Power device package housing

CN309622171SActive Publication Date: 2025-11-21JIANGSU JIEJIE MICROELECTRONICS
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Patent Information

Application Number
CN202530150281.8
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2025-11-21
Estimated Expiration
2040-03-25

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Abstract

1. The name of the design product: power device package shell. 2. The use of the design product: the design product is used for the shell of packaging electronic device. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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