Housing device for an electronic module, electronic module and method for manufacturing a housing device for an electronic module

Abstract

Housing device (105) for an electronic module (100), wherein the housing device (105) has at least the following feature: a first substrate (110), a second substrate (115) and a third substrate (120), wherein the second substrate (115) is arranged or can be arranged between the first (110) and the third substrate (120) and has a recess (135) in the form of a cavity for receiving at least one electronic component (145), and wherein a first opening (141) of the recess (135) is at least partially closed or can be closed by the first substrate (110) and a second opening (142) of the recess (135) is at least partially closed by the third substrate (120), wherein a side region of the recess (135) formed by the second substrate (115) has at least one lateral through-opening (1100) for introducing a medium into the recess (135).

Description

State of the art

[0001] The present invention relates to a housing device for an electronic module, an electronic module and to a method for manufacturing a housing device for an electronic module.

[0002] In consumer electronics, modules are known to consist of active electronic components as well as passive components such as resistors or inductors. These include, for example, modules for wireless transmission such as Bluetooth or Wi-Fi modules. The modules may also be encapsulated with molding compound.

[0003] In principle, MEMS sensors can be integrated into such modules. However, the subsequent overmolding process can affect sensor performance. Furthermore, providing optical or media access to the sensor element is complex.

[0004] DE 10 2010 001 711 A1 describes a conventional housing device for an electronic module. US 2012 / 0 217 049 A1 discloses a wiring board with an integrated image sensor. US 2002 / 0 192 442 A1 relates to a printed circuit board with an embedded electrical device. US 2008 / 0 070 000 A1 discloses a circuit module comprising a multilayer wiring board with a cavity section and an intermediate piece on which a chip is mounted. DE 10 2010 018 499 A1 relates to a printed circuit board with a cavity. DE 10 2007 010 711 A1 discloses a circuit arrangement and a method for its manufacture. Disclosure of the invention

[0005] Against this background, the present invention presents an improved housing device for an electronic module, an improved electronic module, and an improved method for manufacturing such a housing device according to the main claims. Advantageous embodiments will become apparent from the respective dependent claims and the following description.

[0006] A housing device for an electronic module is presented, wherein the housing device has at least the following feature: a first substrate, a second substrate and a third substrate, wherein the second substrate is arranged or can be arranged between the first and the third substrate and has a recess in the form of a cavity for receiving at least one electronic component, and wherein a first opening of the recess is at least partially closed or can be closed by the first substrate and a second opening of the recess is at least partially closed by the third substrate.

[0007] A housing device can generally be understood as a device for receiving an electronic component. Such a housing device, which is particularly simple and inexpensive to manufacture, can protect the electronic component, especially from mechanical damage.

[0008] An electronic component can generally be understood as a component used in electronic circuits, such as a sensor. Electronic circuits can use such components to process signals particularly efficiently.

[0009] An electronic module can generally be understood as an interchangeable, complex element within a complete system, device, or machine, where the element forms a self-contained functional unit. The electronic module could, for example, be a media sensor module or a radio transmission module. The housing can be part of the electronic module. Electronic modules allow for the particularly simple implementation of complex electronic systems.

[0010] A substrate can be, for example, a carrier plate used to mechanically mount electronic components and, in particular, to electrically connect them. Such a substrate is particularly cost-effective to manufacture and quick to assemble.

[0011] A substrate with a recess can generally be understood to be a frame-shaped support plate. Such a recess is particularly cost-effective to produce.

[0012] In conventional housings for electronic modules, the components are often encased in a molding compound to protect them from environmental influences or mechanical stress. However, such a mold coating can limit the performance of the installed components, especially sensors. Furthermore, media access can only be achieved with increased effort using this method.

[0013] To at least partially address these problems, the approach presented here creates a design consisting of at least three levels. In such a stacked structure, at least one level has a recess designed so that components can be placed on a level below, and a level above can close the cavity.

