Cutting device

Abstract

Cutting device (1) comprising: a workpiece holding device (3) for holding a workpiece (W); a cutting device (4) with a rotatable cutting blade (43) for Cutting the workpiece (W) held by the workpiece holding device (3); and a feeding means for the relative movement of the workpiece holding means (3) and the cutting means (4) in a feeding direction; wherein the cutting means (4) comprises a spindle housing (41), a spindle (42) rotatably held on the spindle housing (41), an attachment element (6) for holding the cutting blade (43) attached to a front end section of the spindle (42), and a mounting flange (7) for attaching the cutting blade (43) held by the attachment element (6) to the attachment element (6); wherein the mounting element (6) comprises a hub section (62) for holding the mounting flange (7) in an axially displaceable manner, wherein the hub section (62) is attached to an engagement opening (71) formed in a central section of the mounting flange (7), a flange section (63) which projects radially outwards from the outer circumference of the hub section (62), wherein the flange section (63) has a retaining surface (631) for holding the cutting blade (43) on the front side opposite the mounting flange (7), and includes a cylindrical section (64) formed on the rear side of the flange section (63); wherein the flange section (63) of the mounting element (6) is formed with an intake opening (633) which opens towards the front side of the flange section (63), the cylindrical section (64) of the mounting element (6) is formed with a communication passage (641) which communicates with the intake opening (633), and the communication passage (641) is connected to an intake means (9) by a rotary connection (8); wherein, When the suction device (9) is operated, a reduced pressure is applied through the rotary connection (8), the communication passage (641) and the suction opening (633) to a space between the mounting element (6) and the mounting flange (7), so that the mounting flange (7) is drawn towards the mounting element (6) in order to secure the cutting blade (43) between the mounting element (6) and the mounting flange (7).

Description

BACKGROUND OF THE INVENTION Area of ​​the invention

[0001] The present invention relates to a cutting device with a cutting blade for cutting a workpiece, such as a semiconductor wafer. Description of the state of the art

[0002] In a semiconductor device manufacturing process, several intersecting dividing lines, referred to as roads, are formed on the front face of a generally disk-shaped semiconductor wafer to create multiple areas, each containing several components such as ICs and LSIs. The semiconductor wafer, thus containing the multiple components, is cut along the roads using a cutting device to separate the component areas and obtain the individual semiconductor devices as chips.

[0003] The cutting device for cutting the semiconductor wafer as a workpiece along the paths comprises a workpiece holding device for holding the workpiece, a cutting device with a rotatable cutting blade for cutting the workpiece held by the workpiece holding device, and a feeding device for moving the workpiece holding device and the cutting device relative to each other in a feeding direction. The cutting device comprises a spindle housing, a spindle rotatably mounted on the spindle housing, an attachment element attached to the front end of the spindle, the attachment element having a hub section designed to be inserted through a central opening in the cutting blade, and a mounting flange having an internal screw thread designed to engage with an external screw thread formed on an end section of the hub section of the attachment element.When attaching the cutting blade to the spindle, the hub section of the mounting element is first inserted through the central opening of the cutting blade, and then the inner screw thread of the mounting flange is engaged with the outer screw thread of the hub section of the mounting element, thereby securing the cutting blade between the mounting element and the mounting flange (see, for example, JP H11 - 33 907 A).

[0004] JP 2002 - 154 054 A relates to an attachment mechanism for a cutting blade which is able to prevent the cutting blade from falling off by ensuring a holding force for the cutting blade regardless of the direction of rotation of the rotating shaft. SUMMARY OF THE INVENTION

[0005] When the cutting blade is worn or chipped, it must be replaced, and this replacement of the cutting blade with respect to the mounting element is performed relatively frequently. However, with the conventional cutting device described above, it is necessary to perform a tightening and a loosening of the mounting flange operation each time the cutting blade is replaced, resulting in a reduction in manufacturing efficiency.

[0006] Furthermore, the helical structure of the screw threads on the mounting flange and the attachment element is generally oriented opposite to the direction of rotation of the spindle to prevent the mounting flange from loosening due to spindle rotation during the cutting process with the conventional cutting tool. Accordingly, the tightening force of the mounting flange is gradually increased as the cutting process progresses. As a result, when replacing the cutting blade, it may be difficult to loosen the mounting flange.

