Electronic arrangement with a textile support substrate formed by longitudinal and transverse elements and method for its manufacture

Abstract

Electronic arrangement (1) with a textile support substrate (3) formed by longitudinal elements (3.1) and transverse elements (3.2), with a plurality of elongated electrical conductors (5) extending in a plane of the support substrate (3) in the direction of the longitudinal elements (3.1) or in the direction of the transverse elements (3.2) at a respective distance from each other, wherein the electrical conductors (5) extend in the plane of the support substrate (3) from one side of the support substrate (3) to another side of the support substrate (3), and with electronic components (6) deposited on deposition areas (4) on the support substrate (3) and built up from a sequence of layers, characterized in that the layers of the electronic components (6) are deposited successively on the respective deposition areas (4), whereby the support substrate (3) forms a substrate of the electronic component (6), each of the electronic components (6) is electrically connected to at least two of the electrical conductors (5), a first area of ​​the carrier substrate (3) contains a number of solar cells as electronic components (6) and a second area of ​​the carrier substrate (3) contains a number of batteries as electronic components (6), wherein the batteries can be charged by the solar cells and electrically contactable contact areas (7) are present at the respective end areas of the electrical conductors (5) and the contact areas (7) are located in the area of ​​the sides of the support substrate (3).

Description

[0001] The invention relates to an electronic arrangement of the type known from the publication “Woven electrodes for flexible organic photovoltaic cells” (Kylberg, W. et al., 2011, Advanced Materials 23 (8): 1015-1019).

[0002] Electronic components can now be manufactured in such small sizes yet with such high performance that their use on or in flexible substrates such as textiles is possible without significantly impairing the performance properties of the textiles and the products made from them.

[0003] In order to be able to apply electronic components such as sensors, solar cells or radiation emitters to textile substrates, these must be connected to electrical conductors through which they can be supplied with electrical energy or through which generated electrical energy can be dissipated and through which the electronic components can be controlled if necessary.

[0004] Electrical conductors can be incorporated into a textile substrate by inserting them during the manufacture of the textile substrate, for example by weaving them in or applying them to it, as described in DE 103 42 285 B4.

[0005] The arrangement of electronic components in a multilayer structure of a textile carrier substrate is known, for example, from DE 197 55 792 C2, DE 100 01 942 A1, DE 10 2007 001 225 A1, and US 2006 / 0 078 187 A1. Parallel electrical conductors are incorporated into various layers of the structure and electrically connected to one another to create specific electrical interconnections between the layers.

[0006] US 2009 / 0 053 950 A1 discloses a textile carrier substrate in which longitudinal elements and transverse elements are woven together and arranged in a plane. Electrical components are present on a surface of the longitudinal elements and are connected to one another via lines. The lines do not extend from one side of the carrier substrate to the other side of the carrier substrate, but are only present on individual longitudinal elements and only over sections of these longitudinal elements. Each of the electrical components is connected to only a single electrical conductor. In order to be able to securely connect the electrical components to the longitudinal elements, a substrate can be applied to the surface of the longitudinal elements as a deposition area, to which the electrical components are attached. If the substrate is only applied over sections of the longitudinal elements, the flexibility of the longitudinal elements is largely retained.

[0007] DE 101 01 429 A1 relates to a lightweight construction element made of a textile multi-wall fabric and at least one expanded material between the walls of the multi-wall fabric. The expanded material tightens the textile connecting threads. Particles of the expanded material are bonded to the walls of the multi-wall fabric and / or to each other. This construction results in a very stable, yet lightweight construction element. In one embodiment of such a construction element, silicon-polymer batteries are woven into one side surface. These are electrically conductively connected to a CIS solar cell grid film, which is applied as a coating to the other side surface of the construction element. Apparently, the electrical conductors are guided through the construction element or along its edge from one side to the other.The electrical conductors do not lie in the plane of the longitudinal elements and the transverse elements, but run more or less perpendicular to them.

[0008] US 2010 / 0 109 981 A1 discloses a cuttable fabric formed by longitudinal and transverse elements with a plurality of electrical or electronic components. The electronic components comprise groups of LED pixels woven between conductive fibers and group controllers located on the conductive fibers. The LED pixels are controlled by the group controllers via bus lines. Contact between different intersecting electrical conductors is only possible via prepared connection points on the group controllers.

