High-precision chip die bonder
CN309735892SActive Publication Date: 2026-01-13DONGGUAN CO ROBOT INTELLIGENT EQUIP TECH CO LTD
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Patent Information
- Application Number
- CN202530305179.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-29
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2040-05-29
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: high-precision chip die bonder. 2. The use of the design product: the design product is used for automatic chip alignment, dispensing, die bonding, full-automatic feeding and laminating production. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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