[0014] According to one embodiment of the present approach, the first and / or the second and / or the third substrate can be provided with electrical conductors. This allows electronic components with which the substrates can be mounted to be electrically connected to each other in a particularly simple and cost-effective manner.

[0015] Furthermore, a first contact area formed between the second and the first substrate and / or a second contact area formed between the second and the third substrate can be electrically connected. The second substrate can be designed to enable an electrical connection between the first and second contact areas. Thus, electronic components potentially mounted on the first and third substrates can be easily connected electrically via the second substrate.

[0016] It is also advantageous if the first and / or third substrate has at least one opening in the recess for introducing a medium. This medium could be, for example, a gas, pressure, or even light. The opening, which could be a simple hole, is particularly cost-effective to create.

[0017] According to the invention, a side region of the recess formed by the second substrate has at least one lateral through-opening for introducing a medium into the recess. The lateral through-opening can be implemented particularly cost-effectively, for example, as a recess formed in the first and / or second contact area, if present, or even as a simple bore.

[0018] According to another advantageous embodiment of the approach presented here, the through-hole and / or the lateral through-hole can be closed or closable by a light-conducting sealing element. The light-conducting sealing element can, for example, be an optically transparent material or an optical fiber leading into the recess and possibly connected to the electronic component. The light-conducting sealing element can be provided particularly cost-effectively.

[0019] Furthermore, the first and / or third substrate can have a component placement area facing the recess, which is electrically contactable and can be fitted with at least one electronic component. Such a component placement area could, for example, be a PCB socket soldered to the first and / or third substrate. Using this component placement area, the at least one electronic component can be positioned in the recess and integrated into a circuit particularly easily and cost-effectively.

[0020] Furthermore, it is advantageous if, in a further embodiment of the present approach, a fifth substrate has an additional component receiving area facing away from the recess, which is electrically contactable and can be equipped with at least one additional electronic component. In particular, the at least one additional electronic component can be electrically connected to the at least one electronic component. The additional component receiving area can, for example, be an electrically contacted area. The at least one additional electronic component, which can, for example, be soldered onto the additional component receiving area in a particularly cost-effective manner, can, in particular, be configured as a control unit for processing the signals output by the at least one electronic component.

[0021] Furthermore, the at least one additional electronic component can be provided with a sealing element to protect it against external influences. In particular, the at least one additional electronic component can be encapsulated with a molding compound. Such a sealing element can be manufactured particularly efficiently.

[0022] According to a further particularly advantageous embodiment of the approach presented here, the housing device can be characterized by a fourth and a fifth substrate. The fourth substrate can be arranged, or be arranged, between the third and the fifth substrates. Furthermore, the fourth substrate can be provided with a further recess for receiving at least one additional electronic component. In this case, a further first opening of the further recess can be at least partially closed, or be closed, by the third substrate, and a further second opening of the further recess can be at least partially closed, or be closed, by the fifth substrate. Such a housing device, modularly constructed from several identical substrates, can be implemented particularly simply and cost-effectively.

[0023] Furthermore, the present approach creates an electronic module with the following features: a housing device according to an embodiment presented here; and at least one electronic component that is arranged in the recess, in particular wherein the electronic component is designed as a sensor.

[0024] The electronic module can, for example, be a second-level package for a sensor or other active component, designed as a substrate stack. The electronic module allows at least one electronic component to be mechanically protected and connected to the substrate free from mechanical stress.

[0025] Finally, the presented approach provides a method for manufacturing a housing device for an electronic module, the method comprising the following steps: Providing a first substrate, a second substrate and a third substrate, wherein the second substrate is provided with a recess in the form of a cavity for receiving at least one electronic component; Applying the second substrate to the first substrate, whereby a first opening of the recess is closed by the first substrate; and Closing a second opening of the recess by the third substrate, wherein a side region of the recess formed by the second substrate has at least one lateral through-opening for introducing a medium into the recess.

