dicing saw
CN309739735SActive Publication Date: 2026-01-16JIANGSU JCA ELECTRONICS TECH CO LTD
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Patent Information
- Application Number
- CN202530328315.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2040-06-09
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: wafer scriber. 2. The use of the design product: used for precision cutting of IC, PCB, ceramic, glass, lithium niobate, alumina, quartz and other materials; widely used in IC integrated circuit (8 12 inches), LED packaging, QFN, DFN, BGA, optical photoelectric, communication and other industries. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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