Method for producing a housing for an optoelectronic component

Abstract

A method for producing a housing (11) for at least one electronic component, comprising a base part (12) with a mounting area (13a, 13b) for the electronic component (16a, 16b), wherein a cover (1) of the housing (11) made of an infrared radiation-permeable material is provided with a glass window (5a, 5b) and is connected to a base part (12) or wherein a cover (1) of the housing (11) made of glass is provided with a window (6) made of an infrared radiation-permeable material and is connected to a base part (12), characterized in that a wafer is used as the base part (12), wherein the wafer is singulated after the cover (1) has been connected to the base part (12), wherein a dividing line during singulation divides the housing (11) into a first housing with an infrared radiation-permeable window (6) and a second housing with a glass window (5a,5b) or a first housing with a lid (1) made of glass and a second housing with a lid (1) made of glass with an infrared radiation-permeable window (5a, 5b).

Description

Field of the invention

[0001] The invention relates to a method for producing a housing for electronic components. Background of the invention

[0002] Housings for optical components, particularly optoelectronic components, are known. These are, in particular, hermetically sealed housings that have windows through which electromagnetic radiation can enter or exit the housing.

[0003] Such housings are particularly well-known in the field of optical sensors. They include windows that are transparent in the UV, visible, and infrared wavelength ranges.

[0004] Quartz glass is a versatile material for such a window. However, quartz glass has very low thermal expansion and is therefore difficult to bond with most other materials used for such housings, such as silicon.

[0005] Document US 9,564,569 B1 shows a hermetically sealed housing in which several windows are separately applied to a base body. This makes it possible to provide a housing that has both an infrared radiation-permeable window and a window that is permeable in a different wavelength range.

[0006] The disadvantage of this housing's design, however, is its complex manufacturing process. Multiple handling steps are required to insert the various windows. Furthermore, the housing base must have a continuous center bar to create a continuous, sealed edge for both windows.

[0007] US 2016 / 0 240 721 A1 discloses a sensor module with a housing. The sensor module comprises a light source, a photodetector, and a substrate. The housing comprises a base part with a mounting area for the electronic component 110 and a cover. The cover can be made of organic glass, such as PMMA or PC, or of inorganic glass, such as silicate glass, or of silicone. Optically transparent windows can be arranged in the cover. Object of the invention

[0008] The invention is based on the object of providing a housing for an electronic component and a method for its production, in which a housing cover with both an infrared radiation-permeable region and a region which is permeable to a different wavelength can be provided in a simple manner. Summary of the invention

[0009] The object of the invention is achieved by a method for producing a housing for an electronic component according to one of the independent claims.

[0010] Preferred embodiments and further developments of the invention can be found in the subject matter of the dependent claims, the description and the drawings.

[0011] The invention relates to a housing for at least one electronic component. In particular, the invention relates to a housing for an optoelectronic component.

[0012] The housing can in particular be equipped with one or more optoelectronic components, such as sensors, in particular UV, IR or photodetectors and / or light-emitting diodes.

[0013] Furthermore, the invention also relates to a housing comprising a cover which is connected to a wafer, which must first be separated in a further step, i.e. divided into individual housings with electronic components.

[0014] According to a first embodiment of the invention, the housing comprises a cover made of a material permeable to infrared radiation.

[0015] An infrared radiation-permeable material is preferably understood to mean a material which has an average transmission of more than 20%, preferably more than 40%, at least in a wavelength range from 1.5 to 5 µm.

[0016] In one embodiment of the invention, the cover is made of silicon. Silicon is transparent above a wavelength of 1 µm and can be easily bonded to other semiconductor components, especially to a wafer that is also made of silicon.

[0017] Furthermore, according to the first embodiment of the invention, at least one glass window is arranged in the cover made of infrared radiation-permeable material.

[0018] The invention provides in particular that the cover for hermetically sealing the housing is at the same time the support, in particular the frame, for a glass window which is permeable in a different wavelength range than the material of the cover.

