Abrasive pad
CN309246712SActive Publication Date: 2025-04-18ZHONGJI SEMICON MATERIALS (SHENZHEN) CO LTD
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Patent Information
- Application Number
- CN202430529085.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2039-08-20
Smart Images
Figure 000004_ABST
Abstract
1. The name of the product of this design: polishing pad. 2. Purpose of the product with this design: The product with this design is used for polishing silicon wafers, etc. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. This appearance design product is a thin product, and the left view, right view, top view and bottom view are omitted.
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