Electronic component with an injection-molded component housing

Abstract

Electronic component (1) with an injection-molded component housing (10), a microcomponent (30), a cover and an electrically conductive insert (20) embedded in the component housing (10) for contacting the microcomponent (30), characterized in that the insert (20) has a receiving area (22) for receiving the microcomponent (30) with a partial area (23, 23') spaced from the microcomponent (30) for decoupling the microcomponent (30) from material stresses in the component housing (10), the partial area (23, 23') having guide grooves (26, 26') for receiving the cover.

Description

State of the art

[0001] The invention is based on an electronic component with an injection-molded component housing according to the preamble of claim 1, as well as a method for producing an electronic component, in particular for use in vehicle technology.

[0002] Such electronic components are generally known, for example from documents DE 10 2011 006 392 A1, DE 198 08 193 A1, US 2012 / 0 175 760 A1, US 7 667 306 B1, US 5 666 003 A, US 2010 / 0 127 366 A1, or DE 103 52 002 A1. The manufacture of electronic components with a microcomponent, such as yaw rate sensors or acceleration sensors, particularly involves the production of a soldered connection between the microcomponent and a printed circuit board intended to accommodate the microcomponent. An alternative manufacturing method involves clamping the microcomponent onto an insert.

[0003] For example, DE 10 2008 006 707 A1 discloses a sensor comprising a sensor housing, a sensor module arranged therein, and an insert. The sensor module is connected to the insert at two opposing outer surfaces. Furthermore, DE 10 2009 026 804 A1, for example, discloses a method for producing electronic components, wherein units of inserts arranged in a frame with a clamped microcomponent are each overmolded with a separate first coating. The overmolded units are separated from the frame and subsequently overmolded with a second coating.

[0004] The manufacture of such electronic components can disadvantageously lead to damage to the microcomponent due to material stresses in the component housing that are transferred to the microcomponent, for example during overmolding of a unit consisting of an insert and microcomponent with a housing material and / or during the curing of the housing material. However, a microcomponent with highly sensitive components that is particularly susceptible to damage, in particular a microelectromechanical sensor, for example a yaw rate sensor, requires particularly good and at the same time cost-effective protection against material stresses, in particular thermomechanical stresses and / or mechanical stresses. The electronic components known from the prior art are not adequately protected against such stresses, especially in cost-critical manufacturing processes and in particular when providing a suitable housing material for overmolding.In particular, the production of electronic components with very sensitive components, such as yaw rate sensors, is associated with increased effort. Disclosure of the invention

[0005] It is therefore an object of the present invention to provide an electronic component which enables cost-effective protection of the component against stresses occurring, in particular during the manufacturing process.

[0006] The electronic component according to the invention with an injection-molded component housing and the method according to the invention for producing an electronic component according to the independent claims have the advantage over the prior art of providing simple and cost-effective protection of the microcomponent against material stresses, in particular thermomechanical loads and / or in particular mechanical stresses transmitted from the component housing to the microcomponent. Furthermore, the electronic component according to the invention advantageously makes it possible to avoid signal distortions by means of a partial region that is designed to be particularly electrically conductive. In particular, this improves the electromagnetic compatibility of the electronic component.The microcomponents are in particular microelectromechanical sensors, for example rotation rate sensors or acceleration sensors, wherein the component according to the invention, which has such a microcomponent, is used, for example, in a vehicle.

[0007] According to the invention, it is possible to connect the microcomponent to external systems, for example in a vehicle, via electrically conductive contact pins arranged on the insert. Preferably, the microcomponent is arranged in the receiving area such that the partial area protects the microcomponent from external influences or from the component housing, in particular from mechanical stresses in the component housing and / or unwanted electrical or electromagnetic effects. It is particularly advantageous to arrange the partial area at a distance from the microcomponent in order to form a type of buffer area between the component housing and the microcomponent.