[0026] The invention is explained in more detail below with reference to the accompanying drawings. These show: Fig. 1 a schematic representation of an electronic module according to an embodiment of the present invention; Fig. 2 a schematic representation of an electronic module according to a further embodiment of the present invention; Fig. 3 a schematic representation of an electronic module according to a further embodiment of the present invention; and Fig. 4 a flowchart of a method for manufacturing a housing device for an electronic module according to a further embodiment of the present invention.

[0027] In the following description of favorable embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and acting similarly, without repeating these elements.

[0028] Fig. Figure 1 shows an electronic module 100 with a housing device 105. The housing device 105 consists of a first substrate 110, a second substrate 115, a third substrate 120, a fourth substrate 125, and a fifth substrate 130, wherein the second substrate 115 is provided with a recess 135 and the fourth substrate 125 with a further recess 140. Furthermore, the second substrate 115 is arranged between the first substrate 110 and the third substrate 120, and the fourth substrate 125 is arranged between the third substrate 120 and the fifth substrate 130. A first opening 141 of the recess 135 is closed by the first substrate 110, and a second opening 142 of the recess 135 is closed by the third substrate 120. Furthermore, a further first opening 143 of the further recess 140 is closed by the third substrate 120 and a further second opening 144 of the further recess 140 is closed by the fifth substrate 130.

[0029] An electronic component 145 or a further electronic component 150 is arranged in the recess 135 or in the further recess 140. The electronic components 145 and 150 can each be, for example, sensor elements such as MEMS sensor elements. The first substrate 110 and the second substrate 120 each have a component receiving area 155 facing the recess 135 or the further recess 140, which is electrically contacted and equipped with the electronic component 145 or the further electronic component 150.

[0030] The fifth substrate 130 also has an additional component receiving area 160 facing away from the further recess 140, which is electrically contacted and equipped with an additional electronic component 165, for example a control unit for the electronic components 145, 150.

[0031] A surface of the fifth substrate 130, equipped with the additional electronic component 165, is completely covered by a semicircular closure element 170. The closure element 170 can, for example, be filled with a molding compound 172, with which the additional electronic component 165 is encapsulated and which protects the additional electronic component 165, for example, from environmental influences and mechanical damage.

[0032] Furthermore, a first contact area 175 is formed between substrates 110 and 115, a second contact area 180 between substrates 115 and 120, a third contact area 185 between substrates 120 and 125, and a fourth contact area 190 between substrates 125 and 130. The contact areas 175, 180, 185, and 190 are each electrically contacted, thus enabling an electrical connection between substrates 110, 115, 120, 125, and 130. The electronic components 145, 150, and 165 are electrically connected to each other via the contact areas 175, 180, 185, and 190 by means of electrical conductors 195 formed in the substrates 110, 115, 120, 125, and 130.

[0033] One side region of the recess 135 formed by the second substrate 115, and another side region of the further recess 140 formed by the fourth substrate 125, each has a lateral through-opening 1100 for introducing a medium (in Fig. (1 shown with arrows) into the recesses 135, 140. The medium can be, for example, a gas, pressure, humidity, or light. The medium penetrating the recesses 135, 140 through the lateral openings 1100 can thus be sensed by the electronic components 145, 150.

[0034] Sensor signals output by the electronic components 145, 150 can be transmitted to the additional electronic component 165 via the contact areas 175, 180, 185, 190 and the electrical conductors 195. The additional electronic component 165 can, for example, be configured to use these sensor signals to determine data signals, which can then be sent to a device located in Fig. 1 additional electronic module not shown can be transmitted.

[0035] If the electronic components 145, 150 are, for example, optical sensor elements, the lateral through-openings 1100 can alternatively be closed by a light-conducting sealing element 1105 (not shown), which is designed to protect the recesses 135, 140 from external environmental influences such as moisture or dirt particles.