[0009] DE 10 2005 033 643 A1 discloses a textile fabric with a plurality of electrical or electronic components. The electrical conductors can be woven and are located in the plane of the carrier substrate. The electronic components are arranged on the electrical conductors, whereby the electronic components can be controlled by a microprocessor via bus lines. The electronic components are each arranged on only one electrical conductor. Contact between different intersecting electrical conductors is only possible via prepared connection points. It should be emphasized that the electrical conductors must necessarily intersect and that the connection points must be prepared, which is not conducive to subsequently flexible wiring.

[0010] The electrical conductors can be wires or threads coated with electrically conductive material, as are known, for example, from the publication "Fabric opto-electronics enabling healthcare applications; a case study" (van Pieterson, L. et al., 2011, 33rd Annual International Conference of the IEEE EMBS, Boston, Massachusetts USA: 8377 - 8379), DE 103 42 285 B4 or the above-mentioned publication by Kylberg, W. et al. (2011).

[0011] The latter publication by Kylberg, W. et al. (2011) describes a transparent and flexible electrode based on a textile carrier substrate. Metallic and polymer fibers are interwoven in a woven mesh, with the metallic fibers serving as electrical conductors. The polymer fibers form longitudinal and transverse elements of the carrier substrate. A disadvantageous porous surface of the fibers, as well as the voids between the fibers, are closed by a one-sided, complete, and surface-wide coating of the carrier substrate with a transparent and inert polymer. On the uncoated side of the carrier substrate, the electrical conductors are partially exposed but are laterally embedded in the layer of the transparent and inert polymer.A layer is deposited over the exposed sides of the electrical conductors, the polymer, and areas of the polymer fibers, which acts as a front contact of a solar cell. The front contact is contacted by the electrical conductors. An active layer and, finally, an electrically conductive layer are applied over this layer as a back contact. Light passes through the layer of transparent and inert polymer and the front contact onto the active layer, where, according to a known principle, it causes a displacement of electrical charges, which can be discharged as electrical voltage through the front and back contacts. The electrode produced in this way is a film that exhibits a certain rigidity and breaks under increased bending stress.

[0012] All electronic assemblies known from the state of the art require that the electrical conductors and electronic components be interconnected during the manufacture of the electronic assembly. If a change to the interconnection is required, ongoing production must be stopped, the desired interconnections created, and production restarted. It is not possible to simply produce a multitude of different interconnections based on a single manufactured electronic assembly.

[0013] The invention is based on the object of proposing a method for producing an electronic device that reduces the disadvantages of the prior art. In particular, it is intended to propose a method for producing various circuits of an electronic device in a simple, efficient manner.

[0014] The object is solved by the subject matter of independent claims 1, 7 and 12. Advantageous embodiments form the subject matter of the associated subclaims.

[0015] The object is achieved by an electronic assembly comprising a textile carrier substrate formed by longitudinal elements and transverse elements, which comprises a plurality of elongated electrical conductors extending in a plane of the carrier substrate in the direction of the longitudinal elements or in the direction of the transverse elements at a respective spacing from one another. The electrical conductors extend in the plane of the carrier substrate from one side of the carrier substrate to another side of the carrier substrate. Electronic components deposited on the carrier substrate and constructed from a sequence of layers are present in deposition areas.An electronic arrangement according to the invention is characterized in that the layers of the electronic components are deposited successively on the respective deposition regions, wherein a substrate of the electronic component is formed by the carrier substrate; each of the electronic components is electrically conductively connected to at least two of the electrical conductors, and electrically contactable contact regions are present at the respective end regions of the electrical conductors, and the contact regions are located in the region of the sides of the carrier substrate.

[0016] A textile carrier substrate is understood to be a substrate in which the longitudinal and transverse elements are selected from a group consisting of threads, fibers, ribbons, and strips. The carrier substrate can be a knitted fabric, a woven fabric, a textile, or a warp-knitted fabric. One plane of the carrier substrate is preferably formed by the longitudinal and transverse elements.

[0017] The longitudinal and transverse elements run in mutually orthogonal directions in a simple and cost-effective design of the carrier substrate.