[0008] Preferably, within the scope of the method for producing the electronic component, a spacer surrounding the microcomponent is used to improve positional tolerance when the insert is populated with the microcomponent. Said spacer fills the gap and is removed, in particular, after the positioning and / or alignment of the microcomponent. Furthermore, the partial region has, in particular, guide grooves for receiving a cover. This advantageously makes it possible to protect the microcomponent from the top side as already described. Furthermore, in particular, the partial region and / or the cover are designed to be electrically conductive to improve electromagnetic compatibility.Particularly preferably, a pre-molded part is attached to the insert for fixing the insert, and in particular the curved walls, to ensure sufficient protection of the unit formed from the insert and the microcomponent during the injection molding process. The method for producing an electronic component with an injection-molded component housing comprising a housing material comprises, in particular, a first manufacturing step, wherein an electrically conductive insert with a receiving region for receiving a microcomponent is provided. In particular, in a second manufacturing step, a partial region located in the receiving region of the insert and spaced apart from the microcomponent decouples the microcomponent from mechanical stresses in the component housing, in particular during the curing of the housing material.In a third manufacturing step, the insert is populated with the microcomponent to form a unit, and in a fourth manufacturing step, the unit is at least partially overmolded to form a housing. This particularly advantageously provides a comparatively high and cost-effective level of protection for a highly sensitive microcomponent during manufacturing.

[0009] Advantageous embodiments and further developments of the invention can be found in the dependent claims and the description with reference to the drawings.

[0010] According to a preferred embodiment, the partial region of the insert is partially curved to decouple the microcomponent from material stresses. This advantageously makes it possible to protect the microcomponent from impairments by the component housing. The curved or angled partial region, also referred to as the wall, is arranged in particular such that the partial region at least partially encloses the microcomponent. The wall is preferably L-shaped in at least one partial region in order to form an almost completely closed frame around the microcomponent, in particular together with at least one further wall. The microcomponent has an upper side arranged parallel to a main extension plane of the microcomponent and an opposite lower side arranged parallel to the upper side.Furthermore, the microcomponent, which is in particular cuboid-shaped, has a side region enclosing the microcomponent. The microcomponent is positioned with its underside in the receiving region of the insert. The wall is arranged in particular within the main extension plane of the microcomponent from the side region of the microcomponent arranged in the receiving region of the insert such that a gap having a gap width is formed between the wall and the microcomponent. The gap width is in particular selected such that the microcomponent cannot be moved and, in particular, an unwanted rattling movement of the microcomponent is not possible. Furthermore, the partial region in particular has guide grooves for receiving a cover. This advantageously makes it possible to also protect the microcomponent from the top in the manner already described.In particular, the partial area and / or the cover are designed to be electrically conductive to improve electromagnetic compatibility.

[0011] According to a preferred embodiment, the insert has a registration mark, in particular a punched one, for positioning and / or aligning the microcomponent. This advantageously makes it possible to position and align the microcomponent relatively precisely in the receiving area and in particular at a defined distance from the partial area using the registration mark. In particular, the microcomponent has an electrically conductive, force-fitting and / or material-fit connection with the insert, wherein the microcomponent is in particular soldered to the insert using a solder and / or bonded using a conductive adhesive.This advantageously makes it possible, in particular, to connect the microcomponent having highly sensitive components to the insert part without damaging the microcomponent, for example due to the clamping force resulting from the clamping of the microcomponent by means of a retaining tab.

[0012] According to a preferred embodiment, it is provided that the microcomponent has three, in particular triangularly arranged, solder contact areas or four, in particular quadrangularly arranged, solder contact areas for contacting the insert, wherein in particular the microcomponent has a land grid array or a ball grid array.

[0013] This advantageously makes it possible to reduce the mechanical stresses acting on the microcomponent when the solder contact areas are arranged triangularly on the underside of the microcomponent and / or to largely prevent any tilting movement of the microcomponent. With a square arrangement of the solder contact areas on the underside of the microcomponent, it is advantageously possible to improve the alignment of the microcomponent in the receiving area, known as "floating."

[0014] According to a preferred embodiment, it is provided that the insert part has a structure, in particular a depression, for increasing the distance between the microcomponent and the receiving area of ​​the insert part in a contact direction perpendicular to a main extension plane of the receiving area.

