Heat pipe
CN309392950SActive Publication Date: 2025-07-18SHENZHEN VC THERMAL TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202430729677.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2039-11-18
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Figure 000007_ABST
Abstract
1. Name of the design product: Heat pipe. 2. Use of the design product: The design product is used for heat dissipation of mobile phone chips. 3. Design key points of the design product: Lies in the shape. 4. Picture or photo that best shows the design key points: 3D view of Design 1. 5. Design 1 is designated as the basic design.
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