[0007] It is therefore an objective of the present invention to provide a cutting device that enables an operator to easily replace the cutting blade.

[0008] According to one aspect of the present invention, a cutting device is provided comprising: a workpiece holding device for holding a workpiece, a cutting device with a rotatable cutting blade for cutting the workpiece held by the workpiece holding device, and a feeding device for moving the workpiece holding device and the cutting device relative to each other in a feeding direction. The cutting device comprises a spindle housing, a spindle rotatably mounted on the spindle housing, an attachment element for holding the cutting blade attached to the front end section of the spindle, and a mounting flange for attaching the cutting blade, held by the attachment element, to the attachment element.The mounting element comprises a hub section for holding the mounting flange in an axially displaceable manner, wherein the hub section is attached to an engagement opening formed in a central section of the mounting flange; a flange section projecting radially outward from the outer circumference of the hub section, wherein the flange section has a retaining surface for holding the cutting blade on its front side opposite the mounting flange; and a cylindrical section formed on the rear side of the flange section.

[0009] The flanged section of the mounting element is designed with an intake port opening towards the front of the flanged section. The cylindrical section of the mounting element is designed with a communication port that communicates with the intake port, and the communication port is connected to a suction device via a rotary joint. When the suction device is operated, a reduced pressure is applied through the rotary joint, the communication port, and the intake port to the space between the mounting element and the mounting flange, causing the mounting flange to be drawn towards the mounting element and thereby securing the cutting blade between the mounting element and the mounting flange.

[0010] Preferably, the cutting device further includes a pressure sensor provided between the rotary connection and the suction device for detecting the reduced pressure, an alarm device for generating an alarm if the reduced pressure detected by the pressure sensor is greater than a predetermined value, and a control device for outputting an alarm signal to the alarm device.

[0011] According to the present invention, when the suction device is operated, a reduced pressure is applied through the rotary joint, the communication passage, and the suction opening to the space between the mounting element and the mounting flange, causing the mounting flange to be drawn towards the mounting element and thus securing the cutting blade between the mounting element and the mounting flange. Accordingly, when replacing the cutting blade, the operator only needs to stop the application of the reduced pressure by the suction device and then engage and release the mounting flange with respect to the hub section of the mounting element. Therefore, the operator can easily replace the cutting blade without the need for any special tools or skills.After the cutting blade has been replaced, the suction device is reactivated to apply reduced pressure to the space between the mounting element and the mounting flange via the rotary joint, communication port, and suction opening. This draws the mounting flange towards the mounting element, allowing the new cutting blade to be installed between the mounting element and the mounting flange. The cutting blade can thus be replaced efficiently.

[0012] The above and further aims, features and advantages of the present invention and the manner in which they are realized will become more apparent, and the invention itself will be best understood by studying the following description and the attached claims with reference to the accompanying drawings, which show some preferred embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view of a cutting device according to a preferred embodiment of the present invention; Fig. 2 is a perspective view of a single part of a piece in the Fig. The cutting device shown in 1 included a cutting blade attachment mechanism; Fig. 3 is a cross-sectional view of the in Fig. 2 cutting blade attachment mechanism shown in its assembled state; and Fig. 4 is a sectional view of a hub blade as a modification of the one in Fig. 2 and Fig. 3 cutting blades shown. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS

[0013] A preferred embodiment of the cutting device according to the present invention is described in detail below with reference to the drawings. Fig. Figure 1 is a perspective view of a cutting device 1 according to this preferred embodiment. The cutting device 1 includes a substantially box-shaped base housing 2. A clamping table 3 is provided in the base housing 2 as a workpiece holding device for holding a workpiece. The clamping table 3 is movable in the direction indicated by an arrow X as the feed direction. The clamping table 3 includes a vacuum clamping device holder 31 and a vacuum clamping device 32 attached to the vacuum clamping device holder 31. The vacuum clamping device 32 has an upper surface as a holding surface for holding a disk-shaped semiconductor wafer, as an example of the workpiece, by operating a suction device (not shown). Furthermore, the clamping table 3 is rotatable by a rotary mechanism (not shown).The clamping table 3 can be moved in the feeding direction shown by arrow X by operating a feeding device (not shown).