[0018] Electrical conductors can be, for example, metal wires, e.g., CuSn, metallic strands, electrically conductive coated fibers, or combinations thereof. The electrical conductors run in the plane of the carrier substrate from one side of the carrier substrate to another side of the carrier substrate, so that the contact areas are located in the area of ​​the sides of the carrier substrate.

[0019] The longitudinal elements and the transverse elements can be made of the same or different materials. In an advantageous embodiment, the material is a glass fiber or a composite of several glass fibers. Glass fibers are particularly well suited as the substrate of an electronic component.

[0020] Glass fibers exhibit good temperature resistance, which is advantageous for some coating processes. Natural materials such as cotton or sheep's wool, as well as synthetic materials such as polyamides, polyethylene, polyvinyl chloride, or polypropylene, as well as combinations thereof, can also be used, particularly when lower temperatures are used for the deposition of electronic components.

[0021] The core of the invention is the provision of an electronic assembly whose electronic components can be easily interconnected in different ways after the assembly has been manufactured. This is based on the fact that the electrical conductors have electrically contactable contact areas at their respective end regions, which are freely accessible and not enclosed in a polymer layer or a similar layer. The contact areas can be subsequently exposed by material removal.

[0022] In an advantageous first embodiment of the electronic arrangement according to the invention, at least two contact areas of two electrical conductors are electrically connected to one another. Depending on which electrical conductors the electronic components are electrically connected to, the electrically conductive connection of the at least two contact areas results in a series connection, a parallel connection, or a combination of series and parallel connection of the electronic components.

[0023] The contact areas of the two electrical conductors present on one side of the carrier substrate can be connected to each other. In a further embodiment of the electronic assembly according to the invention, the contact areas on the other side of the carrier substrate can be connected to each other alternately or additionally. This latter possibility creates a replacement connection between the two electrical conductors, thus advantageously reducing the probability of failure of the electronic assembly.

[0024] A connection of the contact areas can be created, for example, by twisting, soldering, gluing, bonding, coating, printing or bridging the contact areas with each other by an electrically conductive element.

[0025] The layers of a respective electronic component are applied to the respective deposition areas. Additional auxiliary materials, such as filler material, can be applied at least over the extent of the individual deposition areas. It is advantageous if the deposition areas are present on sections of the longitudinal elements or the transverse elements. With such a design, the flexibility of the carrier substrate is largely retained, since its mobility between the deposition areas is not restricted by applied materials. If the deposition areas are not set up over intersection points of longitudinal and transverse elements, the respective longitudinal and transverse elements also remain movable at the intersection point, which favorably supports the flexibility of the carrier substrate.

[0026] Depending on the existing interconnection of the electronic components, in one embodiment of the electronic arrangement according to the invention there are at least two electronic components which are connected in series with one another.

[0027] In one possible embodiment, the electrical conductors run parallel to each other at a certain distance. An electronic component is arranged at every other distance and is connected to the two electrical conductors that define the distance. Multiple electronic components can be arranged on one electrical conductor and connected in parallel. If the contact areas of two electrical conductors, with no electronic component between them, are electrically connected to each other, the electronic components arranged at every other distance are connected in series.

[0028] In a modification of the embodiment described above, an electronic component is arranged at each distance.

[0029] The electronic components can also be arranged so close to each other that there is only one electrical conductor between them and they are contacted by this.

[0030] In a further embodiment of the electronic arrangement according to the invention, it is also possible for a number of electronic components to be arranged on an electrical conductor, and for one contact of each of the electronic components to be electrically contacted by the electrical conductor. Another contact of the electronic component is electrically connected to another electrical conductor.

[0031] In a further embodiment, at least two electronic components are present which are connected in parallel to each other.

[0032] It is also possible that there are at least three electronic components, of which at least two are connected in series and at least the third electronic component is connected in parallel to at least one other electronic component.

[0033] The electronic components can, for example, be selected from a group comprising solar cells, capacitors, batteries, sensors and detectors.

[0034] An electronic arrangement according to the invention can contain identical electronic components, e.g., only solar cells. In further embodiments, different electronic components can also be included. Different electronic components can be electronic components with the same functional principle, for example, solar cells with different performance parameters. However, different electronic components can also be electronic components with different functional principles, e.g., electrical energy storage devices such as batteries or capacitors, sensors, or detectors.