[0015] This advantageously makes it possible to better protect the microcomponent from, in particular, thermally induced or mechanical material stresses and / or to improve the adhesion of the microcomponent when shear forces occur.

[0016] According to a preferred embodiment, it is provided that three, in particular triangularly arranged, solder contact areas or four, in particular quadrangularly arranged, solder contact areas are formed on the microcomponent for contacting the insert, wherein in particular a land grid array or a ball grid array is formed on the microcomponent.

[0017] This advantageously makes it possible to reduce a tilting movement of the microcomponent and / or mechanical stresses on the microcomponent in the case of a triangular arrangement of the soldering contact areas and to improve the floating of the microcomponent, in particular during soldering, and to improve the mechanical shear strength of the microcomponent on the insert part in the case of a square arrangement.

[0018] According to a preferred embodiment, it is provided that a structure, in particular a depression, is formed on the insert part to increase the distance between the microcomponent and the receiving area of ​​the insert part in a contact direction perpendicular to a main extension plane of the receiving area.

[0019] This makes it advantageous to reduce impairments of the microcomponent caused by thermally induced mechanical stresses.

[0020] Embodiments of the present invention are illustrated in the drawings and explained in more detail in the following description. Short description of the drawings

[0021] It shows Fig. 1 is a schematic plan view of the electronic component according to the present invention, Fig. 2 a schematic plan view of the insert according to the present invention, Fig. 3 is a schematic plan view of the insert with a microcomponent according to the present invention, Fig. 4 a schematic side view of the insert according to the present invention Fig. 5 is a schematic side view of a first embodiment of the insert with a microcomponent according to the present invention, Fig. 6 a schematic side view of a second embodiment of the insert with a microcomponent according to the present invention, Fig. 7 is a schematic side view of a first embodiment of the microcomponent according to the present invention and Fig. 8 is a schematic side view of a second embodiment of the microcomponent according to the present invention. Embodiment(s) of the invention

[0022] In the various figures, identical parts are always provided with the same reference symbols and are therefore usually named or mentioned only once.

[0023] In Fig. 1 shows a schematic top view of the electronic component 1 according to the present invention, which is intended, for example, for integration into a vehicle (not shown). The electronic component 1 has an injection-molded component housing 10 and a unit embedded therein consisting of an insert 20 and a microcomponent 30, in particular a microelectromechanical sensor, for example a yaw rate sensor or an acceleration sensor. The insert 20 has an electrically conductive contact pin 21 and a further electrically conductive contact pin 21', which are configured to establish contact between the microcomponent 30 embedded in the injection-molded component housing 10 of the component 1 and a device, for example an electrical vehicle system.

[0024] The microcomponent 30 further has an upper side (not shown) facing away from the receiving area 22 of the insert part 20 and a lower side (not shown) facing the insert part 20 and opposite the upper side. Particularly preferably, the insert part 20 has a receiving area 22 for receiving the microcomponent 30, which in particular has a planar extension. The microcomponent 30 is connected to the insert part 20 on the underside in the receiving area 22 of the insert part 20 in an electrically conductive, force-fitting and / or materially bonded manner. Preferably, at least the receiving area 22 of the insert part 20 has a main extension plane 100, wherein the microcomponent 30, which in particular has a planar extension, is arranged in the receiving area, in particular with the planar extension parallel to the main extension plane 100.

[0025] Furthermore, the insert part 20 has a curved partial region 23 and in particular a curved further partial region 23'. The partial region 23 and the further partial region 23' each have a side surface (not shown) arranged perpendicular to the main extension plane 100 of the receiving region 22, which side surfaces are configured to enclose the microcomponent 30 in a frame-like manner, wherein the side surfaces at least partially, preferably almost completely, enclose the microcomponent. Furthermore, the curved partial region 23 and the further partial region 23' are spaced from the microcomponent 30 in a direction parallel to the main extension plane 100 of the receiving region 22 such that a gap 40 having a gap width is formed between the partial region 23 and the microcomponent and a further gap 40' is formed between the further partial region 23' and the microcomponent 30 on a side of the microcomponent 30 opposite the gap 40.

