Adapter for electrically conductively connecting an electronic component to a component carrier, electronic module and method for producing an electronic module

Abstract

Adapter (100) for electrically conductively connecting an electronic component (405) to a component carrier, wherein the electronic component (405) has at least one first component connection (505) and one second component connection (510) on a connection side (504), wherein the component carrier has at least one first carrier connection and one second carrier connection, and wherein the adapter (100) has the following features: at least one component plate (105) which can be arranged or is arranged opposite the connection side (504) and which has at least one first component contact element (125) for contacting the first component connection (505), a first carrier contact element (130) electrically coupled to the first component contact element (125) for contacting the first carrier connection and at least one contacting recess (110); at least one carrier plate (115) having at least one second component contact element (135) for contacting the second component terminal (510) and a second carrier contact element (140) electrically coupled to the second component contact element (135) for contacting the second carrier terminal, wherein the second component contact element (135) can be arranged or is arranged opposite the contacting recess (110) in order to contact the second component terminal (510) through the contacting recess (110); and at least one insulating element (120) which can be arranged or is arranged between the component plate (105) and the carrier plate (115) in order to electrically decouple the component plate (105) and the carrier plate (115) from one another, and wherein the component plate (105) and / or the insulating element (120) is designed in an annular manner and / or the carrier plate (115) is designed in a cross-shaped or star-shaped manner.

Description

[0001] The present invention relates to an adapter for electrically conductively connecting an electronic component to a component carrier, to an electronic module and to a method for producing such an electronic module.

[0002] Terminals for components such as electrolytic capacitors can be inserted into circuit board holes and connected by soldering. To increase durability against vibration, the components can be secured by applying a bead of an elastic medium.

[0003] DE 43 23 827 C1 relates to a pluggable assembly with a printed circuit board formed as a molded part made of plastic, in which conductor tracks formed from at least one lead frame are embedded, wherein electrically connected components are fastened to the printed circuit board via the conductor tracks and wherein flat plugs formed as a single piece on the lead frame emerge from the printed circuit board.

[0004] DE 195 35 490 A1 discloses a circuit board for the central electrical system of a motor vehicle comprising a carrier board with a conductor track structure for low-current operated components and openings for electrical contacts, wherein at least one circuit board for high-current operated components is electrically and mechanically connected to the carrier board by means of plug-in and / or press-in contacts.

[0005] DE 93 02 586 U1 shows a plug connection of two pairs of busbars, wherein a free end of one pair of busbars is designed as a receiving device for the plug-in part of the other pair of busbars, which is provided with a clamping device such that an adjustable clamping force acts on the receiving device.

[0006] Against this background, the approach proposed here presents an adapter for electrically connecting an electronic component to a component carrier, an electronic module, and a method for producing such an electronic module according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0007] The present approach provides an adapter for electrically conductively connecting an electronic component to a component carrier, wherein the electronic component has at least one first component connection and one second component connection on a connection side, wherein the component carrier has at least one first carrier connection and one second carrier connection, and wherein the adapter has the following features: at least one component plate which can be arranged or is arranged opposite the connection side and which has at least one first component contact element for contacting the first component connection, a first carrier contact element electrically coupled to the first component contact element for contacting the first carrier connection and at least one contacting recess; at least one carrier plate having at least one second component contact element for contacting the second component terminal and a second carrier contact element electrically coupled to the second component contact element for contacting the second carrier terminal, wherein the second component contact element can be arranged or is arranged opposite the contacting recess in order to contact the second component terminal through the contacting recess; and at least one insulating element which can be arranged or is arranged between the component plate and the carrier plate in order to electrically decouple the component plate and the carrier plate from one another.

[0008] An electronic component can be understood as a capacitor or a transistor, for example. A component carrier can be understood as a carrier, for example a printed circuit board, for the mechanical fastening and electrical connection of the electronic component. A component connection can be understood as a connection contact of the electronic component. For example, the component connection can be designed as a pin, tab or flag. A carrier connection can be understood as a connection contact of the component carrier. For example, the carrier connection can be a conductor track or contact surface of the component carrier. For example, the carrier connection can be designed as a metallized hole or through-contact in the component carrier. A component plate can be understood as a plate facing the electronic component for contacting the first component connection.A carrier plate can be understood as a plate facing the component carrier for contacting the second component connection. The component plate and the carrier plate can be arranged one above the other. The component plate can have a contacting recess. A contacting recess can be understood as a through-opening in the component plate that enables contacting the second component connection through the component plate.