[0019] According to another embodiment of the invention, a housing for at least one electronic component is provided, comprising a base part with a mounting area for the electronic component, wherein the housing has a cover made of glass, wherein at least one window made of a material permeable to infrared radiation is arranged in the cover made of glass.

[0020] This embodiment of the invention therefore takes the opposite approach to the first embodiment of the invention and provides a cover made of glass into which a window made of a material permeable to infrared radiation is inserted.

[0021] The mounting area for an optoelectronic component can be arranged under the glass window or a section of the glass cover, which is struck by electromagnetic radiation entering through the window and / or which emits electromagnetic radiation through the glass window.

[0022] A mounting area for a further optoelectronic component, on the other hand, is located under the area of ​​the cover, which in this area also serves as a window for infrared radiation, or in the second embodiment of the invention under the window made of a material permeable to infrared radiation.

[0023] In this way, a hermetically sealed housing can be provided in a simple manner and in just a few process steps. Under the lid of the housing there is both a mounting area for an optoelectronic component sensitive to infrared radiation and a mounting area for an optoelectronic component intended for a different wavelength range.

[0024] The mounting areas can be spatially separated by a web over which the cover extends. According to another embodiment, however, the two mounting areas are arranged in a single space of the housing. For example, a single sensor with two different detection ranges for different wavelengths can extend across both mounting areas.

[0025] The cover is preferably directly connected to a base part or lower part of the housing.

[0026] In particular, the glass window or the glass lid is permeable to UV radiation and / or visible light. Permeability to UV radiation or visible light is preferably understood to mean an average transmission in the UV radiation range or in the visible light range of more than 20%, preferably more than 40%.

[0027] In addition to the use of silicon for the material of the cover or the infrared radiation-permeable window, according to another embodiment it is provided to use aluminum oxide, in particular sapphire or germanium.

[0028] When silicon is used as the material for the cover, the glass window or the glass lid preferably consists of a glass with an average thermal expansion coefficient α at 20 to 300 °C of 2 to 5 ppm / K.

[0029] Preferably, the coefficient of thermal expansion is less than 4 ppm / K, particularly preferably the coefficient of thermal expansion is below 4 ppm / K.

[0030] In one embodiment of the invention, the lid is made of glass, or the glass window is made of borosilicate glass. This is particularly advantageous in the embodiment with a glass lid. The lid can then be very easily bonded to the base part and the window made of infrared-transmissive material by anionic bonding.

[0031] The cover is preferably plate-shaped. According to a preferred embodiment of the invention, the cover is hermetically sealed to a lower part to form a housing. The lower part preferably comprises recesses, each of which provides a mounting area for at least one electronic component.

[0032] In a preferred embodiment of the invention, a glass window is fused into the lid. It is particularly provided that, to provide the glass window, a glass insert is heated to a temperature at least above the glass transition temperature T g is heated and the glass bonds with the material of the lid.

[0033] Since the glass usually has a different thermal expansion coefficient than the material of the lid, tension occurs in the glass when it cools down.

[0034] This voltage depends on the temperature required for melting, the thermal expansion coefficient of the glass material used, the material of the lid and the size of the glass window.

[0035] This results in a difference in length between the glass window and the adjacent area of ​​the lid during the cooling process, which results in compressive or tensile stress.

[0036] It is approximately assumed that the materials are firmly bonded at approximately 20 °C below the glass transition temperature, meaning the glass is no longer soft. The resulting length difference between the glass and the adjacent lid substrate due to cooling can thus be determined as follows: ΔLL=(Tg−20)∗(CTESt−CTEGlass), where L is the length of the glass window in its main extension direction and ΔL is the difference in length when heated during melting of the glass window. In this example, CTE refers Si on the average thermal expansion coefficient of silicon and CTE Glas on the average thermal expansion coefficient of the glass.

[0037] For the stress σ g in the glass is approximately σg=−E∗(ΔLL) where E is the elastic modulus of the glass used.