[0014] The cutting device 1 includes a spindle unit 4 as the cutting means. The spindle unit 4 includes a spindle housing 41, which is mounted on a movable base (not shown) and is movable in the direction indicated by arrow Y as a division direction and in the direction indicated by arrow Z as a cutting direction. The spindle unit 4 further includes a spindle 42, which is rotatably mounted on the spindle housing 41 and is designed to be driven by a rotary drive mechanism (not shown), and a cutting blade 43 detachably attached to the spindle 42.

[0015] Fig. 2 and Fig. Figure 3 shows a cutting blade attachment mechanism 5 for attaching the cutting blade 43 to the spindle 42. The cutting blade 43 in this Fig. 2 and Fig. The preferred embodiment shown in Figure 3 is a so-called disc blade, which is provided only as a ring-shaped cutting edge.

[0016] The one in the Fig. 2 and Fig. The cutting blade attachment mechanism shown in Figure 3 includes a cutting blade attachment mechanism 5 located at the front end section (left end section when viewed from the front). Fig. 3) The mounting element 6, attached to the spindle 42, holds the cutting blade 43, and a mounting flange 7 secures the cutting blade 43 to the mounting element 6 in conjunction with it. The mounting element 6 has a central engagement opening 61 designed to engage with the front end section of the spindle 42. The engagement opening 61 has a chamfered inner circumferential surface. The front end section of the spindle 42 is also chamfered so that it fits into the engagement opening 61 of the mounting element 6. The mounting element 6 includes a hub section 62 for holding the mounting flange 7 in an axially displaceable manner, a flange section 63 projecting radially outward from the outer circumference of the hub section 62, and a flange on the rear side (right side when viewed from the front). Fig. 3) the cylindrical section 64 formed by the flange section 63. The front surface (left-hand surface in the view of the Fig. 3) The flange section 63 is designed as an annular retaining surface 631 for holding the cutting blade 43. That is, the annular retaining surface 631 is formed along the outer circumference of the flange section 63. Furthermore, an annular engagement recess 632 is formed on the front surface of the flange section 63 radially inside the annular retaining surface 631. The annular engagement recess 632 has an inner diameter that is essentially the same as the inner diameter of the cutting blade 43, that is, the diameter of a central opening of the cutting blade 43. The flange section 63 is designed with several intake openings 633 that open to the lower surface of the annular engagement recess 632. The cylindrical section 64 of the mounting element 6 is designed with several communication passages 641, each of which communicates with the intake openings 633 of the flange section 63.Furthermore, an annular groove 642 is formed on the outer circumferential surface of the cylindrical section 64, and the communication openings 641 open to the bottom of the annular groove 642.

[0017] The mounting flange 7, which is to be held on the hub section 62 of the mounting element 6, has a central engagement opening 71 with an inner diameter that is essentially the same as the outer diameter of the hub section 62. By positioning the engagement opening 71 of the mounting flange 7 on the hub section 62 of the mounting element 6, the mounting flange 7 is held on the hub section 62 in an axially displaceable manner. The rear surface of the mounting flange 7 on its outer circumferential section, which faces the mounting element 6, is designed as an annular retaining surface 72, which faces the annular retaining surface 631 of the flange section 63 of the mounting element 6, with the cutting blade 43 inserted between them.The annular retaining surface 72 of the mounting flange 7 acts such that it holds the cutting blade 43 in conjunction with the annular retaining surface 631 of the flange section 63. Furthermore, an annular engagement projection 73 is formed radially within the annular retaining surface 72 on the rear surface of the mounting flange 7. The annular engagement projection 73 has an outer diameter that is essentially the same as the inner diameter of the cutting blade 43. The engagement projection 73 of the mounting flange 7 is designed to engage with the engagement recess 632 of the flange section 63 of the mounting element 6.