[0035] Different electronic components can be arranged alternately or according to a rule on the carrier substrate. They can also be arranged in regions on the carrier substrate. Thus, one region of the carrier substrate can contain a number of electronic components of a first operating principle, for example, solar cells, while another region contains a number of electronic components of a second operating principle, for example, batteries. For example, the batteries can be charged by the solar cells.

[0036] An electronic device according to the invention can be used in a layer sequence with at least two levels, wherein at least one of the levels is formed by the carrier substrate.

[0037] The object is also achieved in a method for producing an electronic device. A method according to the invention comprises the following steps: Step A: Producing a textile carrier substrate formed by longitudinal elements and transverse elements with a plurality of elongated electrical conductors extending in a plane of the carrier substrate in the direction of the longitudinal elements or in the direction of the transverse elements at a respective distance from one another, wherein the electrical conductors extend in the plane of the carrier substrate from one side of the carrier substrate to another side of the carrier substrate and electrically contactable contact regions are provided at respective end regions of the electrical conductors, Step B: Depositing layers of electronic components one after the other onto deposition areas on the carrier substrate, wherein the carrier substrate is used as a substrate of the electronic components and Step C: Establish electrical connections from the electronic component to at least two of the electrical conductors.

[0038] In one embodiment of the process, the electrical connections to be produced in step C can be created simultaneously with the deposition of layers of the electronic components in step B. For example, an electrically conductive layer deposited in step B can be guided to an electrical conductor and connected to it. This makes it possible to closely link steps B and C technologically, which contributes to efficient process management.

[0039] The electronic components can be arranged in series or in parallel. In an advantageous embodiment, a number of electronic components are connected in parallel as a group. Several such groups are connected in series. If the electronic components are, for example, solar cells, the electrical voltages of the solar cells can be added together by connecting them in series, and their electrical currents can be added together by connecting the groups in parallel. If the electronic components are batteries, the same voltage and current additions can be achieved as with solar cells. Increased sensitivity can be achieved with sensors and detectors.

[0040] In a further embodiment of the method according to the invention, after step C, the electronic assembly is separated into subassemblies along separation lines in a step D. This procedure makes it possible to cost-effectively produce a carrier substrate of an efficiently producible size and then separate it into the subassemblies. Typically, each subassembly thus obtained represents an electronic assembly according to the invention. The separation can be achieved, for example, by cutting using a mechanical device such as a punch, knife, or scissors, or by using a beam of high-energy radiation, e.g., a laser.

[0041] The carrier substrate can advantageously be manufactured in bulk or by the meter. For example, the carrier substrate can be produced in webs. Due to its good flexibility, the carrier substrate can be stored and transported in a space-saving manner, for example, stacked or wound on rolls. Separation into subassemblies can be carried out at a later time after the carrier substrate has been manufactured.

[0042] An advantageous, because effective and very variable, procedure for producing the sub-assemblies consists in that, before step D, a selection of a course of the dividing lines is carried out by comparing the known electrical parameters of the electronic components and the electrical conductors as well as the type of interconnection of the electronic assembly according to the invention described above with a desired electrical functionality of an electronic sub-assembly to be produced and the course of the dividing lines is selected such that an actual electrical functionality of an electronic sub-assembly to be obtained in this way is optimally approximated to the desired electrical functionality.

[0043] An electrical functionality of an electronic device is the electrotechnical effect caused by the electronic components present on the electronic device.

[0044] Electrical parameters of electronic components include ohmic resistances, capacitive resistances, inductances, generated currents or voltages.

[0045] In electronic arrangements where the electronic components are arranged every other distance between the electrical conductors, the dividing lines are defined along the distances where no electronic components are arranged.

[0046] If only one electrical conductor is present between the electronic components, the dividing lines between two electrical conductors can be defined along and parallel to them. This embodiment of the method according to the invention results in the destruction of the electronic components arranged between the two electrical conductors, particularly if they are directly adjacent to the electrical conductors. As a result, an area is created along the dividing line that is free of functional electronic components.