[0038] Preferably, the glass and the material of the lid are matched to each other in such a way that the glass window at 20 °C is subjected to a stress that lies between -100 MPa compressive stress and +30 MPa tensile stress, particularly preferably between -20 MPa compressive stress and +10 MPa tensile stress.

[0039] This can be achieved in particular by using glasses whose coefficient of expansion is adapted to that of the lid material used.

[0040] It is understood that for glasses with a low glass transition temperature T g a larger difference in the coefficient of linear expansion to the material of the cover is possible in order to comply with the range of the specified tensile or compressive stress.

[0041] In particular, according to one embodiment of the invention, glasses with a glass transition temperature T g below 600 °C.

[0042] In particular, according to one embodiment of the invention, a glass having an average thermal expansion coefficient α at 20 to 300 °C of 3 to 4 ppm / K and a glass transition temperature T g from 500 to 600 °C.

[0043] In one embodiment of the invention, a low-melting glass with a glass transition temperature T g from 300 to 500 °C, which has a thermal expansion coefficient α at 20 to 300 °C of 4 to 5 ppm / K.

[0044] In particular, the following commercially available glasses can be used: Schott 8689, Schott 8347, Schott 8330, Schott 8487, Schott 8341, Schott 8337, Schott G017-388, Schott G017-002 and Schott G017-339.

[0045] The invention further relates to a cover for a housing for an electronic component. In particular, the invention relates to a cover for a housing as described above.

[0046] The lid is made of a material permeable to infrared radiation and has a glass window which is also transparent in at least another wavelength range of electromagnetic radiation, or according to the second embodiment of the invention, the lid is made of glass and comprises a window made of a material permeable to infrared radiation.

[0047] The cover or window made of infrared radiation-permeable material consists in particular of silicon and comprises a fused, bonded or welded glass.

[0048] The invention further relates to a method for producing a housing for an electronic component, in particular a housing as described above.

[0049] According to the invention, a cover made of an infrared-permeable material, in particular silicon, is provided, and the cover is provided with a glass window, or a glass cover is provided with an infrared-permeable window and then connected to a base part, in particular a wafer, in order to provide a hermetically sealed housing. At least one mounting area for an electronic component is located beneath the glass window or a section of the glass cover, and a further mounting area for an electronic component is located beneath a region of the cover not provided with a glass window or beneath the window made of infrared-permeable material. According to a first embodiment, the material of the cover itself, which in turn is preferably directly connected to the base part, forms an infrared-permeable window above the further mounting area.

[0050] It is particularly provided that a substrate is used for the cover, into which at least one opening is made for inserting the glass window or window made of material permeable to infrared radiation.

[0051] The opening can be created, for example, by etching, in particular wet etching or reactive ion etching, by mechanical processing such as drilling, grinding, lapping or sandblasting.

[0052] Depending on the method used, the side walls of the opening may be slanted.

[0053] However, this can actually improve the mechanical connection between the components, especially when melting a glass window.

[0054] Then, after the opening has been made, at least one glass window or window made of infrared-permeable material is inserted.

[0055] Various design variants are provided for this purpose.

[0056] On the one hand, the glass can be melted directly.

[0057] For this purpose, a glass insert is used, which is inserted into the previously created opening in the substrate.

[0058] The substrate with the glass insert is then heated to a temperature above T g of the glass is heated and the glass bonds with the substrate and forms a window.

[0059] Due to the surface tension of the glass, as provided in one embodiment of the invention, a lens, in particular a convex lens, can be formed.

[0060] This design has the advantage that it allows for a very stable mechanical and hermetically sealed connection in a simple manner.

[0061] On the other hand, in this embodiment of the invention, the selection of the glasses used depending on the geometry of the housing is limited by the fact that the glasses used should, on the one hand, have an expansion coefficient adapted to the thermal expansion coefficient of the substrate and, on the other hand, must have a sufficiently low glass transition temperature.

[0062] According to another embodiment of the invention, it is therefore provided that a solder is used which softens or melts at a lower temperature than the glass window.