[0018] The cylindrical section 64 of the mounting element 6 is rotatably attached to a rotary joint 8, which is mounted at the front end of the spindle housing 41. The rotary joint 8 consists of an annular mounting section 81, designed to be mounted at the front end of the spindle housing 41, and a cylindrical retaining section 82, which projects axially from the annular mounting section 81 such that it engages with the cylindrical section 64 of the mounting element 6, allowing the cylindrical section 64, which is fixedly attached to the spindle 42, to rotate. As shown in Fig. As shown in Figure 2, the annular mounting section 81 of the rotary joint 8 is formed with several bolt insertion openings 811, and the front end surface of the spindle housing 41 is formed with several openings 411 with internal threads, each corresponding to the multiple bolt insertion openings 811 of the rotary joint 8. By inserting several tightening bolts 80 through the bolt insertion openings 811 of the rotary joint 8 and engaging the tightening bolts 80 with the openings 411 of the spindle housing 41 with internal threads, the rotary joint 8 is attached to the front end surface of the spindle housing 41. As shown in Fig. As shown in Figure 3, the cylindrical retaining section 82 of the rotary joint 8 is formed with an intake inlet 821 that opens towards the inner surface of the retaining section 82. One end of the intake inlet 821 of the rotary joint 8 communicates with the annular groove 642 of the cylindrical section 64 of the mounting element 6.

[0019] As in Fig. As shown in Figure 3, the other end of the intake inlet 821 of the rotary joint 8 communicates with an intake device 9. The intake device 9 includes a vacuum source 91, an intake line 92 for connecting the vacuum source 91 and the intake inlet 821 of the rotary joint 8, and an electromagnetic three-way valve 93 provided in the intake line 92. The electromagnetic three-way valve 93 is designed to select either a first operating mode in which communication between the vacuum source 91 and the rotary joint 8 is established, or a second operating mode in which the communication between the vacuum source 91 and the rotary joint 8 is interrupted in order to expose the intake inlet 821 of the rotary joint 8 to the atmosphere. A pressure sensor 94 is provided for detecting the pressure in a section of the intake line 92 between the electromagnetic three-way valve 93 and the intake inlet 821 of the rotary joint 8.The pressure sensor 94 is connected to a control device 10 to transmit a pressure signal indicating the pressure detected by the pressure sensor 94. For example, if the pressure detected by the pressure sensor 94 is greater than 0.02 MPa, the control device 10 outputs an alarm signal to an alarm device 101. An input device 102 is also connected to the control device 10 to allow an operator to input a cutting blade attachment signal, a cutting blade replacement signal, an operating start signal, etc. The control device 10 controls the electromagnetic three-way valve 93 according to the cutting blade attachment signal or the cutting blade replacement signal input from the input device 102.

[0020] The process of assembling the cutting blade attachment mechanism 5 is described below with reference to the Fig. 2 and Fig. 3 described. First, the front end section of the spindle 42 is inserted through the annular mounting section 81 and the cylindrical retaining section 82 of the rotary joint 8. Furthermore, the multiple tightening bolts 80 are inserted through the multiple bolt insertion openings 811 of the annular mounting section 81 of the rotary joint 8 and then brought into screw engagement with the multiple openings 411 of the internally threaded spindle housing 41. As a result, the rotary joint 8 is firmly attached to the front end surface of the spindle housing 41. Then, the engagement opening 61 of the mounting element 6 is attached to the front end section of the spindle 42, and the cylindrical section 64 of the mounting element 6 is rotatably engaged with the cylindrical retaining section 82 of the rotary joint 8, as described in Fig. Figure 3 shows that a tightening nut 11 with an external screw thread 421 formed on the outer circumference of the front end section of the spindle 42 is then engaged. As a result, the mounting element 6 is attached to the front end section of the spindle 42. The annular cutting blade 43 is then attached to the engagement projection 73 of the mounting flange 7, and the engagement opening 71 of the mounting flange 7 is attached to the hub section 62 of the mounting element 6. Finally, the engagement projection 73 of the mounting flange 7 is fitted into the engagement recess 632 of the mounting element 6.

[0021] After the cutting blade 43 has been attached to the engagement projection 73 of the mounting flange 7, the engagement opening 71 of the mounting flange 7 has been attached to the hub section 62 of the mounting element 6, and then the engagement projection 73 of the mounting flange 7 has been fitted into the engagement recess 632 of the mounting element 6, as described above, the cutting blade attachment signal is entered by the operator via the input device 102. As a result, the control device 10 actuates the electromagnetic three-way valve 93 of the suction device 9 to select the first operating mode in which communication is established between the vacuum source 91 and the rotary joint 8.Accordingly, the vacuum source 91 is brought into communication with the engagement recess 632 of the flange section 63 of the mounting element 6 via the intake line 92, the intake inlet 821 of the retaining section 82 of the rotary joint 8, the annular groove 642, the communication passages 641 of the cylindrical section 64 of the mounting element 6, and the intake openings 633 of the flange section 63 of the mounting element 6. A vacuum is thus applied to the engagement projection 73 of the mounting flange 7, which is fitted into the engagement recess 632 of the flange section 63 of the mounting element 6, so that the mounting flange 7 is drawn towards the flange section 63 of the mounting element 6. Accordingly, the cutting blade 43 is firmly fixed between the annular holding surface 631 of the flange section 63 of the mounting element 6 and the annular holding surface 72 of the mounting flange 7.