[0047] A desired interconnection of the electronic components of the electronic arrangement or sub-array can be achieved by electrically connecting exactly two contact areas of two electrical conductors to one another at least once, wherein the contact areas to be electrically connected to one another are selected with regard to the desired interconnection to be created. For example, with the knowledge of which electrical conductors the respective electronic components of an electronic arrangement are electrically connected to and how the electronic components are arranged relative to one another on the carrier substrate, it is possible to decide which contact areas are to be electrically connected to one another in order to achieve a desired electrical functionality of an electronic arrangement.

[0048] By connecting the contact areas, groups of electronic components connected in parallel can be connected in series. This makes it possible to create a large number of interconnection variants starting from a single electronic arrangement.

[0049] In order to compensate for any unevenness or gaps in the surface of the carrier substrate by applying a filler material at least over the respective extent of a deposition area, a filler material can be applied to the carrier substrate after step A and before step B. The filler material can also be applied only over the extent of the deposition area in order to achieve or maintain high flexibility of the substrate.

[0050] In a further embodiment of the method according to the invention, it is also possible to apply a filling material instead or additionally, by means of which gaps in the surface of the carrier substrate are closed and compensated.

[0051] Using the method according to the invention, a large number of series- and parallel-connected electronic components can be interconnected on the carrier substrate. A desired combination of series- and parallel-connected electronic components can subsequently be separated. The contact areas present at the edge of an electronic assembly or subassembly are electrically connected to one another according to the desired electrical functionality. Preferably, the outermost electrical conductors are used to contact external energy consumers or energy sources.

[0052] The invention is explained in more detail below with reference to figures and exemplary embodiments. In the following: Fig. 1 a schematic representation of a first embodiment of an electronic arrangement according to the invention with a first wiring variant, Fig. 2 a schematic representation of an electronic component with a first variant of the contacting of electrical conductors, Fig. 3 a schematic representation of a second embodiment of an electronic arrangement according to the invention with a second wiring variant, Fig. 4 a schematic representation of an electronic component with a second variant of the contacting of electrical conductors, Fig. 5 a schematic representation of a third embodiment of an electronic arrangement according to the invention, which is divided into sub-arrangements along dividing lines and Fig. 6 a schematic representation of a fourth embodiment of an electronic arrangement according to the invention, which is divided into sub-arrangements along dividing lines.

[0053] In a Fig. In the first exemplary embodiment of an electronic arrangement 1 according to the invention with a first wiring variant, shown in Figure 1, a carrier substrate 3 is present which has longitudinal elements 3.1 and transverse elements 3.2 that are woven together. Wires as electrical conductors 5 are woven into the carrier substrate 3 in the direction of the longitudinal elements 3.1 and parallel to these (shown in a simplified manner). The electrical conductors 5 run parallel to one another and at a distance from one another from one end of the carrier substrate 3 to an opposite other end of the carrier substrate 3 and have an electrically contactable contact region 7 at each of their end regions, with which the electrical conductors 5 protrude from the carrier substrate 3. The longitudinal and transverse elements 3.1, 3.2 as well as the electrical conductors 5 run in one plane.

[0054] In Fig. 1 shows, by way of example and in a simplified manner, a first to a sixth electrical conductor 5.1 to 5.6. Between the first electrical conductor 5.1 and the second electrical conductor 5.2, between the third electrical conductor 5.3 and the fourth electrical conductor 5.4, and between the fifth electrical conductor 5.5 and the sixth electrical conductor 5.6, three electronic components 6.1 to 6.3, 6.4 to 6.6, and 6.7 to 6.9 are each electrically conductively connected to the adjacent electrical conductors 5.1 and 5.2, 5.3 and 5.4, and 5.5 and 5.6, respectively, and are arranged in parallel interconnection. The contact regions 7 of the second and third electrical conductors 5.2 and 5.3, and of the fourth and fifth electrical conductors 5.4 and 5.5 are electrically conductively connected to one another. The three electronic components 6.1, 6.2 and 6.3 are connected to the three electronic components 6.4, 6.5 and 6.6 and the three electronic components 6.7, 6.8 and 6.9 connected in series.

[0055] The electronic components 6.1 to 6.9 are each solar cells of the same type and, within the manufacturing tolerances, have identical electrical parameters. The electronic components 6.1 to 6.9 are applied to deposition areas 4 on the cross elements 3.2.