[0063] This allows for greater flexibility in the material used for the glass window. In particular, as provided for in one embodiment of the invention, preformed optical elements, e.g., lenses, filters, diffractive optical elements, etc., can be inserted into the lid as windows. Their shape is not defined by the melting during the joining process. The preformed optical elements are preferably soldered, bonded, or welded.

[0064] Furthermore, low-melting solders, especially solders with a glass transition temperature below 350 °C, can be used.

[0065] According to one embodiment of the invention, a glass solder is used. Thus, a glass with a lower glass transition temperature than the window material is used for soldering.

[0066] According to another embodiment of the invention, a metal solder is used. The window is metallized, preferably at least in sections, in particular by a deposition process, is then inserted into the opening of the substrate, and is bonded to the substrate by melting the metal solder.

[0067] The above-mentioned embodiments have in common that the glass windows are preferably arranged at least in sections in the opening of the substrate, i.e. are connected to the side walls of the substrate.

[0068] This allows for a particularly flat design.

[0069] In a further embodiment of the invention, the at least one glass window or window made of infrared radiation-permeable material is bonded, in particular anodically bonded or welded.

[0070] Preferably, a structured glass wafer is used for this purpose.

[0071] This can be welded to the substrate of the lid using laser radiation, for example.

[0072] For this purpose, the glass, in particular the glass window, in particular the structured glass wafer, is preferably placed on the substrate in such a way that the openings of the substrate are covered by glass.

[0073] This is followed by a connection by welding or anodic bonding, whereby the glass, in particular the glass windows, are connected by a bottom side to the top side of the substrate. In these embodiments of the invention, the connection is therefore preferably not made at the side walls of the openings, but rather at the top side of the cover.

[0074] In the embodiment in which a glass lid is used which is provided with an infrared radiation-permeable window, the glass lid is preferably connected to the base part and / or to the infrared radiation-permeable window by anionic bonding.

[0075] A lid made of borosilicate glass is preferably used for this purpose. Since this glass has a coefficient of thermal expansion that matches the linear expansion coefficient of the base part and the infrared-transmissive window, such a housing can be easily provided. In particular, the thermal Coefficient of linear expansion of the borosilicate glass by a maximum of + / - 0.5 ppm / K from the thermal Linear expansion coefficient of the material of the base part and / or the infrared radiation permeable window. Brief description of the drawings The invention will be described below with reference to the drawings Fig. 1a to Fig. 7c will be explained using schematically illustrated embodiments. Referring to the schematic sectional views according to Fig. 1a and Fig. 1b is intended to explain the design of a generic housing for optoelectronic components, as is known from the prior art. Referring to Fig. 2a to 2d, an embodiment of a method according to the invention is explained in which the glass windows are melted into the lid. Fig. 3a to Fig. 3d shows an embodiment in which the glass windows are connected to the substrate of the cover by means of a solder. Fig. 4a to Fig. Figure 4d shows a process in which a structured glass wafer is applied to the substrate and connected by welding or anionic bonding. Fig. 5a and Fig. 5b is a schematic sectional view of the components of an embodiment of a housing according to the invention with optoelectronic components. Fig. 6a and Fig. 6b shows a further schematic sectional view of an alternative embodiment of a housing with optoelectronic components. Referring to Fig. 7a to Fig. Figure 7c is intended to explain, using a schematic sectional view, how a plurality of optoelectronic components in the wafer assembly are provided with a cover and then separated. Detailed description of the drawings

[0076] Fig. 1a and Fig. 1b shows, by means of a sectional view, how a housing 11 for optoelectronic components 16a, 16b is manufactured according to the prior art.

[0077] As in Fig. 1a is shown in a sectional view, the housing 11 consists of a lower part 12, to which at least one cover 1 is applied.

[0078] The lower part 12 comprises recesses, each forming a mounting area 15a, 15b for an optoelectronic component 16a, 16b.