[0022] To maintain the fixed position of the cutting blade 43 between the flange section 63 of the mounting element 6 and the mounting flange 7, the vacuum applied to the engagement projection 73 of the mounting flange 7, which is fitted into the engagement recess 632 of the flange section 63 of the mounting element 6, must be maintained, for example, at 0.02 MPa or less. In this preferred embodiment, the pressure sensor 94 is provided in a section of the suction line 92 between the electromagnetic three-way valve 93 of the suction device 9 and the suction inlet 821 of the rotary joint 8 for detecting the applied pressure. Accordingly, the vacuum applied to the engagement projection 73 of the mounting flange 7 is detected by the pressure sensor 94, and a pressure signal indicating the vacuum detected by the pressure sensor 94 is transmitted to the control device 10.If, for example, the pressure detected by the pressure sensor 94 is greater than 0.02 MPa, the control means 10 determines that it is difficult to maintain the fixed state of the cutting blade 43 between the flange section 63 of the mounting element 6 and the mounting flange 7, and subsequently issues an alarm signal to the alarm means 101.

[0023] If the cutting blade replacement signal is entered by the operator via the input device 102 in order to replace the cutting blade 43 with a new one, the control device 10 actuates the electromagnetic three-way valve 93 of the suction device 9 to select the second operating mode in which the suction inlet 821 of the rotary joint 8 is open to the atmosphere. As a result, the vacuum applied to the engagement projection 73 of the mounting flange 7, which is fitted into the engagement recess 632 of the flange section 63 of the mounting element 6, is released to the atmosphere through the intake openings 633 of the flange section 63 of the mounting element 6, the communication passages 641 and the annular groove 642 of the cylindrical section 64 of the mounting element 6, the intake inlet 821 of the retaining section 82 of the rotary joint 8 and the electromagnetic three-way valve 93.Accordingly, the mounting flange 7 can be easily removed from the hub section 62 of the mounting element 6, and the cutting blade 43 attached to the engagement projection 73 of the mounting flange 7 can be easily removed. A new cutting blade 43 is then attached to the engagement projection 73 of the mounting flange 7, and the engagement opening 71 of the mounting flange 7 is attached to the hub section 62 of the mounting element 6. Furthermore, the engagement projection 73 of the mounting flange 7 is fitted into the engagement recess 632 of the mounting element 6.

[0024] The operator then inputs the cutting blade fastening signal via the input device 102, thereby firmly fastening the new cutting blade 43 between the annular holding surface 631 of the flange section 63 of the mounting element 6 and the annular holding surface 72 of the mounting flange 7, as described above. In this way, if the cutting blade 43 is replaced with a new one, the operator only needs to engage and release the mounting flange 7 with respect to the hub section 62 of the mounting element 6. Accordingly, the operator can easily replace the cutting blade 43 without the need for any special tools or skills.

[0025] Fig. Figure 4 shows a cutting blade 430 as a modification, in which the cutting blade 430 is a so-called hub blade, consisting of a hub and an annular cutting edge provided on the outer circumferential section of the hub. As in Fig. As shown in Figure 4, the cutting blade 430, being a hub blade, consists of a disc-shaped hub 431 and an annular cutting edge 432, which is provided on a side surface of the hub 431 along its outer circumference. The hub 431 is, for example, made of aluminum. The hub 431 has a central engagement opening 431a with an inner diameter that is essentially the same as the outer diameter of the hub section 62 of the mounting element 6. The hub 431 is designed with an engagement projection 431b, which corresponds to the one shown in Figure 4. Fig. The engagement projection 73 of the mounting flange 7 shown in Figure 3 is equivalent. The cutting edge 432 is formed, for example, by electroforming diamond abrasive grains with a grain size of approximately 10 µm. The disc-shaped hub 431 of the cutting blade 430, constructed in this way, acts as a hub blade and has a function similar to that of the one shown in Figure 3. Fig. 3 shown mounting flange 7. That is, by attaching the engagement opening 431a of the disc-shaped hub 431 to the hub section 62 of the mounting element 6 and fitting the engagement projection 431b of the hub 431 into the engagement recess 632 of the mounting element 6, the hub 431 acts in a similar manner to the mounting flange 7.