[0026] In Fig. 2 shows a schematic plan view of the insert according to the present invention. The insert 20 is provided in particular as a stamped insert 20, wherein the insert 20 has a contact pin 21 and a further contact pin 21'. The contact pins 21, 21' are configured, for example, to supply the microcomponent with electrical energy and / or for signal transmission. The partial region 23 of the insert 20 and the further partial region 23' of the insert 20 are each configured to form a frame-like structure, in particular a cage-shaped or basket-shaped structure open towards a side facing away from the insert 20, enclosing the receiving region 22, in particular the microcomponent 30 positioned in the receiving region 22.In this case, the partial regions 23, 23' are each bent at the intended bending points 24, 24' parallel to a main extension direction 102 of the contact pins 21, 21' arranged parallel to one another along the main extension direction. The partial regions 23, 23' are bent in a direction 103 perpendicular to the main extension direction 100 of the receiving region 22. Furthermore, further predetermined bending points 25, 25' are arranged on the stamped inserts at two opposite ends of the partial regions 23, 23' to form an at least partially L-shaped partial region, wherein the L-shaped partial region has the L-shape in a plan view of the main extension plane 100 of the receiving region 22.

[0027] In particular, guide grooves 26 are provided on the partial region 23 and further guide grooves 26' are provided on the further partial region 23' for receiving a cover (not shown) placed on the curved partial regions that at least partially laterally enclose the microcomponent 30 and, in particular, soldered to the partial region. To further increase electromagnetic compatibility, in particular to protect against signal corruption, the cover, like the partial regions 23, 23', is designed to be electrically conductive. The microcomponent 22 preferably has three solder contact regions 34, 34', 36 arranged at three different corners of an equilateral triangle for contacting the insert part 20. The triangular arrangement of the solder contact regions 34, 34', 36 advantageously makes it possible to reduce mechanical stress on the microcomponent 30.Furthermore, it is advantageously possible to avoid a tilting movement of the microcomponent 30 by selecting the position of the triangular arrangement of the solder contact areas 34, 34', 36 and thus to ensure a better hold of the microcomponent 30 in the receiving area 22 of the insert 20.

[0028] Furthermore, the solder contact areas 34, 34', 35, 35' are preferably arranged at four different corners of a square or rectangle. This advantageously makes it possible to achieve improved floating of the microcomponent 30, particularly during soldering or bonding to the insert 20, and increased mechanical shear strength of the microcomponent 30 on the insert 20.

[0029] Each solder contact area 34, 34', 35, 35', 36 has in particular 1 to 5 partial contact points 33, wherein in Fig. 2 shows three such sub-sections as examples.

[0030] In particular, in the receiving area 22 of the insert 20, at the locations provided for an optimal position of the microcomponent 30, in particular punched solder contact recesses (not shown) are formed for particularly simple, in particular automated, positioning and alignment of the microcomponent 30 on the insert 20. Furthermore, a marking 27', referred to as a registration mark 27', in particular circular or cross-shaped, is applied to the insert 20, in particular punched, in order to achieve particularly precise positioning and alignment of the microcomponent 30 by an automatic pick and place machine (not shown) with a positional accuracy in the micrometer range.

[0031] In particular, one or more punched holes 41 are formed in the insert 20 in an area in which a short circuit between measuring contact points (not shown) of the microcomponent 30 arranged at adjacent locations on the underside of the microcomponent 30 is to be avoided. A short circuit can be caused, for example, by solder balls or other electrically conductive particles.

[0032] In Fig. 3 shows a schematic plan view of the insert 20 with a microcomponent 30 according to the present invention.