[0036] Fig. Figure 2 shows the electronic module 100 according to the one in Fig. 1. Exemplary embodiment of the present invention shown. In contrast to Fig. 1 includes the in Fig. In the embodiment shown in Figure 2, only the substrates 110, 115, 120 are shown. The housing device 105 also has a through-opening 205 instead of the lateral through-opening 1100, which is formed in the first substrate 110 in an area of ​​the recess 135 for introducing the medium into the recess 135.

[0037] The component receiving area 155 is in Fig. 2 in the form of a circuit board base which is electrically connected to the first substrate 110 via two solder balls arranged in an outer edge area of ​​the base.

[0038] Furthermore, the in Fig. The additional component mounting area 160 shown in Figure 2 is equipped with a further additional electronic component 210. The additional electronic components 165, 210 are, in contrast to the one in Figure 2, Fig. 1. The embodiment shown is not covered by the locking element 170.

[0039] Fig. Figure 3 shows the electronic module 100 according to the one in Fig. 2. In contrast to the embodiment shown in Fig. The embodiment shown in 2 features the Fig. Figure 3 shows a closure element 305. The closure element 305 is in the form of a rectangular half-shell, corresponding to the width of the housing device 105 and completely covering one surface of the third substrate 120 facing away from the recess 135. Furthermore, the closure element 305 is filled with a molding compound 172, with which the additional electronic components 165, 210 are encapsulated for protection against external influences.

[0040] The following will describe the in the Fig. 2 and Fig. 3. The illustrated structure of an embodiment of the present invention is described again in other words.

[0041] The present invention provides a design for a second-level package. This design is particularly suitable for the requirements of media sensors such as gas, humidity, pressure, or light sensors and, in addition to providing media access or optical access, also offers protection of the sensors against mechanical damage.

[0042] The design consists of a stacked structure made up of several printed circuit board layers as substrates 110, 115, 120. In this substrate stack, at least one layer 115, also called second substrate, middle layer or printed circuit board frame, has a recess or cavity 135 designed such that sensors and other electronic components 145 can be mounted on a layer 110 below, also called first substrate, lower layer or lower substrate layer, and a layer 120 above, also called third substrate, upper layer or upper substrate layer, closes the cavity 135.

[0043] In its simplest form, the structure consists of a triple stack, made, for example, of substrate materials commonly used in the electronics industry, such as FR4 or ceramic. The middle layer 115 is reduced to a frame that serves as a spacer and establishes an electrical connection between the upper layer 120 and the lower layer 110 via through-holes, which are implemented, for example, as contact areas 175 and 180 (also called electrical and mechanical contact levels) and electrical conductors 195. The upper substrate layer 120 can be populated with additional components 165, also referred to as additional electronic components, which in turn can be protected, for example, by overmolding.

[0044] Inertial sensors, in particular, benefit from the described design because it provides mechanical protection without subjecting a component 145, also called an electronic component, to additional mechanical stresses through contact with another material. This design is especially advantageous for sensors with media access, such as pressure, gas, or humidity sensors, optical sensors such as photodiodes, or optically active components such as laser elements. For this purpose, it is necessary to create access to the interior of the cavity 135 in the form of a through-hole 205 or a lateral through-hole 1100, also simply called openings.

[0045] In the case of media sensors, this is possible, for example, by drilling holes in the upper substrate layer 120 or the lower substrate layer 110. A recess as a lateral through-hole 1100 in the middle substrate layer 115, the frame, is also conceivable, as is the creation of sufficient spacing in the contact layer, for example, by a high standoff during soldering or by a wider lateral distance or pitch between the solder contacts.

[0046] When using optical sensors or optically active components, the unprotected openings 205, 1100 of cavity 135 can be sealed with an optically transparent material to prevent, for example, the ingress of moisture. Furthermore, an optical fiber can be directly connected to the openings 205, 1100 to couple radiation in or out.

[0047] Using such a sensor module with cavity 135 as an electronic module 100, for example multi-sensor systems and self-contained sensor nodes can be built.