[0026] With renewed reference to Fig. The cutting device 1 further includes an imaging mechanism 12 for imaging the front side of a workpiece held on the upper surface of the vacuum clamping device 32 of the clamping table 3, in order to detect a target area to be cut by the cutting blade 43 or to check the condition of cut grooves. This imaging mechanism 12 is provided as an optical means, such as a microscope and a CCD camera. The cutting device 1 further includes a display means 13 for displaying an image obtained by the imaging mechanism 12.

[0027] The cutting device 1 further includes a cassette 14 for storing a semiconductor wafer W as a workpiece. The semiconductor wafer W is stored in the cassette 14 in the state in which the wafer W is attached to a cutting belt T, which is held on an annular frame F. The annular frame F is made of a metal material, such as stainless steel. The cassette 14 is arranged on a cassette table 15, which is vertically movable by a lifting device (not shown).

[0028] The cutting device 1 further includes a transition arrangement means 16 for temporarily arranging the semiconductor wafer W removed from the cassette 14, a handling means 17 for handling the semiconductor wafer W in order to guide it from the cassette 14 to the transition arrangement means 16 and vice versa, a first transfer means 18 for transferring the semiconductor wafer W from the transition arrangement means 16 to the clamping table 3, a cleaning agent 19 for cleaning the semiconductor wafer W after cutting, and a second transfer means 20 for transferring the semiconductor wafer W from the clamping table 3 to the cleaning agent 19 after cutting.

[0029] The operation of the cutting device 1 is described below. When the operator inputs the start signal from the input device 102 during the cutting process of the cutting device 1, the control device 10 actuates the electromagnetic three-way valve 93 of the suction device 9 to select the first operating mode in which communication is established between the vacuum source 91 and the rotary joint 8. As a result, the vacuum source 91 is brought into communication with the engagement recess 632 of the flange section 63 of the mounting element 6 via the suction line 92, the suction inlet 821 of the retaining section 82 of the rotary joint 8, the annular groove 642, the communication passages 641 of the cylindrical section 64 of the mounting element 6, and the suction openings 633 of the flange section 63 of the mounting element 6.Accordingly, a vacuum is applied to the engagement projection 73 of the mounting flange 7, which is fitted into the engagement recess 632 of the flange section 63 of the mounting element 6, so that the mounting flange 7 is drawn towards the flange section 63 of the mounting element 6. As a result, the cutting blade 43 is firmly fixed between the annular holding surface 631 of the flange section 63 of the mounting element 6 and the annular holding surface 72 of the mounting flange 7. If the in . Fig. When the cutting blade 430 shown is used as a hub blade, the engagement projection 431b of the cutting blade 430 is drawn towards the flange section 63 of the mounting element 6 in order to secure the cutting blade 430.

[0030] The cassette table 15 is then moved vertically by the lifting device (not shown) to move the cassette 14 vertically and to bring the semiconductor wafer W, which is stored at a predetermined position in the cassette 14, into a specific exit position (the semiconductor wafer W, which is held by the slicing belt T on the annular frame F, is hereinafter simply referred to as the semiconductor wafer W). The handling device 17 is then operated to guide the semiconductor wafer W, now in the exit position, from the cassette 14 to the transition device 16. The semiconductor wafer W is then positioned by the transition device 16. The first transfer device 18 is then operated in a pivoting manner to transfer the semiconductor wafer W from the transition device 16 to the clamping table 3, which is placed into a Fig. The semiconductor wafer W is brought into the ready position shown in Figure 1. In this state, the semiconductor wafer W is positioned on the upper surface of the vacuum clamping device 32 of the clamping table 3. The suction device (not shown) is then activated to hold the semiconductor wafer W against the upper surface of the vacuum clamping device 32. The clamping table 3, which thus holds the semiconductor wafer W, is subsequently moved to a position directly below the imaging mechanism 12. When the clamping table 3 is positioned directly below the imaging mechanism 12, several parting lines formed on the semiconductor wafer W are detected by the imaging mechanism 12, and the spindle unit 4 is moved in the Y-direction, the indexing direction, to align the cutting blade 43 with one of the predetermined parting lines.