[0033] The partial region 23 and the further partial region 23' are each formed as walls 23, 23' that are bent upwards in a viewing direction perpendicular to the main extension plane 100 of the receiving region 22 of the insert part 20, in particular extending from the drawing plane 100 towards a viewer. The wall 23 of the partial region 23 and the further wall 23' of the further partial region 23' together form a receiving region 22 of the insert part 20 that is basket-shaped in the main extension plane 100 and that receives the microcomponent 30, in particular open on the side of the wall 23 or the further wall 23' facing away from the insert part 20, in which the microcomponent 30 is arranged. In this case, a gap 40 having a gap width is formed between the microcomponent 30 and the wall, and a further gap 40' having a further gap width, in particular equal to the gap width, is formed between the microcomponent 30 and the further wall.In particular, the wall and the further wall are designed to be electrically conductive to improve electromagnetic compatibility and, for example, to protect the microcomponent 30 from signal corruption. Furthermore, the wall 23 and, in particular, the further wall 23' provide sufficient protection for the microcomponent, which is particularly highly sensitive, from mechanical stresses, particularly during overmolding of the unit comprising the insert 20 and the microcomponent 30.

[0034] In particular, the insert 20 is configured to form gap widths between the microcomponent 30 and the walls 23, 23' such that, particularly taking into account the tolerances achievable by the placement machine, movement of the microcomponent 30 parallel to the main extension plane 100 is excluded. The placement machine is configured in particular to position and align the microcomponent 30 on the insert 20, for example, with an accuracy of approximately 35-50 micrometers.

[0035] Preferably, a pre-molded part is attached to the insert 20 for fixing the insert 20 and the wall 23 at least partially enclosing the microcomponent 30 and the further wall 23' of the partial region 23 and the further partial region 23', in particular for forming the component housing 10 during an injection molding process. This ensures sufficient protection against bending and / or torsion of individual parts of the unit comprising the insert 20 and the microcomponent 30 against one another, in particular during overmolding in the injection molding process. The pre-molded part holds the insert 20 and the partial regions 23, 23' in the intended position relative to one another and relative to the microcomponent 30.

[0036] In Fig. 4 shows a schematic side view of the insert 20 according to the present invention. The wall 23 of the partial region 23 has a bevel 28, and the further wall 23' of the further partial region 23' has a further bevel 28', each of which is provided for particularly simple, and in particular automated, assembly of the microcomponent 30 provided with a spacer (not shown) on the insert 20. The gap widths of the gaps 40, 40' are configured in particular to accommodate the spacer in the respective gaps 40, 40'. In particular, the spacer partially encloses the microcomponent 30 along a side region of the microcomponent 30 in a frame-like manner to improve the positional tolerances. The spacer is preferably removed after the microcomponent 30 has been connected to the insert 20.Alternatively, the spacer comprises a material that protects, in particular dampens, the microcomponent 30 from mechanical stresses in order to prevent movement of the microcomponent 30, in particular parallel to the main extension direction 100 of the receiving region 22.

[0037] In Fig. 5 shows a schematic side view of a first embodiment of the insert 20 with a microcomponent 30 according to the present invention. The microcomponent 30 is integrally connected to the insert 20 in the receiving area 22 on an underside facing the insert 30 by means of a conductive connecting means 50, in particular a solder 50 or an adhesive 50. The microcomponent 30 has, in particular, a molding compound 31 and a laminate 32, wherein in the area of ​​the laminate 32, the laminate is formed with partial contact points 33 of the solder contact points 34, 34', 35', 35', 36 penetrating in a contact direction 103 perpendicular to the main extension plane 100 of the receiving area 22, wherein Fig. 5 example three partial contact points 33 (see also Fig. 2). To increase the protection of the microcomponent against thermally induced mechanical stresses, and in particular to improve the adhesion of the microcomponent in the case of shear forces occurring, for example, during the injection molding process, an adjustment of the distance between the microcomponent 30 and the insert 20 in the contact direction 103 is possible, for example by changing the amount of solder, changing the extent of the solder contact areas 34, 34', 35, 35', 36 and / or the size of contact points 37 (see Fig. 7) a ball grid array formed on the underside of the microcomponent 30.

[0038] In Fig. 6 shows a schematic side view of a second embodiment of the insert 20 with a microcomponent 30 according to the present invention. The insert 20 has a, in particular punched, recess 51 for receiving the connecting means 50, wherein a pointed tear-off edge 52 framing the recess 51 is formed in an edge region of the recess 51. By means of the recess 51 formed in the insert, a comparatively large distance between the microcomponent 30 and the insert 20 is possible, wherein a solder meniscus is formed that projects beyond the tear-off edge parallel to the main extension direction 100 of the receiving region 22.