[0079] To provide the mounting areas 15a, 15b with a hermetically sealed cover 1, two windows 14a, 14b are applied directly to the base 12, which forms a frame for the windows 14a and 14b. The cover 1 is thus formed by the windows 14a and 14b.

[0080] As in Fig. As shown in Fig. 1b, the windows 14a, 14b are connected to the lower part 12, for example by being hermetically sealed onto the lower part 12 by means of a solder.

[0081] Window 14a can, for example, be permeable to infrared radiation, so that optoelectronic component 16a is, for example, an infrared sensor. Sensor 14b, on the other hand, can be permeable to UV radiation or visible light, so that optoelectronic component 16b is, for example, designed as an LED or a photocell.

[0082] The application of the windows 14a and 14b is complex, since they must be applied as individual windows on a frame, which in this embodiment is formed as part of the lower part 12 of the housing 11.

[0083] The invention therefore provides for a single cover in which the material of the cover itself forms the infrared radiation-permeable window, wherein the cover has a glass window which is permeable in a different wavelength range.

[0084] Fig. 2a to Fig. 2d show the process steps of inserting the glass windows into such a cover 1 according to the first embodiment of the invention.

[0085] First, when providing a cover 1, a substrate 2, in particular in the form of a silicon wafer, is provided (see Fig. 2a).

[0086] Then, as in Fig. 2b, openings 3 are introduced into the substrate 2, for example by etching or mechanical processing.

[0087] Then, as in Fig. 2c, glass inserts 4a, 4b are inserted into the openings 3.

[0088] As in Fig. 2d, the lid 1 is then heated to a temperature above the glass transition temperature T g heated.

[0089] The glass of the glass inserts 4a and 4b softens and bonds with the side wall of the opening 3 of the substrate 2, creating a hermetic seal. Fused windows 5a and 5b are formed from the glass inserts 4a and 4b.

[0090] Depending on the glass used, its volume and surface tension, as well as the atmosphere in which the heating is carried out, a lens can form, as shown in window 5b.

[0091] Now, below a region 6 of the cover 1, there is an IR-permeable window formed by the cover 6. In the region 7, however, there is a UV and / or visible light-permeable window 5a.

[0092] Mounting areas for different optoelectronic components can therefore be arranged below areas 6 and 7.

[0093] The cover 1 is preferably connected, after the introduction of the glass windows 5a, 5b, to a base part, in particular to a wafer, on which the electronic components are arranged.

[0094] The wafer can then be separated into individual chips.

[0095] According to one embodiment of the invention, it is provided that a separation, i.e. a severing of the wafer, takes place within a region of the cover 1.

[0096] In particular, according to the invention, it is also provided that individual components are provided which do not have a glass window, but merely a cover which is permeable to infrared radiation.

[0097] In the wafer composite, the invention also offers significant cost advantages for such embodiments.

[0098] Referring to Fig. 3a to Fig. 3d, a further embodiment of the method according to the invention will be explained.

[0099] As in Fig. 3a and Fig. 3b, first, as above with reference to Fig. 2a to Fig. 2d, openings 3 are introduced into the substrate 2 of the cover 1.

[0100] In contrast to the reference to Fig. 2a to Fig. 2d described procedures as in Fig. 3c, glass windows 5a, 5b are then provided, which are connected to the substrate 2 not by softening the glass of the glass windows 5a, 5b themselves, but by using a solder, in particular a solder glass 10a, 10b.

[0101] The windows 5a, 5b can be either plate-shaped windows or optical components, which are designed, for example, as a lens, as is symbolized by the round shape of the glass window 5b.

[0102] By heating the glass solder 10a, 10b, the glass windows 5a, 5b are connected to the substrate 2, wherein in this embodiment the windows 5a, 5b protrude from the substrate and the glass solder 10a, 10b is arranged around the protruding area.

[0103] According to a further embodiment of the invention, for example, the glass solder 10a, 10b can also be inserted into the opening 3 as a sleeve and thus connect the side walls of the glass windows 5a, 5a with the side walls of the opening 3 (not shown).

