Silicon wafer flipping apparatus

Abstract

The application provides a silicon wafer overturning device, which comprises a conveying assembly, the conveying assembly comprising a first conveying structure and a second conveying structure, the first conveying structure and the second conveying structure having a predetermined distance therebetween; an overturning assembly, the overturning assembly comprising a rotating structure and a fixing structure, the rotating structure being arranged between the first conveying structure and the second conveying structure, the fixing structure comprising a connecting part and a first limiting part, the connecting part being movably connected with the rotating structure, and the first limiting part being connected with one end of the connecting part, which is away from the rotating structure. The technical scheme of the application effectively solves the problem of low production efficiency caused by the difficulty in disassembling and assembling the wind fire wheel during the process of overturning the silicon wafer by using the wind fire wheel.

Description

Technical Field

[0001] This application relates to the technical field of solar cell processing, and more particularly to a silicon wafer flipping device. Background Technology

[0002] In the battery production process, CVD solar cells need to be flipped three times to deposit an I layer on both sides of the solar cell, followed by an N layer and a P layer. Currently, the main method used is to flip the silicon wafer to deposit the coating on both sides of the solar cell.

[0003] The device has solar cell tracks on both sides of the rotating wheel. When a silicon wafer moves to the wheel, its rotation causes it to leave the track and flip, allowing it to be placed onto another track. Over time, the contact points between the wheel and the wafer can wear down, altering the wafer's position and causing it to be repositioned on the track. The tracks are equipped with pins to hold the wafer in place. If the wafer is not positioned accurately, its edge may strike the pins, resulting in wafer fragmentation.

[0004] In existing technologies, the common approach is to readjust the position of the fire wheel or replace it with a new one. However, fire wheels are relatively large, making adjustment and replacement difficult, time-consuming, and labor-intensive, which affects production efficiency. Utility Model Content

[0005] One of the technical problems this application aims to solve is the low production efficiency caused by the difficulty in disassembling and installing the hot wheel during the process of flipping silicon wafers.

[0006] To address the aforementioned technical problems, this application provides a silicon wafer flipping device.

[0007] A silicon wafer flipping device according to this application includes: a conveying assembly, which includes a first conveying structure and a second conveying structure, with a predetermined distance between the first conveying structure and the second conveying structure; and a flipping assembly, which includes a rotating structure and a fixed structure, wherein the rotating structure is disposed between the first conveying structure and the second conveying structure, and the fixed structure includes a connecting part and a first limiting part, wherein the connecting part is movably connected to the rotating structure, and the first limiting part is connected to the end of the connecting part away from the rotating structure.

[0008] In some embodiments, the rotating structure includes a rotating part having a fixed hole, and a connecting part having a threaded section that is movably inserted into the fixed hole.

[0009] In some embodiments, the rotating part is a hollow cylinder, and the axis of the threaded section is arranged along the radial direction of the rotating part.

[0010] In some embodiments, the fixing structure further includes a first fixing part and a second fixing part. The first fixing part has a first threaded hole that engages with a threaded segment. The second fixing part has a second threaded hole that engages with a threaded segment. The first fixing part and the second fixing part are located on the inner and outer sides of the rotating part, respectively.

[0011] In some embodiments, the first limiting portion has a first groove, and the portion of the silicon wafer to be flipped is located within the first groove.

[0012] In some embodiments, the rotating structure further includes a side plate and a second limiting part, the second limiting part being connected to the side plate and having a second groove, the silicon wafer to be flipped being located in the second groove, and the second groove being correspondingly provided with the first groove.

[0013] In some embodiments, the side plates include two side plates, which are located on both sides of the rotating part.

[0014] In some embodiments, the side plate has an opening, which is provided in correspondence with the fixing structure.

[0015] In some embodiments, the first conveying structure portion is located between the two side plates, and the second conveying structure portion is located between the two side plates.

[0016] In some embodiments, the fixing structure includes multiple fixing structures, which are connected to the rotating structure and are evenly distributed.

