Automatic detection wafer film thickness measuring instrument
CN309540305SActive Publication Date: 2025-10-14YONGCHUN SEMICON (WUXI) CO LTD
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Patent Information
- Application Number
- CN202530045555.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-10-14
- Estimated Expiration
- 2040-01-23
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: automatic detection wafer film thickness measuring instrument. 2. The use of the design product: wafer film thickness measurement, can carry wafer when wafer film thickness detection, and automatic detection wafer film thickness. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: perspective drawing.
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