[0104] Fig. 4a to 4b schematically show a further embodiment of the invention, in which a substrate 2, in particular in the form of a silicon wafer, is provided, into which openings 3 are again introduced.

[0105] Furthermore, a glass substrate 8, in particular a glass wafer, is provided, which, as in Fig. 4b, whereby open areas 9 and closed areas, which form the later glass windows 5a, 5b, are created.

[0106] As in Fig. As shown in Fig. 4c, the glass substrate 8 is placed on the substrate 2 of the cover 1 in such a way that the glass windows 5a, 5b cover the openings 3.

[0107] The glass windows 5a, 5b are then connected to the substrate 2.

[0108] This can be achieved by welding, in particular using laser radiation. In particular, the glass substrate 8 and the substrate 2 of the cover can be pressed together, and a focused laser can be used to heat the material of both the substrate 2 and the glass windows 5 at the edges near the openings 3, resulting in a weld.

[0109] According to a further embodiment, in the Fig. In the step shown in Figure 4d, a connection can be made by means of anionic bonding. In this case, a voltage is applied at a high temperature, typically above 350°C, between the two halves of a tool that clamps the composite of glass substrate 8 and substrate 2 of the lid. In particular, an alkali-containing glass can be used. Charge zones due to ion migration at the interfaces form silicon-oxygen bridges, which lead to a bond between glass substrate 8 and substrate 2.

[0110] As in the other embodiments, a region of the substrate 2 forms an infrared radiation-transmissive region 6 for the cover 1 itself, whereas a glass window 5a forms a mounting region over which the cover 1 is transmissive in a different wavelength range.

[0111] Referring to the schematic sectional views according to Fig. 5a and Fig. Figure 5b explains how a housing 11 according to the invention is formed with a cover 1.

[0112] As in Fig. As shown in Figure 5a, in this embodiment the housing 11 consists of a base part or lower part 12 and the cover 1.

[0113] The cover 1 is preferably plate-shaped and comprises, as described above, a substrate made of an infrared radiation-permeable material.

[0114] Furthermore, the cover 1 comprises a preferably fused window 5a, which is permeable in a different wavelength range.

[0115] In this embodiment, the lower part 12 comprises recesses 15a, 15b, which each form a mounting area 13a, 13b for at least one optoelectronic component 16a, 16b.

[0116] The lower part 12 may comprise feedthroughs and / or conductor tracks (not shown) for the optoelectronic components 16a, 16b.

[0117] The lower part 12 can be made of silicon or ceramic, for example.

[0118] In this embodiment, the lower part 12 comprises at least one web 17 which separates the mounting areas 13a and 13b from each other.

[0119] The web 17 also serves as a support surface for the cover 1.

[0120] The mounting areas 13a, 13b preferably have a surface area of ​​4 mm in plan view2 up to 10 cm 2 .

[0121] As in Fig. As shown in Figure 5b, the cover 1 is connected to the base 12 to form a hermetically sealed mounting area 13a, 13b.

[0122] This can be done, for example, by using a glass or metal solder.

[0123] The window 5a is preferably introduced into the substrate of the cover 1 before connecting the cover 1 to the lower part 12.

[0124] The material of the cover itself is permeable to infrared radiation, so that the area 6 forms a window for the entry or exit of infrared radiation for the optoelectronic component 16a.

[0125] Window 5a, on the other hand, forms a region 7, which serves as a window for UV radiation or visible light, for example. Accordingly, optoelectronic component 16b either receives and / or emits UV radiation and / or radiation in the visible wavelength range.

[0126] Fig. 6a and Fig. 6b show an alternative embodiment of the invention, in which, in contrast to the embodiment according to Fig. 5a and Fig. 5b the window 5b, which forms an area 7 that is permeable to UV radiation or visible light, is designed as a lens.

