Card-type thermal imager housing
CN309989143SActive Publication Date: 2026-05-19ZHENGZHOU FEELELEC TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- ZHENGZHOU FEELELEC TECH CO LTD
- Filing Date
- 2025-11-14
- Publication Date
- 2026-05-19
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Card-type thermal imager housing. 2. Purpose of this design: For use as a housing for a card-type thermal imager. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key features: the front view.
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