[0031] The cutting blade 43 is then moved a predetermined amount in the Z-direction (cutting direction) and rotated in a predetermined direction. In this state, the clamping table 3, which holds the semiconductor wafer W, is moved in the X-direction (feed direction, perpendicular to the axis of rotation of the cutting blade 43 in an XY plane) at a predetermined feed rate. As a result, the semiconductor wafer W, held on the clamping table 3, is cut by the cutting blade 43 along the predetermined parting lines (cutting step). This cutting step is performed similarly along all parting lines formed on the semiconductor wafer W, thereby dividing the semiconductor wafer W into several individual semiconductor chips. The individual semiconductor chips, thus separated, remain attached to the severing belt T to maintain the shape of the semiconductor wafer W held on the annular frame F.After the cutting step along all separation lines on the semiconductor wafer W, as described above, has been completed, the clamping table 3, which holds the semiconductor wafer W (the individual semiconductor chips held by the dividing belt T on the annular frame F), is moved to the position shown in . Fig.The semiconductor wafer W is returned to the ready position shown in Figure 1, and the operation of the suction device (not shown) is stopped to end the suction holding of the semiconductor wafer W on the clamping table 3. The semiconductor wafer W is then transferred by the second transfer device 20 from the clamping table 3 to the cleaning agent 19 and subsequently cleaned by the cleaning agent 19. The semiconductor wafer W is then transferred by the first transfer device 18 from the cleaning agent 19 to the transition assembly device 16. Finally, the semiconductor wafer W is returned by the handling device 17 from the transition assembly device 16 to the predetermined position in the cassette 14.

[0032] The present invention is not limited to the details of the preferred embodiments described above. The scope of the invention is defined by the attached claims, and all modifications and variations that fall within the equivalence of the scope of the claims are therefore included in the invention.

Claims

[1] Cutting device (1) comprising: a workpiece holding device (3) for holding a workpiece (W); a cutting device (4) with a rotatable cutting blade (43) for Cutting the workpiece (W) held by the workpiece holding device (3); and a feeding means for the relative movement of the workpiece holding means (3) and the cutting means (4) in a feeding direction; wherein the cutting means (4) comprises a spindle housing (41), a spindle (42) rotatably held on the spindle housing (41), an attachment element (6) for holding the cutting blade (43) attached to a front end section of the spindle (42), and a mounting flange (7) for attaching the cutting blade (43) held by the attachment element (6) to the attachment element (6); wherein the mounting element (6) comprises a hub section (62) for holding the mounting flange (7) in an axially displaceable manner, wherein the hub section (62) is attached to an engagement opening (71) formed in a central section of the mounting flange (7), a flange section (63) which projects radially outwards from the outer circumference of the hub section (62), wherein the flange section (63) has a retaining surface (631) for holding the cutting blade (43) on the front side opposite the mounting flange (7), and includes a cylindrical section (64) formed on the rear side of the flange section (63); wherein the flange section (63) of the mounting element (6) is formed with an intake opening (633) which opens towards the front side of the flange section (63), the cylindrical section (64) of the mounting element (6) is formed with a communication passage (641) which communicates with the intake opening (633), and the communication passage (641) is connected to an intake means (9) by a rotary connection (8); wherein, When the suction device (9) is operated, a reduced pressure is applied through the rotary connection (8), the communication passage (641) and the suction opening (633) to a space between the mounting element (6) and the mounting flange (7), so that the mounting flange (7) is drawn towards the mounting element (6) in order to secure the cutting blade (43) between the mounting element (6) and the mounting flange (7). [2] Cutting device (1) according to claim 1, further comprising: a pressure sensor (94) provided between the rotary connection (8) and the suction means (9) for detecting the reduced pressure; an alarm means (101) for generating an alarm if the reduced pressure detected by the pressure sensor (94) is greater than a predetermined value; and a control device (10) for issuing an alarm signal to the alarm device (101).

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