[0017] Through the above technical solution, the silicon wafer flipping equipment provided in this application, in which the first conveying structure conveys the silicon wafer to the flipping assembly, and after the silicon wafer contacts the first limiting part, the flipping assembly rotates, causing the silicon wafer to flip. After the silicon wafer contacts the second conveying structure, it is conveyed by the second conveying structure, and the silicon wafer leaves the first limiting part. When a displacement of the silicon wafer is detected, it indicates that the first limiting part has worn. The position of the first limiting part can be adjusted by adjusting the position of the connecting part, without replacing the entire flipping assembly. The technical solution of this application effectively solves the problem of low production efficiency caused by the difficulty in disassembling and installing the fan wheel during the silicon wafer flipping process in the prior art. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This paper shows a top view of the silicon wafer flipping device disclosed in Embodiment 1 of this application; Figure 2 It shows Figure 1 A schematic diagram of the structure of the flipping assembly of a silicon wafer flipping device; Figure 3 It shows Figure 1 A schematic diagram of the fixed structure of a silicon wafer flipping device.

[0020] Explanation of reference numerals in the attached figures: 10. Conveying assembly; 11. First conveying structure; 12. Second conveying structure; 20. Tilting assembly; 21. Rotating structure; 211. Rotating part; 212. Side plate; 2121. Opening; 213. Second limiting part; 2131. Second groove; 22. Fixing structure; 221. Connecting part; 222. First limiting part; 2221. First groove; 223. First fixing part; 224. Second fixing part. Detailed Implementation

[0021] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments of the application herein, but includes all technical solutions falling within the scope of the claims.

[0022] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.

[0023] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0025] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0026] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as having idealized or highly formalized meanings, unless expressly defined herein.

[0027] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0028] like Figures 1 to 3 As shown, the silicon wafer flipping device disclosed in Embodiment 1 of this application includes: a conveying assembly 10 and a flipping assembly 20. The conveying assembly 10 includes a first conveying structure 11 and a second conveying structure 12, with a predetermined distance between the first conveying structure 11 and the second conveying structure 12. The flipping assembly 20 includes a rotating structure 21 and a fixing structure 22. The rotating structure 21 is disposed between the first conveying structure 11 and the second conveying structure 12. The fixing structure 22 includes a connecting portion 221 and a first limiting portion 222. The connecting portion 221 is movably connected to the rotating structure 21, and the first limiting portion 222 is connected to the end of the connecting portion 221 away from the rotating structure 21.

[0029] Applying the technical solution of Embodiment 1, the first conveying structure 11 conveys the silicon wafer to the flipping assembly 20. After the silicon wafer contacts the first limiting part 222, the flipping assembly 20 rotates, causing the silicon wafer to flip. After the silicon wafer contacts the second conveying structure 12, it is conveyed by the second conveying structure 12, and the silicon wafer leaves the first limiting part 222. When a displacement of the silicon wafer is found, it indicates that the first limiting part 222 has been worn. The position of the first limiting part 222 can be adjusted by adjusting the position of the connecting part 221, without replacing the entire flipping assembly 20. The technical solution of Embodiment 1 effectively solves the problem of low production efficiency caused by the difficulty in disassembling and installing the "wind-fire wheel" during the flipping process of silicon wafers in the prior art.

[0030] like Figure 2 and Figure 3 As shown, in the technical solution of Embodiment 1, the rotating structure 21 includes a rotating part 211 with a fixing hole, and a connecting part 221 with a threaded section that is movably inserted into the fixing hole. The diameter of the fixing hole is larger than the outer diameter of the threaded section. By moving the threaded section in the fixing hole, the position of the first limiting part 222 connected to the connecting part 221 can be adjusted. This adjustment method is convenient, easy to operate, and has high adjustment efficiency.

[0031] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the rotating part 211 is a hollow cylinder, and the axis of the threaded section is arranged along the radial direction of the rotating part 211. The threaded section passes through the rotating part 211, so the end of the threaded section away from the first limiting part 222 is located inside the rotating part 211. Since the rotating part 211 is a hollow cylinder, workers can use tools to directly insert into the interior of the rotating part 211 from the end of the rotating part 211 to adjust the position of the connecting part 221. This adjustment method is convenient and will not contact the silicon wafer or other components on the first limiting part 222.

[0032] like Figure 2 and Figure 3 As shown, in the technical solution of Embodiment 1, the fixing structure 22 further includes a first fixing part 223 and a second fixing part 224. The first fixing part 223 has a first threaded hole that mates with a threaded segment. The second fixing part 224 has a second threaded hole that mates with a threaded segment. The first fixing part 223 and the second fixing part 224 are located on the inner and outer sides of the rotating part 211, respectively. Due to the threaded drive, rotating the first fixing part 223 and the second fixing part 224 can change the distance between them. After adjusting the threaded segment until the first limiting part 222 is in the appropriate position, rotating the first fixing part 223 and the second fixing part 224 causes them to move in a direction close to the rotating part 211, clamping the rotating part 211 and fixing the position of the threaded segment. This adjustment method is simple to operate and highly efficient.