[0009] A first component contact element can be understood as a connection contact of the component board for contacting the first component connection. A second component contact element can be understood as a connection contact of the carrier plate for contacting the second component connection. A first carrier contact element can be understood as a connection contact of the component board for contacting the first carrier connection. A second carrier contact element can be understood as a connection element of the carrier plate for contacting the second carrier connection. The component and carrier contact elements can be implemented, for example, as pins, tabs, or lugs.

[0010] The component plate can, for example, be a ground plate that can be connected to a ground terminal of the component via the first component contact element. Accordingly, the first carrier contact element can serve to connect the ground plate to a ground terminal of the component carrier.

[0011] An insulating element can be arranged between the component board and the carrier board. An insulating element can be understood as an intermediate layer made of an electrically insulating material, such as a plastic.

[0012] The approach presented here is based on the realization that an electronic component can be mounted on a printed circuit board using a simple and cost-effective adapter. Such an adapter offers the advantage of a secure and vibration-resistant connection between the component and the printed circuit board over the component's entire service life. Furthermore, the geometry of the adapter can be adapted to different component shapes with little effort. For example, the adapter can be pre-assembled with the component. This can significantly reduce manufacturing costs. A further advantage of the adapter is that the application of an elastic medium for vibration dampening can be eliminated, and the elimination of the associated curing time simplifies production.

[0013] According to one embodiment, the component plate and / or the carrier plate can be made of an electrically conductive material. The first component contact element and, additionally or alternatively, the first carrier contact element can be designed as part of the component plate. Accordingly, the second component contact element and, additionally or alternatively, the second carrier contact element can be designed as part of the carrier plate. The component plate and the carrier plate can be implemented, for example, as metal sheets. The metal sheets can, for example, have tabs or pins as component and carrier contact elements. This allows the adapter to be manufactured particularly cost-effectively.

[0014] To enable simple and cost-effective pre-assembly of the adapter, the insulating element can have at least one locking element, and the component plate can have at least one locking receptacle that can be locked to the locking element, so that the insulating element can be locked to the component plate. A locking element can be understood, for example, as a lug or a hook-shaped element on the insulating element. A locking receptacle can be understood, for example, as an edge, recess, or elevation of the component plate.

[0015] According to a further embodiment, the insulating element can have a recess for receiving the carrier plate and at least one retaining element for holding the carrier plate in the recess. A retaining element can be understood, for example, as a projection or a hook-shaped element in an edge region of the recess. This embodiment also allows the adapter to be pre-assembled quickly and cost-effectively without additional tools. Furthermore, by arranging the carrier plate in the recess, the adapter can be constructed as flat as possible.

[0016] The insulating element can have at least one carrier contact recess for passing the first carrier contact element through the insulating element and / or at least one component contact recess for passing the first component contact element and / or the first component terminal through the insulating element. This allows for very simple and space-saving contacting of the component board.

[0017] The component plate and / or the insulating element is ring-shaped, which allows the adapter to be designed particularly compactly, and / or the carrier plate is cross-shaped or star-shaped, which allows the material required to manufacture the carrier plate to be reduced.

[0018] The first carrier contact element and / or the second carrier contact element can be designed as a press-in contact for pressing into the component carrier. A press-in contact, also called a press-fit contact, can be understood as a spring-like, electrically conductive contact element that can be pressed into an opening in the component carrier and held in place by spring action. This allows the adapter to be electrically connected to the component carrier without soldering, reducing thermal stress on the component and preventing damage to the component. Such a solderless connection is also very robust against vibrations.

[0019] According to a further embodiment, the component contact element can be designed as a first welding tab for welding to the first component connection. Accordingly, the second component contact element can be designed as a second welding tab for welding to the second component connection. This allows the component to be connected to the component plate or the carrier plate with comparatively low thermal stress. Such a welded connection can also be implemented very cost-effectively.

[0020] The component plate and the carrier plate can be overmolded with a potting compound, whereby the insulating element can be made from the potting compound. The potting compound can be a thermoplastic or thermosetting plastic, for example. This design allows the adapter to be produced very cost-efficiently in large quantities. Furthermore, the manufacture of the insulating element and the assembly of the adapter can be carried out in a single step.

[0021] The component board can have at least one additional first carrier contact element electrically coupled to the first component contact element. Alternatively or additionally, the carrier board can have at least one additional second carrier contact element electrically coupled to the second component contact element. This allows a contact on the component to be divided between multiple contact surfaces on the component carrier.