[0056] The first electrical conductor 5.1 and the sixth electrical conductor 5.6 each contact a pole of an external energy consumer (symbolized by plus or minus signs).

[0057] Through the Fig. 2 shows a schematic and exemplary sectional view of a solar cell 9 as the first electronic component 6.1, representative of all electronic components 6.1 to 6.9. The transverse element 3.2, formed by a plurality of glass fibers (shown simplified as thin lines), is provided with a polymer as a filler material 12 via a deposition region 4, by which unevenness and hollow areas on the surface of the glass fibers and between the glass fibers are smoothed. A layer is deposited on the glass fibers in the deposition region 4, which layer functions as a back contact 8 of the solar cell 9. The actual solar cell 9 is applied to the back contact 8 in the form of a photovoltaically active layer.

[0058] In further embodiments, a battery, a capacitor, a sensor, or a detector may be present instead of the solar cell 9. In further embodiments, the aforementioned elements may also be multilayered and / or structured differently.

[0059] In further embodiments of the electronic arrangement 1 according to the invention, the first to sixth electronic components 6.1 to 6.6 can be solar cells and the seventh to ninth electronic components 6.7 to 6.9 can be batteries.

[0060] A further layer is deposited on the solar cell 9, which functions as a front contact 10 of the first electronic component 6.1.

[0061] The rear contact 8 is electrically connected to the second electrical conductor 5.2 via a contact 14. The front contact 10, in turn, is electrically connected to the first electrical conductor 5.1 via a contact 14. The contacts 14 are applied by soldering after the deposition of the rear contact 8, solar cell 9, and front contact 10.

[0062] In further embodiments of the electronic arrangement 1 according to the invention, the contacts 14 are produced by coating, gluing, printing, soldering or bonding.

[0063] One in the Fig. 3 schematically illustrated second embodiment of an electronic arrangement according to the invention with a second wiring variant differs from the first embodiment ( Fig. 1) in that the deposition regions 4 on the respective transverse element 3.2 extend over the entire distance between the first electrical conductor 5.1 and the second electrical conductor 5.2, between the third electrical conductor 5.3 and the fourth electrical conductor 5.4 and between the fifth electrical conductor 5.5 and the sixth electrical conductor 5.6.

[0064] The to Fig. 3 corresponding representative representation of the first electronic component 6.1 is in Fig. 4. The filler material 12 is applied to the cross element 3.2 made of glass fibers over the deposition area 4 and the surface of the cross element 3.2 is smoothed. Areas of the glass fibers serve as a substrate for the back contact 8. This is deposited around an area of ​​the second electrical conductor 5.2 and is in direct electrical connection with the latter. The solar cell 9 is deposited over the back contact 8 and is guided on one side of the back contact 8 up to the deposition area 4. The front contact 10 is deposited over the solar cell 9. This is also guided along one side of the solar cell 9 up to the deposition area 4, so that the solar cell 9 forms a separation between the back contact 8 and the front contact 10. The front contact 10 is deposited at the deposition area 4 around areas of the first electrical conductor 5.1 and is in direct electrical connection with the latter.

[0065] In Fig. 5 shows a third embodiment of the electronic device 1 according to the invention, which has the same basic structure as the Fig. 1 described embodiment. However, on the Fig. 5 schematically shown electronic arrangement 1, a plurality of electronic components 6 are arranged. The shown electronic arrangement 1 is manufactured as a semi-finished product, which is converted into an electronic arrangement 1 with a desired circuitry by further processing steps. For this purpose, the carrier substrate 3 is separated into two sub-assemblies 2 by means of a directed and focused laser beam of a separating tool 13 (shown in a highly simplified manner) along defined separating lines 11. Both sub-assemblies 2, considered individually, represent electronic arrangements 1 according to the invention. Fig. 5 horizontally defined dividing line 11 runs in the middle between two transverse elements 3.2. A vertically defined dividing line 11 runs at a distance between two electrical conductors 5 in which no electronic components 6 are arranged. The two sub-assemblies 2 are separated using the separating tool 13, which is guided along the respective dividing lines 11 from the edges of the carrier substrate 3 to an intersection point of the dividing lines 11. In the example shown, a sub-assembly 2 with six rows and five columns was separated from an electronic assembly 1 as a semi-finished product with electronic components 6 arranged in a matrix in twelve rows and nine columns.

