Micromechanical sensor

Abstract

Micromechanical sensor (100), comprising: - a substrate (10); - a first functional layer (20) arranged on the substrate (10); - a second functional layer (30) arranged on the first functional layer (20) with movable micromechanical structures (31); - a cavity (11) arranged in the substrate (10) below the movable micromechanical structures (31); and - a vertical trench structure (40) formed circumferentially around the movable micromechanical structures (31) of the second functional layer (30) and extending into the substrate (10) up to the cavity (11), - wherein a membrane formed in the first functional layer (20) and delimited by the trench structure (40) is anchored vertically and / or laterally to the substrate (10), - wherein fixing elements of the movable micromechanical structures (31) on the first functional layer (20) and fixing elements (20d) of the first functional layer (20) on the substrate (10) are arranged substantially one above the other, - the cavity (11) is provided by means of an APSM cavity or a SON cavity or by means of a cSOl substrate, - where APSM stands for “advanced porous silicon membrane”, SON stands for “silicon-on-nothing”, and cSOl stands for “cavity substrate on insulator”.

Description

[0001] The invention relates to a micromechanical sensor. The invention further relates to a method for producing a micromechanical sensor. State of the art

[0002] The published patent application US 2015 / 0 122 038 A1 discloses a pressure sensor.

[0003] The published patent application DE 10 2014 202 923 A1 discloses a sensor and a method for producing a sensor.

[0004] The published patent application DE 10 2007 052 ​​367 A1 discloses a micromechanical system.

[0005] The published patent application DE 10 2014 117 969 A1 discloses a carrier and a method for processing a carrier.

[0006] The published patent application US 2012 / 0 186 354 A1 discloses a pressure sensor.

[0007] Micromechanical inertial sensors for measuring acceleration and angular rate are mass-produced for various applications in the automotive and consumer sectors. Today's inertial sensors are sensitive to externally coupled mechanical stress, which can adversely reduce their accuracy.

[0008] US Pat. No. 7,170,140 B2 shows a structure that enables extensive stress decoupling. However, its fabrication requires an expensive layer-transfer process.

[0009] From US 6 893 928 B2 and from I. Mizushima, T. Sato, S. Taniguchi, Y. Tsunashima, “Empty-space-in-silicon technique for fabricating a silicon-on-nothing structure, Applied physics letters, Vol. 77, number 20, 13 November 2000, a so-called SON substrate (silicon-on-nothing) with a cavity in the substrate and a method for producing a membrane are known.

[0010] US 7 843 025 B2 discloses surface micromechanical processes for the production of membranes.

[0011] A principle of stress decoupling trenches for micromechanical components is also known from DE 10 2014 210 945 A1. Disclosure of the invention

[0012] It is an object of the present invention to provide a micromechanical sensor improved with respect to external mechanical stress loading.

[0013] The object is achieved according to a first aspect with a micromechanical sensor having the features of claim 1, comprising: - a substrate; - a first functional layer arranged on the substrate; - a second functional layer arranged on the first functional layer with movable micromechanical structures; - a cavity arranged in the substrate below the movable micromechanical structures; and - a vertical trench structure formed around the movable micromechanical structures of the second functional layer and extending into the substrate up to the cavity.

[0014] This provides a stress decoupling structure for the micromechanical sensor, which can prevent or significantly reduce the impact of external stress on the sensor element and thus false signals. This advantageously supports improved functionality of the micromechanical sensor. This is essentially achieved by creating pivot points for the movable micromechanical structures around which the entire structure can rotate. This ensures that the movable micromechanical structures remain essentially motionless even under external stress, thus preventing any false electrical sensor signals from being generated.

[0015] As a result, improved stress decoupling of the electromechanical structure from the surrounding substrate is provided, enabling the realization of highly sensitive micromechanical sensors.

[0016] According to a second aspect, the object is achieved by a method for producing a micromechanical sensor having the features of claim 5, comprising the steps: - Providing a substrate having a cavity formed therein; - forming a first functional layer on the substrate; - forming a second functional layer with movable micromechanical structures on the first functional layer, wherein the movable micromechanical structures are formed in a region of the second functional layer above the cavity; and - Formation of a vertical trench structure around the movable micromechanical structures into the substrate up to the cavity.

[0017] Preferred embodiments of the micromechanical sensor are the subject of dependent claims.

[0018] The micromechanical sensor according to the invention is characterized in that a membrane formed in the first functional layer and delimited by the trench structure is anchored vertically and / or laterally to the substrate. This advantageously provides different fastening options for the membrane formed in the first functional layer. This advantageously increases the design freedom for the stress decoupling structure.