[0022] Furthermore, the present approach creates an electronic module with the following features: an electronic component having at least a first component terminal and a second component terminal on a terminal side; and an adapter according to one of the previously described embodiments, wherein the component plate is arranged opposite the connection side and the first component contact element contacts the first component connection and the second component contact element contacts the second component connection.

[0023] The adapter can extend at least partially beyond the base surface of the electronic component to form a contact surface for exerting pressure on the adapter. A contact surface can be understood, for example, as a protruding flange of the adapter. This contact surface can prevent pre-existing mechanical damage to the component, for example, when pressing the component into a circuit board.

[0024] Finally, the approach proposed here provides a method for producing an electronic module according to one of the embodiments described above, the method comprising the following steps: Providing an electronic component, at least one component plate, a carrier plate, and an insulating element, wherein the electronic component has at least one first component connection and one second component connection on a connection side, wherein the component plate has at least one first component contact element for contacting the first component connection, a first carrier contact element electrically coupled to the first component contact element for contacting a first carrier connection of a component carrier, and a contacting recess, and wherein the carrier plate has at least one second component contact element for contacting the second component connection and a second carrier contact element electrically coupled to the second component contact element for contacting a second carrier connection of the component carrier; and Assembling the electronic component, the component plate, the carrier plate and the insulating element, wherein the component plate is arranged opposite the connection side, wherein the first component contact element is electrically conductively connected to the first component connection, wherein the second component contact element is arranged opposite the contacting recess and is electrically conductively connected to the second component connection through the contacting recess and wherein the insulating element is arranged between the component plate and the carrier plate in order to electrically decouple the component plate and the carrier plate from one another.

[0025] The invention is explained in more detail by way of example with reference to the accompanying drawings. They show: Fig. 1 is a schematic representation of an adapter according to an embodiment of the present invention; Fig. 2 is a schematic representation of an adapter according to an embodiment of the present invention; Fig. 3 is an exploded view of an adapter according to an embodiment of the present invention; Fig. 4 is a schematic diagram of an electronic module according to an embodiment of the present invention; Fig. 5 is an exploded view of an electronic module according to an embodiment of the present invention; Fig. 6 is a schematic diagram of an electronic module according to an embodiment of the present invention; Fig. 7 is an exploded view of an adapter according to an embodiment of the present invention; Fig. 8 is a schematic diagram of an electronic module according to an embodiment of the present invention; Fig. 9 is an exploded view of an electronic module according to an embodiment of the present invention; Fig. 10 is a schematic diagram of an electronic module according to an embodiment of the present invention; and Fig. 11 is a flowchart of a method for manufacturing an electronic module according to an embodiment of the present invention.

[0026] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0027] Fig. 1 shows a schematic representation of an adapter 100 according to an embodiment of the present invention. The adapter 100 comprises a component plate 105 with a contacting recess 110, a carrier plate 115, and an insulating element 120. The carrier plate 115 is arranged opposite the component plate 105, with the contacting recess 110 being covered by the carrier plate 115. The insulating element 120 is arranged around the contacting recess 110 between the component plate 105 and the carrier plate 115 in order to electrically insulate the component plate 105 from the carrier plate 115.

[0028] The component board 105 is designed with a first component contact element 125, which is configured to contact a first component terminal of an electronic component. For this purpose, the component can be arranged on the component board 105. Furthermore, the component board 105 has a first carrier contact element 130, which is electrically conductively connected to the first component contact element 125 and is configured to contact a first carrier terminal of a component carrier. Thus, an electrically conductive connection between the first carrier terminal and the first component terminal can be established by means of the component board 105.

[0029] The carrier plate 115 can be arranged on the component carrier and has a second component contact element 135, which is arranged in the region of the contacting recess 110 and in Fig. 1, for example, extends through the contacting recess 110. The second component contact element 135 is designed to contact a second component terminal of the electronic component through the contacting recess 110. The carrier plate 115 is designed with a second carrier contact element 140, which is electrically connected to the second component contact element 135 and serves to contact a second carrier terminal of the component carrier. Thus, an electrically conductive connection between the second carrier terminal and the second component terminal can be established by means of the carrier plate 115.

[0030] According to this embodiment, the respective ends of the first component contact element 125 and the first carrier contact element 130 are oriented in opposite directions, and the respective ends of the second component contact element 135 and the second carrier contact element 140 are oriented in opposite directions.

