined surface of the lower pressure plate 404. As the support base 401 continues to move downwards, the upper pressure plate 402 pushes the lower pressure plate 404 to move outwards towards the base plate 405. The lower pressure plate 404 drives the slide plate 403, which is fixedly connected to it, to slide along the slide groove 408. The movement of the slide plate 403 stretches the spring 411 located inside the hollow block 406 through the connecting block 410, causing the spring 411 to undergo elastic deformation and accumulate potential energy. When the support base 401 moves downwards... After the upper pressure plate 402 has completely passed the inclined area of the lower pressure plate 404, the upper pressure plate 402 no longer applies horizontal pushing force to the lower pressure plate 404. At this time, the spring 411 releases its elastic potential energy to reset, pulling the slide plate 403 and the lower pressure plate 404 to rebound inward, so that the bottom plane of the lower pressure plate 404 is tightly locked above the top plane of the upper pressure plate 402. This automatic locking method, which combines inclined plane transmission with spring 411 reset, ensures the longitudinal limiting stability of the moisture-proof component 5 after installation, and at the same time achieves the quick installation effect of pressing and locking.
[0036] For the protection and guidance of the reset mechanism, the hollow block 406 is fixedly installed at the top center of the base plate 405 by the support block 407. The hollow block 406 covers the outside of the spring 411 and the connecting block 410. The connecting block 410 slides through the side wall opening of the hollow block 406. This structural layout not only provides a closed receiving space for the spring 411 to prevent external debris from interfering with the extension and contraction of the spring 411, but also provides auxiliary guidance for the reciprocating motion of the connecting block 410 through the side wall opening of the hollow block 406, preventing the slide plate 403 from deflecting during the sliding process.
[0037] Based on the above embodiments, the present invention may further include the following preferred technical solutions:
[0038] As a preferred embodiment, to address the problem that traditional microcapacitor packaging is prone to cracking due to thermal expansion and contraction caused by changes in ambient temperature, leading to moisture ingress and failure, the moisture-proof component 5 adopts a triple-protection structure arranged sequentially from the inside out. Please refer to... Figure 4The moisture-proof component 5 includes a ceramic sealing shell 503, a buffer cavity 502, and an epoxy resin potting layer 501. The ceramic sealing shell 503, as the innermost core isolation barrier, tightly covers the outside of the capacitor body 1. The ceramic sealing shell 503 and the capacitor body 1 are preferably connected by laser welding. Laser welding can form a continuous and dense weld, effectively preventing water vapor from penetrating into the core channel of the capacitor along the joint. The epoxy resin potting layer 501, as the outermost physical protective shell, covers and is installed on the outside of the ceramic sealing shell 503. The bottom of the epoxy resin potting layer 501 is fixedly connected to the top of the support base 401. In order to further improve the density and corrosion resistance of the outer protection, the epoxy resin potting layer 501 is uniformly doped with nano-silica filler. The addition of nano filler can effectively fill the micropores in the resin matrix and block the penetration path of water molecules.
[0039] As a further preferred embodiment, in order to alleviate the thermal stress generated between different material layers due to drastic fluctuations in ambient temperature and prevent cracking of the encapsulation structure, the inner wall of the epoxy resin potting layer 501 and the outer wall of the ceramic sealing shell 503 are not in direct rigid contact, but a buffer cavity 502 is reserved. The interior of the buffer cavity 502 is filled with moisture-proof silicone with good elasticity and moisture absorption properties. The thickness of the buffer cavity 502 (i.e., the gap between the epoxy resin potting layer 501 and the ceramic sealing shell 503) is preferably between 0.1 mm and 0.3 mm. This thickness range ensures sufficient buffer space to absorb the deformation stress generated by thermal expansion and contraction, avoiding cracking of the outer potting layer or the inner ceramic shell under stress, without excessively increasing the overall encapsulation volume. The buffer cavity 502 filled with moisture-proof silicone forms a flexible transition layer between the rigid shell and the core sealing layer, constructing a second moisture barrier.
[0040] As a preferred embodiment of electrical connection, in order to achieve a reliable connection between the capacitor body 1 and the external circuit, one end of the anode connector 2 and the cathode connector 3 are electrically connected to the positive and negative poles of the capacitor body 1, respectively. The other end of the anode connector 2 and the cathode connector 3 pass through the ceramic sealing shell 503, the buffer cavity 502 and the epoxy resin potting layer 501 in sequence and extend to the outside of the end face of the moisture-proof component 5. The penetration between the connector and each shell layer is also sealed to ensure the integrity of the moisture-proof system.
[0041] The working principle of this moisture-proof miniature capacitor is as follows:
[0042] When protecting the capacitor from moisture, the device constructs a triple protective barrier through the moisture-proof component 5. First, moisture from the external environment is blocked by the outermost epoxy resin potting layer 501, in which the added nano-silica filler significantly improves the material's density and effectively reduces moisture permeability. Second, any small amount of moisture or condensation caused by temperature changes is absorbed and buffered by the moisture-proof silicone in the middle buffer cavity 502. At the same time, the moisture-proof silicone layer, as a flexible medium, can absorb the thermal stress generated by the difference in thermal expansion coefficients between the ceramic sealing shell 503 and the epoxy resin potting layer 501, preventing the encapsulation layer from cracking. Finally, the innermost ceramic sealing shell 503, combined with laser welding technology, provides an airtight core isolation environment for the capacitor body 1, completely blocking moisture from entering the internal electrical channels, thereby ensuring the long-term stable operation of the capacitor in a humid environment.