[0019] The micromechanical sensor according to the invention provides that the fixing elements of the movable micromechanical structures on the first functional layer and the fixing elements of the first functional layer on the substrate are arranged substantially one above the other. This advantageously results in identical pivot points for the movable micromechanical structures and for the electrode structure arranged underneath, thereby substantially preventing false signals.

[0020] The micromechanical sensor according to the invention is characterized in that the cavity is provided by an APSM cavity or a SON cavity or by a cSOI substrate. This advantageously provides different possibilities for providing a cavity beneath the movable micromechanical structures. This advantageously increases the design freedom for the stress decoupling structure.

[0021] Another advantageous embodiment of the micromechanical sensor is characterized in that the vertical trench structure is bridged by a bridging element. In this way, for example, an electrical power supply of the micromechanical structures can be advantageously realized.

[0022] Another advantageous embodiment of the micromechanical sensor is characterized in that the bridging element is designed in a spring-like manner. In this way, favorable mechanical properties are provided for the bridging element.

[0023] Another advantageous embodiment of the micromechanical sensor is characterized in that the micromechanical sensor is designed as an acceleration sensor, rotational speed sensor or pressure sensor. In this way, different types of micromechanical sensors can be advantageously realized by means of the principle according to the invention.

[0024] The invention is described in detail below with further features and advantages using several figures. Identical or functionally equivalent elements have the same reference numerals. The figures are intended in particular to illustrate the principles essential to the invention and are not necessarily drawn to scale. For the sake of clarity, not all reference numerals may be shown in all figures.

[0025] Disclosed method features result analogously from corresponding disclosed device features, and vice versa. This means, in particular, that features, technical advantages, and embodiments relating to the method for producing a micromechanical sensor result analogously from corresponding embodiments, features, and advantages of the micromechanical sensor, and vice versa.

[0026] In the figures shows: Fig. 1 a schematic diagram of a conventional micromechanical sensor without external stress; Fig. 2 a schematic diagram of the conventional micromechanical sensor with external stress; Fig. 3 a schematic representation of a functional principle of the micromechanical sensor according to the invention; Fig. 4 a cross-sectional view of an embodiment of the micromechanical sensor according to the invention; Fig. 5...11 show a process flow for producing an embodiment of the micromechanical sensor according to the invention; and Fig. 12 shows a basic sequence of a method for producing a micromechanical sensor according to the invention. Description of embodiments

[0027] A core idea of ​​the present invention is the provision of a stress decoupling structure for a micromechanical sensor. The proposed architecture and the associated manufacturing method of the micromechanical sensor result in a substantial stress decoupling of the MEMS structure from the surrounding substrate, thus enabling the creation of highly sensitive micromechanical inertial components.

[0028] The integration environment (e.g., circuit board) and the packaging of an inertial component (e.g., molded housing) traditionally couple mechanical stress into micromechanical inertial components due to different thermal expansion coefficients of the materials used, which can lead to deformations. Changes in these deformations occur when temperatures change, resulting in measured false signals and adversely reducing the accuracy of the inertial components.

[0029] The proposed micromechanical sensor can be used advantageously for infrared sensor arrays, acceleration sensors, angular rate sensors, pressure sensors as well as combinations of the aforementioned sensors in sensor clusters.

[0030] Fig. Figure 1 schematically shows a conventional micromechanical inertial sensor with a substrate 10, on which a first functional layer 20 (not shown) and a second functional layer 30 with movable micromechanical structures (not shown) are arranged. This shows a situation without externally applied mechanical stress, in which the component is not deformed and the plane of the movable micromechanical structures and the substrate 10 are essentially planar.

[0031] Fig. 2 shows a situation of the conventional arrangement of Fig. 1 with externally applied stress, the effect of which is indicated by two rotation arrows. In this case, the component is deformed primarily in the z-direction. Free-standing structures are not bent, but functional elements anchored directly to the substrate 10 (e.g., rigid detection electrodes, not shown) are. This results in a geometric shift between free-standing and vertically anchored functional elements, which is detected as an undesirable electrical signal.

[0032] Fig. Figure 3 shows a schematic representation of the proposed architecture. It provides vertical anchors for a so-called "membrane" on the substrate 10 and a cavity 11 formed in the substrate 10 below the membrane. As a result, pivot points P1, P2 are created around which the substrate 10 can bend or twist relative to the membrane, thereby ensuring that the deformation of the substrate 10 is not transferred to the membrane surface. As a result, the second functional layer 30 with the movable micromechanical structures remains essentially stationary and is therefore advantageously not bent by externally applied mechanical stress. Advantageously, no or only very small electrical faulty signals are generated when the arrangement is bent.