[0031] Fig. 2 shows a schematic representation of an adapter 100 according to an embodiment of the present invention. In contrast to Fig. 1 is the Fig. 2 is designed with a further component plate 200 and a further insulating element 205. The further component plate 200 is arranged on the component plate 105. The further insulating element 205 is arranged between the component plate 105 and the further component plate 200 in order to electrically decouple the component plate 105 from the further component plate 200.

[0032] The further component plate 200 has a further contacting recess 210, which is arranged opposite the contacting recess 110 to form a contacting channel, wherein the further insulating element 205 is arranged around the further contacting recess 210. For example, the second component contact element 135 extends through both contacting recesses 110, 210 to enable contacting of the second component terminal in the contacting channel or on a side of the further component plate 200 facing away from the carrier plate 115. For this purpose, the component can be arranged on the further component plate 200.

[0033] The further component board 200 is implemented with a third component contact element 215, which is designed to contact a third component terminal of the electronic component, which is separate from the first and second component terminals. Furthermore, the further component board 200 comprises a third carrier contact element 220 for contacting a third carrier terminal of the component carrier, which is separate from the first and second carrier terminals. To electrically connect the third carrier terminal to the third component terminal, the third carrier contact element 220 is electrically coupled to the third component contact element 215 by the further component board 200.

[0034] According to this embodiment, the first component contact element 125 is passed through the further insulating element 205 and the further component plate 200 in order to enable electrical contacting of the first component terminal.

[0035] For example, the component contact elements 125, 135, 215 each end on the side of the further component plate 200 facing away from the carrier plate 115, i.e., facing the component. The carrier contact elements 130, 140, 220, on the other hand, for example, end on a side of the carrier plate 115 facing away from the further component plate 200, i.e., facing the component carrier.

[0036] According to a further embodiment, the adapter 100 can be realized with a plurality of contact plates arranged one above the other and electrically decoupled from one another by insulating elements in the manner of the component plates 105, 200 or the carrier plate 115.

[0037] Fig. 3 shows an exploded view of an adapter 100 according to an embodiment of the present invention. In contrast to Fig. 1, the component plate 105 and the insulating element 120 are each ring-shaped. The carrier plate 115 is cross-shaped. The contacting recess 110 is realized as a central circular opening in the component plate 105. The insulating element 120 has a central insulating element opening 300, which is arranged opposite the contacting recess 110 and in Fig. 3 is shown as an octagonal shape by way of example. For example, the insulating element 120 is a plastic ring. The second component contact element 135 is configured in the region of a center point of the carrier plate 115 and can thus be contacted through the contacting recess 110 and the insulating element opening 300.

[0038] By way of example, the component plate 105 comprises three further first carrier contact elements 305 and three further first component contact elements 307, and the carrier plate 115 comprises three further second carrier contact elements 308. The first component contact elements 125, 307 and the first carrier contact elements 130, 305 are arranged alternately around the contacting recess 110. The second carrier contact elements 140, 308 are arranged around the second component contact element 135.

[0039] The component plate 105 and the carrier plate 115 are each made in one piece from an electrically conductive sheet metal. The first component contact elements 125, 307 and the first carrier contact elements 130, 305 are each formed as first tabs from the component plate 105, and the second component contact element 135 and the second carrier contact elements 140, 308 are each formed as second tabs from the carrier plate 115.

[0040] All tabs are bent in the same direction. Fig. 3, they are bent essentially at right angles to the component plate 105 or the carrier plate 115. Relative to a center point of the component plate 105, the first carrier contact elements 130, 305 are bent outward, and the first component contact elements 125, 307 are bent inward.

[0041] The carrier plate 115 has four arms arranged in a cross-shaped manner, at each end of which one of the second carrier contact elements 140, 308 is formed. The second carrier contact elements 140, 308 are bent outward from a center point of the carrier plate 115.

[0042] The first component contact elements 125, 307 and the second component contact element 135 can each be realized as a welding tab.

[0043] The adapter 100 is designed, for example, as an adapter for electronic components from solder to press-in contacts. For this purpose, the first carrier contact elements 130, 305 and the second carrier contact elements 140, 308 are implemented as press-in contacts. Fig. In Figure 3, the press-in contacts are pin-like and have a recess in the center. This allows the press-in contacts to be compressed like a spring when pressed into the component carrier. The spring action can establish an electrical connection with the component carrier. Alternatively, the press-in contacts can also be formed as solid pins. The spring action can be created by deformable openings in the component carrier.