[0033] like Figures 1 to 3 As shown, in the technical solution of Embodiment 1, the first limiting part 222 has a first groove 2221, and the silicon wafer to be flipped is located in the first groove 2221. The two sides of the first groove 2221 limit the silicon wafer. When the rotating part 211 rotates, the sides of the first groove 2221 apply an external force to the silicon wafer, causing the silicon wafer to flip. When the bottom of the first groove 2221 wears, the distance between the silicon wafer and the rotating part 211 changes, so the position between the flipped silicon wafer and the second conveying structure 12 will shift. At this time, it is necessary to adjust the position of the first connecting part 221 to ensure that the distance between the silicon wafer and the rotating part 211 is restored, without having to readjust the position of the entire rotating structure 21 or the position of the second conveying structure 12. This reduces the difficulty of adjustment and improves the efficiency of adjustment.

[0034] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the rotating structure 21 further includes a side plate 212 and a second limiting part 213. The second limiting part 213 is connected to the side plate 212 and has a second groove 2131. The silicon wafer to be flipped is located in the second groove 2131, and the second groove 2131 is correspondingly arranged with the first groove 2221. The sidewall of the second groove 2131 limits the silicon wafer, and the second limiting part 213 limits the side of the silicon wafer, further preventing the silicon wafer from shifting position. The second limiting part 213 and the first limiting part 222 work together to apply external force to the silicon wafer, causing the silicon wafer to flip.

[0035] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the side plate 212 includes two side plates 212, which are respectively located on both sides of the rotating part 211. Each side plate 212 is provided with a second limiting part 213, thus each first limiting part 222 is provided with two second limiting parts 213, thereby simultaneously limiting both sides of the silicon wafer, further ensuring the stability of the silicon wafer during the flipping process and preventing the silicon wafer from slipping.

[0036] like Figure 2 As shown, in the technical solution of Embodiment 1, the side plate 212 has an opening 2121, which is correspondingly provided with the fixing structure 22. This allows workers to directly observe the position of the silicon wafer, the state of the first limiting part 222, etc., from the opening. At the same time, when adjusting the position of the connecting part 221, tools can be inserted through the opening, further reducing the difficulty of adjustment.

[0037] like Figure 1As shown, in the technical solution of Embodiment 1, the first conveying structure 11 is partially located between the two side plates 212, and the second conveying structure 12 is partially located between the two side plates 212. The unloading end of the first conveying structure 11 is located between the two side plates 212. The rotating structure 21 rotates until the first groove 2221 and the second groove 2131 are aligned with the silicon wafer on the first conveying structure 11. The first conveying structure 11 conveys the silicon wafer, feeding it into the first groove 2221 and the second groove 2131 until the silicon wafer abuts against the bottom of the first groove 2221. The rotating structure 21 then rotates, causing the silicon wafer to flip. The loading end of the second conveying structure 12 is located between the two side plates 212. After the silicon wafer falls onto the second conveying structure 12, the rotating part stops rotating, and the second conveying structure 12 conveys the silicon wafer, causing it to leave the first groove 2221 and the second groove 2131. The side plates also serve to limit and protect the silicon wafer, while facilitating the positioning of the entire flipping assembly 20.

[0038] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the fixing structure 22 includes multiple fixing structures 22, which are connected to the rotating structure 21 and are evenly distributed. The arrangement of multiple fixing structures 22 makes the flipping of the silicon wafer more continuous, suitable for mass production, and improves production efficiency.

[0039] The difference between the technical solution of Embodiment 2 and the technical solution of Embodiment 1 is that the second limiting part 213 is movably connected to the side plate 212, and the moving direction is parallel to the rotation axis of the rotating structure 21. This avoids problems such as wear of the second limiting part 213 leading to silicon wafer position displacement, further improving the positional accuracy of the silicon wafer and preventing silicon wafer fragments.

