Power device package housing
CN309622171SActive Publication Date: 2025-11-21JIANGSU JIEJIE MICROELECTRONICS
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Patent Information
- Application Number
- CN202530150281.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2040-03-25
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Figure 000004_ABST
Abstract
1. The name of the design product: power device package shell. 2. The use of the design product: the design product is used for the shell of packaging electronic device. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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