[0039] In Fig. Figure 7 shows a schematic side view of a first embodiment of the microcomponent 30 according to the present invention. The microcomponent 30 has a ball grid array with ball-shaped conductive contacts 37 on its underside. Solder contact recesses (not shown) are arranged in the receiving area 22 of the insert 20, particularly for particularly simple and precise positioning.

[0040] In Fig. Figure 8 shows a schematic side view of a second embodiment of the microcomponent 30 according to the present invention.

[0041] The microcomponent 30 has a land grid array on its underside with a flat, conductive contact surface 38. In particular, partial contact points 33 penetrating the laminate 32 in the contact direction 103, in particular two to five spaced-apart, are formed in the microcomponent 30. The partial contact points 33 are closed at two opposite ends, in particular in the contact direction 103, in order to prevent the formation of solder cavities in the solder contact points 33 due to air inclusions.

Claims

[1] Electronic component (1) with an injection-molded component housing (10), a microcomponent (30), a cover and an electrically conductive insert (20) embedded in the component housing (10) for contacting the microcomponent (30), characterized by that the insert part (20) has a receiving area (22) for receiving the microcomponent (30) with a partial area (23, 23') spaced from the microcomponent (30) for decoupling the microcomponent (30) from material stresses of the component housing (10), wherein the partial area (23, 23') has guide grooves (26, 26') for receiving the cover. [2] Electronic component (1) according to claim 1, characterized by that the partial region (23, 23') of the insert (20) is partially bent to decouple the microcomponent (30) from material stresses. [3] Electronic component (1) according to one of the preceding claims, characterized bythat the insert part (20) has a, in particular punched, registration mark (27') for positioning and / or aligning the microcomponent (30) and / or wherein the microcomponent (30) has an electrically conductive, force-fitting and / or material-fitting connection with the insert part (20), wherein the microcomponent (30) is in particular soldered to the insert part (20) by means of a solder (50) and / or glued by means of a conductive adhesive (50). [4] Electronic component (1) according to one of the preceding claims, characterized by that the microcomponent (20) has three, in particular triangularly arranged, solder contact areas (34, 34', 36) or four, in particular quadrangularly arranged, solder contact areas (34, 34', 35, 35') for contacting the insert part (20), wherein in particular the microcomponent (30) has a land grid array (38) or a ball grid array (37). [5] Electronic component (1) according to one of the preceding claims, characterized by that the insert part (20) has a structural element (51), in particular a trough (51), for increasing the distance between the microcomponent (30) and the receiving area (22) of the insert part (20) in a contact direction (103) perpendicular to a main extension plane (100) of the receiving area (22). [6] Method for producing an electronic component (1) with an injection-molded component housing (10), a microcomponent (30) and a cover, wherein an electrically conductive insert (20) for contacting the microcomponent (30) is embedded in a housing material of the component housing (10), characterized byin that in a receiving area (22) for receiving the microcomponent (30) on the insert part (20), a partial area (23) spaced apart from the microcomponent (30) decouples the microcomponent (30) from material stresses of the component housing (10) during the curing of the housing material, wherein the partial area (23, 23') has guide grooves (26, 26') for receiving the cover. [7] Method according to claim 6, characterized by that three, in particular triangularly arranged, solder contact areas (34, 34', 36) or four, in particular quadrangularly arranged, solder contact areas (34, 34', 35, 35') are formed on the microcomponent (30) for contacting the insert part (20), wherein in particular a land grid array (38) or a ball grid array (37) is formed on the microcomponent (30). [8] Method according to one of claims 6 or 7, characterized bythat a structure (51), in particular a depression (51), is formed on the insert part (20) to increase the distance between the microcomponent (30) and the receiving area (22) of the insert part (20) in a contact direction (103) perpendicular to a main extension plane (100) of the receiving area (22). [9] Electronic component (1) for use in vehicle technology produced by a method according to one of claims 6 to 8, wherein the microcomponent (30) comprises a microelectromechanical sensor, in particular a rotation rate sensor.

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