[0043] During the rapid installation of the capacitor, the operator aligns the entire device with the base plate 405 pre-fixed on the PCB board, holds the support base 401 and presses it down. As the support base 401 moves downward, the wedge-shaped inclined surface of the upper pressure plate 402 at its bottom contacts and abuts against the corresponding wedge-shaped inclined surface of the lower pressure plate 404. The downward vertical pressing force is converted into a horizontal thrust through the inclined surface cooperation, pushing the lower pressure plate 404 and causing the slide plate 403 to slide outward along the slide groove 408. The movement of the slide plate 403 pulls the spring 411 located inside the hollow block 406 through the connecting block 410, causing the spring 411 to extend. 11. Accumulate elastic potential energy. When the support base 401 is pressed onto the surface of the base plate 405, the upper pressure plate 402 completely crosses the inclined area of the lower pressure plate 404. At this time, the horizontal thrust disappears, and the spring 411 releases elastic potential energy and quickly retracts, pulling the slide plate 403 and the lower pressure plate 404 to return to their original position inward. This causes the bottom plane of the lower pressure plate 404 to engage with the top plane of the upper pressure plate 402, completing the locking mechanism. If disassembly is required, simply manually push the lower pressure plate 404 or the slide plate 403 outward to release the locking mechanism, and the support base 401 and the capacitor can be pulled upward for quick maintenance and replacement.
[0044] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. A moisture-proof miniature capacitor, comprising: The quick-installation assembly (4), the moisture-proof assembly (5) installed on the top of the quick-installation assembly (4), and the capacitor body (1) encapsulated inside the moisture-proof assembly (5), wherein the output end of the capacitor body (1) is fixedly connected to an anode connector (2) and a cathode connector (3); The quick-installation assembly (4) is characterized in that it includes a base plate (405), a support base (401), and a sliding plate (403); A support block (407) is fixedly connected to the top of the base plate (405), and a hollow block (406) is fixedly connected to the top of the support block (407). A spring (411) is housed inside the hollow block (406). One end of the spring (411) is fixedly connected to the inner wall of the support block (407), and the other end of the spring (411) is fixedly connected to a connecting block (410). The top of the base plate (405) is provided with a groove (408), the bottom of the slide plate (403) is fixedly connected with a slider (409), the slider (409) is slidably connected to the inside of the groove (408), the inner side wall of the slide plate (403) is fixedly connected to the end of the connecting block (410) away from the spring (411), and the outer side wall of the slide plate (403) is fixedly connected with a lower pressure plate (404). The support base (401) is disposed above the base plate (405), the top of the support base (401) is fixedly connected to the moisture-proof component (5), and the bottom of the support base (401) is fixedly connected to the upper pressure plate (402). The upper pressure plate (402) and the lower pressure plate (404) abut against each other, and the bottom plane of the lower pressure plate (404) is engaged with the top plane of the upper pressure plate (402).
2. The moisture-proof miniature capacitor according to claim 1, characterized in that, The outer side wall of the upper pressure plate (402) has an inwardly inclined structure, and the inner side wall of the lower pressure plate (404) has an outwardly inclined structure that cooperates with the upper pressure plate (402). During the downward movement of the support base (401), the inclined surface of the upper pressure plate (402) slides in contact with the inclined surface of the lower pressure plate (404).
3. The moisture-proof miniature capacitor according to claim 1, characterized in that, The number of the sliding plates (403) is two sets, and the two sets of sliding plates (403) are symmetrically distributed about the central axis of the base plate (405). The hollow block (406) is located between the two sets of sliding plates (403), and the connecting block (410) slides through the side wall of the hollow block (406).
4. The moisture-proof miniature capacitor according to claim 1, characterized in that, The moisture-proof component (5) includes a ceramic sealing shell (503), a buffer cavity (502), and an epoxy resin potting layer (501) arranged sequentially from the inside to the outside; The ceramic sealing shell (503) covers the outside of the capacitor body (1), and the ceramic sealing shell (503) and the capacitor body (1) are connected by laser welding.
5. The moisture-proof miniature capacitor according to claim 4, characterized in that, The epoxy resin potting layer (501) covers the outside of the ceramic sealing shell (503), and the buffer cavity (502) is formed between the inner wall of the epoxy resin potting layer (501) and the outer wall of the ceramic sealing shell (503).
6. The moisture-proof miniature capacitor according to claim 5, characterized in that, The buffer cavity (502) is filled with moisture-proof silicone, and the thickness of the buffer cavity (502) is between 0.1 mm and 0.3 mm.
7. The moisture-proof miniature capacitor according to claim 4, characterized in that, The bottom of the epoxy resin potting layer (501) is fixedly connected to the top of the support base (401), and the epoxy resin potting layer (501) is doped with nano-silica filler.
8. The moisture-proof miniature capacitor according to claim 4, characterized in that, One end of the anode connector (2) and the cathode connector (3) are electrically connected to the capacitor body (1), and the other end of the anode connector (2) and the cathode connector (3) successively penetrate the ceramic sealing shell (503), the buffer cavity (502) and the epoxy resin potting layer (501) and extend to the outside of the moisture-proof component (5).