[0040] In summary, the front and rear tracks (conveyor assembly 10) of the windmill are fixed to the machine platform and are integrally fixed with the gantry, and cannot be adjusted. The track pins ensure that the battery cells before and after the windmill is flipped are fixed between two pins; otherwise, overlap will cause damage and scratches to the battery cells. The internal design of the windmill (flipping assembly 20) allows for adjustable support positions, optimizing the front and rear positions to prevent battery cells from overlapping the pins. The middle position of the windmill is adjustable, and the position of the supporting battery cells is also adjustable to solve the matching problem with the front and rear track pins. The middle support point (fixed structure 22) is designed to be detachable, making it easy to replace after long-term wear of the contact battery cells. The adjustable support point (fixed structure 22) consists of three parts: a bolt (threaded section) fixed at the middle rotating position of the windmill; a locking nut (first fixing part 223 and second fixing part 224), which, after length adjustment, is locked in the rotating mechanism (rotating structure 21) to prevent positional displacement due to long-term operation; and the rotating battery cell contact surface (first groove 2221), i.e., the contact position with the battery cell. This application details the following: As shown in the overall diagram, the entire wind-fire wheel can move to both sides, i.e., along the axial direction. The fulcrum mechanism is fixed on the wind-fire wheel. During debugging, the wind-fire wheel is centered and adjusted to the middle of the two side tracks. When material overlap occurs during infeed and outfeed, loosen the nut, tighten the bolt to the appropriate position, and then tighten the nut again. Because the fulcrum position is adjustable, once the wind-fire wheel is confirmed to be centered, adjustments can be made more easily with the bolts, reducing equipment downtime and ensuring equipment uptime. This device allows for more convenient adjustment of the infeed and outfeed positions of battery cells, solving the problem more efficiently and ensuring stable workshop production capacity. This application has a simple structure and is easy to install, eliminating the need to consider pre-reserved positions for the front and rear wind-fire wheels. It effectively solves the problem of difficult machine positioning accuracy in the early stages. The components at the intermediate support position are easy to disassemble and replace, facilitating maintenance. This flipping structure (flipping component 20) is suitable for various industries to achieve precise adjustment of the material's position before and after flipping.

[0041] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions of this application based on the above description.

[0042] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.

Claims

1. A silicon wafer flipping device, characterized in that, include: The conveying assembly (10) includes a first conveying structure (11) and a second conveying structure (12), with a predetermined distance between the first conveying structure (11) and the second conveying structure (12); The flipping assembly (20) includes a rotating structure (21) and a fixed structure (22). The rotating structure (21) is disposed between the first conveying structure (11) and the second conveying structure (12). The fixed structure (22) includes a connecting part (221) and a first limiting part (222). The connecting part (221) is movably connected to the rotating structure (21). The first limiting part (222) is connected to the end of the connecting part (221) away from the rotating structure (21).

2. The silicon wafer flipping device according to claim 1, characterized in that, The rotating structure (21) includes a rotating part (211) having a fixing hole, and the connecting part (221) having a threaded section that is movably inserted into the fixing hole.

3. The silicon wafer flipping device according to claim 2, characterized in that, The rotating part (211) is a hollow cylinder, and the axis of the threaded section is arranged along the radial direction of the rotating part (211).

4. The silicon wafer flipping device according to claim 2, characterized in that, The fixing structure (22) further includes a first fixing part (223) and a second fixing part (224). The first fixing part (223) has a first threaded hole that engages with the threaded segment. The second fixing part (224) has a second threaded hole that engages with the threaded segment. The first fixing part (223) and the second fixing part (224) are located on the inner and outer sides of the rotating part (211), respectively.

5. The silicon wafer flipping device according to claim 2, characterized in that, The first limiting part (222) has a first groove (2221), and the silicon wafer to be flipped is located in the first groove (2221).

6. The silicon wafer flipping device according to claim 5, characterized in that, The rotating structure (21) further includes a side plate (212) and a second limiting part (213). The second limiting part (213) is connected to the side plate (212). The second limiting part (213) has a second groove (2131). The silicon wafer to be flipped is located in the second groove (2131). The second groove (2131) is correspondingly arranged with the first groove (2221).

7. The silicon wafer flipping device according to claim 6, characterized in that, The side plate (212) includes two, and the two side plates (212) are respectively located on both sides of the rotating part (211).

8. The silicon wafer flipping device according to claim 6, characterized in that, The side plate (212) has an opening (2121), which is correspondingly provided with the fixing structure (22).

9. The silicon wafer flipping device according to claim 7, characterized in that, The first conveying structure (11) is partially located between the two side plates (212), and the second conveying structure (12) is partially located between the two side plates (212).

10. The silicon wafer flipping device according to any one of claims 1 to 9, characterized in that, The fixed structure (22) includes multiple fixed structures (22), which are connected to the rotating structure (21) and are evenly distributed.

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