[0048] Fig. Figure 4 shows a method 400 for manufacturing a housing device for an electronic module according to a further embodiment of the present invention. First, in step 405, a first substrate, a second substrate, and a third substrate are provided. The second substrate is provided with a recess for receiving at least one electronic component. Then, in a further step 410, the second substrate is applied to the first substrate. A first opening of the recess is closed by the first substrate. Finally, in step 415, a second opening of the recess is closed by the third substrate.

[0049] The embodiments described and shown in the figures are only examples. Different embodiments can be combined completely or with respect to individual features. An embodiment can also be supplemented by features from another embodiment.

[0050] Furthermore, the process steps according to the invention can be repeated and carried out in a different order than described.

[0051] If an embodiment includes an “and / or” connection between a first feature and a second feature, this is to be read as meaning that the embodiment according to one embodiment has both the first feature and the second feature, and according to another embodiment either only the first feature or only the second feature.

Claims

[1] Housing device (105) for an electronic module (100), wherein the housing device (105) has at least the following feature: a first substrate (110), a second substrate (115) and a third substrate (120), wherein the second substrate (115) is arranged or can be arranged between the first (110) and the third substrate (120) and has a recess (135) in the form of a cavity for receiving at least one electronic component (145), and wherein a first opening (141) of the recess (135) is at least partially closed or closeable by the first substrate (110) and a second opening (142) of the recess (135) is at least partially closed or closeable by the third substrate (120), wherein a side region of the recess (135) formed by the second substrate (115) has at least one lateral through-opening (1100) for introducing a medium into the recess (135). [2] Housing device (105) according to claim 1, characterized bythat the first (110) and / or the second (115) and / or the third substrate (120) is provided with electrical conductor tracks (195). [3] Housing device (105) according to one of the preceding claims, characterized by that a first contact region (175) formed between the second (115) and the first (110) substrate and a second contact region (180) formed between the second (115) and the third substrate (120) can be electrically contacted, wherein the second substrate (115) is designed to enable an electrical connection between the first (175) and the second contact region (180). [4] Housing device (105) according to one of the preceding claims, characterized by that the first (110) and / or the third substrate (120) has at least one through-opening (205) in a region of the recess (135) for introducing the medium into the recess (135). [5] Housing device (105) according to one of the preceding claims, characterized by that the through-opening (205) and / or the lateral through-opening (1100) is closed or closable by a light-conducting sealing element (1105). [6] Housing device (105) according to one of the preceding claims, characterized by that the first (110) and / or the third substrate (120) has a component receiving area (155) facing the recess (135), which can be electrically contacted and equipped with the at least one electronic component (145). [7] Housing device (105) according to one of the preceding claims, characterized bya fourth (125) and a fifth substrate (130), wherein the fourth substrate (125) is arranged or can be arranged between the third (120) and the fifth substrate (130), wherein the fourth substrate (125) is provided with a further recess (140) for receiving at least one further electronic component (150) and wherein a further first opening (143) of the further recess (140) is or can be closed at least partially by the third substrate (120) and a further second opening (144) of the further recess (140) is or can be closed at least partially by the fifth substrate (130). [8] Electronic module (100) having the following features: a housing device (105) according to one of the preceding claims; and at least one electronic component (145) arranged in the recess (135), in particular wherein the electronic component (145) is designed as a sensor. [9] Method (400) for producing a housing device (105) for an electronic module (100), the method (400) comprising the following steps: Providing (405) a first substrate (110), a second substrate (115) and a third substrate (120), wherein the second substrate (115) is provided with a recess (135) in the form of a cavity for receiving at least one electronic component (145); Applying (410) the second substrate (115) to the first substrate (110), wherein a first opening (141) of the recess (135) is closed by the first substrate (110); and Closing (415) a second opening (142) of the recess (135) by the third substrate (120), wherein a side region of the recess (135) formed by the second substrate (115) has at least one lateral through-opening (1100) for introducing a medium into the recess (135).

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