[0066] In further embodiments of the method according to the invention, only a single separating line 11 can be defined, whereby the electronic arrangement 1 produced as a semi-finished product is separated into partial arrangements 2 in the direction of the separating line 11.

[0067] In further embodiments of the method according to the invention, it is also possible for more than two dividing lines 11 to be defined, so that complex-shaped, e.g., stepped, sub-arrangements 2 can be produced.

[0068] By separating between the transverse elements 3.2, the respective electrical conductors 5 are also severed, whereby the sections of the electrical conductors 5 lying in the region of the separating line 11 and severed now form end regions and contact regions 7 of these electrical conductors 5.

[0069] The contact areas 7 can now be electrically connected to one another, as shown by way of example for the smaller of the two sub-assemblies 2.

[0070] The number and course of the dividing lines 11 can be determined by relating the known electrical parameters of the electronic components 6 and the electrical conductors 5 to the type of interconnection of the respective electronic arrangement 1 serving as a semi-finished product by means of a simulation or calculation. This determines which electrical effect (actual electrical functionality) the electronic arrangement 1 exerts. Once the desired electrical functionality of an electronic sub-arrangement 2 to be manufactured is known, the actual electrical functionality can be compared with the desired electrical functionality, and a decision can be made as to which modifications to the electronic arrangement 1 are required to optimally approximate the desired electrical functionality.These modifications are achieved by defining the separation lines 11 such that a subassembly 2 obtained by separating the electronic assembly 1 exhibits a desired electrical functionality. The simulation also considers which of the contact areas 7 newly created by the separation are to be electrically connected to one another after the separation.

[0071] An optimal adaptation is determined taking into account the manufacturing tolerances of the electronic assembly 1 and its components as well as the electrical parameters of the electronic components 6. If the comparison of the actual electrical functionality and the desired electrical functionality results in a sufficient (= optimal) match, the course of the dividing lines 11 is determined accordingly.

[0072] On the sub-assembly 2 thus produced, those newly created contact areas 7 are electrically connected to one another by soldering, which, in interaction with the electronic components 6 of the sub-assembly 2 and their interconnection, bring about the desired electrical functionality.

[0073] In further embodiments of the method according to the invention, the contact areas 7 are twisted, soldered, glued, bonded, coated, printed or bridged by an electrically conductive element.

[0074] In the Fig.Figure 6 schematically shows, as a fourth embodiment, an electronic arrangement 1 according to the invention with twelve rows and nine columns, whose electronic components 6 are arranged at each spacing between the electrical conductors 5. In the horizontal direction shown, the flexibility of the electronic arrangement 1 may be limited; in the vertical direction shown, this flexibility remains.

[0075] In order to be able to produce subassemblies 2 according to the above-described embodiments of the method according to the invention, the course of the separating line 11 or the courses of the separating lines 11 between two electrical conductors 5 must be defined. The separating line 11 crosses the electronic components 6 arranged between the electrical conductors 5. When separating along the separating line 11, these electronic components 6 are inevitably destroyed by the separating tool 13. List of reference symbols 1 electronic arrangement 2 Partial arrangement 3 Carrier substrate 3.1 Longitudinal element 3.2 Cross element 4 Deposition area 5 electrical conductors 5.1 first electrical conductor 5.2 second electrical conductor 5.3 third electrical conductor 5.4 fourth electrical conductor 5.5 fifth electrical conductor 5.6 sixth electrical conductor 6 electronic component 6.1 first electronic component 6.2 second electronic component 6.3 third electronic component 6.4 fourth electronic component 6.5 fifth electronic component 6.6 sixth electronic component 6.7 seventh electronic component 6.8 eighth electronic component 6.9 ninth electronic component 7 Contact area 8 Back contact 9 solar cell 10 front contact 11 Dividing line 12 Filling material 13 Cutting tool 14 Contact