[0044] The insulating element 120 is designed, for example, with four snap hooks 310 as locking elements. The locking elements 310 are arranged in an outer edge region of the insulating element 120, with two locking elements 310 located opposite each other.

[0045] The component plate 105 has four recesses 315 in an outer edge region, which serve as locking receptacles for receiving the locking elements 310. The locking elements 310 can be locked into the locking receptacles 315.

[0046] Corresponding to the respective number of first carrier and component contact elements, the insulating element 120 has four carrier contact recesses 320 and four component contact recesses 325, which are arranged alternately around the insulating element opening 300. Thus, during assembly of the adapter 100, the first carrier contact elements 130, 305 can be guided through the carrier contact recesses 320, and the first component contact elements 125, 307 can be guided through the component contact recesses 325.

[0047] Optionally, the carrier plate 115 can have at least one further second component contact element for contacting the second component connection.

[0048] Fig. Figure 4 shows a schematic representation of an electronic module 400 according to an embodiment of the present invention. The module 400 comprises an electronic component 405, for example an electrolytic capacitor, and the Fig. 3 in the assembled state. Component 405 is embodied as an example. Component 405 is arranged centrally on component plate 105 and is electrically connected to the component contact elements, for example, by welding. The first carrier contact elements 130, 305 and the second carrier contact elements 140, 308 protrude from the carrier plate 115, with each of the carrier contact elements 130, 305 forming a connection pair with each of the second carrier contact elements 140, 308.

[0049] The adapter 100 has a larger footprint than the component 405, so that the adapter 100 protrudes beyond the component 405 and forms a peripheral edge around the component 405. Thus, a surface of the component plate 105 facing the component 405 and projecting beyond the component 405 can serve as an engagement surface 410 for exerting pressure on the adapter 100 in order to press the adapter 100 with the component 405 mounted thereon into the component carrier, such as a printed circuit board. In this way, the press-fit contacts 130, 140, 305, 308 can be pressed into the component carrier without applying force to the actual component 405.

[0050] Fig. Figure 5 shows an exploded view of an electronic module 400 according to an embodiment of the present invention. The module 400 is the Fig. 4 shown module in disassembled state. In contrast to Fig. 4 is the module 400 in Fig. 5 is shown obliquely from below, so that a respective underside of the component plate 105, the carrier plate 115, the insulating element 120 and the component 405 is visible.

[0051] The insulating element 120 has a cross-shaped recess 500 into which the arms of the support plate 115 can be recessed during assembly of the adapter 100. Four retaining elements 502 are formed, for example, at the edge of the insulating element opening 300 to fix the support plate 115 in the recess 500. The retaining elements 502 are arranged in pairs opposite one another and can be implemented as snap hooks, similar to the locking elements 310.

[0052] A connection side 504 of the component 405 facing the component board 105 comprises, for example, four outer pins 505 arranged in an outer edge region of the component 405 as the first component connection and a central center pin 510 as the second component connection. The outer pins 5050 can be ground pins.

[0053] According to one embodiment, component 405 can be mounted on adapter 100, and its contacts 505, 510 can be welded to the designated sheet metal tabs 125, 135, 307 of adapter 100. Adapter 100 consists of a ground plate 105, a center pin plate 115, and an insulating part 120. The number of plates and their geometry depend on the number of separate connections on component 405, in this case, two. Adapter 100 has a round outer contour. The two plates 105, 115 are held on the insulating part 120 with designated snap hooks 310, 502 and each have one or more press-fit contacts on the underside.

[0054] Alternatively, the adapter 100 can be manufactured as a two-component injection-molded part by inserting the sheets 105, 115 into an injection mold and overmolding them.

[0055] For mounting component 405 on a printed circuit board, the edge of adapter 100 extends beyond the outer dimensions of component 405. Such a pressure surface allows the press-fit contacts to be pressed in without applying force to the actual component.

[0056] Fig. Figure 6 shows a schematic representation of an electronic module 400 according to an embodiment of the present invention. The module 400 is the Fig. 5 shown module in assembled state.

[0057] The support plate 115 is recessed into the recess 500 such that the support plate 115 is flush with a surface of the insulating element 120.