[0127] The provision of such a window 5b, which is designed as a lens, can, as with reference to Fig. 2a to Fig. 2d has already been described, by melting a glass insert, which forms a lens due to its surface tension.

[0128] Referring to Fig. 7a to Fig. 7c describes the production of a plurality of housings 11, which according to one embodiment of the invention takes place in a wafer composite.

[0129] As in Fig. As shown in Fig. 7a, a wafer 18, in particular a silicon or ceramic wafer, is used for this purpose, which has a plurality of recesses, each forming a mounting area 13a and 13b.

[0130] Before the cover 1 is applied, an optoelectronic component 16a, 16b is introduced into each of these recesses, which is contacted, for example, via feedthroughs of the wafer 18 (not shown here).

[0131] The cover 1 comprises a plurality of windows 5a which, as described above, are permeable to a different wavelength range than the material of the cover 1 itself.

[0132] The cover 1 is so large that it occupies the area of ​​several housings 11. Preferably, a single cover 1 is used for a single wafer 18.

[0133] As in Fig. As shown in Figure 7b, the wafer 18, which simultaneously forms the lower part of the housing 11, is connected to the cover 1.

[0134] Then, as in Fig. 7c, the wafer 18 is separated into a plurality of housings 11 by being severed along the walls 19.

[0135] In this embodiment, each housing 11 then has a cover 1 which has a region 6 which is permeable to infrared radiation, as well as a further region 7 which is formed by the window 5a and which is permeable to a different wavelength.

[0136] By manufacturing in a wafer composite, as provided according to one embodiment of the invention, housings with optoelectronic components can be provided in a simple manner, which have a mounting area for a UV-selective optoelectronic component and / or an optoelectronic component selective in another wavelength range.

[0137] According to a further, second embodiment of the invention, the cover 1 is made of glass, with the window 5a / 5b being made of a material that transmits infrared radiation. Except for the design of the windows as fused-in lenses, the housing 11, in particular the cover 1, can otherwise be designed and / or manufactured as described above.

[0138] In this embodiment of the invention, the lid 1 is preferably made of a borosilicate glass and is connected to the base part / lower part 12 and to the window 5a / 5b by anionic bonding.

[0139] The invention also made it possible to provide, in a simplified manner, a hermetically sealed housing with an area that is permeable to infrared radiation as well as with a glass window that allows the passage of electromagnetic radiation in a different wavelength range. List of reference symbols 1 lid 2 Substrat 3 Opening 4a, 4b glass insert 5a, 5b windows 6 Infrared radiation-permeable window 7 windows for UV radiation and / or visible light 8 Glass substrate 9 open area 10a, 10b solder glass 11 housings 12 Base part / lower part 13a, 13b Assembly area 14a, 14b windows 15a, 15b recess 16a, 16b optoelectronic component 17 jetty 18 wafers 19 Wall

Claims

[1] Method for manufacturing a housing (11) for at least one electronic component, comprising a base part (12) with a mounting area (13a, 13b) for the electronic component (16a, 16b), wherein a cover (1) of the housing (11) made of an infrared-transmitting material is provided with a glass window (5a, 5b) and is connected to a base part (12), or wherein a cover (1) of the housing (11) made of glass is provided with a window (6) made of an infrared-transmitting material and is connected to a base part (12), characterized by, that a wafer is used as the base part (12), wherein the wafer is singulated after connecting the lid (1) to the base part (12), wherein a separating line during singulation divides the housing (11) into a first housing with an infrared radiation-transmitting window (6) and a second housing with a glass window (5a, 5b) or a first housing with a glass lid (1) and a second housing with a glass lid (1) with an infrared radiation-transmitting window (5a, 5b). [2] Method according to the preceding claim, characterized by , that a glass window (5a, 5b) is melted into the lid (1), soldered with a solder glass (10a, 10b), anodically bonded or welded in. [3] Method according to any of the preceding claims, characterized by , that a glass lid (1) is connected to the base part (12) and / or to an infrared radiation-permeable window (6) by anionic bonding.

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