Bottom positioning and labeling of substrate storage and transport containers
CN309069647SActive Publication Date: 2025-01-14SHIN ETSU POLYMER CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202330653568.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2023-04-12
- Filing Date
- 2023-10-10
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2038-10-10
Smart Images

Figure 000007_ABST
Abstract
1. The name of this design product: Bottom positioning and labeling portion of a container for storing and transporting substrates. 2. Purpose of the product of this design: This product is a substrate storage and transport container used for transporting and storing fine wafers (i.e., FOSB) such as semiconductor wafers. The portion indicated by the solid line is the bottom positioning and labeling portion of the substrate storage and transfer container. 3. The design highlights of this appearance design product are: the shape shown by the solid line part. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. Other situations that need explanation: The part shown by the solid line in the view is the part that you want to protect, and the part shown by the dotted line is the part that you do not want to protect. The dot-dash line is a dividing line used to distinguish the part you want to protect from other parts. In the reference figure showing the part that is desired to be protected, the part shown in red is the part that is not desired to be protected.
Need to check novelty before this filing date? Find Prior Art