[0058] The second component contact element 135 is cut out of the carrier plate 115 as a tab and bent in a direction away from the component 405, so that the second component contact element 135 protrudes beyond the carrier plate 115. Bending the second component contact element 135 creates a carrier plate recess 600 in the carrier plate 115.

[0059] The center pin 510 is guided through the carrier plate recess 600 and touches the second component contact element 135.

[0060] Each of the first component contact elements 125, 307 and an outer pin 505 are guided through the component contact recesses 325. The points where the center pin 510 and the second component contact element 135, or where each of the outer pins 505 and one of the first component contact elements 125, 307 touch, can serve as welding points.

[0061] Fig. 7 shows an exploded view of an adapter 100 according to an embodiment of the present invention. In contrast to Fig. 3, the contacting recess 110 is not round here, but rectangular. Furthermore, the first carrier contact elements 130, 305 are bent inwards and the first component contact elements 125, 307 are bent outwards. The insulating element opening 300 is round. The carrier contact recesses 320 are realized as cutouts in the outer edge region of the insulating element 120. The ends of the four arms of the carrier plate 115 are each bent inwards to form the second carrier contact elements 140, 308. The carrier plate recess 600 is round. The tab of the second component contact element 135 protrudes into the carrier plate recess 600 and is bent at an angle such that it protrudes beyond an upper side of the carrier plate 115 facing the insulating element 120.

[0062] Fig. Figure 8 shows a schematic representation of an electronic module 400 according to an embodiment of the present invention. In contrast to the Fig. 4 and Fig. 6, the module 400 in Fig. 8 the in Fig. 7 shown adapter 100.

[0063] Fig. 9 shows an exploded view of the Fig. 8 shown module 400 from diagonally below.

[0064] According to this exemplary embodiment, the ground pins 505 of the capacitor 405 are designed as a metal sheet mounted beneath a capacitor housing 900 with a central recess for the center pin 510. This metal sheet has four upwardly angled metal tabs 905 that are connected to the capacitor housing 900. Since the material thickness of the metal sheet reduces the projecting length of the center pin 510, the second component contact element 135 is bent such that it protrudes beyond a surface of the carrier plate 115 facing the component 405. In this way, the second component contact element 135 can be easily welded to the center pin 510 despite the reduced usable length of the center pin 510.

[0065] Fig. 10 shows that in Fig. Module 400 shown in Figure 9 in assembled state.

[0066] Fig.11 shows a flow diagram of a method 1100 for producing an electronic module according to an embodiment of the present invention. In a step 1105, the electronic component, the component board, the carrier board, and the insulating element are provided. In a further step 1110, the component, the component board, the carrier board, and the insulating element are joined together. Here, the first component contact element is electrically conductively connected to the first component terminal, the second component contact element is arranged opposite the contacting recess and electrically conductively connected to the second component terminal through the contacting recess, and the insulating element is arranged between the component board and the carrier board in order to electrically decouple the component board and the carrier board from one another. Reference symbol 100 adapters 105 carrier plate 110 Contact recess 115 Carrier plate 120 insulating element 125 first component contact element 130 first carrier contact element 135 second component contact element 140 second carrier contact element 200 additional component plates 205 additional insulating element 210 additional contact recess 215 third component contact element 220 third carrier contact element 300 Insulating element opening 305 further first carrier contact element 307 further first component contact element 308 further second carrier contact element 310 locking element 315 locking mount 320 carrier contact recess 325 component contact recess 400 electronic module 405 electronic component 410 Attack surface 500 deepening 502 holding element 504 connection side 505 first component connection 510 second component connection 600 carrier plate recess 900 capacitor housing 905 metal flag 1100 Method for producing an electronic module 1105 Deployment step 1110 Step of joining