[0033] Fig. Figure 4 shows a schematic cross-sectional view through a first embodiment of the proposed micromechanical sensor 100. A substrate 10 can be seen, on which a first functional layer 20 is arranged, wherein one or more electrodes 21 are arranged in the first functional layer 20. An etch stop layer 22 and an oxide layer 23 are arranged within the first functional layer 20. A second functional layer 30 is arranged on the first functional layer 20, in which movable micromechanical structures 31 (MEMS structures) are formed. These structures interact with the electrode 21 of the first functional layer 20 and, upon a defined movement of the movable structures 31, generate an electrical measurement signal of the micromechanical sensor 100.

[0034] A cavity 11 is formed in the substrate 10, which cavity can be provided by different processes known per se, according to the invention in the form of an APSM membrane (advanced porous silicon membrane) or a SON membrane (silicon-on-nothing) or by using a cSOI substrate (cavity substrate on insulator).

[0035] A vertical trench structure 40 is formed circumferentially around the movable micromechanical structures 31, penetrating the first functional layer 20 and extending into the substrate 10 to approximately the level of the cavity 11. In this way, a membrane is created in a portion of the first functional layer 20 together with a portion of the substrate 10, which membrane is anchored vertically to the remaining substrate 10 on four support elements 20d.

[0036] By means of the vertical trench structure 40, four pivot points are thus provided for the aforementioned membrane, around which the substrate 10 can rotate without thereby twisting the movable micromechanical structures 31 arranged on the aforementioned membrane. As a result, a mechanical decoupling of the movable micromechanical structures 31 from the substrate 10 is realized, thereby increasing the mechanical insensitivity of the micromechanical sensor 100 by largely avoiding false electrical signals due to mechanical stress acting externally on the sensor 100. The described vertical anchoring of the membrane to the substrate 10 has the advantage that no in-plane stress is coupled into the movable micromechanical structures 31.

[0037] In this way, the membrane area M is laterally bounded by a circumferential stress isolation or stress decoupling trench, which is spanned only by electrical supply elements (not shown). The anchoring membrane ensures that out-of-plane bending moments of the substrate are not transmitted to the MEMS elements 31 due to the lack of force transmission.

[0038] Alternatively, it would also be conceivable to anchor the membrane laterally to the substrate 10 (not shown).

[0039] By means of a bond frame 50, a cap wafer 60 is arranged on the second functional layer 30 by means of a bond connection.

[0040] The following is based on the Fig. 5 to 11 illustrate a process flow for manufacturing one embodiment of the micromechanical sensor 100. Further details of the process flow will not be presented here, as these are known process steps of standard surface micromechanics techniques.

[0041] Fig. 5 shows a cross-sectional view of a substrate 10 in which a cavity 11 is formed. Using a known surface micromechanical process, e.g., an APSM process or a SON process, a lattice-shaped structure is formed in the substrate 10 by an anisotropic and, if appropriate, an isotropic etching process.

[0042] Fig. Figure 6 shows the closure of the grid by epitaxy or a thermal reflow process. Subsequently, an oxide layer 20a is deposited and substrate contact holes 20b are formed. Afterward, an oxide grid is created in the intended area of ​​the future stress isolation trenches, the basic structures of which can be seen as cavities below the substrate contact holes 20b.

[0043] The cross-sectional view of Fig. 7 indicates that a trench was drilled through the oxide grid and a polysilicon layer 20c was preferably deposited on the oxide grid. This is followed by structuring of electrical wiring lines. In a right-hand section of the Fig. Figure 7 shows a top view of the membrane area M, where support columns 20d of the membrane and spring-like bridging elements 20e are visible, via which an electrical connection of the micromechanical structures is established. A sectional plane indicated by two support columns 20d corresponds to the sectional view of the left area of Fig. 7.

[0044] The spring-like structure of the bridging elements 20e advantageously provides a high degree of flexibility to ensure the best possible stress decoupling. However, other bridge shapes, such as multiple meanders, would also be conceivable. It is also conceivable to provide a spring bridge on each of the membrane sides (e.g., top and bottom).

[0045] In Fig. 8 shows that the first functional layer 20 is completed by deposition and structuring of additional functional layers. Optionally, an etch stop layer 22 is deposited for the subsequent sacrificial layer etching and an oxide or sacrificial layer 23 is deposited. The oxide layer 23 and, if applicable, the etch stop layer 22 are then structured.

[0046] In Fig. 9 shows the deposition of a second functional layer 30, preferably in the form of polycrystalline silicon. This is followed by the deposition of a first metallization layer 50a (for example, aluminum) for bond pads and as bond metallization for a bond interface 50 to be subsequently formed.