Claims

[1] Electronic arrangement (1) with a textile carrier substrate (3) formed by longitudinal elements (3.1) and transverse elements (3.2), with a plurality of elongated electrical conductors (5) running in a plane of the carrier substrate (3) in the direction of the longitudinal elements (3.1) or in the direction of the transverse elements (3.2) at a respective distance from one another, wherein the electrical conductors (5) run in the plane of the carrier substrate (3) from one side of the carrier substrate (3) to another side of the carrier substrate (3), and with electronic components (6) deposited on deposition areas (4) on the carrier substrate (3) and constructed from a sequence of layers, characterized by , that the layers of the electronic components (6) are deposited one after the other on the respective deposition areas (4), wherein the carrier substrate (3) forms a substrate of the electronic component (6), each of the electronic components (6) is electrically connected to at least two of the electrical conductors (5), a first region of the carrier substrate (3) contains a number of solar cells as electronic components (6) and a second region of the carrier substrate (3) contains a number of batteries as electronic components (6), wherein the batteries can be charged by the solar cells and electrically contactable contact areas (7) are present at respective end areas of the electrical conductors (5) and the contact areas (7) are located in the area of ​​the sides of the carrier substrate (3). [2] Electronic device (1) according to claim 1, characterized by that at least once exactly two contact areas (7) of two electrical conductors (5) are electrically connected to one another. [3] Electronic device (1) according to claim 1 or 2, characterized bythat the deposition areas (4) are present on sections of the longitudinal elements (3.1) or the transverse elements (3.2). [4] Electronic arrangement (1) according to one of claims 1 to 3, characterized by that there are at least two electronic components (6) which are connected in series with each other. [5] Electronic arrangement (1) according to one of claims 1 to 3, characterized by that there are at least two electronic components (6) which are connected in parallel to each other. [6] Electronic arrangement (1) according to one of claims 4 or 5, characterized by that at least three electronic components (6) are present, of which at least two are connected in series and at least the third electronic component (6.3) is connected in parallel to at least one other electronic component (6). [7] Method for producing an electronic device (1) according to one of the preceding claims, comprising the steps: Step A: Producing a textile carrier substrate (3) formed by longitudinal elements (3.1) and transverse elements (3.2) with a plurality of elongated electrical conductors (5) extending in a plane of the carrier substrate (3) in the direction of the longitudinal elements (3.1) or in the direction of the transverse elements (3.2) at a respective distance from one another, wherein the electrical conductors (5) extend in the plane of the carrier substrate (3) from one side of the carrier substrate (3) to another side of the carrier substrate (3) and electrically contactable contact regions (7) are provided at respective end regions of the electrical conductors (5), Step B: Depositing layers of electronic components (6) one after the other onto deposition areas (4) on the carrier substrate (3), wherein the carrier substrate (3) is used as a substrate of the electronic components (6) and Step C: Establish electrical connections from the electronic component (6) to at least two of the electrical conductors (5). [8] Method according to claim 7, characterized by that after step C, in a step D, the electronic arrangement (1) is separated into sub-arrangements (2) along separating lines (11). [9] Method according to claim 8, characterized bythat before step D, a selection of a course of the dividing lines (11) is carried out by comparing the known electrical parameters of the electronic components (6) and the electrical conductors (5) as well as the type of interconnection of the electronic arrangement (1) according to one of claims 1 to 6 with a desired electrical functionality of an electronic sub-arrangement (2) to be produced and the course of the dividing lines (11) is selected such that an actual electrical functionality of an electronic sub-arrangement (2) to be obtained in this way is optimally approximated to the desired electrical functionality. [10] Method according to claim 7 or any one of claims 8 or 9, characterized bythat a desired interconnection of the electronic components (6) of the electronic arrangement (1) or of the sub-arrangement (2) is effected by at least once exactly two contact areas (7) of two electrical conductors (5) being electrically connected to one another, wherein the contact areas (7) to be electrically connected to one another are selected with regard to the desired interconnection to be produced. [11] Method according to one of claims 7 to 10, characterized by that after step A and before step B, any unevenness or gaps in the surface of the carrier substrate (3) are compensated for at least over the respective extent of a deposition area (4) by applying a filling material (12). [12] Use of an electronic device (1) according to one of claims 1 to 6 in a layer sequence with at least two levels, wherein at least one of the levels is formed by the substrate.

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