Claims

[1] Adapter (100) for electrically conductively connecting an electronic component (405) to a component carrier, wherein the electronic component (405) has at least one first component connection (505) and one second component connection (510) on a connection side (504), wherein the component carrier has at least one first carrier connection and one second carrier connection, and wherein the adapter (100) has the following features: at least one component plate (105) which can be arranged or is arranged opposite the connection side (504) and which has at least one first component contact element (125) for contacting the first component connection (505), a first carrier contact element (130) electrically coupled to the first component contact element (125) for contacting the first carrier connection and at least one contacting recess (110); at least one carrier plate (115) having at least one second component contact element (135) for contacting the second component terminal (510) and a second carrier contact element (140) electrically coupled to the second component contact element (135) for contacting the second carrier terminal, wherein the second component contact element (135) can be arranged or is arranged opposite the contacting recess (110) in order to contact the second component terminal (510) through the contacting recess (110); and at least one insulating element (120) which can be arranged or is arranged between the component plate (105) and the carrier plate (115) in order to electrically decouple the component plate (105) and the carrier plate (115) from one another, and wherein the component plate (105) and / or the insulating element (120) is designed in an annular manner and / or the carrier plate (115) is designed in a cross-shaped or star-shaped manner. [2] Adapter (100) according to claim 1,characterized by that the component plate (105) and / or the carrier plate (115) is made of an electrically conductive material, wherein the first component contact element (125) and / or the first carrier contact element (130) is designed as part of the component plate (105) and / or wherein the second component contact element (135) and / or the second carrier contact element (140) is designed as part of the carrier plate (115). [3] Adapter (100) according to one of the preceding claims, characterized by that the insulating element (120) has at least one locking element (310) and the component plate (105) has at least one locking receptacle (315) that can be locked to the locking element (310) in order to lock the insulating element (120) to the component plate (105). [4] Adapter (100) according to one of the preceding claims, characterized bythat the insulating element (120) has a recess (500) for receiving the carrier plate (115) and at least one holding element (502) for holding the carrier plate (115) in the recess (500). [5] Adapter (100) according to one of the preceding claims, characterized by that the insulating element (120) has at least one carrier contact recess (320) for passing the first carrier contact element (130) through the insulating element (120) and / or at least one component contact recess (325) for passing the first component contact element (125) and / or the first component connection (505) through the insulating element (120). [6] Adapter (100) according to one of the preceding claims, characterized by that the first carrier contact element (130) and / or the second carrier contact element (140) is formed as a press-in contact for pressing into the component carrier. [7] Adapter (100) according to one of the preceding claims, characterized bythat the first component contact element (125) is designed as a first Welding tab for welding to the first component connection (505) and / or the second component contact element (135) is designed as a second welding tab for welding to the second component connection (510). [8] Adapter (100) according to one of the preceding claims, characterized by that the component plate (105) and the carrier plate (115) are overmolded with a potting compound, wherein the insulating element (120) is made of the potting compound. [9] Adapter (100) according to one of the preceding claims, characterized by that the component plate (105) has at least one further first carrier contact element (305) electrically coupled to the first component contact element (125) and / or the carrier plate (115) has at least one further second carrier contact element (308) electrically coupled to the second component contact element (135). [10] Electronic module (400) with the following features: an electronic component (405) having at least a first component connection (505) and a second component connection (510) on a connection side (504); and an adapter (100) according to one of the preceding claims, wherein the component plate (105) is arranged opposite the connection side (504) and the first component contact element (125) contacts the first component connection (505) and the second component contact element (135) contacts the second component connection (510). [11] Electronic module (400) according to claim 10 characterized by that the adapter (100) projects at least partially beyond a base surface of the electronic component (405) in order to form an engagement surface (410) for exerting pressure on the adapter (100). [12] A method (1100) for manufacturing an electronic module (400), the method (1100) comprising the following steps: Providing (1105) an electronic component (405), at least one component plate (105), a carrier plate (115) and an insulating element (120), wherein the electronic component (405) has at least one first component connection (505) and one second component connection (510) on a connection side (504), wherein the component plate (105) has at least one first component contact element (125) for contacting the first component connection (505), a first carrier contact element (130) electrically coupled to the first component contact element (125) for contacting a first carrier connection of a component carrier, and a contacting recess (110), and wherein the carrier plate (115) has at least one second component contact element (135) for contacting the second component connection (510) and a second carrier contact element (140) electrically coupled to the second component contact element (135) for contacting a second carrier connection of the component carrier;and; Joining (1110) the electronic component (405), the component plate (105), the carrier plate (115) and the insulating element (120), wherein the component plate (105) is arranged opposite the connection side (504), wherein the first component contact element (125) is electrically conductively connected to the first component connection (505), wherein the second component contact element (135) is arranged opposite the contacting recess (110) and is electrically conductively connected to the second component connection (510) through the contacting recess (110), and wherein the insulating element (120) is arranged between the component plate (105) and the carrier plate (115) in order to electrically decouple the component plate (105) and the carrier plate (115) from one another, and wherein the component plate (105) and / or the insulating element (120) is annular and / or the carrier plate (115) is cross-shaped or star-shaped.

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