[0047] In the cross-sectional view of Fig. 10 indicates that the second functional layer 30 is structured, thereby forming movable micromechanical structures 31. Furthermore, the mechanical functional regions are exposed and the vertical trench structure 40 explained above is created by sacrificial layer etching.

[0048] Fig. 11 shows the result of a final encapsulation of the entire structure by means of wafer bonding, as well as the exposure and isolation of bond pads by etching. The wafer bonding process is preferably a metallic bonding process, since not only the tightness of the sensor cavity (encapsulation cavity) around the membrane area is to be ensured by such a bonding process, but also the electrical chip-to-chip contacts between the first and second functional layers 20, 30. Examples of suitable metallic bonding processes are Al-Ge, Au-Si, Cu-Sn, Al-Al, Cu-Cu, Au-Au. Stops are also provided to avoid sticking. An encapsulation cavity is formed within the encapsulation wafer.

[0049] Fig. 12 shows a basic process flow for manufacturing a micromechanical structure.

[0050] In step 200, a substrate 10 with a cavity 11 formed therein is provided.

[0051] In a step 210, a first functional layer 20 is formed on the substrate 10.

[0052] In a step 220, a second functional layer 30 with movable micromechanical structures 31 is formed on the first functional layer 20, wherein the movable micromechanical structures 31 are formed in a region of the second functional layer 30 above the cavity 11.

[0053] In a step 230, a vertical trench structure 40 is formed around the movable micromechanical structures 31 into the substrate up to the cavity 11.

[0054] In the case that the micromechanical sensor 100 has a plurality of sensor functional units, a separate vertical trench structure 40 is preferably formed for each individual sensor functional unit, whereby entire sensor arrays are advantageously stress-decoupled.

[0055] Although the invention has been described above with reference to concrete application examples, a person skilled in the art can also implement embodiments not disclosed or only partially disclosed without deviating from the essence of the invention.

Claims

[1] Micromechanical sensor (100), comprising: - a substrate (10); - a first functional layer (20) arranged on the substrate (10); - a second functional layer (30) arranged on the first functional layer (20) with movable micromechanical structures (31); - a cavity (11) arranged in the substrate (10) below the movable micromechanical structures (31); and - a vertical trench structure (40) formed circumferentially around the movable micromechanical structures (31) of the second functional layer (30) and extending into the substrate (10) up to the cavity (11), - wherein a membrane formed in the first functional layer (20) and delimited by the trench structure (40) is anchored vertically and / or laterally to the substrate (10), - wherein fixing elements of the movable micromechanical structures (31) on the first functional layer (20) and fixing elements (20d) of the first functional layer (20) on the substrate (10) are arranged substantially one above the other, - the cavity (11) is provided by means of an APSM cavity or a SON cavity or by means of a cSOl substrate, - where APSM stands for “advanced porous silicon membrane”, SON stands for “silicon-on-nothing”, and cSOl stands for “cavity substrate on insulator”. [2] Micromechanical sensor (100) according to claim 1, characterized by that the vertical trench structure (40) is bridged by means of a bridging element (20e). [3] Micromechanical sensor (100) according to claim 2, characterized by that the bridging element (20e) is spring-like. [4] Micromechanical sensor (100) according to one of the preceding claims, characterized bythat the micromechanical sensor (100) is designed as an acceleration sensor, yaw rate sensor or pressure sensor. [5] Method for producing a micromechanical sensor (100), comprising the steps: - providing a substrate (10) having a cavity (11) formed therein; - forming a first functional layer (20) on the substrate (10); - forming a second functional layer (30) with movable micromechanical structures (31) on the first functional layer (20), wherein the movable micromechanical structures (31) are formed in a region of the second functional layer (30) above the cavity (11); and - forming a vertical trench structure (40) around the movable micromechanical structures (31) into the substrate up to the cavity (11), - wherein a membrane delimited by the trench structure (40) is formed in the first functional layer (20), wherein the membrane is anchored vertically and / or laterally to the substrate (10), - wherein fixing elements of the movable micromechanical structures (31) on the first functional layer (20) and fixing elements (20d) of the first functional layer (20) on the substrate (10) are arranged substantially one above the other, - the cavity (11) is provided by means of an APSM cavern or a SON cavern or by means of a cSOl substrate, - where APSM stands for “advanced porous silicon membrane”, SON stands for “silicon-on-nothing”, and cSOl stands for “cavity substrate on insulator”. [6] Method according to claim 5, wherein the micromechanical sensor (100) is designed as a micromechanical rotation rate sensor or as a micromechanical acceleration sensor or as a micromechanical pressure sensor. [7] Method according to claim 5 or 6, wherein in the case that the micromechanical sensor (100) has a plurality of functional units, a separate vertical trench structure (40) is formed for each functional unit.

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